CN208623980U - A kind of wireless charging FPC multi-layer board - Google Patents
A kind of wireless charging FPC multi-layer board Download PDFInfo
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- CN208623980U CN208623980U CN201821129686.4U CN201821129686U CN208623980U CN 208623980 U CN208623980 U CN 208623980U CN 201821129686 U CN201821129686 U CN 201821129686U CN 208623980 U CN208623980 U CN 208623980U
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- Prior art keywords
- wireless charging
- layer board
- coil
- unicoil
- pad
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Abstract
The utility model discloses a kind of wireless charging FPC multi-layer boards, including four coil blocks, for connecting the pure glue (5) of four coil blocks, four coil blocks bond from top to down, any coil block includes two unicoils (1) and be set between described two unicoils (1) PI layers of substrate (4), the both ends of any unicoil (1) are provided with pad (2), conductive copper (6) are provided between pad (2) on the two neighboring unicoil (1), the multiple-plate manufacture craft of wireless charging FPC is the following steps are included: standing dry film wall, copper facing, striping and etching, superposition.Utility model has the advantages that reducing the size of FPC, reduce coil-span, effectively improve the transmission power of transmitting terminal, improves transmission speed.
Description
Technical field
The utility model relates to FPC technical field, in particular to a kind of wireless charging FPC multi-layer board and its manufacture craft.
Background technique
With the development of smart phone, wireless charging is that future market trend is also higher technical threshold, wireless charging
Transmitting terminal requires delivering power big, and transmission speed is fast, and light, thin, short, small consequently facilitating carrying, and transmitting terminal makes of FPC to be become
Development Trend, existing FPC production method mainly include that two kinds, i.e. etching method and copper wire coil, etching method refer to using image
Transfer method directly etches the figure of demand, and this method is unable to reach the demand of thick copper, and generation power is small, transmission speed
Difference.Copper wire coil, which refers to, has copper wire to be coiled into coil as concussion source, and the FPC size of the production of this method is big, heavy, is unfavorable for
It carries, and coil-span is limited, transmission power is small, and transmission speed is slow.
Summary of the invention
The purpose of this utility model is to solve the deficiencies in the prior art, provides that a kind of easy to carry and transmission power is big, passes
Defeated fireballing wireless charging FPC multi-layer board and its manufacture craft.
The technical scheme in the invention for solving the above technical problem is: a kind of wireless charging FPC multi-layer board, including four
A coil block, the pure glue for connecting four coil blocks, four coil blocks bond from top to down, Ren Yisuo
Stating coil block includes PI layers of two unicoils and the substrate being set between described two unicoils, any described monocoil
Both ends are provided with pad, are provided with conductive copper between the pad on the two neighboring unicoil.
In some embodiments, the total copper of the wireless charging FPC multi-layer board is 400 μm to 500 μm thick.
In some embodiments, the monocoil line-spacing is 30 μm to 40 μm.
In some embodiments, the thickness of the pure glue is not less than 40 μm.
In some embodiments, identical through-hole is offered on any pad, and the quantity of the through-hole is eight
It is a or eight or more.
The utility model has the beneficial effects that: using the lattice coil addition method, so that the FPC produced has Gao Gong
The advantages of rate, high transmission speed, overcomes current technology bottleneck, while reducing the size of transmitting terminal.
Detailed description of the invention
Fig. 1 is the utility model wireless charging FPC multi-layer board overall schematic；
Fig. 2 is the utility model wireless charging FPC single coil structure schematic diagram；
Fig. 3 is the utility model wireless charging FPC multi-layer board technological process of production schematic diagram；
In figure, 1, unicoil；2, pad；3, through-hole；4, substrate PI layers；5, pure glue；6, conductive copper；7, dry film wall.
Specific embodiment
The utility model is described further with reference to the accompanying drawings and examples.
In Fig. 1, Fig. 2, a kind of wireless charging FPC multi-layer board, including four coil blocks, for connect four coil blocks
Pure glue 5, four coil blocks bond from top to down, and any coil block includes two unicoils 1 and is set to two single lines
Substrate PI layer 4 between circle 1, the both ends of any unicoil 1 are provided with pad 2, the pad 2 on two neighboring unicoil 1 it
Between be provided with conductive copper 6, conductive copper 6 is for connecting pad 2 and being powered.
In specific design, the total copper of wireless charging FPC multi-layer board is 400 μm to 500 μm thick, and the line-spacing of unicoil 1 is 30 μ
M to 40 μm, the thickness of pure glue 5 is not less than 40 μm.
Identical through-hole 3 is offered on any pad 2, and the quantity of through-hole 3 is eight or eight or more, 3 energy of through-hole
Ensure the electric wire conducting between eight layers.
Using the structure of above-described embodiment, reach the demand of thick copper, and reduced whole size, improves transmitting terminal
Transmission power and transmission speed, be convenient for carrying.
As shown in Figure 1, Figure 2, Fig. 3, a kind of multiple-plate manufacture craft of wireless charging FPC, comprising the following steps:
A. subtract process for copper, copper foil is reduced into 2-6 μm of face copper residue；
B. standing dry film wall, process is stood high 50-60 μm, wide 30-40 μm of dry film on the copper foil through exposure and development
Wall 7, and the spacing between the dry film wall 7 is 150-500 μm；
C. dry film wall confirms, confirms that nonvisualization is unclean, the dry film wall 7 standing is not toppled over after AOI is scanned；
D. copper-plating technique carries out graphic plating technique, is acted on by the dry film wall 7, coil pattern can be presented after copper facing；
E. membrane process is removed, the dry film in above step is removed；
Bottom copper between route in above step is all stung erosion by f. etch process；
G. superposition process takes eight to be overlapped by the unicoil 1 that above step makes, is overlapped；
H. bore process, opens up through-hole 3 on the pad 2 unidirectionally enclosed, and 3 quantity of through-hole is no less than eight；
I. conductive copper is arranged, and conductive copper 6 is arranged between the through-hole 3 on the pad 2 of the two neighboring unicoil 1.
Preferably, the diameter of through-hole 3 is 0.2mm in step h.
Using above-mentioned manufacture craft, overcome in the prior art because being asked using etching method or the brought technology of copper coil method
Topic effectively reduces the size of FPC, reduces coil-span, effectively improves the transmission power of transmitting terminal, improves transmission speed.
Only the most preferred embodiment of the utility model is described above, but is not to be construed as the limit to claim
System.The utility model is not only limited to above embodiments, and specific structure is allowed to vary.It is all in the utility model independent right
It is required that protection scope in made various change in scope of protection of the utility model.
Claims (5)
1. a kind of wireless charging FPC multi-layer board, which is characterized in that including four coil blocks, for connecting four coils
The pure glue (5) of component, four coil blocks bond from top to down, and any coil block includes two unicoils (1)
And PI layers of substrate (4) between described two unicoils (1) are set to, the both ends of any unicoil (1) are provided with weldering
Disk (2) is provided with conductive copper (6) between the pad (2) on the two neighboring unicoil (1).
2. wireless charging FPC multi-layer board according to claim 1, which is characterized in that the total copper of wireless charging FPC multi-layer board
Thickness is 400 μm to 500 μm.
3. wireless charging FPC multi-layer board according to claim 1, which is characterized in that the line-spacing of the unicoil (1) is 30 μm
To 40 μm.
4. wireless charging FPC multi-layer board according to claim 1, which is characterized in that the thickness of the pure glue (5) is not less than 40
μm。
5. wireless charging FPC multi-layer board according to claim 1, which is characterized in that offered on any pad (2)
Identical through-hole (3), and the quantity of the through-hole (3) is eight or eight or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821129686.4U CN208623980U (en) | 2018-07-17 | 2018-07-17 | A kind of wireless charging FPC multi-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821129686.4U CN208623980U (en) | 2018-07-17 | 2018-07-17 | A kind of wireless charging FPC multi-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208623980U true CN208623980U (en) | 2019-03-19 |
Family
ID=65705919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821129686.4U Active CN208623980U (en) | 2018-07-17 | 2018-07-17 | A kind of wireless charging FPC multi-layer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208623980U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021249142A1 (en) * | 2020-06-08 | 2021-12-16 | 深圳市云顶信息技术有限公司 | Wireless charging coil assembly and charging device |
-
2018
- 2018-07-17 CN CN201821129686.4U patent/CN208623980U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021249142A1 (en) * | 2020-06-08 | 2021-12-16 | 深圳市云顶信息技术有限公司 | Wireless charging coil assembly and charging device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 6 Helitai Road, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province, 341600 Patentee after: Jiangxi Yinuo New Material Co., Ltd Address before: No. 6 Helitai Road, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province, 341600 Patentee before: JIANGXI BYD ELECTRONIC COMPONENT Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |