CN208592709U - Grinding module and substrate grinding device including it - Google Patents
Grinding module and substrate grinding device including it Download PDFInfo
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- CN208592709U CN208592709U CN201820960598.2U CN201820960598U CN208592709U CN 208592709 U CN208592709 U CN 208592709U CN 201820960598 U CN201820960598 U CN 201820960598U CN 208592709 U CN208592709 U CN 208592709U
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Abstract
A kind of grinding module and the substrate grinding device including it are disclosed, lapping liquid is supplied to substrate by grinding module.Substrate grinding device includes: grinding pad, is set to substrate top, is in contact with the substrate and grinds the substrate；Substrate parts, downside are provided with the grinding pad；Drive shaft is set to the top of the substrate parts；Fluid supply unit is set to the drive shaft, passes through the fluid of the drive shaft supply pressurization grinding pad；And lapping liquid supply unit, lapping liquid is supplied to the surface to be polished of substrate by the flow path different from the fluid supply unit in the drive shaft.
Description
Technical field
Following embodiment is related to a kind of grinding module and the substrate grinding device including it.
Background technique
The manufacture of semiconductor element needs CMP (chemical mechanical polishing, chemical mechanical grinding) to make
Industry, CMP operation include: grinding and polishing (buffing) and clean.Semiconductor element is the form of multilayered structure, and in substrate
Layer is formed with the transistor unit with diffusion zone.In substrate layer, metal line pattern is connected, and to be formed with being electrically connected to
The transistor unit of functional property element.As is well known, patterned conductive layer by the insulating materials such as silica with
The insulation of other conductive layers.Due to forming more metal layers and relative insulating layer, thus make insulating materials it is flat must
The property wanted increases.If being not carried out planarization, due to many variations in configuration of surface, substantially, the manufacture of additional metal layer
It is more difficult.In addition, metal line pattern is formed by insulating materials, excessive metal object is removed by substrate grinding operation.
Existing substrate grinding device is as the composition ground, polished and cleaned for the one or both sides to substrate
Element is provided with mechanical lapping component, and mechanical lapping component includes conveyer belt, grinding pad or brush, using in grinding liquor
Chemical component promote and strengthen grinding operation.
In addition, in general, substrate grinding device realizes grinding in the form of following: to being attached to grinding for grinding flat plate (platen)
While mill pads and be installed on the lapping liquid supplied between the substrate of carrier head including polishing particles, revolved with to same direction
Turn, by the relative rotational between grinding pad and substrate substrate surface is planarized.
The area of substrate becomes larger, and when grinding large-area substrates, is suitble to make to grind the uniformity, well-known side
Formula is, substrate carrier is divided into multiple regions and setting flexible film, by each region apply different pressure come
Control amount of grinding.But even if being split as discussed to substrate carrier, one is maintained in the grinding uniformity for making substrate
Determine and carry out controlling party face there is also the limit, thus needs the mode of new control amount of grinding.
In addition, the size with substrate is gradually larger in area, it is difficult to carry out the base to substrate grinding device and substrate carrier
The loading of plate and unloading to generate delay time, and reduce output (throughput).
In addition, the lapping liquid of grinding base plate is used for the supply of the surface to be polished of substrate in grinding base plate.Existing substrate
Grinding device with grinding module pressurize substrate while rotation and grinding base plate, be set to existing grinding module for plus
The case where fluid flow port of pressure, has because the port of port and supply air for supplying lapping liquid is formed as one
The problem of replacing entire port is needed when a port is damaged.
In particular, with regard to existing for internal corrosion or blocking for supplying the port of lapping liquid, can be generated in lapping liquid characteristic
As it is therefore necessary to regularly replace lapping liquid supply unit, at this point, productivity is low caused by the presence of the interruption due to device
The problem of.Accordingly, truth be need it is a kind of for solving the problems, such as the replacement due to lapping liquid supply unit caused by grinding dress
It sets.
Utility model content
According to embodiment, a kind of substrate grinding device is provided, independently with the fluid flow port for pressurization and for injecting
The lapping liquid supply unit of lapping liquid is connected, readily replaceable lapping liquid supply unit.
The project for wanting to solve in embodiment is not limited to project as described above, and practitioner can be bright from following record
Really understand other projects not referred to.
According to the embodiment of the project for realizing the desired solution, the grinding module of substrate grinding device includes: to grind
Mill pad, is set to substrate top, is in contact with the substrate and grinds the substrate；Substrate parts, downside setting is
State grinding pad；Drive shaft is set to the top of the substrate parts；Fluid supply unit is set to the drive shaft, passes through
The fluid of the drive shaft supply pressurization grinding pad；And lapping liquid supply unit, the drive shaft by with it is described
The different flow path of fluid supply unit supplies lapping liquid to the surface to be polished of substrate.
In addition, according to the embodiment of the project for realizing the desired solution, substrate grinding device includes: base plate transfer
Portion is used to transfer substrate；Grinding module, downside are provided with grinding pad, and grinding pad is contacted with the surface to be polished of substrate and grinds
Grind the substrate；Lapping liquid supply unit is set to the drive shaft of the grinding module, by grinding described in the driving axial
The surface to be polished of pad and the substrate supplies lapping liquid；And driving portion, the drive shaft is rotated, with the driving
Axis rotates and the grinding module is made to carry out swing rotary along with the circle or elliptic orbit of the substrate-parallel.
As described above, according to embodiment, grinding base plate while the grinding pad rotation of quadrangle, and by grinding module to
The surface to be polished of grinding pad and substrate provides lapping liquid.
In addition, being independently connected with fluid supply unit and lapping liquid supply unit, lapping liquid supply unit can be easily carried out
Replacement, fluid supply unit is used for pressure grinding pad, and lapping liquid supply unit is for supplying lapping liquid.
According to the grinding module of one embodiment and the effect of the substrate grinding device including it, it is not limited to the above institute
The content referred to, common technical staff can be clearly understood that other effects not referred to by following record.
Detailed description of the invention
Appended the following drawings exemplifies preferred one embodiment of the utility model in this specification, and originally practical new
The technical idea for being even further appreciated that the utility model is played the role of in the detailed description of type together, therefore should not be construed as this reality
Documented item in the attached drawing is only defined in novel.
Fig. 1 is the perspective view according to the substrate grinding device of one embodiment.
Fig. 2 is in Fig. 1 along the sectional view of the substrate grinding device of II-II line.
Fig. 3 is the enlarged partial sectional figure that axis and fluid supply line body portion are supplied in Fig. 2.
Fig. 4 is the perspective view of fluid supply line body in the grinding module according to one embodiment.
Fig. 5 is the plan view of distribution plate in the grinding module according to one embodiment.
Fig. 6 is the plan view for illustrating the operation of the grinding module according to one embodiment.
Fig. 7 is the major part perspective view for illustrating the driving portion of the grinding module according to one embodiment.
Specific embodiment
It is as follows, embodiment is described in detail by the attached drawing of illustration.It should be noted that, in the structure to each attached drawing
When adding reference numeral at element, although being indicated on different figures identical constituent element, also make as far as possible
Its label having the same.In addition, when explaining the embodiment, being judged as the tool for related known composition or function
Body illustrates the case where interfering the understanding to embodiment, and description is omitted.
In addition, the arts such as first, second, A, B, (a), (b) can be used when the constituent element to embodiment is illustrated
Language.The term is used only for distinguishing this composition element and other constituent elements, and corresponding structure is limited not by term
At element essence sequentially or sequence etc..Some constituent element " connection ", " in conjunction with " or " engagement " is recorded as in other compositions
The case where element, although this composition element can be directly connected to or be engaged in other constituent elements, but it is also possible to be interpreted as,
" connection ", " in conjunction with " or " engagement " has other other constituent elements between each constituent element.
Hereinafter, referring to Figure 1 to Figure 7, being illustrated to substrate grinding device 10 according to the embodiment.As reference, Fig. 1 is
Indicate the perspective view of the part of the substrate grinding device 10 according to one embodiment, Fig. 2 is in Fig. 1 along the substrate of II-II line
The sectional view of grinding device 10.Also, Fig. 3 is 124 part supply axis 123a and fluid supply line body in amplification expression Fig. 2
Sectional view, Fig. 4 are the perspective views of fluid supply line body 124 in the grinding module 12 according to one embodiment.Also, Fig. 5 is root
According to the plan view of distribution plate 220 in the grinding module 12 of one embodiment.Fig. 6 is for illustrating the grinding according to one embodiment
The plan view of the operation of module 12, Fig. 7 are the compositions for illustrating driving portion 128 in the grinding module 12 according to one embodiment
And the major part perspective view of operation.
Referring to attached drawing, substrate grinding device 10 includes: base plate transfer portion 11, is used to transfer substrate 1；Grinding module 12,
It is provided with the grinding pad 121 for grinding base plate 1.
Substrate 1 can be transparent substrate, including for as LCD (liquid crystal display, liquid crystal display),
Panel display apparatus (the flat panel display such as PDP (plasma display panel, plasma display panel)
Device, FPD) glass.But substrate 1 is not limited to this, for example, it may be for manufacturing semiconductor device
The silicon wafer (silicon wafer) of (semiconductor device).Although in addition, showing substrate 1 in figure with four sides
Shape shape, but this is only an illustration, form and dimension of substrate 1 etc. is not limited by attached drawing.
Base plate transfer portion 11 is formed as while and continuously transferring to multiple substrates 1.For example, base plate transfer portion 11 has
There are conveyer belt or conveyer form.Base plate transfer portion 11 is formed as successively transferring at least more than one, it is preferable that successively transfers
Multiple substrates 1.But this is only an illustration, the size and form in base plate transfer portion 11 are not limited by attached drawing, essence
On can carry out multiplicity change.
Grinding module 12 includes the substrate parts 122 and drive shaft 123 for being provided with grinding pad 121.It and include: lapping liquid
Supply unit 126 is used to supply lapping liquid to grinding pad 121 by grinding module 12；Fluid supply unit 127, supply are used for
The fluid of pressure grinding module 12.
Substrate parts 122 are formed with the flow path S1 for supplying lapping liquid in inside, and are provided with distribution plate below
220, so as to supply lapping liquid to grinding pad 121, distribution plate 220 is formed with multiple 221,222,223 (reference figures of spray-hole
5)。
For example, substrate parts 122 have chest form, there is quadrangle or rectangle form below, and formed in inside
There are space or flow path S1, flow path S1 is for supplying lapping liquid.
Distribution plate 220 is constituted below substrate parts 122, is equably divided the lapping liquid of supply by substrate parts 122
It is assigned to grinding pad 121.In addition, distribution plate 220 plays the role of so that the plate that grinding pad 121 adheres to.For example, referring to Fig. 5, distribution
Plate 220 has defined plate shape, and multiple spray-holes 221,222,223 are configured to a column or multiple row, or are configured to zigzag state
Etc. various forms.But the configuration of the spray-hole 221,222,223 of distribution plate 220 and shape are not limited by attached drawing.
Grinding pad 121 is set to the downside facing with substrate 1 in substrate parts 122.Grinding pad 121 has and has rule
The item (bar) or quadrangle form of measured length and width.In addition, grinding pad 121 can have the length and/or width with substrate 1
Spend corresponding quadrangle form.
But this is only an illustration, the shapes and sizes of grinding pad 121 are not limited by attached drawing, substantially may be used
To have the shapes and sizes of multiplicity.For example, grinding pad 121 is not limited to rectangular or square, it can be formed as round or ellipse
It is round.Alternatively, grinding pad 121 can also be formed as multiple rather than 1.
According to one embodiment because the size of grinding pad 121 is smaller than substrate 1, be easy to grinding pad 121 manufacture and
Replacement.In addition, it is few for time loss needed for replacing maintenance/management of grinding pad 121, it is possible thereby to shorten the process time.
In addition, grinding module 12 and grinding pad 121 are formed as the situation bigger than substrate 1, can also equably grinding base plate 1, and can
To shorten milling time.
It is provided with one or more drive shafts 123.In the present embodiment, because the length of grinding module 12 forms longer,
So being provided with multiple drive shafts 123.In addition, being divided into the drive shaft for being formed with grinding liquid pipe 233 in multiple drive shafts 123
It (hereinafter referred to as ' supply axis 123a ') and is illustrated as the drive shaft (hereinafter referred to as ' rotary shaft 123b ') of rotary shaft,
It grinds liquid pipe 233 and supplies lapping liquid to grinding pad 121, rotary shaft is connected with driving portion 128 so that grinding module 12 revolves
Turn.
Supply axis 123a is located at the center of grinding module 12, and rotary shaft 123b can be configured at around supply axis 123a.
But this is only an illustration, rotary shaft 123b can be set in the center of grinding module 12, and supplying axis 123a can also set
It is placed in around rotary shaft 123b.In addition, the position of supply axis 123a and rotary shaft 123b and quantity can carry out the change of multiplicity
More.
3 drive shafts 123 are formed in grinding module 12 here, instantiating in the present embodiment, this is only an illustration,
The change of multiplicity can be substantially carried out to the quantity of drive shaft 123.In addition, instantiate one in drive shaft 123 or
A part grinds the supply axis 123a of liquid pipe 233 to be formed with, and remaining part is rotary shaft 123b, but can also be in institute
There is drive shaft 123 to form grinding liquid pipe 233, thus as supply axis 123a and rotary shaft 123b.
Supply axis 123a is formed with grinding liquid pipe 233, and grinding liquid pipe 233 is by the center of axis body 231 and along supply axis
The length direction of 123a penetrates through.Grinding liquid pipe 233 be the lapping liquid that will be flowed by the lapping liquid supply unit 126 described below to
The flow path that grinding pad 121 provides.Grinding liquid pipe 233 is formed as being connected to lower end, lower end and formation from the upper end of supply axis 123a
Lapping liquid supply line S1 inside substrate parts 122 is connected.
In the present embodiment, the fluid pressure grinding module 12 supplied by fluid supply line body 124, and pass through grinding liquid pipe
233 supply lapping liquids.In addition, grinding liquid pipe 233 and fluid supply line body 124 are formed independently of each other.
Lapping liquid supply unit 126 is connected to grinding head in the form of interchangeable, and can supply and grind to grinding pad 121
Liquid.Lapping liquid supply unit 126 obtains the supply of lapping liquid and is transferred to substrate parts 122 from outside, so as to passing through grinding
The substrate position that pad 121 is ground supplies lapping liquid.Lapping liquid flows between substrate and grinding pad 121, by by grinding
Mechanical friction caused by liquid particles and pad surface bulge carries out the grinding of substrate, meanwhile, the group by constituting lapping liquid can be passed through
It closes chemical reaction caused by object and comes grinding base plate surface.The type of the lapping liquid supplied by lapping liquid supply unit 126 can root
The difference according to the type for the substrate being ground, characteristic, and it is not limited to this.
Lapping liquid supply unit 126 can connect in the upside of grinding head.For example, lapping liquid supply unit 126 can be to pass through
The form of the grinding basad component 122 of liquid pipe 233 supply lapping liquid is connected to drive shaft 123.
According to the construction, lapping liquid supply unit 126 can be by the connection of the fluid feed port 125 for grinding head
The form of the interference at position is connected to grinding head.Lapping liquid supply unit 126 is connected to grinding head in the form of interchangeable, such as connects
It is connected to drive shaft 123, so can only make in the case where not being directed to the separation process of fluid feed port 125 of grinding head
Obtain 126 independent separate of lapping liquid supply unit.
In general, will lead in lapping liquid supply unit 126 for lapping liquid supply unit 126 because of the characteristic of lapping liquid
Portion is corroded, to generate leakage (leak) phenomenon of lapping liquid leakage, pipeline is ground the blocking (clogging) that liquid is blocked
Phenomena such as, need exist to periodic replacement.According to the substrate grinding device 1 of one embodiment, lapping liquid supply unit 126 and fluid
Supply mouth 125 has the structure that separates independently of each other, therefore can also be simply only to grinding even if not separating fluid feed port 125
Grinding fluid supply unit 126 is replaced or repairs.The time needed for repair apparatus is few as a result, so as to improve substrate grinding work
Productivity between skill.
Fluid supply line body 124 combines on the outside of supply axis 123a, fluid feed port 125 and fluid supply unit 127
It is combined with fluid supply line body 124.Here, fluid may include pure water (De-Ionized Water) or air (air).
Referring to Fig. 4, fluid supply line body 124 be set as supply axis 123a with lapping liquid supply unit 126 and lapping liquid
The mutually independent form of pipe 233 supplies fluid.Fluid supply line body 124 is set on coaxial with supply axis 123a, and is formed as wrapping
Enclose the tube shape of the supply periphery axis 123a.Fluid supply line body 124 may include shell 241 and multiple fluid hoses 242.
It is formed with mesoporous 243 inside shell 241, and may be formed to have the cylindrical shape of specified diameter, supplies axis 123a
It is inserted in mesoporous 243.In other words, as supply axis 123a is inserted in inside the mesoporous 243 of shell 241, fluid supply line body
124 shell 241 is combined in the form of surrounding and supplying axis 123a.In addition, though it is not illustrated, being in shell 241
It can be set bearing (bearing is not shown) between inner face and the outside for supplying axis 123a, bearing is used for so that supply axis 123a
Relative rotation be possibly realized, and reduce the frictional force that generates with rotation.
Fluid hose 242 is formed in the inside of shell 241 along the length direction of shell 241, and providing will be from fluid feed port
125 fluids flowed into are guided to the flow path of substrate parts 122.Fluid hose 242 includes: entrance 242a, with fluid feed port 125
It is connected；And outlet 242b, it is connected with substrate parts 122, and fluid hose 242 is formed with along in shell 241
Portion is connected to entrance 242a to the flow path for exporting 242b.Entrance 242a can penetrate through the lateral surface of shell 241 and be formed, and can edge
Formed with mutually different height around shell 241.It is formed below outlet 242b perforation shell 241.
It is formed with multiple fluid hoses 242.In addition, fluid hose 242 along around shell 241 mutually to separate specified interval
Form formed, so as to non-interference.In other words, for fluid hose 242, in the part being connected with substrate parts 122,
Outlet 242b is formed in the form of separating certain intervals along the circumferencial direction on the basis of the center for supplying axis 123a.Accordingly,
With the radial fluid for being fed through multiple fluid hoses 242 and injecting on the basis of the center for supplying axis 123a, and can be to grinding
The omnidirection of pad 121 is equably supplied.
The outside of fluid supply line body 124 is arranged in fluid feed port 125, provides to each fluid hose 242 mutually different
Or same fluid.For example, referring to Fig. 2 and Fig. 3, fluid feed port 125 has 241 knot of shell with fluid supply line body 124
Together in the tube shape on coaxial, it is connected in inside with fluid hose 242.In addition, multiple fluid feed ports 125 are provided with, it is multiple
Fluid feed port 125 can be connected in a manner of the length direction lamination along shell 241.
Here, fluid feed port 125 is connected with fluid supply unit 127 on the outside, in inside and fluid supply line body 124
Fluid hose 242 be connected.In addition, fluid feed port 125 is configured to be connected in inside with a fluid hose 242.Respectively
A fluid feed port 125 can be connected with the multiple fluid hoses 242 for being formed in 241 outside of shell respectively.Pass through each stream as a result,
The fluid that body supply mouth 125 supplies can be supplied by each fluid hose 242 to each position of substrate parts 122.
Rotary shaft 123b is provided with driving portion 128, driving portion 128 makes grinding pad 121 be contacted with 1 surface of substrate
Track rotation (orbital motion) is carried out along round or elliptic orbit under state.
Here, so-called ' track rotation ' refers to that the mobile track of the central point of grinding module 12 forms specified diameter
Circle or ellipse.In the accompanying drawings, the mobile track the center C of grinding module 12 is indicated with ' Tc '.Driving portion 128 to grind
Module 12 is rotated along round or elliptic orbit with fixing speed, i.e. swing (oscillation), thus grinding base plate 1.
Alternatively, driving portion 128 rotates grinding module 12 along round or elliptic orbit, it is also possible that grinding
Grind 12 rotation of module.At this point, so-called 12 rotation of grinding module refers to that the center of grinding module 12 is being fixed on substrate 1
It is rotated under state.In addition, driving portion 128 can also make it along a direction using the center of grinding module 12 as rotary shaft
Or both direction rotates within prescribed limit or it can also be made to be rotated by 360 °.
But this is only an illustration, the operation of grinding module 12 can substantially carry out various change.In addition, driving
Dynamic portion 128 rotates 12 rotation of grinding module or track, at the same time, it can also be made along any in x-axis or y-axis direction
One direction or both direction carry out round-trip linear movement.As described above, grinding module 12 passes through rotation, track rotates and linear
Any one or compound operation in movement and rotate/move, while the comprehensive of substrate 1 can be ground.
Driving portion 128 can make grinding module 12 rotate with certain speed, or be revolved with variable rotation speed
Turn.
Driving portion 128 is connected to the rotary shaft 132b in drive shaft 123.In the center eccentric position with rotary shaft 132b
Eccentric shaft 281 is set, and driving portion 128 is connected to eccentric shaft 281 and is rotated, so that grinding module 12 is to provide
Speed carries out track rotation.But this is only an illustration, driving portion 128 can have so that grinding module 12 is along circle
Or various form that elliptic orbit is rotated.
For embodiment as described above, although the embodiment and attached drawing according to restriction are illustrated, if it is
With the technical staff of common knowledge in technical field, then the modification and change of multiplicity can be carried out from the record
Shape.For example, even if executing system to explanation of illustrated technology and/or person, knot with the sequence different from the method for explanation
The constituent elements such as structure, device, circuit are combined or are combined in the form of different with the method for explanation, or are wanted using differently composed
Element or equipollent are replaced or are replaced, and also may be implemented result appropriate.
Therefore, different realizations, different embodiment and the power described below is belonged to the item of claims equalization
The range of sharp claim.
Label declaration
1: substrate
10: substrate grinding device
11: base plate transfer portion
12: grinding module
121: grinding pad
122: substrate parts
220: distribution plate
221,222,223: spray-hole
123,123a, 123b: drive shaft
231: axis body
233: grinding liquid pipe
124: fluid supply line body
241: shell
242: fluid supply line
243: mesoporous
125: fluid feed port
126: lapping liquid supply unit
127: fluid supply unit
128: driving portion
281: eccentric shaft
S1: lapping liquid flow path
Claims (25)
1. a kind of grinding module, characterized in that it comprises:
Grinding pad is set to substrate top, is in contact with the substrate and grinds the substrate；
Substrate parts, downside are provided with the grinding pad；
Drive shaft is set to the top of the substrate parts；
Fluid supply unit is set to the drive shaft, passes through the fluid of the drive shaft supply pressurization grinding pad；And
Lapping liquid supply unit, in the drive shaft, by the flow path different from the fluid supply unit, to being ground for substrate
Face supplies lapping liquid.
2. grinding module according to claim 1, which is characterized in that
The drive shaft is formed with grinding liquid pipe, and lapping liquid is tubular to become length direction along the drive shaft from the driving
The upper end of axis is penetrated through to lower end, for supplying lapping liquid,
The upper end of the grinding liquid pipe is connected with the lapping liquid supply unit, and lower end is connected with the substrate parts.
3. grinding module according to claim 2, which is characterized in that
The lapping liquid supply unit by with the grinding liquid pipe it is dismountable in the form of formed.
4. grinding module according to claim 1, which is characterized in that
It further include fluid supply line body, fluid supply line body is set to the drive shaft, by grinding described in the driving axial
Pad supply fluid,
The fluid supply line body is to have coaxial form with the drive shaft and around the shape of the periphery of the drive shaft
Formula is formed.
5. grinding module according to claim 4, which is characterized in that the fluid supply line body includes:
Shell, is formed with mesoporous, and the drive shaft is inserted in mesoporous；And
Fluid hose is formed in the interior of shell, provides the flow channel of fluid, so that fluid is supplied to the basal part
Part.
6. grinding module according to claim 5, which is characterized in that
Multiple fluid hoses are formed with,
The multiple fluid hose is configured on the basis of the center of the drive shaft along the circumferencial direction of shell at certain intervals.
7. grinding module according to claim 6, which is characterized in that
The entrance of the fluid hose is formed in the outer peripheral surface of the shell, and outlet is connected with the substrate parts.
8. grinding module according to claim 7, which is characterized in that
The entrance of the fluid hose is formed in the outer peripheral surface of the shell with mutually different height.
9. grinding module according to claim 7, which is characterized in that
The outlet of the fluid hose on the basis of the center of the drive shaft, along shell circumferencial direction at certain intervals
It is formed.
10. grinding module according to claim 7, which is characterized in that
It further include fluid feed port, fluid feed port supplies fluid to the fluid supply line body,
The fluid feed port is connected with the entrance of the fluid hose.
11. grinding module according to claim 10, which is characterized in that
The entrance of the fluid hose is formed in the outer peripheral surface of the shell with mutually different height,
It is formed with the multiple fluid feed ports being connected respectively with the entrance.
12. grinding module according to claim 1, which is characterized in that
It further include distribution plate, distribution plate is set to the downside of the substrate parts,
The distribution plate is formed with multiple spray-holes, and spray-hole divides the lapping liquid supplied from the lapping liquid supply unit
Match.
13. grinding module according to claim 1, which is characterized in that
The grinding pad is with any one shape in rectangle, square, polygon, circle, ellipse.
14. grinding module according to claim 1, which is characterized in that
It further include driving portion, driving portion is so that the grinding pad is carried out in the form that the state being in contact with the substrate rotates
Driving,
The driving portion makes the grinding pad carry out the circular orbit rotation or elliptic orbit rotation parallel with the substrate surface.
15. grinding module according to claim 14, which is characterized in that the driving portion further include:
Eccentric shaft, setting with the drive shaft eccentric position.
16. a kind of substrate grinding device including grinding module, characterized in that it comprises:
Base plate transfer portion is used to transfer substrate；
Grinding module, downside are provided with grinding pad, and grinding pad is in contact with the surface to be polished of substrate and grinds the substrate；
Lapping liquid supply unit is set to the drive shaft of the grinding module, passes through grinding pad described in the driving axial and institute
State the surface to be polished supply lapping liquid of substrate；And
Driving portion rotates the drive shaft, with the drive shaft rotate and make the grinding pad along with it is described
The circle or elliptic orbit of substrate-parallel carry out swing rotary.
17. the substrate grinding device according to claim 16 including grinding module, which is characterized in that the grinding module
Include:
Substrate parts are provided with the grinding pad and provide the space so that lapping liquid flowing internal；And
The downside of the substrate parts is arranged in distribution plate, is formed with multiple spray-holes, and multiple spray-holes are described for distributing
Lapping liquid.
18. the substrate grinding device according to claim 17 including grinding module, which is characterized in that
The grinding pad is with any one shape in rectangle, square, polygon, circle, ellipse.
19. the substrate grinding device according to claim 17 including grinding module, which is characterized in that
It is formed with grinding liquid pipe, grinding liquid pipe is to supplying grinding along the length direction of the drive shaft inside the drive shaft
Liquid,
Tubular become of the lapping liquid penetrates through from the upper end of the drive shaft to lower end, and the upper end of the grinding liquid pipe is ground with described
Grinding fluid supply unit is connected, and lower end is connected with the substrate parts.
20. the substrate grinding device according to claim 17 including grinding module, which is characterized in that further include:
Fluid supply line body, to be set to the outer peripheral surface of the drive shaft with coaxial form；
Fluid feed port is incorporated into the outer peripheral surface of the drive shaft, is supplied by the fluid supply line body to the grinding pad
To fluid,
The fluid feed port is connected to the fluid supply line body.
21. the substrate grinding device according to claim 20 including grinding module, which is characterized in that the fluid supply
Tube body includes:
Shell, there is coaxial form and the periphery to surround the drive shaft with the drive shaft in the form of be formed with
Hole；And
Multiple fluid hoses are formed in the inside of the shell, provide the flow channel of fluid,
Multiple fluid feed ports are formed in the form being connected respectively with the multiple fluid hose.
22. the substrate grinding device according to claim 21 including grinding module, which is characterized in that
The multiple fluid feed port is to be set to the periphery of the fluid supply line body with coaxial form, along the stream
Body supplies the length direction lamination setting of tube body.
23. the substrate grinding device according to claim 22 including grinding module, which is characterized in that
The entrance of the fluid hose is formed in the outer peripheral surface of the shell, and outlet is connected with the substrate parts,
The entrance of the fluid hose with the form that is connected with the multiple fluid feed port the shell outer peripheral surface with phase
Mutually different height is formed.
24. the substrate grinding device according to claim 23 including grinding module, which is characterized in that
The outlet of the fluid hose on the basis of the center of the drive shaft, along shell circumferencial direction at certain intervals
It is formed,
The outlet of the fluid hose is formed in the inside of the drive shaft, and is formed and the lapping liquid for supplying lapping liquid
Manage mutually independent flow path.
25. the substrate grinding device according to claim 16 including grinding module, which is characterized in that the driving portion is also
Include:
Eccentric shaft, setting with the drive shaft eccentric position.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20170181095 | 2017-12-27 | ||
| KR10-2017-0181095 | 2017-12-27 | ||
| KR1020180032660A KR102529415B1 (en) | 2017-12-27 | 2018-03-21 | Polishing module and substrate polishing apparatus having the same |
| KR10-2018-0032660 | 2018-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208592709U true CN208592709U (en) | 2019-03-12 |
Family
ID=65601713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820960598.2U Active CN208592709U (en) | 2017-12-27 | 2018-06-21 | Grinding module and substrate grinding device including it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208592709U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111558865A (en) * | 2020-05-23 | 2020-08-21 | 安徽财经大学 | Surface grinding device and method for large-size TFT-LCD glass substrate |
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2018
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111558865A (en) * | 2020-05-23 | 2020-08-21 | 安徽财经大学 | Surface grinding device and method for large-size TFT-LCD glass substrate |
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