CN208589535U - LCP single-layer or multi-layer plate antenna - Google Patents
LCP single-layer or multi-layer plate antenna Download PDFInfo
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- CN208589535U CN208589535U CN201820451947.8U CN201820451947U CN208589535U CN 208589535 U CN208589535 U CN 208589535U CN 201820451947 U CN201820451947 U CN 201820451947U CN 208589535 U CN208589535 U CN 208589535U
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Abstract
The utility model relates to a kind of LCP single-layer or multi-layer plate antennas, and a kind of LCP multi-layer board antenna, the LCP multi-layer board antenna is successively by metallic circuit layer, LCP layer, metallic circuit layer, LCP layer, the intermediate LCP lamina of metallic circuit layer ..., LCP layer, metallic circuit layer, LCP layer, metallic circuit layer ... LCP layer, metallic circuit layer composition, the multilayer circuit board offers hole, conductive seed layer is formed in the bottom of the metallic circuit layer and the hole wall in the hole, and the metallic circuit layer is removed by the partial region of metal foil layer and is formed, wherein the conductive seed layer includes the ion implanted layer being injected into the surface LCP and below the hole wall in the hole by ion implantation, it further include that sinking above the ion implanted layer is deposited on by plasma-deposited or magnetron sputtering deposition method Lamination, wherein the hole includes the through-hole through entire multi-layer board antenna, and through one or more layers LCP layer for connecting the blind hole of the metallic circuit layer.
Description
Technical field
The utility model relates to a kind of single-layer or multi-layer plate antennas of liquid crystal polymer (LCP) substrate, and it is suitable for high frequencies
It communicates (>=3GHz).
Background technique
In recent years, all smart machines such as smart phone, in order to realize the high quality of signal transmission, high stable and high speed
Etc. characteristics, the frequency range used is higher and higher, and speed is getting faster, and then antenna material is required to have high-frequency high-speed characteristic.However,
Traditional Kapton since loss is high, Insertion Loss greatly without being suitably applied high frequency (>=3GHz), but LCP film due to
Favored extensively with low-k, low-dielectric loss, low water absorption and high heat resistance, and takes the lead in being applied to hand
Machine antenna, such as iPhone X antenna for mobile phone.
Processing technology of flexible printed circuit board (FPC) technique as antenna, have lamina antenna and multi-layer board antenna it
Point.Specifically, lamina is the single layer FPC formed using LCP flexibility coat copper plate (FCCL) by FPC processing procedure, and such as Fig. 1
Shown, multi-layer board equally uses LCP FCCL to form single layer FPC1, presses single side copper foil LCP FCCL, by 4, mesoporous metal of drilling
Change forms hole copper 3, press dry film, exposure, development, etching, forms route 6, successively adds up, and forms multi-layer board, wherein LCP can be straight
It connects and serves as bonding sheet, can also be bonded single side copper foil LCP FCCL and core plate using high frequency adhesion glue 7 in bonding, such as Fig. 2
It is shown.
During forming lamina antenna and multi-layer board antenna using the technique of the prior art, to hole metallization
When, the binding force between copper electroplating layer 3 and hole wall is poor, and layers of copper 3 is easy to be detached from from hole wall, forms open circuit, causes electrical property failure.
In addition, the minimum-value aperture for the micropore for using the prior art to produce in copper-clad plate is 20-50 μm, when aperture is less than
At 20 μm, the radius-thickness ratio that can generate hole is excessively high and the problems such as hole wall layers of copper is uneven occurs in heavy copper and plating.In micropore area
In domain, current density, which is unevenly distributed, will lead to the deposition rate that copper is greater than hole wall and bottom in the deposition rate of micropore surface.
Therefore, it is easy to form hole or crack during the deposition process, the copper thickness for also resulting in hole surface is greater than the copper thickness of hole wall, causes electricity
Property is uneven, to be unsuitable for high-frequency communication.
Therefore, a kind of new LCP multi-layer board antenna and its manufacturing method are needed, at present to solve traditional LC P multi-layer board day
Defect caused by line and its manufacturing method.
Utility model content
In order to solve the deficiency of LCP multi-layer board antenna in the prior art, the utility model provides a kind of LCP lamina day
Line and a kind of LCP multi-layer board antenna.
The utility model technical scheme applied to solve the technical problem 1 is a kind of LCP lamina antenna, by LCP layer
It is formed with the metallic circuit layer for being located at the upper and lower two sides of the LCP layer, the single layer board offers hole, in the metal wire
The hole wall in the bottom of road floor and the hole is formed with conductive seed layer, and the metallic circuit layer is by the part of metal foil layer
Region is removed and is formed, wherein the conductive seed layer include be injected into the surface LCP by ion implantation and
Ion implanted layer below the hole wall in the hole, further include be deposited on by plasma-deposited or magnetron sputtering deposition method it is described
Sedimentary above ion implanted layer wherein the hole includes the through-hole through the entire lamina antenna, and runs through institute
State the blind hole for being used to connect the metallic circuit layer of LCP layer.
The utility model technical scheme applied to solve the technical problem 2 is a kind of LCP multi-layer board antenna, successively by metal
The intermediate LCP lamina of line layer, LCP layer, metallic circuit layer, LCP layer, metallic circuit layer ..., LCP layer, metallic circuit layer,
LCP layer, metallic circuit layer ... LCP layer, metallic circuit layer composition, the multilayer circuit board offers hole, in the metal wire
The hole wall in the bottom of road floor and the hole is formed with conductive seed layer, and the metallic circuit layer is by the part of metal foil layer
Region is removed and is formed,
Wherein the conductive seed layer includes being injected into the surface LCP by ion implantation and the hole in the hole
Ion implanted layer below wall further includes being deposited on the ion implanted layer by plasma-deposited or magnetron sputtering deposition method
The sedimentary of top,
Wherein the hole includes the through-hole through the entire multi-layer board antenna, and runs through one or more layers described LCP
The blind hole for being used to connect the metallic circuit layer of layer.
The LCP multi-layer board antenna according to technical solution 2 of technical solution 3., which is characterized in that the ion implanted layer
For the doped layer by the ion implanting to be formed between the metallic of injection and LCP molecule.
The LCP multi-layer board antenna according to technical solution 3 of technical solution 4., which is characterized in that the doped layer is from institute
The depth of the hole wall and/or the outer surface of stating hole being partially submerged into inside the LCP film is 5 ~ 30nm.
The LCP multi-layer board antenna according to technical solution 3 of technical solution 5., which is characterized in that the doped layer from
Subcategory is Cr, Ni, Ti, Mo, Mn, Nb and two or more alloy in them.
The LCP multi-layer board antenna according to technical solution 2 of technical solution 6., which is characterized in that the sedimentary at
It is divided into Cr, Ni, Ti, Mo, Mn, Nb, Cu and two or more alloy in them.
The LCP multi-layer board antenna according to technical solution 2 of technical solution 7., which is characterized in that the LCP multi-layer board
Antenna is no glue or has glue, wherein the LCP film directly serves as bonding sheet in the no glue LCP multi-layer board antenna, and
Have in glue LCP multi-layer board antenna described, the setting of high frequency binding glue the center LCP is mono- and/or multi-layer board and its upper and lower two
Between the LCP film of side.
The LCP multi-layer board antenna according to technical solution 2 of technical solution 8., which is characterized in that the LCP multi-layer board
Antenna further include be formed in via plating on the conductive seed layer with a thickness of 2 μm ~ 72 μm of copper foil.
The LCP multi-layer board antenna according to technical solution 2 of technical solution 9., which is characterized in that the metallic circuit layer
Via press dry film, exposure, development, etching formed.
The LCP multi-layer board antenna according to technical solution 9 of technical solution 10., which is characterized in that the metallic circuit
Line width and line-spacing be 50 μm ~ 500 μm.
Compared with the prior art, the LCP multi-layer board antenna of the utility model has the advantages that.In obtained nothing
Glue/have in glue LCP multi-layer board antenna, ion implanted layer facilitates between LCP film and conductive seed layer to form biggish knot
With joint efforts, and then obscission is reduced or eliminated, and can makes the surface of conductive seed layer that there is the good uniformity and densification
Property, it is not easy to there is pin-hole phenomena.In addition, the thickness of ion implanted layer is usually relatively thin, electric conductivity is not good enough, and it is plasma-deposited
Layer can be improved the electric conductivity of conductive seed layer, so as to improve the high frequency performance of gained LCP multi-layer board antenna.In addition, in micropore
When metallization, the problems such as being not in hole wall conductor layer uneven and hole or crack, it is thus possible to effectively improve metal
Change the electric conductivity in hole, and then improves signal transmission and reduction loss of signal rate of the LCP multi-layer board antenna during high-frequency communication.
Furthermore it is superimposed LCP multi-layer board prepared by LCP film as centrally located LCP mono-/multi- laminate and on it
Each of all have conductive seed layer at a part on surface and hole wall, therefore compared to multi-layer board is laminated after
Drill again and make hole metallization some manufacture multilayer circuit boards method, it can be ensured that for high-frequency communication (>=3GHz),
Enough substrate surfaces and hole wall with conductive seed layer, to further increase the signal transporting of LCP multi-layer board antenna
Energy.
Detailed description of the invention
After reading the following detailed description referring to attached drawing, the utility model is will be better understood in those skilled in the art
The features, aspects and advantages of these and other.For the sake of clarity, the drawings are not necessarily drawn to scale, but some of them
Part may be exaggerated to show detail.In all the appended drawings, identical reference label indicates the same or similar part,
Wherein:
Fig. 1 is traditional schematic cross-section without glue LCP multi-layer board antenna according to prior art；
Fig. 2 is the schematic cross-section that tradition has glue LCP multi-layer board antenna according to prior art；
Fig. 3 is schematic cross-section of the ion implantation according to the present utility model without glue LCP multi-layer board antenna；And
Fig. 4 is the schematic cross-section that ion implantation according to the present utility model has glue LCP multi-layer board antenna.
Reference label:
1 single layer FPC
2 LCP films
3 copper foils
4 holes
6 metallic circuits
7 high frequency adhesion glue
10 LCP laminas
11 LCP films
12 LCP film surfaces
13 conductive seed layers
131 doped layers (ion implanted layer)
132 sedimentaries
14 conductor thickening layers
16 metallic circuits
17 holes
19 hole walls
20 high frequency adhesion glue.
Specific embodiment
The utility model is described in more detail below in conjunction with specific embodiment.Those skilled in the art should
Understand, these descriptions only list some specific embodiments of the utility model, to the utility model and its protection scope without
Any restrictions.
In addition, when introducing the element of various embodiments of the application, the article " one ", "one", "the" and " described " meaning
Figure indicates to deposit in the component one or more.Term "include", "comprise" and " having ", which are intended that, includes, and indicates
The add ons other than the element listed may be present.
The method according to the present utility model for manufacturing LCP multi-layer board antenna is described in detail presently in connection with Fig. 3 and Fig. 4, with
And the embodiment of resulting LCP multi-layer board antenna, wherein Fig. 3 is the ion implantation according to the utility model without glue LCP multilayer
The schematic cross-section of plate antenna, and Fig. 4 is to have the section of glue LCP multi-layer board antenna to show according to the ion implantation of the utility model
It is intended to.
In the first step of this method, in the manufacturing process of metal circuit board, usually using insulating materials as base
Material, on the single or double of the substrate composite material and it is etched to be made circuit board.In the embodiment
In, select LCP film 11 as substrate, the thickness of the LCP film 11 can be 25 ~ 100 μm.
Then, it drills 17 on LCP film 11, forms LCP film 11 with holes, which may include through-hole and/or blind
Hole.The shape in hole 17 can be the various shapes such as circle, rectangle, triangle, diamond shape, trapezoidal shape.Drilling can use
Machine drilling, punching, laser boring, plasma etching and reactive ion etching etc. carry out, and wherein laser boring can wrap again
Infrared laser punching, YAG laser boring and ultraviolet laser drilling are included, aperture can be formed on LCP film 11 and reach 25 μm ~ 1mm
Micropore 17.
It in the second step of this method, is formed after hole 17 on LCP film 11, device to hole 17 is cleaned, to remove
The impurity such as drilling cuttings present in it.Specifically, carrying out Hall source to the LCP film 11 for being equipped with hole 17 before ion implanting
Plasma clean can also carry out decontamination, surface cleaning, hole sealing agent processing, surface lodgment to the substrate for offering hole 17
The pre-treatments such as reason.
In the third step of this method, conductive seed layer is formed at the hole wall 19 in the surface of LCP film 11 12 and hole 17
Layer 13.The formation includes the hole wall that conductive material is injected into surface 12 lower section and hole 17 of LCP film 11 by ion implanting
19 lower sections, to form ion implanted layer, that is, doped layer 131, at least part as conductive seed layer 13.
The formation of ion implanted layer 131 can be realized by the following method: use conductive material as target, in vacuum ring
In ion implantation device under border, the ionization of the conductive material in target is set to generate ion by arcing, then in high electricity
Make the ion acceleration under the electric field of pressure and obtains very high energy, for example, 1 ~ 1000keV.The conductive material ion of high energy is then
The surface 12 of LCP film 11 and the hole wall 19 in hole 17 are directly impinged with very high speed, and are injected into 11 surface of LCP film
12 and the certain depth in the lower section of hole wall 19, such as 1 ~ 500nm.In the material of the conductive material ion and composition LCP film that are injected
Stable doped structure is formd between material, as the doped structure in semiconductor.The doped structure is (that is, ion implanting
The outer surface of layer 131) is flush with 11 surface 12 of LCP film or hole wall 19, and its inner surface is deep into the interior of LCP film 11
Portion.As example, the ion of conductive material can obtain the energy of 15 ~ 40keV during ion implanting, and can be injected into
19 5 ~ 30nm of lower section of 11 surface 12 of LCP film and hole wall；In addition, the ion concentration of ion implanted layer 131, that is, injection metering can
It is 1 ~ 5 × 1014A/cm2, and injection length is 30s ~ 3min.
Various metals, alloy, conductive oxide, conductive carbide, conductive organic matter etc. can be used as ion implanting
Conductive material, but be not restricted to that this.Preferably, carried out using the metal or alloy strong with substrate molecule binding force from
Son injection, two or more alloy including Cr, Ni, Ti, Mo, Mn, Nb etc. and in them.Moreover, ion implanted layer
131 may include one or more layers.
During ion implanting, the ion of conductive material is forcibly injected into the inside of substrate with very high speed, with base
Stable doped structure is formed between material, is equivalent to below substrate surface and hole wall and is formd large number of foundation pile.Due to
The presence of foundation pile, and subsequent metal layer (plasma deposited layers 132 or conductor thickening layer 14) obtained is connected with foundation pile, because
This, substrate and the peel strength being subsequently formed between metal layer thereon can achieve 0.5N/mm or more, such as in 0.7-
Between 1.5N/mm, more specifically between 0.8-1.2N/mm.Moreover, the size of the conductive material ion for ion implanting
Usually Nano grade is distributed incident angular difference that is relatively uniform, and arriving substrate surface 12 and hole wall 19 during ion implanting
Not not less.It is accordingly possible to ensure the subsequent conductor thickening layer 14 or plasma deposited layers formed above ion implanted layer 131
132 have the good uniformity and compactness, it is not easy to pin-hole phenomena occur.In addition, being easy in micropore metal in hole wall
The conductive seed layer 13 of surface even compact, and the conductor thickness of the conductor layer thickness of hole wall 19 and substrate surface are formed on 19
The ratio of degree can reach 1:1, therefore be not in uneven hole wall conductor layer and hole or crack in subsequent electro-coppering etc.
The problems such as, the electric conductivity of plated through-hole can be effectively improved.
Other than ion implanting, third step can also include by it is plasma-deposited by conductive material deposit to from
Sub- 131 top of implanted layer, to form plasma deposited layers 132, the plasma deposited layers 132 and ion implanted layer 131 1
With composition conductive seed layer 13.
Specifically, plasma-deposited carried out by the way of similar with ion implanting, only in the course of work
It is middle to apply lower acceleration voltage.That is, equally under vacuum conditions, being passed through using conductive material, especially Cu as target
Arcing makes the conductive material in target ionize and generate ion, and the ion acceleration is then driven under electric field action and is obtained
Certain energy deposits on the surface of substrate and metallic circuit and constitutes plasma deposited layers 132, wherein plasma
Conductive material used by depositing is Cr, Ni, Ti, Mo, Mn, Nb, Cu etc. and two or more alloy in them.?
Plasma-deposited period can make the ion of conductive material obtain 10 ~ 50 eV (examples by adjusting the acceleration voltage of electric field
Such as 10,15,20,30,50eV) energy, and control ion deposition time, deposition current, deposition rate etc. can be passed through
And it obtains with a thickness of the plasma deposited layers of (such as 20,50,80,100,120,140,180,200nm etc.) 20 ~ 200 nm
132, and it is plasma-deposited after LCP measurement sheet resistance be 0.1 Ω/cm2~30Ω/cm2, wherein sedimentation time can be 30s
~ 6min, deposition current can be 40 ~ 70A, and deposition rate can be 20 ~ 30nm/min.
In plasma-deposited period, conductive material ion flies to substrate surface 12 and hole wall 19 at a relatively high speed and deposits
To being formed on the ion implanted layer 131 of substrate surface 12 and the lower section of hole wall 19, with the conductive material in ion implanted layer 131 it
Between form biggish binding force, thus be not easy to fall off from substrate surface and hole wall.In addition, being used for plasma-deposited conduction
The size of material ions is usually Nano grade, more uniform in the distribution of plasma-deposited period, and arrives substrate surface 12
It is little with the incidence angle difference of hole wall 19, so can ensure resulting plasma deposited layers 132 or be subsequently formed thereon
Conductor thickening layer 14 have the good uniformity and compactness, it is not easy to there is pin-hole phenomena.In addition, ion implanted layer 131
Thickness it is usually relatively thin, electric conductivity is not good enough, and plasma deposited layers 132 can be improved the electric conductivity of conductive seed layer 13, from
And improve the performance of gained circuit board.
Certainly, plasma-deposited to can be replaced magnetron sputtering, that is, sedimentary 132 can be formed by magnetron sputtering.As
Example, in the operation of specific magnetron sputtering, sputtering current can be 2 ~ 8A, and sputtering voltage can be 250 ~ 500V, sputter rate
It can be 40 ~ 120nm/min, and sputtering time can be 20 ~ 3min.
In the four steps of this method, is forming a thin layer conductive seed layer 13 and then adding by what is be such as electroplated
Thick mode is post-processed, and to form certain thickness copper foil 14, and then forms the two-sided LCP flexible copper-clad for having hole metallization
Plate, wherein 14 thickness of electro-coppering can be 2 μm ~ 72 μm, and the electric current sealing being electroplated can be 2 ~ 3 ASD.Then, LCP is soft
Property copper-clad plate by pressing dry film, exposure, development, etching form metallic circuit layer, that is, LCP lamina antenna 10, wherein the list
The line width and line-spacing of laminate 10 can be 50 μm ~ 500 μm, and its layer on surface of metal roughness can be 20nm ~ 0.4 μm.
In the 5th step of this method, in order to further construct LCP multi-layer board antenna, it is being formed by LCP lamina
LCP film 11 is placed on the upper and lower two sides of antenna 10, and via high-temperature laminating that they are laminated together.Then, similarly,
Via the step similar to first to fourth step, that is, by drilling, the cleaning of Hall source, ion implanting, it is plasma-deposited and/
Or magnetron sputtering, plating form surface and hole wall covers copper, using press dry film, exposure, development, etching form metallic circuit 16,
It successively adds up, ultimately forms no glue LCP multi-layer board antenna, wherein similarly, multiple-plate line width and line-spacing can be 50 μm
~ 500 μm, and its layer on surface of metal roughness can be 20nm ~ 0.4 μm.
Certainly, other than the LCP lamina antenna 10 shown in Fig. 3 directly serves as bonding sheet, in LCP lamina antenna
10 and be disposed thereon, laminated between the LCP film 11 of lower two sides can be realized via high frequency binding glue 20 therebetween is placed,
And then it is formed with glue LCP multi-layer board antenna, as shown in Figure 4.
As shown in figure 3, the LCP multi-layer board antenna as made from the above method includes center LCP mono- and/or multi-layer board and position
In the center LCP is mono- and/or the LCP film 11 of the upper and lower two sides of multi-layer board, the center LCP is mono- and/or multi-layer board and institute
The LCP multi-layer board antenna obtained has drilled through hole 17, and is formed in a part of outer surface 12 with conductive seed layer 13
Metallic circuit 16, conductive seed layer 13 include being embedded into 19 lower section of hole wall in hole 17 and mixing for the beneath portions of outer surface 12
Diamicton 131, and be arranged in doped layer 131 top and the sedimentary 132 closely coupled with doped layer 131.Certainly, the 4th
When step does not include plasma-deposited and/or magnetron sputtering, conductive seed layer 13 is just only made of ion implanted layer 131.
Finally, in obtained no glue/have in glue LCP multi-layer board antenna, ion implanting facilitate LCP film 11 with lead
Biggish binding force is formed between electric seed layer 13, and can make conductive seed layer 13 surface have the good uniformity and
Compactness, it is not easy to pin-hole phenomena occur.In addition, the thickness of ion implanted layer is usually relatively thin, electric conductivity is not good enough, and plasma
Sedimentary can be improved the electric conductivity of conductive seed layer.In addition, being not in that hole wall conductor layer is uneven in micropore metal
And the problems such as hole or crack, it is thus possible to effectively improve the electric conductivity of plated through-hole.
Furthermore it is superimposed LCP multi-layer board prepared by LCP film 11 as centrally located LCP lamina 10 and on it
Each of all have conductive seed layer 13 at a part on surface 12 and hole wall 19, therefore compared to by multi-layer board layer
The method for pressing some manufacture multilayer circuit boards for drilling and making hole metallization again later, can further increase LCP multi-layer board day
The signal transmission performance of line.
Above-described content is only referred to the preferred embodiment of the utility model.However, the utility model not by
It is limited to specific embodiment described in the text.Those skilled in the art will readily occur to, in the main idea for not departing from the utility model
In range, these embodiments can be carried out with various obvious modifications, adjustment and replacement, to make it fit in specific feelings
Shape.It in fact, the protection scope of the utility model is defined by the claims, and may include that those skilled in the art can be pre-
The other examples expected.If such other examples have the structural element with the literal language indifference of claim, or
If they include the equivalent structural elements for having non-limiting difference with the literal language of claim to person, they will be fallen
In scope of protection of the claims.
Claims (10)
1. a kind of LCP lamina antenna is made of, institute LCP layer and the metallic circuit layer positioned at the upper and lower two sides of the LCP layer
It states single layer board and offers hole, be formed with conductive seed layer in the bottom of the metallic circuit layer and the hole wall in the hole,
And the metallic circuit layer is removed by the partial region of metal foil layer and is formed,
Wherein the conductive seed layer includes being injected into the surface LCP and under the hole wall in the hole by ion implantation
The ion implanted layer of side further includes being deposited on above the ion implanted layer by plasma-deposited or magnetron sputtering deposition method
Sedimentary,
Wherein the hole includes the through-hole through the entire lamina antenna, and through the LCP layer for connecting institute
State the blind hole of metallic circuit layer.
2. a kind of LCP multi-layer board antenna, successively by metallic circuit layer, LCP layer, metallic circuit layer, LCP layer, metallic circuit
Layer ... intermediate LCP lamina, LCP layer, metallic circuit layer, LCP layer, metallic circuit layer ... LCP layer, metallic circuit layer group
At the multilayer circuit board offers hole, is formed with conductive seed in the bottom of the metallic circuit layer and the hole wall in the hole
Crystal layer, and the metallic circuit layer is removed by the partial region of metal foil layer and is formed,
Wherein the conductive seed layer includes being injected into the surface LCP and under the hole wall in the hole by ion implantation
The ion implanted layer of side further includes being deposited on above the ion implanted layer by plasma-deposited or magnetron sputtering deposition method
Sedimentary,
Wherein the hole includes the through-hole through the entire multi-layer board antenna, and through LCP layer described in one or more layers
For connecting the blind hole of the metallic circuit layer.
3. LCP multi-layer board antenna according to claim 2, which is characterized in that the ion implanted layer be by it is described from
Doped layer of the son injection to be formed between the metallic of injection and LCP molecule.
4. LCP multi-layer board antenna according to claim 3, which is characterized in that the doped layer from the hole wall in the hole and/
Or the depth being partially submerged into inside the LCP film on the surface LCP is 5 ~ 30nm.
5. LCP multi-layer board antenna according to claim 3, which is characterized in that the ionic species of the doped layer be Cr,
Ni, Ti, Mo, Mn, Nb and two or more alloy in them.
6. LCP multi-layer board antenna according to claim 2, which is characterized in that the ingredient of the sedimentary be Cr, Ni, Ti,
Mo, Mn, Nb, Cu and two or more alloy in them.
7. LCP multi-layer board antenna according to claim 2, which is characterized in that the LCP multi-layer board antenna is no glue or has
Glue, wherein the LCP film directly serves as bonding sheet, and has glue LCP described in the no glue LCP multi-layer board antenna
In multi-layer board antenna, high frequency binding glue is arranged between intermediate LCP mono- and/or multi-layer board and the LCP film of its upper and lower two sides.
8. LCP multi-layer board antenna according to claim 2, which is characterized in that the LCP multi-layer board antenna further include via
Plating be formed on the conductive seed layer with a thickness of 2 μm ~ 72 μm of copper foil.
9. LCP multi-layer board antenna according to claim 2, which is characterized in that the metallic circuit layer via press dry film, expose
Light, development, etching are formed.
10. LCP multi-layer board antenna according to claim 9, which is characterized in that the line width and line-spacing of the metallic circuit are equal
It is 50 μm ~ 500 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820451947.8U CN208589535U (en) | 2018-04-02 | 2018-04-02 | LCP single-layer or multi-layer plate antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820451947.8U CN208589535U (en) | 2018-04-02 | 2018-04-02 | LCP single-layer or multi-layer plate antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208589535U true CN208589535U (en) | 2019-03-08 |
Family
ID=65532086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820451947.8U Active CN208589535U (en) | 2018-04-02 | 2018-04-02 | LCP single-layer or multi-layer plate antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208589535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109830806A (en) * | 2019-03-12 | 2019-05-31 | 信利半导体有限公司 | A kind of flat panel Liquid Crystal antenna and preparation method thereof |
-
2018
- 2018-04-02 CN CN201820451947.8U patent/CN208589535U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109830806A (en) * | 2019-03-12 | 2019-05-31 | 信利半导体有限公司 | A kind of flat panel Liquid Crystal antenna and preparation method thereof |
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