CN208593023U - A kind of sensor outer housing molding die - Google Patents
A kind of sensor outer housing molding die Download PDFInfo
- Publication number
- CN208593023U CN208593023U CN201821152711.0U CN201821152711U CN208593023U CN 208593023 U CN208593023 U CN 208593023U CN 201821152711 U CN201821152711 U CN 201821152711U CN 208593023 U CN208593023 U CN 208593023U
- Authority
- CN
- China
- Prior art keywords
- inclined guide
- guide pillar
- outer housing
- molding die
- sensor outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model embodiment discloses a kind of sensor outer housing molding die, comprising: outside plate comprising bottom plate, top plate and more root posts, the upper end of the column are connect with top plate, and lower end is connect with bottom plate；Inclined guide pillar comprising more upper inclined guide pillars and more lower inclined guide pillars, more upper inclined guide pillar upper ends are connect with top plate, and more lower inclined guide pillar lower ends are connect with bottom plate；Mode comprising multiple upper submodule benevolence and multiple lower submodule benevolence, upper submodule benevolence and upper inclined guide pillar, which correspond, to be socketed, and lower submodule benevolence and lower inclined guide pillar are corresponded and be socketed, and upper submodule benevolence and lower submodule benevolence complement each other to form hermetic type chamber.The utility model has the following beneficial effects: a kind of two modes up and down of sensor outer housing molding die of the utility model include multiple submodule benevolence, in die sinking, it can be moved along inclined guide pillar, replace traditional design of the mavable module core in conjunction with quiet mode, so that mold overall structure is flexible, it is conducive to quickly die sinking and return.
Description
Technical field
The utility model relates to injection mold technology more particularly to a kind of sensor outer housing molding dies.
Background technique
Injection molding is a kind of plastic cast technique, injects molten plastic raw material into mold cavity by pressurizeing, is full of it
Mold cavity forms specified product structure after cooling, and then the production of product is completed in demoulding.It needs in injection moulding process using note
Mould, injection moulding process include injected plastic raw material and die sinking, and the quality of injection mold directly affects the quality to form product.It is existing
It is being usually to open mold after the cooling period, is being ejected product using thimble, die sinking process passes through the inclined guide pillar on sliding equipment
With the mobile separation for realizing mode and product of movable slider, existing mavable module core and quiet mode are usually an entirety, are unfavorable for fast
Speed demoulding.
Utility model content
The purpose of the utility model is to overcome above-mentioned technical deficiencies, propose a kind of sensor outer housing molding die, solve
The technical issues of mavable module core and quiet mode are usually an entirety in the prior art, are unfavorable for fast demoulding.
In order to reach above-mentioned technical purpose, the utility model embodiment provides a kind of sensor outer housing molding die, should
A kind of sensor outer housing molding die includes:
Outside plate comprising bottom plate, top plate and more root posts, the upper end of the column are connect with top plate, and lower end is connect with bottom plate；
Inclined guide pillar comprising more upper inclined guide pillars and more lower inclined guide pillars, more upper inclined guide pillar upper ends are connect with top plate,
More lower inclined guide pillar lower ends are connect with bottom plate；
Mode comprising multiple upper submodule benevolence and multiple lower submodule benevolence, upper submodule benevolence and upper inclined guide pillar, which correspond, to be covered
It connects, lower submodule benevolence and lower inclined guide pillar are corresponded and be socketed, and upper submodule benevolence and lower submodule benevolence complement each other to form hermetic type chamber.
Compared with prior art, the utility model has the following beneficial effects: a kind of sensor outer housing of the utility model
Two modes up and down of molding die include multiple submodule benevolence, die sinking when, can be moved along inclined guide pillar, replace mavable module core with
The traditional design that quiet mode combines is conducive to quickly die sinking and return so that mold overall structure is flexible.
Detailed description of the invention
Fig. 1 is a kind of side view of sensor outer housing molding die provided by the utility model；
Fig. 2 is the drawing in side sectional elevation of Section A-A in Fig. 1.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe.
It is a kind of side view of sensor outer housing molding die provided by the utility model to Fig. 2, Fig. 1 referring to Figure 1；Figure
2 be the drawing in side sectional elevation of Section A-A in Fig. 1.
A kind of sensor outer housing molding die includes: outside plate, ejector retainner plate, inclined guide pillar and mode.
Outside plate includes top plate 11, bottom plate 12 and more root posts 13.13 upper end of column is connect with the edge of top plate 11, lower end
It is connect with the edge of bottom plate 12.
Ejector retainner plate includes upper ejector retainner plate and lower ejector retainner plate.Upper ejector retainner plate includes upper plate body 21 and upper thimble 22, upper plate body
21 are fixedly connected with top plate 11, and upper 11 upper end of thimble is fixedly connected with upper plate body 21, arrange downward.Lower ejector retainner plate includes lower body
23 and lower thimble 24, lower body 23 be fixedly connected with bottom plate 12, lower 24 lower end of thimble is connect with lower body 23, upwardly disposed.
Inclined guide pillar includes more upper inclined guide pillars 31 and more lower inclined guide pillars 32.In the present embodiment, upper inclined guide pillar is under
Inclined guide pillar 32 is four.Upper 31 upper end of inclined guide pillar is connect with 11 4 angles of top plate respectively, and lower end is to gathering at center；It is oblique to lead
32 lower end of column is connect with four angles of bottom plate 12, and upper end is to gathering at center.Upper thimble 22 is divided into four parts, often
A part of corresponding upper inclined guide pillar 31 is parallel.Likewise, lower thimble 24 is also divided into four parts, each section and its
Corresponding lower inclined guide pillar 32 is parallel.
In the present embodiment, mode includes four upper submodule benevolence 41 and four lower submodule benevolence 42, is tiltedly led with upper respectively
Column 31 and lower inclined guide pillar 32 correspond socket.There is half mould chamber in upper 41 upper surface of submodule benevolence, and lower 42 upper surface of submodule benevolence also has half
Type chamber complements each other to form hermetic type chamber.Upper submodule benevolence 41 also offers upper centre hole, upper thimble with upper thimble 22 one-to-one correspondence
Hole and upper 22 transition fit of thimble, upper thimble 22 are inserted into centre hole, when upper submodule benevolence 41 is transported upwards along upper inclined guide pillar 31
When dynamic demoulding, the intracavitary product of type is ejected.Likewise, lower submodule benevolence 42 also offers lower thimble with lower thimble 24 one-to-one correspondence
Hole, lower centre hole and lower 24 transition fit of thimble, lower thimble 24 are inserted into lower centre hole, and submodule benevolence 42 is along lower inclined guide pillar instantly
32 when moving downward demoulding, and the intracavitary product of type is ejected.
Implement the utility model embodiment, has the following beneficial effects: a kind of sensor outer housing molding of the utility model
Two modes up and down of mold include multiple submodule benevolence, in die sinking, can be moved along inclined guide pillar, and mavable module core and quiet mould are replaced
The traditional design that benevolence combines is conducive to quickly die sinking and return so that mold overall structure is flexible.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (5)
1. a kind of sensor outer housing molding die, which is characterized in that a kind of sensor outer housing molding die includes:
Outside plate comprising bottom plate, top plate and more root posts, the upper end of the column are connect with the top plate, lower end and the bottom
Plate connection；
Inclined guide pillar comprising more upper inclined guide pillars and more lower inclined guide pillars, the more upper inclined guide pillar upper ends and the top plate
Connection, the more lower inclined guide pillar lower ends are connect with the bottom plate；
Mode comprising multiple upper submodule benevolence and multiple lower submodule benevolence, the upper submodule benevolence and the upper inclined guide pillar one are a pair of
It should be socketed, the lower submodule benevolence and the lower inclined guide pillar are corresponded and be socketed, and the upper submodule benevolence and the lower submodule benevolence are mutual
Cooperatively form hermetic type chamber.
2. a kind of sensor outer housing molding die according to claim 1, which is characterized in that a kind of sensor outer housing
Molding die further includes upper ejector retainner plate, and the upper ejector retainner plate includes upper plate body and upper thimble, the upper plate body and the top plate
Connection, the upper thimble are arranged downward.
3. a kind of sensor outer housing molding die according to claim 2, which is characterized in that opened up in the upper submodule benevolence
There is upper centre hole, the upper centre hole is slidably connected with the upper thimble.
4. a kind of sensor outer housing molding die according to claim 1, which is characterized in that a kind of sensor outer housing
Molding die further includes lower ejector retainner plate, and the lower ejector retainner plate includes lower body and lower thimble, the lower body and the bottom plate
Connection, the lower thimble are upwardly disposed.
5. a kind of sensor outer housing molding die according to claim 4, which is characterized in that opened up in the lower submodule benevolence
There is lower centre hole, the lower centre hole is slidably connected with the lower thimble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821152711.0U CN208593023U (en) | 2018-07-19 | 2018-07-19 | A kind of sensor outer housing molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821152711.0U CN208593023U (en) | 2018-07-19 | 2018-07-19 | A kind of sensor outer housing molding die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208593023U true CN208593023U (en) | 2019-03-12 |
Family
ID=65603353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821152711.0U Expired - Fee Related CN208593023U (en) | 2018-07-19 | 2018-07-19 | A kind of sensor outer housing molding die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208593023U (en) |
-
2018
- 2018-07-19 CN CN201821152711.0U patent/CN208593023U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190312 Termination date: 20210719 |
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| CF01 | Termination of patent right due to non-payment of annual fee |