CN208596662U - A kind of wafer paster apparatus of optical splitter - Google Patents
A kind of wafer paster apparatus of optical splitter Download PDFInfo
- Publication number
- CN208596662U CN208596662U CN201821003257.2U CN201821003257U CN208596662U CN 208596662 U CN208596662 U CN 208596662U CN 201821003257 U CN201821003257 U CN 201821003257U CN 208596662 U CN208596662 U CN 208596662U
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- China
- Prior art keywords
- patch
- rack
- wafer
- plate
- locating piece
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Abstract
The utility model discloses a kind of wafer paster apparatus of optical splitter, it includes rack, the patch workbench being arranged on the rack, through-hole is offered on patch workbench, the side of rack is fixed with cylinder, the piston rod of cylinder connects slide, and the two sides of slide are equipped with rolling bearing units and servo motor, and screw axis is mounted on rolling bearing units and servo motor, screw axis is threadedly coupled with slide plate, and slide plate is connect with plaster mechanism；It is fixed with tooth plate under slide, is provided with movable rotation-shaft in rack, movable rotation-shaft is provided with gear, is equipped with axle sleeve on the diameter of axle, and gear engages connection with tooth plate, glue brush is provided on axle sleeve；Lower end positioned at axle sleeve is provided with gumming mechanism, the purpose of this utility model is in view of the above problems, a kind of wafer paster apparatus of optical splitter is provided, while declining plaster mechanism using cylinder, complete the brush coating task to glass cover-plate, semi-automatic patch task is completed, the patch efficiency and quality of wafer are improved.
Description
Technical field
The invention belongs to communication products fields, in particular to being bonded to wafer and glass cover-plate, specially a kind of light
The wafer paster apparatus of splitter.
Background technique
Being thinned for wafer is frequently involved in semiconductor processes, especially in the preparation process of semiconductor laser chip
In, in order to reach good heat dissipation effect and adapt to laser chip light and smallization development trend, the wafer by 400 microns is needed to subtract
100 microns are as thin as, however the thinned of wafer thickness leads to the reduction of its mechanical strength, causes to be easy to produce in thinning process
Raw fragment, production yield greatly reduce.Therefore it before carrying out reduction process, needs to exist the front of wafer by adhesive bond
Have on certain thickness glass or ceramic substrate, to facilitate the operation of reduction process, increase wafer mechanical strength, is split to reduce
Piece promotes yield.
Wafer crosses Cheng Qian in patch, needs to smear glass cover-plate or wafer in UV glue, existing paster apparatus is all to use
The mode manually smeared carries out, and due to smearing using artificial, if the UV glue smeared is excessive, wafer fitting can be made to cool down waiting
Time is longer, if the UV glue smeared is very few, fitting dynamics is inadequate, is easy to fall off, and after smearing UV glue, when carrying out patch, shows
There is device, placing wafer and when glass cover-plate, not can guarantee the precision of institute's placement location, error, cannot achieve
High accuracy positioning patch, good time difference when leading to patch quality, levels of audit quality is uneven, therefore, needs a kind of paster apparatus, to meet
To the quick patch of wafer.
Summary of the invention
The purpose of the present invention is made using cylinder in view of the above problems, provide a kind of wafer paster apparatus of optical splitter
While plaster mechanism declines, complete that the brush coating task of glass cover-plate is completed semi-automatic patch task, improves wafer
Patch efficiency and quality.
In order to achieve the above object, the technical solution adopted by the present invention is that: a kind of wafer paster apparatus of optical splitter, it is wrapped
Including rack, the patch workbench being arranged on the rack offer on the patch workbench and place wafer and glass cover-plate
Two through-holes, the side of the rack are fixed with cylinder, and the piston rod of the cylinder connects slide, and the two sides of the slide are equipped with
Rolling bearing units and servo motor, screw axis are mounted on rolling bearing units and servo motor, and the screw axis is threadedly coupled with slide plate,
The opening that the slide plate passes through slide is connect with plaster mechanism, and the plaster mechanism is located at the upper end of through-hole；In the slide
Lower plate on be fixed with tooth plate, be provided with movable rotation-shaft in rack, the two sides of the movable rotation-shaft are provided with gear, on the diameter of axle
Axle sleeve is installed, the gear engages connection with tooth plate, and glue brush is provided on axle sleeve, and the glue brush is located at glass cover-plate institute
In the through-hole of placement；Lower end positioned at axle sleeve is provided with gumming mechanism.
Further, the gumming mechanism is by glue loading box and support bar group at being placed with UV glue in the glue loading box.
Further, the plaster mechanism includes a manifold clamp, connecting rod and patch rack, the branch manifold clamp
It is connect with connecting rod with slide plate, paster table frame is arranged in connecting rod；Positioned at the lower end of patch rack, sucker fixed block, institute are set
The lower end for stating sucker fixed block is provided with sucker, and gas-tpe fitting is connect by tracheae with sucker.
Further, inner cavity and the gas outlet for being connected to inner cavity are offered in the patch rack, the gas outlet is located at
Patch rack two sides, branch pipe one end are fixed on branch manifold clamp, and the other end is connected to the inner cavity of patch rack.
Further, the identical left locating piece of shape is respectively arranged with for placing the through hole of glass cover-plate and wafer
I and left locating piece II, the through hole for placing wafer are provided with the right locating piece II being oppositely arranged with left locating piece II, institute
The left locating piece I stated and left locating piece II pass through spring and connect patch workbench, and left-hand end is provided with the conical surface, the conical surface with
It is formed with card slot between patch workbench, is provided with the briquetting matched with the conical surface on the left of the patch rack.
Further, the shape of the left locating piece I and left locating piece II is to form parallel first of extending direction
Point and Part III, and the second part of connection first part and Part III, the second part and first part and third
Part is vertically arranged.
Further, in wafer patch, the patch rack and left locating piece II, wafer, glass cover-plate and patch
A drying tank is formed between piece workbench, the drying tank is connected to inner cavity by gas outlet.
The invention has the benefit that
Engagement 1. the present invention carries out moving down clamping glass cover-plate using cylinder to slide, by tooth plate to gear
Thrust rotates movable rotation-shaft, realizes and carries out brush coating to glass cover-plate, reduces the use of motor, cleverly design, and makes entire
Device is more reasonable, by semi-automatic patch, substantially increases the quality of the patch efficiency of wafer.
2. the device uses automatic brush coating, make to be applied to the UV glue amount homogeneous on glass cover-plate, the wafer after patch is high
Degree is consistent.
3. the patch rack with inner cavity, by being filled with hot wind, is accelerated to the solidification after wafer bak stay after patch
Speed.
4. in decline, using the extruding of briquetting, make left locating piece I and left locating piece II to glass cover-plate and wafer into
Row centralized positioning guarantees that welt flushes in patch, and the quality being bonded is highly improved, and the stability of wafer obtains
Enhancing.
5. in wafer patch, between patch rack and left locating piece II, wafer, glass cover-plate and patch workbench
A drying tank is formed, the hot gas being filled in drying tank, the hot gas being filled with is dried in drying tank around welt side seam,
Reduce distributing for hot gas.
6. wafer of the present invention is kept entire patch efficiency quicker, is reduced the labor of worker using semi-automatic patch
Fatigue resistance improves work efficiency.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the partial enlargement structural representation in Fig. 1 at A.
Fig. 3 is the structural schematic diagram that brush coating is carried out to glass cover-plate.
Fig. 4 is the structural schematic diagram that glue brush is provided on movable rotation-shaft.
Fig. 5 is the structural schematic diagram that plaster mechanism draws that glass cover-plate prepares patch.
Fig. 6 is the connection schematic perspective view of sucker fixed block and sucker.
Fig. 7 is the partial enlargement structural representation in Fig. 5 at B.
Fig. 8 is the structural schematic diagram of left locating piece I.
Label character described in figure indicates are as follows: 1, rack；2, cylinder；3, piston rod；4, slide；5, rolling bearing units；6, it watches
Take motor；7, screw axis；8, slide plate；9, plaster mechanism；10, tooth plate；11, gear；12, movable rotation-shaft；13, axle sleeve；14, glue
Brush；15, gumming mechanism；16, patch workbench；17, glass cover-plate；18, wafer；19, left locating piece I；20, sliding slot；21, bullet
Spring；22, right locating piece II；23, left locating piece II；24, UV glue；151, glue loading box；152, support rod；161, through-hole；191, it supports
By face；192, first part；193, second part；194, Part III；231, the conical surface；401, it is open；901, branch manifold clamp；
902, connecting rod；903, gas-tpe fitting；904, sucker fixed block；905, sucker；906, branch pipe；907, patch rack；908, interior
Chamber；909, briquetting；910, gas outlet；911, drying tank；912, gap.
Specific embodiment
In order to make those skilled in the art more fully understand technical solution of the present invention, with reference to the accompanying drawing to the present invention into
Row detailed description, the description of this part be only it is exemplary and explanatory, should not have any limitation to protection scope of the present invention
Effect.
As Figure 1-Figure 8, specific structure of the invention are as follows: it includes rack 1, the patch being arranged in rack 1 work
Platform 16 offers two through-holes 161 for placing wafer 18 and glass cover-plate 17, the rack 1 on the patch workbench 16
Side be fixed with cylinder 2, the piston rod 3 of the cylinder 2 connects slide 4, and the two sides of the slide 4 are equipped with 5 He of rolling bearing units
Servo motor 6, screw axis 7 are mounted on rolling bearing units 5 and servo motor 6, and the screw axis 7 is threadedly coupled with slide plate 8, are passed through
The step of servo motor 6 drives slide plate 8 to be displaced on screw axis 7, realizes intermediate plate and patch, the slide plate 8 passes through opening for slide 4
Mouth 401 is connect with plaster mechanism 9, and the plaster mechanism 9 is located at the upper end of through-hole 161；It is solid on the lower plate of the slide 4
Surely there is tooth plate 10, be provided with movable rotation-shaft 12 in rack 1, the two sides of the movable rotation-shaft 12 are provided with gear 11, pacify on the diameter of axle
Equipped with axle sleeve 13, the gear 11 engages connection with tooth plate 10, pushes gear 11 to rotate by tooth plate 10, is arranged on axle sleeve 13
There is glue brush 14, the gear 11 of rotation drives movable rotation-shaft 12 to rotate, makes glue brush 14 that 24 glue of UV glue is applied to glass cover-plate 17
On, the glue brush 14 is located in the through-hole 161 that glass cover-plate 17 is placed, and brushes convenient for the bottom to glass cover-plate 17
Glue；The lower end of axle sleeve 13 is provided with gumming mechanism 15；Using automatic brush coating, the UV glue amount for making to be applied on glass cover-plate is equal
Matter, 18 height of wafer after patch are consistent.
Preferably, the gumming mechanism 15 is made of glue loading box 151 and support rod 152, is placed in the glue loading box 151
UV glue while autosizing, contains the glue of drippage, ensure that the benefit of 24 glue of cleannes and UV glue of device
With rate.
Preferably, the plaster mechanism 9 includes a manifold clamp 901, connecting rod 902 and patch rack 907, described
Branch manifold clamp 901 and connecting rod 902 are connect with slide plate 8, and patch rack 907 is arranged in connecting rod 902；Positioned at patch rack
Sucker fixed block 904 is arranged in 907 lower end, and the lower end of the sucker fixed block 904 is provided with sucker 905, and gas-tpe fitting 903 is logical
Tracheae is crossed to connect with sucker 905.
Preferably, inner cavity 908 and the gas outlet 910 for being connected to inner cavity 908 are offered in the patch rack 907, it is described
Gas outlet 910 is located at 907 two sides of patch rack, and 906 one end of branch pipe is fixed on branch manifold clamp 901, the other end and patch rack
907 inner cavity 908 is connected to, and the patch rack 907 with inner cavity 908, by being filled with hot wind, is accelerated to wafer after patch
Setting rate after 18 patch of piece.
Preferably, the identical left side of shape is respectively arranged at glass cover-plate 17 and the through-hole 161 of wafer 18 for placing
Locating piece I19 and left locating piece II23 is provided with set opposite with left locating piece II23 at the through-hole 161 for placing wafer 18
The right locating piece II22, the left locating piece I19 and left locating piece II23 set passes through spring 21 and connects patch workbench 16,
And left-hand end is provided with the conical surface 231, and card slot 20, the patch rack 907 are formed between the conical surface 231 and patch workbench 16
Left side be provided with the briquetting 909 matched with the conical surface 231, briquetting 909 pushes left locating piece I19 or left locating piece II23 to glass
Glass cover board 17 and wafer carry out intermediate plate positioning and patch positioning, guarantee that welt flushes in patch, the quality being bonded obtains
The stability of biggish promotion, wafer is enhanced.
Preferably, the shape of the left locating piece I19 and left locating piece II23 be to be formed extending direction it is parallel first
Part 192 and Part III 194, and the second part 193 of connection first part 192 and Part III 194, the second part
193 are vertically arranged with first part 192 and Part III 194.
Preferably, in wafer patch, the patch rack 907 and left locating piece II23, wafer 18, glass cover-plate 17
And a drying tank 911 is formed between patch workbench 16, the drying tank 911 is connected to inner cavity 908 by gas outlet 910,
The hot gas being filled in drying tank, the hot gas being filled with are dried in drying tank around welt side seam, and hot gas is reduced
It distributes, improves the reasonable utilization of heat.
The course of work of the invention:
Manually or mechanically glass cover-plate 17 and wafer 18 are placed on patch workbench 16 by hand, such as Fig. 2, glass cover-plate
17 are placed on left locating piece I19；Such as Fig. 7, wafer 18 is placed in left locating piece 23.Then such as Fig. 1, starts cylinder 2, make piston
Bar 3 bounces back, and slide 4 moves down, and while slide 4 moves down, the rack gear 10 being arranged on slide 4 drives gear 11 to rotate, and drives
Movable rotation-shaft 12 rotates, and the glue brush 14 of rotation carries out brush coating to 17 bottom surface of glass cover-plate, and (height of glue brush 14 works beyond patch
The upper plane of platform 16), for the briquetting 909 positioned at patch rack 907 in decline, briquetting 909 pushes left locating piece I19 to move to right, and supports
It pushes glass cover-plate 17 mobile by face 191, the gap 912 between glass cover-plate 17 and abutment face 191 is made to be converted into fit-state,
Sucker 905 draws glass cover-plate 17 at this time, is clamped to glass cover-plate 17.
Then, starting cylinder 2, slide 4 is pushed to rise to certain position, servo motor 6 starts, and drive screw axis 7 to rotate,
Since to be threadedly coupled, slide plate 8 is moved to right, after reaching the positive upper end of wafer 18, cylinder 2 starts, and slide 4 is made to be displaced downwardly to fixation
Position, as shown in figs. 4 and 7, briquetting 909 push left locating piece II23 mobile, carry out centralized positioning to wafer 18, guarantee patch
Piece flushes, and after patch flushes, patch rack 907 and left locating piece II23, wafer 18, glass cover-plate 17 and patch work
Drying tank 911 is formed between platform 16, is filled with hot wind into drying tank 911, and fitting side seam is dried, it is solidifying after accelerating welt
Gu speed.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or equipment for including a series of elements not only includes those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic
Element.
Used herein a specific example illustrates the principle and implementation of the invention, the explanation of above example
Method and its core concept of the invention are merely used to help understand, the above is only a preferred embodiment of the present invention, are answered
When pointing out due to the finiteness of literal expression, and objectively there is unlimited specific structure, for the common skill of the art
For art personnel, without departing from the principle of the present invention, several improvement, retouching or variation can also be made, can also incited somebody to action
Above-mentioned technical characteristic is combined in the right way；These improve retouching, variation or combination, or the not improved structure by invention
Think and technical solution directly applies to other occasions, is regarded as protection scope of the present invention.
Claims (7)
1. a kind of wafer paster apparatus of optical splitter, which is characterized in that it includes the patch of rack (1), setting on rack (1)
Piece workbench (16) offers two through-holes for placing wafer (18) and glass cover-plate (17) on the patch workbench (16)
(161), the side of the rack (1) is fixed with cylinder (2), and the piston rod (3) of the cylinder (2) connects slide (4), the cunning
The two sides of seat (4) are equipped with rolling bearing units (5) and servo motor (6), and screw axis (7) is mounted on rolling bearing units (5) and servo motor
(6) on, the screw axis (7) is threadedly coupled with slide plate (8), and the slide plate (8) passes through the opening (401) and patch of slide (4)
Mechanism (9) connection, the plaster mechanism (9) are located at the upper end of through-hole (161)；It is fixed on the lower plate of the slide (4)
Have tooth plate (10), be provided in rack (1) movable rotation-shaft (12), the two sides of the movable rotation-shaft (12) be provided with gear (11),
It is equipped on the diameter of axle axle sleeve (13), the gear (11) engages connection with tooth plate (10), and axle sleeve is provided with glue brush on (13)
(14), the glue brush (14) is located in the through-hole (161) that glass cover-plate (17) is placed；It is arranged positioned at the lower end of axle sleeve (13)
There are gumming mechanism (15).
2. a kind of wafer paster apparatus of optical splitter according to claim 1, which is characterized in that the gumming mechanism
(15) it is made of glue loading box (151) and support rod (152), is placed with UV glue in the glue loading box (151).
3. a kind of wafer paster apparatus of optical splitter according to claim 1, which is characterized in that the plaster mechanism
(9) include a manifold clamp (901), connecting rod (902) and patch rack (907), the branch manifold clamp (901) and connection
Bar (902) is connect with slide plate (8), and patch rack (907) is arranged on connecting rod (902)；Positioned at the lower end of patch rack (907)
It is arranged sucker fixed block (904), the lower end of the sucker fixed block (904) is provided with sucker (905), and gas-tpe fitting (903) is logical
Tracheae is crossed to connect with sucker (905).
4. a kind of wafer paster apparatus of optical splitter according to claim 3, which is characterized in that the patch rack
(907) inner cavity (908) and the gas outlet (910) for being connected to inner cavity (908) are offered in, the gas outlet (910) are located at patch
Rack (907) two sides, branch pipe (906) one end are fixed on branch manifold clamp (901), the inner cavity of the other end and patch rack (907)
(908) it is connected to.
5. a kind of wafer paster apparatus of optical splitter according to claim 4, which is characterized in that for placing glass cover
The identical left locating piece I(19 of shape is respectively arranged at the through-hole (161) of plate (17) and wafer (18)) and left locating piece II
(23), the right locating piece being oppositely arranged with left locating piece II(23) is provided at the through-hole (161) for placing wafer (18)
II(22), the left locating piece I(19) and left locating piece II(23) by spring (21) connection patch workbench (16), and
Left-hand end is provided with the conical surface (231), and card slot (20), the patch are formed between the conical surface (231) and patch workbench (16)
The briquetting (909) matched with the conical surface (231) is provided on the left of rack (907).
6. a kind of wafer paster apparatus of optical splitter according to claim 5, which is characterized in that the left locating piece I
(19) and left locating piece II(23) shape be to form the parallel first part of extending direction (192) and Part III (194),
And the second part (193) of connection first part (192) and Part III (194), the second part (193) and first part
(192) it is vertically arranged with Part III (194).
7. a kind of wafer paster apparatus of optical splitter according to claim 5, which is characterized in that in wafer patch,
The patch rack (907) and left locating piece II(23), wafer (18), glass cover-plate (17) and patch workbench (16) it
Between formed a drying tank (911), the drying tank (911) and inner cavity (908) are connected to by gas outlet (910).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821003257.2U CN208596662U (en) | 2018-06-28 | 2018-06-28 | A kind of wafer paster apparatus of optical splitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821003257.2U CN208596662U (en) | 2018-06-28 | 2018-06-28 | A kind of wafer paster apparatus of optical splitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208596662U true CN208596662U (en) | 2019-03-12 |
Family
ID=65602014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821003257.2U Expired - Fee Related CN208596662U (en) | 2018-06-28 | 2018-06-28 | A kind of wafer paster apparatus of optical splitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208596662U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
| CN110620065A (en) * | 2019-08-26 | 2019-12-27 | 石狮市纳傲贸易有限公司 | Wafer processing equipment |
| CN113771375A (en) * | 2021-09-16 | 2021-12-10 | 深圳市阿龙电子有限公司 | Patch device with heat equalization function for intelligent manufacturing of tablet personal computer |
-
2018
- 2018-06-28 CN CN201821003257.2U patent/CN208596662U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
| CN110364464B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic multifunctional paster device and full-automatic paster process |
| CN110620065A (en) * | 2019-08-26 | 2019-12-27 | 石狮市纳傲贸易有限公司 | Wafer processing equipment |
| CN113771375A (en) * | 2021-09-16 | 2021-12-10 | 深圳市阿龙电子有限公司 | Patch device with heat equalization function for intelligent manufacturing of tablet personal computer |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190312 Termination date: 20200628 |