CN208738237U - A kind of LED encapsulation structure and its lighting device, electronic equipment - Google Patents

Abstract

The utility model relates to technical field of LED display more particularly to LED encapsulation structure and its lighting devices, electronic equipment.LED encapsulation structure, including chip, conducting resinl, bonding line and pedestal, pedestal is provided at least one first conductive structure and at least one second conductive structure, first conductive structure and the second conductive structure are spaced apart, chip is fixed on the first conductive structure with conducting resinl and is electrically connected by conducting resinl and the first conductive structure, bonding line one end and chip are electrically connected, the other end and the second conductive structure are electrically connected, the conductive region that conducting resinl is formed between conducting resinl and pedestal in the view field on pedestal, the position that conductive region is corresponded on pedestal is equipped with connection structure, connection structure one end and tube chamber welds with base are fixed or are integrally formed with pedestal, its other end protrusion pedestal simultaneously protrudes into conducting resinl, when being removed between conducting resinl and pedestal, the part that the connection structure protrudes into conducting resinl remains to guarantee LED well Chip works normally.

Description

A kind of LED encapsulation structure and its lighting device, electronic equipment

[technical field]

The utility model relates to technical field of LED display more particularly to a kind of LED encapsulation structure and lighting devices, electronics Equipment.

[background technique]

LED (Light emitting diode, light emitting diode) is that one kind can convert electrical energy into visible light and radiation The luminescent device of energy.LED has that operating voltage is low, power consumption is small, luminous efficiency is high, emission response time is extremely short, photochromic pure etc. Advantage.In addition, having pollution-free, shock resistance, vibration resistance, stable and reliable for performance, light-weight, body in the manufacturing process of LED itself The features such as product is small, at low cost, is widely regarded as 21 century top quality light source to replace incandescent lamp and fluorescent lamp.

The encapsulation of LED mainly has following three links: first is that chip is fixed on bracket with conducting resinl；Second is that using gold thread It is welded on the circuit that formation can be powered between chip and bracket；Third is that with glue package to protect chip and gold thread not to be damaged. Detailed process are as follows: prepare material, bracket processing, on bracket put conducting resinl, die bond, baking, bonding wire, plasma cleaning, bonding wire, Plasma cleaning, sealing, baking molding.LED product packaged by this technology is applied in high temperature illuminating device When, the problem of due to the stress problem or high temperature of packaging plastic conductive glue being melted, make conducting resinl and chip can be together It is detached from bracket and leads to LED failure, to reduce the reliability and service life of LED.

[utility model content]

Conducting resinl and base support are easily peeled off and lead to LED chip and pedestal in encapsulating structure to overcome existing LED It is electrically connected the defect of failure, the present invention provides the switching performance between a kind of conducting resinl and chip and pedestal good LED envelope Assembling structure and lighting device, electronic equipment.

In order to solve the above-mentioned technical problem, the utility model provides a kind of LED encapsulation structure, including chip, conducting resinl, key Zygonema and pedestal, the pedestal are provided at least one first conductive structure and at least one second conductive structure, and described first leads Electric structure and the second conductive structure are spaced apart, and the chip is fixed on first conductive structure with the conducting resinl And be electrically connected by the conducting resinl and first conductive structure, described bonding line one end and the chip are electrically connected, The other end and second conductive structure are electrically connected, and the view field of the conducting resinl on the base is the conducting resinl The conductive region formed between the pedestal, the position that conductive region is corresponded on the pedestal is provided with connection structure, described Connection structure one end and the tube chamber welds with base are fixed or are integrally formed with the pedestal, and the other end protrudes the pedestal and stretches Enter in the conducting resinl, the connection structure is welding spot structure or conductor structure.

Preferably, first conductive structure is the conductive metal sheet being arranged on the pedestal, and it includes protrusion The freedom portion of the base plane, the freedom portion protrude into the conducting resinl.

Preferably, within the same conductive region, the connection structure can be one or more.

It preferably, is interval setting between the chip and the pedestal；Or the chip is directly contacted with the pedestal, The conducting resinl is around the chip surrounding and is fixed on the pedestal.

Preferably, the conducting resinl includes silver system conducting resinl, gold system conducting resinl, copper system conducting resinl and charcoal system conducting resinl etc..

Preferably, the area of the conductive region is more than or equal to the chip close to the area of the pedestal.

In order to solve the above-mentioned technical problem the present invention, it is as follows to provide another technical solution: a kind of lighting device comprising on The LED encapsulation structure is stated, the lighting device includes car lighting lamp, operating condition lamp or tunnel lamp.

Preferably, the lighting device further includes bracket, packaging plastic and display screen, by the packaging plastic by the LED Encapsulating structure is fixed on the bracket, and the display screen is arranged in the pedestal and is provided on the side of LED chip.

In order to solve the above-mentioned technical problem the present invention, it is as follows to provide another technical solution: a kind of electronic equipment comprising on The LED encapsulation structure and display component, display component is stated the pedestal is arranged in and is provided on the side of LED chip.

Compared with prior art, the position that conductive region is corresponded on the pedestal is provided with connection structure, the connection knot Structure one end is fixedly connected with the first base or is integrally formed with the pedestal, and the other end protrudes the pedestal and protrudes into In the conducting resinl, when due to external factor, such as: in hot environment conductive glue fusing or conducting resinl aging or Other external factor cause to remove between conducting resinl and the pedestal, cause to be electrically connected between LED chip and the pedestal disconnected When opening, the part that the connection structure protrudes into the conducting resinl remain to it is good contact and electrically conduct with the conducting resinl, Guarantee that LED chip works normally.

The connection structure can be one or more, the multiple connection structure can certain spacing be distributed in institute It states on pedestal, in this way when partially electronically conductive glue and the pedestal are removed, connection structure is distributed in the region removed, it is described Wherein one end of connection structure is fixedly connected with the base, and the connection structure still partially protrudes into the conducting resinl, is made LED chip is obtained to remain to work well.

The area of the conductive region be more than or equal to the chip close to the pedestal area, can well by The LED chip is fixed on the pedestal, can also increase the conductive area of LED chip Yu the pedestal well, more preferably Guarantee LED chip normally, also, more multiple connection structures can also be set, be further ensured that LED chip and institute State the electric connection of pedestal.

[Detailed description of the invention]

Fig. 1 is the structural schematic diagram of LED encapsulation structure in the utility model first embodiment；

Fig. 2 is that the LED encapsulation that connection structure is integrally formed when the pedestal in the utility model first embodiment is tied The overall structure diagram of structure；

Fig. 3 is the whole knot of LED encapsulation structure when connection structure is set as multiple in the utility model first embodiment Structure schematic diagram；

Fig. 4 is the overall structure diagram of LED encapsulation structure in the utility model second embodiment；

Fig. 5 is the structural schematic diagram for the lighting device that 3rd embodiment provides in the utility model；

Fig. 6 is the structural schematic diagram for the lighting device that fourth embodiment provides in the utility model；

Fig. 7 is the structural schematic diagram for the electronic equipment that the 5th embodiment provides in the utility model.

Description of symbols:

10, LED encapsulation structure；100, LED encapsulation structure；101, pedestal；1011, first base；1012, second base； 1013, the first conductive structure；1014, the second conductive structure；1015, fixed part；1016, freedom portion；103, bonding line；104, LED chip；105, conducting resinl；106, connection structure；200, lighting device；201, bracket；202, display screen；203, packaging plastic； 300, lighting device；400, electronic equipment；401, display component.

[specific embodiment]

In order to make the purpose of this utility model, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to solve The utility model is released, is not used to limit the utility model.

Referring to Fig. 1, the utility model first embodiment provides a kind of LED encapsulation structure 10, including LED chip 104, lead Electric glue 105, bonding line 103 and pedestal 101.The pedestal 101 includes first base 1011 and second base 1012, described It is spaced a distance between first base 1011 and second base 1012.The first conduction is provided in the first base 1011 Structure 1013 is provided with the second conductive structure 1014 in the second base 1012.

First conductive structure 1013 and the second conductive structure 1014 are the conductive metal being embedded on the pedestal 101 Layer, conductive metal sheet or conductive pattern, can be electrically connected with external circuit.First conductive structure 1013 and second Conductive structure 1014 can also be fixed on by other means on the pedestal 101.The material of the pedestal 101 can be rubber Resinae megohmite insulant.

The LED chip 104 is fixed in the first base 1011 with the conducting resinl 105, the conducting resinl 105 to Small part and first conductive structure 1013 coincide, and pass through the conducting resinl 105 and the first base 1011 the One conductive structure 1013 is electrically connected.Described 103 one end of bonding line and the LED chip 104 are electrically connected, the other end with it is described The second conductive structure 1014 in second base 1012 is electrically connected.First conductive structure 1013 and the second conductive structure 1014 connect with external circuit, electric energy are provided for the first conductive structure 1013 and the second conductive structure 1014, so that described LED chip 104 shines.

Please continue to refer to Fig. 1, view field of the conducting resinl 105 on the pedestal 101 be the conducting resinl 105 with The conductive region M formed between the first base 1011 corresponds to the position setting of conductive region M in the first base 1011 There is connection structure 106.

In some specific embodiments, the connection structure 106 can be welding spot structure or conductor structure, solder joint The metal structure that structure is formed generally by the mode of welding, it is corresponding that one end of which is fixed on first conductive structures 1013 Conductive region M in, the other end protrudes the plane of first conductive structure 1013 and protrudes into the conducting resinl 105, Generation type is simple, quick.Conductor structure is generally conductive metal wire, by welding by the fixed institute of one end First base 1011 is stated, the other end protrudes into the conducting resinl 105.In general, conductor structure have preferable reelability and Its length adjustability is strong, so as to control the length protruded into conducting resinl 105 well.

Referring to Fig. 2, in other embodiments, when first conductive structure 1013 is to be arranged in the first base When 1011 conductive metal sheet, first conductive structure 1013 includes the fixed part being fixedly connected with the first base 1011 It 1015 and is wholely set with the fixed part 1015 and protrudes into the freedom portion 1016 in the conducting resinl 105.The freedom portion 1016 correspond to the connection structure 106.

In the present embodiment, the connection structure 106 is set, when under high temperature environment or due to long-time service, conduction The fusing of 105 part of glue or aging, when so that conducting resinl 105 and the first base 1011 being removed, the connection structure 106 Wherein one end is fixedly connected with the pedestal 101, and the connection structure 106 still partially protrudes into the conducting resinl 105, is made LED chip 104 is obtained to remain to work well.

The conducting resinl 105 can have the function of bonding and conduction simultaneously.Conducting resinl 105 includes silver system conducting resinl, gold system Conducting resinl, copper system conducting resinl and charcoal system conducting resinl etc..Preferably, silver system conducting resinl is used in the present invention.

Referring to Fig. 2, the conducting resinl 105 is arranged on the first base 1011, the LED chip 104 It is fixedly connected by way of hot pressing or bonding with the conducting resinl 105, chip is fixed on described by the conducting resinl 105 On one pedestal 101.That is, the LED chip 104 by the conducting resinl 105 it is fixed and by the conducting resinl 105 with it is described First base 1011 is spaced.

Referring to Fig. 3, in other embodiments, the conducting resinl 105 around 104 surrounding of LED chip and by its It is fixed on the first base 1011, the LED chip 104 is directly contacted with the first base 1011.

Please continue to refer to Fig. 3, in some specific embodiments, same conduction is corresponded on the first base 1011 Connection structure 106 can be one or more in the M of region.In some preferred embodiments, by the connection structure 106 It is set as multiple, the multiple connection structure 106 is distributed on the conductive region M of the pedestal 101 with certain spacing, or Connection structure 106 described in person is evenly distributed in the first base 1011.In this way, when partially electronically conductive glue 105 is led with described When electric region M is removed, connection structure 106 is distributed in the region removed, so that the LED chip 104 remains to good work Make.

In some other implementations, the demand for the brightness that LED chip 104 can be issued according to actual product, institute Stating pedestal 101 may include multiple first bases 1011 and multiple second bases 1012, settable one in the first base 1011 LED chip 104 or plurality of LEDs chip 104, and connection structure 106 is set in corresponding conductive region M.

In some specific embodiments, the area of the conductive region M is more than or equal to 104 court of LED chip To the area on the surface of the pedestal 101.In this way, can well by the LED chip 104 be fixed on the pedestal 101 it On, it can also increase the conductive area of LED chip 104 Yu the pedestal 101 well, preferably guarantee LED chip 104 just Often conducting.Further, more multiple connection structures 106 can also be set, be further ensured that LED chip 104 and the bottom The electric connection of seat 101.

Referring to Fig. 4, the second embodiment of the utility model provides another LED encapsulation structure 100, the LED encapsulation Structure 100 includes pedestal 101, the plurality of LEDs chip 104 being arranged on the pedestal 101, conducting resinl 105, bonding line 103. It is provided at least one first conductive structure 1013 and at least one second conductive structure 1014 on the pedestal 101, described first It is spaced apart between conductive structure 1013 and the second conductive structure 1014.The LED chip 104 conducting resinl 105 are fixed on the pedestal 101 and are electrically connected by the conducting resinl 105 with first conductive structure 1013, described 103 one end of bonding line and the LED chip 104 are electrically connected, and the other end and second conductive structure 1014 are electrically connected, In specific application, first conductive structure 1013 and the second conductive structure 1014 electrically conduct with external circuit respectively, Electric energy is provided for the LED chip 104.

First conductive structure 1013 and the second conductive structure 1014 be arranged in mode on the pedestal 101 and its Structure, material are identical with the first embodiment, and details are not described herein.

Similarly, the mode that the LED chip 104 is fixed on the pedestal 101 is identical with first embodiment.

And view field of the conducting resinl 105 on the pedestal 101 is conductive region M, in the conductive region Connection structure 106 is again provided in M, the set-up mode of the connection structure 106, design feature are identical with the first embodiment.

It should be strongly noted that when first conductive structure 1013 and the second conductive structure 1014 are multiple, institute It states multiple first conductive structures 1013 or multiple second conductive structures 1014 and the pedestal 101 is arranged in by concatenated mode On, each LED chip 104 electrically connects with corresponding first conductive structure 1013 and the second conductive structure 1014 respectively It connects.

Referring to Fig. 5, third embodiment of the invention provides a kind of lighting device 200 comprising first embodiment institute as above LED encapsulation structure 10, bracket 201, packaging plastic 203 and the display screen 202 stated.The LED is encapsulated by packaging plastic 203 and is tied The first base 1011 and second base 1012 of structure 10 are fixedly connected with the bracket 201 respectively.The setting of display screen 202 exists The first base 1011 is provided on the side of LED chip 104.The lighting device 200 is mainly used for hot environment photograph It is bright comprising automotive lighting lamp, operating condition lamp or tunnel lamp.

Referring to Fig. 6, fourth embodiment of the invention provides a kind of lighting device 300 comprising second embodiment as above mentions The LED encapsulation structure 100 of confession, bracket 201, display screen 202 and packaging plastic 203, the LED encapsulation structure 100 pass through encapsulation The pedestal 101 is fixedly connected by glue 203 with the bracket 201.The setting of display screen 202 is provided in the pedestal 101 On the side of LED chip 104.

Referring to Fig. 7, fifth embodiment of the invention provides a kind of electronic equipment 400, the electronic equipment 400 includes as above LED encapsulation structure 100 and display component provided by the LED encapsulation structure 10 or second embodiment of first embodiment offer are provided 401.Display component 401 is arranged in the pedestal 101 and is provided on the side of LED chip 104.The electronic equipment 400 can Including but not limited to: the fields such as smart home, smart television, indoor and outdoor large scale display screen.

Compared with prior art, LED encapsulation structure provided by the utility model have it is following the utility model has the advantages that

The position that conductive region is corresponded on pedestal described in LED encapsulation structure provided by the utility model is provided with connection Structure, described connection structure one end are fixedly connected with the first base or are integrally formed with the pedestal, and the other end is convex It the pedestal and protrudes into the conducting resinl out, when due to external factor, such as: conductive glue melts in hot environment, or Conducting resinl aging or other external factor cause to remove between conducting resinl and the pedestal, lead to LED chip and the bottom When being electrically connected disconnection between seat, the part that the connection structure protrudes into the conducting resinl remains to the good and conducting resinl It contacts and electrically conducts, guarantee that LED chip works normally.

The connection structure can be one or more, the multiple connection structure can certain spacing be distributed in institute It states on pedestal, in this way when partially electronically conductive glue and the pedestal are removed, connection structure is distributed in the region removed, it is described Wherein one end of connection structure is fixedly connected with the base, and the connection structure still partially protrudes into the conducting resinl, is made LED chip is obtained to remain to work well.

The area of the conductive region be more than or equal to the chip close to the pedestal area, can well by The LED chip is fixed on the pedestal, can also increase the conductive area of LED chip Yu the pedestal well, more preferably Guarantee LED chip normally, also, more multiple connection structures can also be set, be further ensured that LED chip and institute State the electric connection of pedestal.

The foregoing is merely the utility model preferred embodiments, are not intended to limit the utility model, all in this reality With any modification made within novel principle, equivalent replacement and improve etc. should all comprising the protection scope of the utility model it It is interior.

Claims (9)

1. a kind of L ED encapsulating structure, it is characterised in that: including chip, conducting resinl, bonding line and pedestal, the pedestal setting There are at least one first conductive structure and at least one second conductive structure, first conductive structure and the second conductive structure interval one Set a distance, the chip are fixed on first conductive structure with the conducting resinl and by the conducting resinls and described first Conductive structure is electrically connected, and described bonding line one end and the chip are electrically connected, the other end and second conductive structure electricity Property connection, the conduction region that the view field of the conducting resinl on the base is formed between the conducting resinl and the pedestal Domain, the position that conductive region is corresponded on the pedestal are provided with connection structure, described connection structure one end and the tube chamber welds with base It fixes or is integrally formed with the pedestal, the other end protrudes the pedestal and simultaneously protrudes into the conducting resinl, the connection knot Structure is welding spot structure or conductor structure.

2. L ED encapsulating structure as described in claim 1, it is characterised in that: first conductive structure is to be arranged at the bottom Conductive metal sheet on seat, and it includes the freedom portion for protruding the base plane, the freedom portion protrudes into the conducting resinl In.

3. L ED encapsulating structure as described in claim 1, it is characterised in that: within the same conductive region, the company Binding structure can be one or more.

4. L ED encapsulating structure as described in claim 1, it is characterised in that: set between the chip and the pedestal for interval It sets；Or the chip is directly contacted with the pedestal, the conducting resinl is around the chip surrounding and is fixed in the bottom On seat.

5. L ED encapsulating structure as described in claim 1, it is characterised in that: the conducting resinl includes silver system conducting resinl, gold system Conducting resinl, copper system conducting resinl and charcoal system conducting resinl etc..

6. L ED encapsulating structure as claimed in claim 1 or 2, it is characterised in that: the area of the conductive region be greater than or Equal to the chip close to the area of the pedestal.

7. a kind of lighting device, it is characterised in that: it includes such as L ED encapsulating structure of any of claims 1-6, The lighting device is car lighting lamp, operating condition lamp or tunnel lamp.

8. lighting device as claimed in claim 7, it is characterised in that: the lighting device further includes bracket, packaging plastic and shows Display screen, by the packaging plastic that the L ED encapsulating structure is fixed on the bracket, the display screen is arranged at the bottom Seat is provided on the side of L ED chip.

9. a kind of electronic equipment, it is characterised in that: it include such as L ED encapsulating structure of any of claims 1-6 and Display component, display component are arranged in the pedestal and are provided on the side of L ED chip.