CN208750280U - Air inlet pipe and Wafer processing apparatus for Wafer processing apparatus - Google Patents
Air inlet pipe and Wafer processing apparatus for Wafer processing apparatus Download PDFInfo
- Publication number
- CN208750280U CN208750280U CN201821313890.1U CN201821313890U CN208750280U CN 208750280 U CN208750280 U CN 208750280U CN 201821313890 U CN201821313890 U CN 201821313890U CN 208750280 U CN208750280 U CN 208750280U
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- China
- Prior art keywords
- air inlet
- inlet pipe
- protective layer
- tube body
- wall
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Abstract
The utility model relates to a kind of air inlet pipe and Wafer processing apparatus for Wafer processing apparatus, the air inlet pipe includes: tube body, including inner and outer wall；Protective layer, covers the inner wall and/or outer wall, and the mechanical strength of the protective layer is greater than the mechanical strength of the tube body.The protective layer can be improved the mechanical strength of the air inlet pipe, so that the air inlet pipe is not susceptible to rupture in use.
Description
Technical field
The utility model relates to technical field of semiconductors more particularly to a kind of air inlet pipe and crystalline substance for Wafer processing apparatus
Circle processing equipment.
Background technique
Wafer processing apparatus, such as furnace tube device etc., it will usually using quartz ampoule as air inlet pipe.Some wafer-process are set
It is standby, such as furnace tube device for deposit polycrystalline silicon will use longer air inlet pipe, is easy to happen fracture in use, leads
Cause board can not normal use, to influence the production capacity of equipment.
The intensity for how improving air inlet pipe, improves service life, and is current problem to be solved.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of air inlet pipe and wafer for Wafer processing apparatus
Processing equipment, the air inlet pipe is not easy to break, and service life can be improved.
To solve the above-mentioned problems, the utility model provides a kind of air inlet pipe for Wafer processing apparatus, comprising: pipe
Body, including inner and outer wall；Protective layer, covers the inner wall and/or outer wall, and the mechanical strength of the protective layer is greater than the pipe
The mechanical strength of body.
Optionally, one end of the tube body has certain length as sealed port, the sealed port, is used for and outside
Pipeline is tightly connected；The protective layer covers the tube wall other than the sealed port.
Optionally, the sealed port outer wall surface is covered with transition zone, and the transition zone surface flatness is greater than described
The surface flatness of protective layer.
Optionally, the protective layer is silicon carbide layer.
Optionally, the tube body is silicone tube.
Optionally, the transition zone is silicon oxide layer.
Optionally, the thermal expansion coefficient of the protective layer is greater than the thermal expansion coefficient of the tube body.
Optionally, the protective layer has the compression towards the tube body.
Optionally, the protective layer with a thickness of 0.195mm~0.39mm；The overall thickness of the protective layer and tube body is
1mm~2mm.
Specific embodiment of the present utility model also provides a kind of Wafer processing apparatus, comprising: the air inlet of any of the above-described
Pipe.
The air inlet pipe of the utility model includes the protective layer of the tube wall of tube body and covering tube body, can be improved the air inlet pipe
Mechanical strength so that the air inlet pipe is not easily broken in use, to improve the service life of the air inlet pipe.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the air inlet pipe of one specific embodiment of the utility model；
Fig. 2 is the structural schematic diagram of the air inlet pipe of one specific embodiment of the utility model；
Fig. 3 is the structural schematic diagram of the air inlet pipe of one specific embodiment of the utility model.
Specific embodiment
The specific embodiment of air inlet pipe provided by the utility model and Wafer processing apparatus is done in detail with reference to the accompanying drawing
It describes in detail bright.
Referring to FIG. 1, the structural schematic diagram of the air inlet pipe for one specific embodiment of the utility model.
The air inlet pipe includes: tube body 101, and the tube body includes inner and outer wall；Protective layer 102 covers the inner wall
And/or outer wall, the mechanical strength of the protective layer 102 are greater than the mechanical strength of the tube body.
In the specific embodiment, the inner and outer wall of the tube body 101 is all covered with the protective layer 102.At other
In specific embodiment, the protective layer 102 can only cover the inner wall or outer wall of the tube body 101.
It, can be to the tube body since the mechanical strength of the protective layer 102 is greater than the mechanical strength of the tube body 101
101 play a protective role, so that the air inlet pipe has biggish mechanical strength, are not susceptible to fracture etc. in use and ask
Topic, improves the physical life of the air inlet pipe.
The protective layer 102 can be formed on the tube wall with the tube body 101 by depositing operation.The protective layer 102
Thickness can control in 0.195mm~0.39mm, and the tube wall overall thickness of the air inlet pipe be 1mm~2mm.
In a specific embodiment, the material of the protective layer 102 is silicon carbide.Silicon carbide has high-intensitive, resistance to
The characteristic of high temperature.
In a specific embodiment, the tube body 101 is quartz ampoule.In another specific embodiment, the pipe
Body 101 is silicone tube, and protective layer 102 is silicon carbide layer, since silicon and silicon carbide have similar interfacial state, thus the protective layer
There is good associativity, protective layer 102 is not easy to peel off from the tube body 101, and in high temperature work between 102 and tube body 101
It will not be ruptured under skill.
In a specific embodiment, the thermal expansion coefficient of the protective layer 102 is greater than the thermal expansion of the tube body 101
Coefficient, therefore, in high temperature process environments, the protective layer 102 thermally expands, and can generate and answer towards the pressure of the tube body 101
Power, enable the protective layer 102 it is closer be deposited on 101 surface of tube body, will not fall off.In a specific embodiment
In, the material of the protective layer 102 is silicon carbide, and thermal expansion coefficient is 4.7 × 10-6/K；The material of the tube body 101 is silicon,
Thermal expansion coefficient is 2.62 × 10-6/K。
Referring to FIG. 2, the structural schematic diagram of the air inlet pipe for another specific embodiment of the utility model.
The air inlet pipe includes tube body 201, protective layer 202.And the tube body 201 include a sealed port 200, for
Exterior line is tightly connected；The protective layer 202 covers the tube wall other than the sealed port.
The sealed port 200 is a part of the tube body 201, has certain length.The sealed port 200 is used for
Other gas pipings are connected to, by being tightly connected between sealing ring and other pipelines.In the specific embodiment, the protection
Layer 202 only covers tube wall of the tube body 201 in addition to sealed port 200.It, can during forming protective layer 202
To avoid forming protective layer 202 on the sealed port surface and covering protective case covering in sealed port 200.
Since the protective layer 202 is formed using depositing operation, avoid being easy out-of-flatness, when being other pipelines connection,
It is not easy to realize and be tightly connected.Therefore, the protective layer 202 is not formed in the sealed port, it is ensured that the sealed end
Mouth avoid it is smooth, when sealing ring is placed in the sealed port 200, the sealing ring and 200 surface of sealed port it
Between fit closely.
Referring to FIG. 3, the structural schematic diagram of the air inlet pipe for another specific embodiment.
In order to improve the intensity of the sealed port, in the specific embodiment, the sealed port 200 (please refers to figure
2) surface has transition zone 203, and 203 surface of transition zone is smooth, and the surface flatness of the transition zone 203 is greater than described
The surface flatness of protective layer 202.In a specific embodiment, 201 material of tube body is silicon, can be by described
Sealed port surface carries out oxidation processes, forms silicon oxide layer as the transition zone 203.The oxidation processes can be hot oxygen
Chemical industry skill or wet process oxidation technology, oxidation processes can further eliminate the defect on the sealed port surface of the tube body 201, shape
At the transition zone 203 that surface is more smooth, it is ensured that when the air inlet pipe is connected to exterior line, is capable of forming good sealing and connects
It connects.
The air inlet pipe of above-mentioned specific embodiment includes the protective layer of the tube wall of tube body and covering tube body, be can be improved described
The mechanical strength of air inlet pipe, so that the air inlet pipe is not easily broken in use, to improve the use of the air inlet pipe
Service life.
Specific embodiment of the present utility model also provides a kind of semiconductor processing equipment, the semiconductor processing equipment packet
The air inlet pipe in above-mentioned specific embodiment is included, is passed through by the air inlet pipe into the reaction chamber of semiconductor processing equipment anti-
Answer gas.Since the air inlet pipe is not easily broken in use, the semiconductor processing equipment replacement can be reduced
The frequency of air inlet pipe, improves effective operating time of equipment, to improve the production capacity of the semiconductor processing equipment.Have at one
In body embodiment, the semiconductor processing equipment can be the furnace tube device of growth polysilicon film.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of air inlet pipe for Wafer processing apparatus characterized by comprising
Tube body, including inner and outer wall；
Protective layer, covers the inner wall and/or outer wall, and the mechanical strength of the protective layer is greater than the mechanical strength of the tube body.
2. air inlet pipe according to claim 1, which is characterized in that one end of the tube body is described close as sealed port
Blocking mouth has certain length, for being tightly connected with exterior line；The protective layer covers the pipe other than the sealed port
Wall.
3. air inlet pipe according to claim 2, which is characterized in that the sealed port outer wall surface is covered with transition zone,
The transition zone surface flatness is greater than the surface flatness of the protective layer.
4. air inlet pipe according to claim 1, which is characterized in that the protective layer is silicon carbide layer.
5. air inlet pipe according to claim 1, which is characterized in that the tube body is silicone tube.
6. air inlet pipe according to claim 3, which is characterized in that the transition zone is silicon oxide layer.
7. air inlet pipe according to claim 1, which is characterized in that the thermal expansion coefficient of the protective layer is greater than the tube body
Thermal expansion coefficient.
8. air inlet pipe according to claim 1, which is characterized in that there is the protective layer pressure towards the tube body to answer
Power.
9. air inlet pipe according to claim 1, which is characterized in that the protective layer with a thickness of 0.195mm~0.39mm；
The overall thickness of the protective layer and tube body is 1mm~2mm.
10. a kind of Wafer processing apparatus characterized by comprising
Air inlet pipe as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821313890.1U CN208750280U (en) | 2018-08-15 | 2018-08-15 | Air inlet pipe and Wafer processing apparatus for Wafer processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821313890.1U CN208750280U (en) | 2018-08-15 | 2018-08-15 | Air inlet pipe and Wafer processing apparatus for Wafer processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208750280U true CN208750280U (en) | 2019-04-16 |
Family
ID=66079428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821313890.1U Active CN208750280U (en) | 2018-08-15 | 2018-08-15 | Air inlet pipe and Wafer processing apparatus for Wafer processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208750280U (en) |
-
2018
- 2018-08-15 CN CN201821313890.1U patent/CN208750280U/en active Active
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