CN208521959U - One kind having the twin-lens LED encapsulation structure of plug-in - Google Patents
One kind having the twin-lens LED encapsulation structure of plug-in Download PDFInfo
- Publication number
- CN208521959U CN208521959U CN201821261231.8U CN201821261231U CN208521959U CN 208521959 U CN208521959 U CN 208521959U CN 201821261231 U CN201821261231 U CN 201821261231U CN 208521959 U CN208521959 U CN 208521959U
- Authority
- CN
- China
- Prior art keywords
- lens
- pedestal
- reverberation bowl
- led chip
- twin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 17
- 238000002955 isolation Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 241000218202 Coptis Species 0.000 claims abstract description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 5
- 230000008602 contraction Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses one kind to have the twin-lens LED encapsulation structure of plug-in, it includes pedestal, the LED chip of the reverberation bowl and setting being connected with pedestal on the base, reverberation bowl top opening end face is connected with lower lens and upper lens, the upper surface of upper lens is provided with phosphor powder layer, upper lens, the bottom of lower lens and four angular contact of reverberation bowl is connected with symmetrically arranged arc clamping block, there are contraction mouths between arc clamping block, reverberation bowl quadrangle is provided with skewed slot, lens and the corresponding clamping chamber of lower lens position are provided on skewed slot, the outer wall of upper lens is provided with extension sealing ring, encapsulating glue-line is provided between reverberation bowl and pedestal, heat-conducting glue layer is provided between LED chip and pedestal, isolation channel is provided in pedestal, LED chip is connected to the two sides of isolation channel by gold thread.LED chip is isolated with fluorescent powder and is not directly contacted with by it, both ensure that the uniformity and fade resistance of phosphor powder layer, has also reduced the incidence of hot spot.
Description
Technical field
The utility model relates to LED encapsulation technology fields, in particular to a kind of to have the twin-lens LED encapsulation knot of plug-in
Structure.
Background technique
LED has the characteristics that energy conservation and environmental protection, service life are long, response is fast, small and light, is the lighting engineering of a new generation, answers extensively
Shown for Landscape Lighting, automobile market, traffic lights market, outdoor large screen and particular job illumination etc. fields, existing LED
It is when fluorescent powder is applied directly to chip surface mostly in encapsulating structure, due to the presence of light scattering, light extraction efficiency is lower,
The effect of fluorescent powder be it is photochromic compound, formed white light, characteristic mainly include granularity, shape, luminous efficiency, transfer efficiency,
Stability (thermally and chemically) etc., wherein luminous efficiency and transfer efficiency are crucial, research shows that: as the temperature rises, fluorescent powder
Quantum efficiency reduces, and light is reduced out, and radiation wavelength can also change, so as to cause the variation of white light LEDs colour temperature, coloration, compared with
High temperature can also accelerate the aging of fluorescent powder.Reason be fluorescent coating be by epoxy or silica gel and fluorescent powder allotment and
At heat dissipation performance is poor, when the radiation by purple light or ultraviolet light, temperature quenching and aging easily occurs, drops luminous efficiency
Low, there are also problems for the thermal stability of casting glue and fluorescent powder under high temperature；In addition, the fixation of lens is logical in LED encapsulation structure
It is often to be fixed by the way of glue bonding, after temperature rising, lens can be easy to loosen and influence properties of product.
Utility model content
Aiming at the problem that in the presence of above-mentioned existing LED encapsulation structure, the utility model provides that lens stabilization is good, nothing
Hot spot, intensity of illumination are uniform a kind of with the twin-lens LED encapsulation structure of plug-in.
The utility model is achieved through the following technical solutions: one kind having the twin-lens LED encapsulation structure of plug-in, including
Pedestal, the LED chip of the reverberation bowl being connected with pedestal and setting on the base, reverberation bowl top opening end face is connected with
Lower lens and upper lens, the upper surface of upper lens are provided with phosphor powder layer, four angular contact of the upper lens, lower lens and reverberation bowl
Bottom be connected with symmetrically arranged arc clamping block, there are contraction mouth between arc clamping block, reverberation bowl quadrangle is provided with tiltedly
Slot is provided with lens and the corresponding clamping chamber of lower lens position on skewed slot, and the outer wall of upper lens is provided with extension sealing ring, institute
It states and is provided with encapsulating glue-line between reverberation bowl and pedestal, heat-conducting glue layer is provided between the LED chip and pedestal, is set in pedestal
It is equipped with isolation channel, the positive and negative anodes of the LED chip are connected to the two sides of isolation channel by gold thread.
Further, the encapsulating glue-line is organic silica gel or epoxy resin.
Further, the isolation channel cross section is " convex " shape.
The utility model compared with prior art, 1, isolation channel is set on the base, filled, had with resin after encapsulation process
It is separated by effect the positive and negative electrode of LED chip, prevents the phenomenon of short circuit from occurring；2, close using improved clamping structure and extension
Double lens is fixed and sealed to seal ring, fixes compared to traditional glue, can prevent lens from loosening and influencing properties of product；3, change
Cashing has the mode that fluorescent powder is coated directly on LED chip, fluorescent powder is injected between lens, by LED chip and fluorescent powder
It is isolated and is not directly contacted with, has both ensure that the uniformity and fade resistance of phosphor powder layer, also reduced the incidence of hot spot.
Detailed description of the invention
Fig. 1 is the schematic view of the front view of the utility model,
Fig. 2 is the A-A schematic cross-sectional view of Fig. 1,
Fig. 3 is the B-B section view enlarged structure schematic diagram of Fig. 1.
In the figure 1, pedestal 2, gold thread 3, LED chip 4, upper lens 5, lower lens 6, isolation channel 7, anti-
Penetrate bowl 8, skewed slot 9, extension sealing ring 10, heat-conducting glue layer 11, encapsulating glue-line 12, phosphor powder layer 13, contraction mouth
14, arc clamping block 15, clamping chamber.
Specific embodiment
In order to enable those skilled in the art to better understand the technical solutions of the present invention, it combines and has below according to attached drawing
The utility model is described in further detail in body embodiment.
As shown in Figure 1, 2, 3, described one kind has the twin-lens LED encapsulation structure of plug-in, substantially rectangular body in figure
Structure, it includes pedestal 1, the LED chip 3 of the reverberation bowl being connected with pedestal 7 and setting on the base, the reverberation bowl top
Open end is connected with lower lens 5 and upper lens 4, and lower lens 5 and upper lens 4 are all made of optical grade PMMA material and are made, upper
The upper surface of mirror is provided with phosphor powder layer 12, and the bottom of the upper lens, lower lens and four angular contact of reverberation bowl is connected with symmetrically
The arc clamping block 14 of setting, arc clamping block are made of highly elastic material, and there are contraction mouth 13(between arc clamping block just
The extruding of arc block is shunk when installation), reverberation bowl quadrangle is provided with skewed slot 8, and lens and lower lens position are provided on skewed slot
Corresponding clamping chamber 15 is set, the outer wall of upper lens is provided with extension sealing ring 9, is provided with encapsulating between the reverberation bowl and pedestal
Glue-line 11 is provided with heat-conducting glue layer 10 between the LED chip and pedestal, heat-conducting glue layer is generally tin slurry glue or silver paste glue,
Isolation channel 6 is provided in pedestal, the positive and negative anodes of the LED chip are connected to the two sides of isolation channel by gold thread 2, filled out in isolation channel
Fill resin material.
Preferably, in order to improve the high refractive index and high transparency of LED encapsulation structure, protection LED chip and increase are played
The effect of the luminous flux of LED, the encapsulating glue-line 11 are organic silica gel or epoxy resin.
Preferably, the insulation effect between the positive and negative electrode in order to further increase LED chip, 6 cross section of isolation channel
For " convex " shape.
Embodiment of above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, although referring to specific embodiment
The utility model is described in detail, those skilled in the art should understand that, it can be to the skill of the utility model
Art scheme is modified or replaced equivalently, and without departing from the spirit and scope of the technical scheme of the present invention, should all be covered
In the protective scope of the claims of the utility model.
Claims (3)
1. one kind has the twin-lens LED encapsulation structure of plug-in, it is characterised in that: be connected including pedestal (1), with pedestal anti-
Penetrate bowl (7) and setting LED chip (3) on the base, reverberation bowl top opening end face is connected with lower lens (5) and upper
Lens (4), the upper surface of upper lens are provided with phosphor powder layer (12), the upper lens, lower lens and four angular contact of reverberation bowl
Bottom is connected with symmetrically arranged arc clamping block (14), and there are contraction mouth (13) between arc clamping block, reverberation bowl quadrangle is set
It is equipped with skewed slot (8), lens and the corresponding clamping chamber (15) of lower lens position is provided on skewed slot, the outer wall of upper lens is provided with
Extension sealing ring (9) is provided with encapsulating glue-line (11), sets between the LED chip and pedestal between the reverberation bowl and pedestal
Be equipped with heat-conducting glue layer (10), be provided in pedestal isolation channel (6), the positive and negative anodes of the LED chip by gold thread (2) be connected to every
Two sides from slot.
2. according to claim 1 a kind of with the twin-lens LED encapsulation structure of plug-in, it is characterised in that: the filling
Adhesive layer (11) is organic silica gel or epoxy resin.
A kind of there is the twin-lens LED encapsulation structure of plug-in 3. according to claim 1, it is characterised in that: it is described every
It is " convex " shape from slot (6) cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821261231.8U CN208521959U (en) | 2018-08-07 | 2018-08-07 | One kind having the twin-lens LED encapsulation structure of plug-in |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821261231.8U CN208521959U (en) | 2018-08-07 | 2018-08-07 | One kind having the twin-lens LED encapsulation structure of plug-in |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208521959U true CN208521959U (en) | 2019-02-19 |
Family
ID=65333990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821261231.8U Expired - Fee Related CN208521959U (en) | 2018-08-07 | 2018-08-07 | One kind having the twin-lens LED encapsulation structure of plug-in |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208521959U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585632A (en) * | 2019-02-14 | 2019-04-05 | 旭宇光电（深圳）股份有限公司 | High-power long-distance fluorescent powder type white light LEDs cooling encapsulation |
| CN111379981A (en) * | 2020-04-28 | 2020-07-07 | 东莞市索菲电子科技有限公司 | Light-concentrating high-color-rendering-index high-brightness surface-mounted LED |
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
-
2018
- 2018-08-07 CN CN201821261231.8U patent/CN208521959U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585632A (en) * | 2019-02-14 | 2019-04-05 | 旭宇光电（深圳）股份有限公司 | High-power long-distance fluorescent powder type white light LEDs cooling encapsulation |
| CN111379981A (en) * | 2020-04-28 | 2020-07-07 | 东莞市索菲电子科技有限公司 | Light-concentrating high-color-rendering-index high-brightness surface-mounted LED |
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190219 |