CN208587747U - A kind of LED patch for being easy to radiate - Google Patents
A kind of LED patch for being easy to radiate Download PDFInfo
- Publication number
- CN208587747U CN208587747U CN201821213377.5U CN201821213377U CN208587747U CN 208587747 U CN208587747 U CN 208587747U CN 201821213377 U CN201821213377 U CN 201821213377U CN 208587747 U CN208587747 U CN 208587747U
- Authority
- CN
- China
- Prior art keywords
- insulating coating
- plate
- isolation plate
- heat dissipation
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED patches for being easy to radiate, including heat dissipation copper base, the ceramic isolation plate being arranged on heat dissipation copper base and the wick group for being mounted on ceramic isolation plate upper surface middle part, insulating coating is equipped between the ceramic isolation plate and wick group, several leads are equipped between the ceramic isolation plate and insulating coating, lead one end passes through insulating coating and is electrically connected with wick group, and the other end is arranged in ceramic isolation plate edge and forms welding pin through insulating coating.For this LED patch in the lower surface of existing integrated wick group connection heat dissipation copper base and ceramic isolation plate, the heat dissipation copper base of large area and ceramic isolation plate carry out heat caused by elimination wick group, and heat is avoided to deposit；Furthermore equipped with several leads and setting welding electrode between ceramic isolation plate and insulating coating, it is possible to prevente effectively from connecting with heat dissipation copper base, loss electric energy is avoided.
Description
Technical field
The utility model relates to led light technology field more particularly to a kind of LED patches.
Background technique
As LED patch is using increasingly extensive, some small-sized LED patches are difficult meet the needs of people, generally adopt
The brightness that LED patch is improved with two methods, one is several LED patches are concentrated on carrying out on a matrix while be made
With, such mode can gather materials on the spot, it directly can be completed using the LED patch of existing small dimension, at low cost, good heat dissipation,
But it makes trouble；Another is the LED patch for being directly integrated big specification, and volume has with the compact LED patch of power relatively
There is smaller volume, it is this kind of relatively easy in the fabrication process, but with the increase of power, heat can also be increase accordingly, phase
Than small-sized LED patch, heat is more difficult to be conducted, therefore the heat dissipation of integrated LED patch is to restrict its hair at present now
A kind of important obstruction of exhibition.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, it is simple to provide a kind of structure for the utility model, good heat dissipation effect
LED patch.
The utility model solves technical solution used by its technical problem are as follows:
It is a kind of be easy to radiate LED patch, including heat dissipation copper base, be arranged in heat dissipation copper base on ceramic isolation plate with
And it is mounted on the wick group of ceramic isolation plate upper surface middle part, insulating coating is equipped between the ceramic isolation plate and wick group,
Several leads are equipped between the ceramic isolation plate and insulating coating, lead one end passes through insulating coating and is electrically connected with wick group
It connects, the other end is arranged in ceramic isolation plate edge and forms welding pin through insulating coating.
As an improvement of the above technical solution, the wick group includes metallic heat radiating plate, table is arranged on metallic heat radiating plate
The luminescence component in face and the ceramic joining plate that metallic heat radiating plate lower surface is arranged in, the ceramic joining plate are mounted on insulation and apply
On layer, the metallic heat radiating plate is equipped with heat-conducting part, and the heat-conducting part sequentially passes through ceramic joining plate, insulating coating and ceramics absolutely
Listrium is connect with heat dissipation copper base, and the welding pin sequentially passes through insulating coating luminescence component, ceramic joining plate by lead
And metallic heat radiating plate is connect with luminescence component.
As an improvement of the above technical solution, the metallic heat radiating plate upper surface is equipped with and is easily installed the recessed of luminescence component
Luminescence component is sealed in groove by slot, the metallic heat radiating plate by epoxy resin layer.
As an improvement of the above technical solution, the luminescence component include chip, the phosphor powder layer being arranged on chip with
And the layer of silica gel on phosphor powder layer is set.
As an improvement of the above technical solution, the welding pin is electrically connected with chip.
As an improvement of the above technical solution, the welding pin is located at heat dissipation metal Board position equipped with insulation sleeve.
As an improvement of the above technical solution, the heat dissipation copper base, ceramic isolation plate and insulating coating collectively constitute
The edge of composite plate, the composite plate is equipped with several installation gaps.
As an improvement of the above technical solution, the upper surface of the welding pin is flushed with insulating coating upper surface.
The beneficial effects of the utility model have:
This LED patch is in the lower surface of existing integrated wick group connection heat dissipation copper base and ceramic isolation plate, large area
Heat dissipation copper base and ceramic isolation plate carry out eliminate wick group caused by heat, avoid heat from depositing；Furthermore in ceramics
Equipped with several leads and setting welding electrode between insulation board and insulating coating, it is possible to prevente effectively from connecting with heat dissipation copper base
It connects, avoids loss electric energy.
Detailed description of the invention
With reference to the accompanying drawing and specific embodiment the utility model is described in further detail, in which:
Fig. 1 is the structural schematic diagram one of the utility model embodiment；
Fig. 2 is the top view of the utility model embodiment；
Fig. 3 is in Fig. 2 along the cross-sectional view in the direction A-A；
Fig. 4 is in Fig. 2 along the cross-sectional view in the direction B-B.
Specific embodiment
Referring to Fig. 1 to Fig. 4, a kind of LED patch for being easy to radiate of the utility model, including heat dissipation copper base 1, setting exist
Ceramic isolation plate 2 on heat dissipation copper base 1 and it is mounted on the wick group 3 of 2 upper surface middle part of ceramic isolation plate, in the present embodiment
The area of wick group 3 is less than matrix composed by heat dissipation copper base 1 and ceramic isolation plate 2, improves the contact surface of heat dissipation.It is described
Insulating coating 4 is equipped between ceramic isolation plate 2 and wick group 3, if being equipped between the ceramic isolation plate 2 and insulating coating 4
Dry lead, lead one end pass through insulating coating 4 be electrically connected with wick group 3, the other end be arranged in 2 edge of ceramic isolation plate and
Welding pin 5 is formed through insulating coating 4.Wherein, the heat dissipation copper base 1, ceramic isolation plate 2 and insulating coating 4 are common
Composite plate is formed, the edge of the composite plate is equipped with several installation gaps 6, can be solid by external scolding tin either fixing piece
On matrix to be mounted needed for being scheduled on.
Referring to Fig. 1 and Fig. 3, the wick group 3 includes metallic heat radiating plate 31, the hair that 31 upper surface of metallic heat radiating plate is arranged in
Optical assembly 32 and the ceramic joining plate 33 that 31 lower surface of metallic heat radiating plate is arranged in, the ceramic joining plate 33 are mounted on insulation
On coating 4, the metallic heat radiating plate 31 is equipped with heat-conducting part 34, and the heat-conducting part 34 sequentially passes through ceramic joining plate 33, insulation applies
Layer 4 and ceramic isolation plate 2 are connect with heat dissipation copper base 1, in this way can be directly direct by heat caused by luminescence component 32
It is transmitted on bottom heat radiation copper base 1, the heat of luminescence component 32 is most carried out fastly thermally conductive, since heat dissipation base is heat dissipation
Copper base 1 can quickly come out the heat transfer in luminescence component 32 it is generally known that the thermal conductivity of copper is fabulous, and by dissipating
Hot copper base 1 carries out heat exchange with external matrix or air, realizes fast cooling.The welding pin 5 passes through lead successively
It is connect across 4 luminescence component 32 of insulating coating, ceramic joining plate 33 and metallic heat radiating plate 31 with luminescence component 32.The welding
Pin 5 is located at 31 position of metallic heat radiating plate equipped with insulation sleeve, carries out insulation connection by insulation sleeve and metallic heat radiating plate 31, avoids
The foreign current that welding pin 5 is connected avoids electric current from causing metallic heat radiating plate 31 when access excites luminescence component 32
Self-heating generates unnecessary situation and occurs.The upper surface of the welding pin 5 is flushed with 4 upper surface of insulating coating, can also
With the upper surface lower than insulating coating 4 of the upper surface of welding pin 5, in this way can to outer lead with welding pin 5 into
When row welding, there is the space of welding, avoid wrong weldering.
Referring to Fig. 3 and Fig. 4,31 upper surface of metallic heat radiating plate is equipped with the groove for being easily installed luminescence component 32, described
Luminescence component 32 is sealed in groove by metallic heat radiating plate 31 by epoxy resin layer.The luminescence component 32 includes chip, sets
The layer of silica gel setting the phosphor powder layer on chip and being arranged on phosphor powder layer, the welding pin 5 are electrically connected with chip.
This LED patch is in the lower surface of existing integrated wick group 3 connection heat dissipation copper base 1 and ceramic isolation plate 2, big face
Long-pending heat dissipation copper base 1 and ceramic isolation plate 2 carries out heat caused by elimination wick group 3, and heat is avoided to deposit；Furthermore exist
Equipped with several leads and setting welding electrode between ceramic isolation plate 2 and insulating coating 4, it is possible to prevente effectively from and radiating copper
Substrate 1 connects, and avoids loss electric energy.
The above, the only better embodiment of the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as its technical effect for reaching the utility model with any same or similar means, all should belong to the utility model
Protection scope.
Claims (8)
1. a kind of LED patch for being easy to radiate, it is characterised in that: including heat dissipation copper base, the pottery being arranged on heat dissipation copper base
Porcelain insulating plate and the wick group for being mounted on ceramic isolation plate upper surface middle part, are equipped between the ceramic isolation plate and wick group
Insulating coating, is equipped with several leads between the ceramic isolation plate and insulating coating, lead one end passes through insulating coating and lamp
The electrical connection of core group, the other end are arranged in ceramic isolation plate edge and form welding pin through insulating coating.
2. a kind of LED patch for being easy to radiate according to claim 1, it is characterised in that: the wick group includes metal
Heat sink, the luminescence component that metallic heat radiating plate upper surface is set and the ceramic joining that metallic heat radiating plate lower surface is set
Plate, the ceramic joining plate are mounted on insulating coating, and the metallic heat radiating plate is equipped with heat-conducting part, and the heat-conducting part sequentially passes through
Ceramic joining plate, insulating coating and ceramic isolation plate are connect with heat dissipation copper base, and the welding pin is successively worn by lead
Insulating coating luminescence component, ceramic joining plate and metallic heat radiating plate is crossed to connect with luminescence component.
3. a kind of LED patch for being easy to radiate according to claim 2, it is characterised in that: table on the metallic heat radiating plate
Face is equipped with the groove for being easily installed luminescence component, and luminescence component is sealed in groove by epoxy resin layer by the metallic heat radiating plate
It is interior.
4. a kind of LED patch for being easy to radiate according to claim 3, it is characterised in that: the luminescence component includes core
Piece, the phosphor powder layer being arranged on chip and the layer of silica gel being arranged on phosphor powder layer.
5. a kind of LED patch for being easy to radiate according to claim 4, it is characterised in that: the welding pin and chip
Electrical connection.
6. a kind of LED patch for being easy to radiate according to claim 5, it is characterised in that: the welding pin is located at gold
Belong to heat dissipation Board position and is equipped with insulation sleeve.
7. a kind of LED patch for being easy to radiate according to claim 1 or 2, it is characterised in that: the heat dissipation copper base,
Ceramic isolation plate and insulating coating collectively constitute composite plate, and the edge of the composite plate is equipped with several installation gaps.
8. it is according to claim 1 or 2 it is a kind of be easy to radiate LED patch, it is characterised in that: the welding pin it is upper
Surface is flushed with insulating coating upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821213377.5U CN208587747U (en) | 2018-07-27 | 2018-07-27 | A kind of LED patch for being easy to radiate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821213377.5U CN208587747U (en) | 2018-07-27 | 2018-07-27 | A kind of LED patch for being easy to radiate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208587747U true CN208587747U (en) | 2019-03-08 |
Family
ID=65542827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821213377.5U Active CN208587747U (en) | 2018-07-27 | 2018-07-27 | A kind of LED patch for being easy to radiate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208587747U (en) |
-
2018
- 2018-07-27 CN CN201821213377.5U patent/CN208587747U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105627122B (en) | It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit | |
| CN102569223B (en) | A kind of power device insulated heat radiation structure and circuit board, power-supply device | |
| TW201226797A (en) | LED light module and LED chip | |
| CN105161467B (en) | A kind of power module for electric car | |
| CN104896330A (en) | Led light source module | |
| CN101350390B (en) | LED encapsulation structure | |
| CN209627793U (en) | A kind of cooling circuit board | |
| CN101478024B (en) | Silicon encapsulation unit for LED | |
| CN203309836U (en) | LED light source, backlight source and liquid crystal display device | |
| CN208587747U (en) | A kind of LED patch for being easy to radiate | |
| EP3042400A1 (en) | Floating heat sink support with copper sheets and led package assembly for led flip chip package | |
| CN103247742B (en) | A kind of LED heat radiation substrate and manufacture method thereof | |
| CN207455482U (en) | A kind of mounting structure of car light LED chip | |
| CN102255236A (en) | Circuit packaging structure of high-power semiconductor laser and method for preparing circuit packaging structure | |
| CN207938645U (en) | Ceramic white light sticking type LED light source | |
| CN209282232U (en) | A kind of UV-LED light-source structure | |
| CN107360664A (en) | A kind of heat-conduction circuit board and preparation method thereof | |
| CN202197447U (en) | Metal substrate structure provided with LED | |
| CN103107264A (en) | Integrated light-emitting diode (LED) light source capsulation support frame | |
| CN102544300A (en) | LED packaging structure | |
| CN102777776A (en) | Aluminum oxide ceramic LED (light emitting diode) bulb lamp and manufacture method thereof | |
| CN107940389A (en) | LED light source component and its LED automobile lamp | |
| CN203503690U (en) | LED lamp with ceramic heat radiation substrate | |
| CN201007993Y (en) | Insulation type high-power triode | |
| CN207702372U (en) | LED light source component and its LED automobile lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |