CN208507633U - Cleaning device for producing the equipment of semi-conductor cell and for cleaning printing equipment - Google Patents
Cleaning device for producing the equipment of semi-conductor cell and for cleaning printing equipment Download PDFInfo
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- CN208507633U CN208507633U CN201820392369.5U CN201820392369U CN208507633U CN 208507633 U CN208507633 U CN 208507633U CN 201820392369 U CN201820392369 U CN 201820392369U CN 208507633 U CN208507633 U CN 208507633U
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Abstract
A kind of equipment for producing semi-conductor cell, the equipment include: printing equipment, for printing on semi-conductor cell；Monitoring device is configured to monitor the feature of the semi-conductor cell of the printing；And cleaning device, it is configured as at least several parts for cleaning printing equipment based on the feature of the monitoring of the semi-conductor cell.
Description
Technical field
The implementation of present disclosure is related to the equipment for producing semi-conductor cell.The equipment includes: printing dress
It sets, for being printed on semi-conductor cell；Monitoring device is configured to the feature of the semiconductor of monitoring printing；And cleaning device,
It is configured as at least several parts for cleaning printing equipment based on the feature of the monitoring of semi-conductor cell.
Background technique
Semi-conductor cell all uses in many modern industry fields, such as in electronics industry or solar cell industry
In.The technique applied in the production of semi-conductor cell has chemical constituent and physical component.In addition to chemical coating processes, etching
Outside cleaning procedure, physical method, such as physics coating and cleaning procedure, ion implanting, crystallization or temperature process are also used
(such as diffusion, heating and fusing).For other important process using chemically and physically both technique, such as photoetching or chemical machinery are flat
Face.In addition, many measuring methods are for characterization and technology controlling and process.Production for (micro-) electronic circuit, semiconductor technology work
Skill is applied on substrate with certain sequence.Substrate is usually semiconductor monocrystal (usually silicon) thin slice, such as is thinner than 1 millimeter
Chip.Especially in integrated circuit production, the function of electronic component and component is near surface (for example, being lower than 100 nanometers of depth
Degree) it realizes in region.In this technical field, the material properties of chip, especially electrical property are specifically modified and texture.
Silk-screen printing is such as electric very early in the electronics industry for the design of printed electronic components on a surface of a substrate
Contact or interconnection.Prior art semi-conductor cell, the especially manufacturing process of solar battery, also use silk-screen printing technique.
Since technology develops, the structure formed on substrate or on semi-conductor cell becomes smaller and smaller and increasingly finer, thus
Enhance battery performance.For example, industry is intended to improve the efficiency of solar battery.Due to the higher of high-power semi-conductor cell
Demand, the production of semi-conductor cell also become to become increasingly complex, and wherein cost pressure increases simultaneously.In order to accurately print, print
Machine must be by periodic maintenance, this mainly includes the cleaning of the component of printing machine.When generating shutdown to the regular cleaning of printing machine
Between, especially cause the production of the manufacture system for producing semi-conductor cell to be stopped work.Downtime causes the lower of production capacity
Utilization rate and semi-conductor cell higher cost.
It is described to set in view of equipment above-mentioned, that present disclosure is intended to provide the production semi-conductor cell with printing equipment
It is standby to overcome the problems, such as at least some of above problem.Present disclosure, which is particularly intended to provide, has being used for for improved cleaning procedure
The equipment for producing semiconductor.Printing equipment is changed in semi-conductor electricity pool equipment in addition, present disclosure is particularly intended to provide
Kind cleaning.
Utility model content
In view of above-mentioned, the equipment for producing semi-conductor cell is provided, equipment includes: printing equipment, for partly leading
It is printed on body battery；Monitoring device is configured to the feature of the semi-conductor cell of monitoring printing；And cleaning device, it is configured as
For cleaning at least one portion of printing equipment based on the feature of the monitoring of semi-conductor cell.
According to one aspect of the present disclosure, printing equipment includes silk screen, and cleaning device is configured to cleaning silk
One part of net.
According to another aspect of the present disclosure, it provides for the transport to silk-screen printing device supply semi-conductor cell
Configuration, shipping configuration form the transportation route for semi-conductor cell between printing equipment and monitoring device.
According to another aspect of the present disclosure, shipping configuration includes turntable.
According to another aspect of the present disclosure, turntable has the star main body including tip.
According to another aspect of the present disclosure, star main body has curved shape, and curved shape is between tip
Lateral side regions on recess is provided.
According to another aspect of the present disclosure, shipping configuration includes shuttle.
According to another aspect of the present disclosure, semi-conductor cell supporting element is arranged on shipping configuration, wherein sanitizer cartridge
Setting may be arranged on semi-conductor cell supporting element.
According to another aspect of the present disclosure, monitoring device is configured to semi-conductor cell being divided into several sections simultaneously
And it is configured to the feature of at least one section of monitoring battery, wherein at least one portion of printing equipment corresponds to semiconductor
At least one section of battery.
According to another aspect of the present disclosure, the feature of semi-conductor cell includes finger-shaped material discontinuities.
According to another aspect of the present disclosure, cleaning device includes friction element.
According to another aspect of the present disclosure, the cleaning device that may be arranged at semi-conductor cell supporting element is provided.
According to another aspect of the present disclosure, friction element can be clamped on cylindrical bosses, and cylinder is prominent
Object can be fixed on the surface of cleaning device.
According to another aspect of the present disclosure, cleaning device is configured at least one portion of cleaning printing equipment,
At least one portion of printing equipment corresponds at least one section of semi-conductor cell.
Detailed description of the invention
In order to which mode used in the features described above structure of present disclosure can be understood in detail, in this public affairs summarized briefly above
The more specific description for opening content can be carried out with reference to each implementation.Annexed drawings are related to implementation and following attached
It is described in figure:
Figure 1A shows the example implementations of the equipment 100 for producing semi-conductor cell.
Figure 1B illustrates the exemplary design of printing equipment.
Fig. 2A shows the schematic diagram of the example implementations of shipping configuration 160.
Fig. 2 B shows the schematic plan of the example implementations of the shipping configuration including turntable.
Fig. 2 C shows the schematic diagram of the exemplary division technique of semi-conductor cell.
Fig. 3 A shows the schematic diagram of the example implementations of cleaning device.
Fig. 3 B shows the schematic diagram of the example implementations for the cleaning device being arranged in print nest 150.
Fig. 4 shows the schematic side elevation of the example implementations of shipping configuration.
Fig. 5 shows the schematic diagram of the example implementations of the equipment for producing semi-conductor cell.
Fig. 6 shows the enlarged drawing of the upper part of Fig. 5.
Fig. 7 shows the schematic diagram of the another exemplary implementation of the shipping configuration including turntable.
Fig. 8 shows the schematic diagram of another implementation of semi-conductor cell production equipment, semi-conductor cell production equipment
Shipping configuration including having shuttle track 160.
Fig. 9 A shows the schematic diagram of the semi-conductor cell by printing equipment printing.
Fig. 9 B shows the enlarged drawing of the solar battery similar to the above-mentioned example described in Fig. 9 A, the solar-electricity
Pond includes finger-shaped material discontinuities.
Figure 10 shows the example of the clean operation of the printing equipment of semi-conductor electricity pool equipment.
Specific embodiment
Reference will now be made in detail to the various implementations of present disclosure, and one or more examples of implementation are attached
It is shown in figure.In the description below to attached drawing, the same reference numerals about single realization mode are described.Each example passes through
It is provided in a manner of explaining present disclosure, is limited without indicating.A part as an implementation shows or describes
Other features can be used in combination on other implementations or with other implementations to generate another implementation.This
Specification is intended to include such modifications and variations.
In this disclosure, the equipment for producing semi-conductor cell is provided.The equipment includes: printing equipment, is used
In printed semiconductor battery；Monitoring device is configured to the feature of monitoring semi-conductor cell；And cleaning device, it is configured as using
In at least one portion for cleaning printing equipment based on the feature of the monitoring of semi-conductor cell.
Referring to Figure 1A, the example implementations of the equipment 100 for producing semi-conductor cell are depicted.The equipment packet
Shipping configuration 160 is included, wherein semi-conductor cell 130 is sent to printing equipment 120 by shipping configuration 160.Monitoring device 140 is arranged
At the shipping configuration 160 for being located at 120 downstream of printing equipment.Monitoring device 140 monitors the semi-conductor electricity after printing technology
The feature in pond 130.The feature of the monitoring of semi-conductor cell based on printing, cleaning device 210 are carried out to the clear of printing equipment 120
It is clean.
As the term semi-conductor cell used in implementation described herein can be for selected from the group being made of following item
In at least one element: conductive material, plate, chip, semiconductor wafer, is partly led at the conductive material with silicon or alumina base
Body, solar cell wafer, Si chip, Si solar cell wafer, greenbelt circuit board and particularly for formed photovoltage
The similar articles of battery or greenbelt circuit.For example, solar cell wafer or greenbelt circuit board can provide as semi-conductor cell.
Term semi-conductor cell, battery, semiconductor or solar battery can be used synonymously in this paper.
Printing equipment can be regarded as the device for being printed on semi-conductor cell, and wherein print steps include by material
Material, such as slurry comprising metal or dielectric substance or fellow are placed on semi-conductor cell.Figure 1B is for illustrating printing
The exemplary design of device.Printing equipment 120 includes at least one printing equipment 128 and mask to print 125 (for example, print
Brush filament net 125) printing chamber 122.Printing equipment 128 can be regarded as to be deposited on semi-conductor cell 130 for applying
The tool of material (not shown).Printing equipment 128 pushes material to pass through printing screen 125 and is deposited on semi-conductor cell 130.Print
Dataller's tool can for example be interpreted as doctor 128, and the other end of printing screen can be moved to from one end of printing screen 125.It is logical
The applied force on printing screen 125 is crossed, material is applied to the semiconductor for being positioned at 125 lower section of printing screen by printing equipment 128
On battery 130.
Monitoring device can be regarded as include at least one sensor unit sensor module.Sensor unit can for selected from
At least one element in group be made of following item: laser scanner, tracer, electromagnetic sensor, optical sensor,
Optical vision system, optical check unit or sonic transducer etc..Monitoring process can be grasped by using a large amount of sensor units
Make.Monitoring device may be arranged at transportation route or close to transportation route or along one or more section cloth of transportation route
It sets.Monitoring device can also abut or neighbouring printing equipment is arranged.
The feature of the semi-conductor cell of term printing can be regarded as physical property, for example, printing semi-conductor cell electricity,
Mechanical, optics or material composition and property etc..Particularly, the semi-conductor cell that the feature of semi-conductor cell is printed by monitoring
Surface monitors.The feature of semi-conductor cell may include at least one parameter of above-mentioned physical property, such as the semiconductor of printing
The thickness of battery, material composition, scrambling, defect, printing quality defect and impurity.Feature can also comprise influence such as half
The electric conductivity of conductor battery and the printed patterns of efficiency.
Cleaning device can be regarded as to clean the device of at least one portion of printing equipment.In addition cleaning device can be managed
Solution is the cleaning assemblies for including more than one cleaning device, wherein a cleaning device in several cleaning devices is configured to
Clean a part of printing equipment.Cleaning device may be adapted to the specific part or particular elements of printing equipment.Cleaning device can
Such as mask or silk screen, supply line, inlet port, printing chamber for being configured to cleaning printing equipment etc..
Cleaning procedure can the burnisher such as by making such as rubber, tissue shape medium, roller or synthetic sponge with
The corresponding component of printing equipment to be cleaned is contacted and is mechanically carried out.Cleaning device, the especially movement of burnisher, can describe
For friction, scrub, polishing etc..In addition, cleaning procedure can be by being applied to particular elements to be cleaned for detergent come chemical
Ground carries out.In addition, cleaning procedure can be supported by pressure jet etc..Different cleaning technique as described herein can also combine or
Simultaneously carry out.
It can automatically drive or braking cleaning device, or can semi-automatically operate (such as being supported by operator) cleaning
Device.According to implementation, at least one portion of term cleaning printing equipment can be regarded as some portions of cleaning printing equipment
Point or component, wherein some other parts of all parts of printing equipment or component without cleaning.Term cleaning printing dress
In addition at least one portion set can be interpreted as only cleaning a part of a component of printing equipment, such as silk screen or mask
One part or region.In addition, at least one portion of term cleaning printing equipment can be regarded as the whole of cleaning printing equipment
Whole components of part or printing equipment, or all parts or region of one component of cleaning.
The cleaning carried out by cleaning device, especially cleaning procedure or technique depend on semi-conductor cell as described herein
The feature of monitoring.The cleaning of feature based on monitoring, especially cleaning procedure, it will be appreciated that be the feature based on monitoring to start, touch
The cleaning procedures such as send out, initiate or carry out.Monitoring device can be configured to based on the number obtained via monitoring semi-conductor cell feature
According to and initiate cleaning procedure.The triggering of cleaning procedure can by comparing or check the feature that monitors as described herein and be stored in
The inside of feature in monitoring device is arranged and activates.Inside setting may include the threshold value of feature to be monitored, wherein semiconductor
The feature of the monitoring of battery can trigger cleaning procedure compared with the threshold value of the feature of inside setting.Triggering cleaning procedure can also be managed
Solution be so that monitoring device control printing equipment which will partially be cleaned.
Cleaning, especially cleaning procedure or program, can the feature based on the monitoring of semi-conductor cell as described herein and lead to
Cleaning printing equipment is crossed to improve.Particularly, the semi-conductor electricity that cleaning time can be printed by only cleaning the generation of printing equipment
Part or the component of the feature in pond and reduce.In addition, cleaning can be printed by the feature and short-term cleaning for monitoring printed battery
The impurity of the part of device or component is more effectively carried out.Term can be regarded as between 1 and 15 minute in short term or 1 and 60 second it
Between time span.In addition, the quality of semi-conductor cell can be improved.As cleaning device above can also be by producing compared with less waste material
To save time and cost.
According to the implementation that can be combined with other implementations as described herein, provide for silk-screen printing device
The shipping configuration of semi-conductor cell is supplied, wherein shipping configuration is formed between printing equipment and monitoring device for semi-conductor electricity
The transportation route in pond.Shipping configuration can be regarded as being formed the transmission module or several of the transportation route for transmitting semi-conductor cell
Or more transmission module array.Transportation route may be designed as physical connection, such as conveyer belt, track, shuttle or guide rail etc.
Deng.In addition, transportation route can be formed by clip like transmission module, wherein module or percussion tool are arranged in the work of clip like module
Make in radius.
Fig. 2A shows the example implementations of shipping configuration 160.Shipping configuration 160 includes conveyer belt 160a or enters
Conveyer belt 160a may include actuating unit 161.In some implementations, actuating unit 161 is for example configured as line
Property mobile unit.Conveyer belt 160a can be configured to receive semi-conductor cell 130 from the input unit of such as entrance conveyor 165
And semi-conductor cell 130 is sent to printing equipment 120 along transmission direction 164.Shipping configuration 160, which can also comprise, leaves biography
Band 160b is sent, can be configured to receive the semi-conductor cell 130 of printing from printing equipment 120.Monitoring device 140 may be arranged at
It leaves at conveyer belt 160b for monitoring the semi-conductor cell 130 printed as described herein.Leaving conveyer belt 160b can also
Semi-conductor cell 130 is sent to semi-conductor cell and removes device (such as outlet conveyer belt 165b).Entrance conveyor 165a and
Export a part that conveyer belt 165b can be bigger production line.
In the implementation that can be combined with other implementations as described herein, shipping configuration may include turntable and/
Or shuttle.Turntable can for example be interpreted as the transmitting device with circular body, can be transmitted by moving in rotation and be arranged in or put
Set the semi-conductor cell in body surfaces.The signal that Fig. 2 B shows the example implementations of the shipping configuration including turntable is bowed
View.Semi-conductor cell 130 is sent to printing equipment 120 by using moving in rotation 312 by turntable 310.Semi-conductor cell 130
Turntable 130 can be sent to by the input unit 165a of such as entrance conveyor 165a, wherein semi-conductor cell 130 passes through platform
Moving in rotation is especially moved to the lower section of printing equipment 120 to printing equipment 120.After the printing, battery 130 can be transmitted
To outlet device 165b (especially outlet conveyer belt 165b) for further transmitting or being further processed.Monitoring device 140 can
At turntable 310, be particularly close to printing equipment 120, or be more specifically arranged in printing equipment 120 and outlet conveyer belt 165b it
Between.
According to the implementation that can be combined with some other implementations as described herein, semi-conductor cell supporting element arrangement
On shipping configuration, wherein cleaning device is optionally arranged on semi-conductor cell supporting element.Semi-conductor cell supporting element
It also is understood as print nest, print nest is configured to support semi-conductor cell during printing treatment.Print nest can install for example,
It fixes or is attached at shipping configuration, wherein print nest serves as shipping container to ensure the safety of the semi-conductor cell in equipment
Transmission.In addition, print nest is configured to support the printing technology in printing equipment.According to some implementations, print nest can be with
Including print nest transfer tape assemble, print nest transfer tape assemble from another shipping configuration component of such as entrance conveyor to receive
Semi-conductor cell.Print nest transfer tape assemble is arranged to especially comprising support plate, and wherein semi-conductor cell is on the supporting plate
Position can be adjusted by print nest transfer tape assemble.
According to the implementation that can be combined with some other implementations as described herein, cleaning device, which may be arranged at, is partly led
In body battery support.Cleaning device can have the design such as circle, rectangular or square.Cleaning device may include being placed in partly to lead
Flat surfaces on the top of body battery support, are especially flat lower surface.
The schematic diagram of the example implementations of cleaning device is shown in Fig. 3 A.Cleaning device 210 includes basic body
211, wherein friction element 230 is arranged on the surface of basic body 211.Cleaning device 210 is by having supporting pad 245
Cleaning supporting element is arranged 235 and is placed on semi-conductor cell supporting element (not shown), for friction element 230 to be mounted on
On the basic body 211 of cleaning device.In addition cleaning supporting element arrangement 235 is configured to arrange cleaning device 210, especially put
It sets in print nest as described herein.
According to the implementation that can be combined with some other implementations described herein, cleaning device can be stored in and " pick up
Take placement " in position, wherein friction element can improve the cleaning effect of cleaning device full of wiping liquid, and especially friction is single
The cleaning effect of member.In addition, cleaning device can maintain in " picking up & to place " position.B referring to Fig. 3, cleaning device 210 are arranged
In print nest 150, especially it is arranged on the support surface 152 or support plate 152 of print nest.Cleaning device 210 can have
Circular design with flat surfaces, wherein cleaning device 210, the especially support of the plane Yu print nest 150 of basic body 211
Face contact.In the implementation that can be combined with some other implementations as described herein, supporting surface 152 may be, for example, porous
Material, porous material allow that semi-conductor cell 130 and cleaning device 210 are clamped in print nest 150 using vacuum, very
Sky is applied on the opposite side of supporting surface 152 by conventional vacuum generating means (for example, vacuum pump, vacuum ejector).
The cleaning device being arranged in print nest can provide advantageous effect, i.e. cleaning device can be sent to printing easily
Device is arranged without additional transmission.Shipping configuration can be used for for the print nest with semi-conductor cell being transmitted to printing dress
Set and transmit the print nest with cleaning device.The shipping configuration probably already existed can be used for transmitting cleaning device, without
It is used for transmission the other arrangement of cleaning device.Cleaning device also is understood as the substitute or " Counterfeit Item " of semi-conductor cell,
It is arranged in print nest when the special characteristic for the semi-conductor cell that can be printed as described herein in monitoring.
The schematic side elevation of the example implementations of shipping configuration is shown in Fig. 4.Shipping configuration includes being used for half
Conductor battery is sent to the shuttle 510 of printing equipment 120.As described herein, cleaning device 210 is arranged in print nest 150,
It is especially arranged on the support surface 152 of print nest 152, wherein cleaning device 210 is moved to printing equipment 120 by shuttle 510
Lower section.In order to start cleaning treatment, the cleaning device 210 including friction element 230 is contacted with the downside 121 of printing equipment 120,
With at least one the component (not shown) of cleaning arrangement at the downside of printing equipment 120 121.In order to make friction element 230 with
The component contact being arranged on the downside 121 of screen process press 120, screen process press 120 can decline in Z-direction 337.This
Outside, screen process press 120 can also be raised to adjust cleaning device 210 (especially friction element 230) and silk screen in Z-direction 337
The distance between downside 121 of printing machine 120.
The component of screen process press to be cleaned may include silk screen, for example, mask or mask to print, printing chamber, outlet,
Jet stream and nozzle etc..According to the implementation that can be combined with other implementations as described herein, the cleaning of cleaning device 210
Processing can be carried out by movable cleaner 210 in X-direction 212.The direction X 212 can correspond to the mobile side of shuttle 510
To wherein the movement of shuttle 510 is sent to cleaning device 210 via print nest 150.The movement of shuttle 510 can be used for cleaning place
Reason, wherein friction element 230 is mobile relative to the downside 121 of screen process press 120.The cleaning carried out by cleaning device 210
The movement of reason can be regarded as moving back and forth in the X direction, wherein moving back and forth can repeat more than once and move back and forth pair
It should be in the moving back and forth in X-direction 212 of shuttle 510.Cleaning movement is carried out by using the X mobile 212 of shuttle 510, can be saved
The simple and cost effective design of cleaning device 210 is realized in slightly another actuator of cleaning device 210, this measure.
According to the other implementation that can be combined with some other implementations as described herein, shipping configuration includes turning
Platform, wherein print nest is arranged on turntable, and cleaning device is arranged in print nest.Fig. 5 is shown for producing semi-conductor electricity
The schematic diagram of the example implementations of the equipment in pond.Turntable 310 with several print nests 150 can be revolved around midpoint 311
Turn, semi-conductor cell 130 is sent to printing equipment 120.Cleaning device 210 can be arranged in print nest 150 by operator
Above or by cleaning supporting element arrangement as described herein automatically arrange in print nest 150.
According to the feature of the semi-conductor cell 130 monitored by monitoring device 140, cleaning device 210 is placed on turntable 310
In print nest 150.According to implementation, when cleaning device will be placed on cleaning sleeve 150, monitoring device 140 can be incited somebody to action
Information is sent to operator.In addition, the information for being sent to the monitoring device 140 of operator may include about cleaning device
210 data relative to the orientation of set 150, especially with respect to orientation and/or placement of the friction element 230 in cleaning device 210
Data.Operator can be for example from device (such as display, headphone, vision or the sound of the authenticity for including enhancing
Frequency signal etc.) receive the information for carrying out self-monitoring device.In order to start cleaning treatment, turntable 310 is revolved by moving in rotation 312
Turn, until cleaning device 210 is located at 120 lower section of printing equipment.According to the reality that can be combined with other implementations as described herein
Existing mode, cleaning device 210 can be arranged or are mounted between two of print nest 150.
Fig. 6 shows the enlarged drawing of the upper part of Fig. 5.The cleaning device 210 being arranged in print nest is located at silk-screen printing
120 lower section of device.As described herein, cleaning treatment can be by by cleaning device 210, especially friction element 230 and printing equipment
120 lower contacts and carry out.In addition, the level (especially height) of turntable 310 (can especially be printed relative to printing equipment 120
The downside of device 120) it rises or declines, to adjust and/or deploy between cleaning device 210 and the downside 121 of printing equipment
Distance.Cleaning device 210 can be by the moving in rotation of turntable 310 in rotation direction 339, especially with respect to printing equipment
It is moved in tangential direction 339.The movement of the cleaning treatment carried out by cleaning device 210 can be regarded as on direction of rotation 339
Move back and forth, wherein moving back and forth can repeat more than once and move back and forth corresponding to turntable 310 on direction of rotation 339
Rotate back and forth movement.
Cleaning treatment can also comprise the movement in the Y direction on 335, and wherein printing equipment 120 moves in 335 in the Y direction.
By the way that cleaning device is arranged in the print nest on turntable, the shipping configuration probably already existed can be used.In addition, cleaning device is clear
Clean movement may include other tangential movement, can improve cleaning result.
Fig. 7 schematically depicts the other example implementations of the shipping configuration including turntable.Turntable 330 has
Star design, especially criss-cross shape design, wherein print nest 150 is arranged on the tip 342 of star or cross turntable 330.Turn
The star of platform 330 or cross main body have curved shape, and which provide the sides between the tip 342 for being located at turntable 330
Recess 340 or recess portion 340 on region.
Cleaning device 210 can be arranged in a recess portion 340, and wherein cleaning device 210 passes through sliding or guidance system
361 guidings.According to implementation, cleaning device 210 may be arranged at 120 lower section of printing equipment, and intermediate station 330 can be at cleaning
Position.The recess portion 340 that cleaning position can be regarded as its intermediate station 330 is located at the position of 120 lower section of printing equipment.In order to clean,
Turntable 330 can stop at cleaning position, and wherein printing equipment 120 is located at 340 top of recess portion of turntable 330.The recess portion of turntable
340 enable cleaning device 210 to be arranged in printing equipment 120 by the guidance system 361 with guide rail 361a and guide rail 361b
Lower section.As described herein, the cleaning device 210 with guidance system 361 is arranged in below printing equipment 120 can be achieved entirely
Automated cleaning processing.Cleaning device is arranged in the printing equipment time required below by reduction and subtracted by full-automatic cleaning treatment
Lack the downtime for producing the equipment of semi-conductor cell.Further, since coming low heavy with the curved design of turntable 310
Amount, the curved design of turntable 330 allow high rotation speed.According to the reality that can be combined with other implementations as described herein
Existing mode, cleaning device 210 can be arranged or is mounted at turntable, especially between two in print nest 150.Cleaning device
210 can arrange or be mounted or attached or be fixed at cleaning device supporting element, and wherein cleaning device supporting element is arranged in turntable
In 330 recess portion 340.Lid 370 is arranged on turntable 330, and particularly less than the side of turntable for operator for example to transport
Maintenance work, which is carried out, on defeated configuration, especially on turntable provides safe working environment.
Fig. 8 shows the schematic diagram of another implementation of semi-conductor cell production equipment, semi-conductor cell production equipment packet
Include the shipping configuration with shuttle track 160.Cleaning device 210a is arranged on the side of shuttle track 160.Cleaning device
210a is arranged in " storage " on fold mechanism 520 or inactive position.Inactive position also is understood as " picking up & to place "
Position is such as described herein.The feature of monitoring based on the semi-conductor cell printed as described herein, cleaning device 210a can be with
By monitoring device (not shown) automatic trigger, wherein by by cleaning device 210a from the folding position edge of cleaning device 210a
Folding direction 515 is sent to the expanded position of cleaning device 210b and " expansion " cleaning device 210a.
Cleaning device can be regarded as cleaning shuttle 210b, the monitoring based on semi-conductor cell 130 as described herein
Feature and be placed on track 160.It is such as described in this paper implementation, cleaning shuttle 210b can clean printing equipment
120.It rubs in addition, cleaning shuttle 210b can be provided and cleaning in shuttle including one or more actuator (not shown)
Individual cleanings movement of unit 230 is wiped, actuator is configured to move up dynamic friction unit 230 on the surface of cleaning shuttle 210b.
Actuator for example can provide the additional moving direction of friction element 230, can be as support is described herein or reinforces cleaning shuttle
Cleaning along track 160 is moved.Use cleaning shuttle that can realize the full-automatic cleaning of printing equipment as cleaning device, entirely certainly
Dynamic cleaning reduces the time spent in entire cleaning process.
According to the implementation that can be combined with other implementations as described herein, monitoring device is configured to semiconductor
Battery is divided into several sections and is configured to the feature of at least one section of monitoring semi-conductor cell, wherein printing equipment
At least one portion in one correspond to semi-conductor cell section.Semi-conductor cell is divided into several sections to be appreciated that
To segment monitoring device by semi-conductor cell or being divided into different sections, wherein monitoring device is determined in semi-conductor cell
Section or sector.Term division can be regarded as semi-conductor cell and arithmetically assign into several sections or fan by monitoring device
Area.Semi-conductor cell is divided into several sections, especially partition program can be by using laser, laser element, optics
Inspection unit, optical vision system or scanning element monitor battery and carry out in a virtual manner, wherein the semi-conductor electricity monitored
Pond remains unchanged and intactly.The feature of semi-conductor cell in section can be monitored, wherein extremely for semi-conductor cell
A few sector, can store Individual features.
Term " feature of at least one section of monitoring battery " can be regarded as monitoring whole sections in semi-conductor cell
Some sections in semi-conductor cell feature or monitor semi-conductor cell whole sections in feature.Term " printing dress
The component that section of at least one portion set corresponding to battery " can be regarded as printing equipment can correspond to each of semi-conductor cell
Other section.In addition, term " at least one portion of printing equipment " is it will be understood that can at least one portion of silk screen or mask
Corresponding to semi-conductor cell section or the section of semi-conductor cell can be linked to.By the way that semi-conductor cell sector chaining is extremely printed
The corresponding part of brush device, especially links to the silk screen of printing equipment, and the defect of printing treatment can be such as described herein by monitoring
Semi-conductor cell feature and detect, and component can be linked to, especially link to the corresponding region of silk screen.Silk screen it is miscellaneous
Matter, dirt or the region of blocking can more preferably and quickly be identified and positioned, wherein effectively cleaning can be by clear as described herein
Clean device carries out.
In fig. 2 c, the schematic diagram of the exemplary division technique of semi-conductor cell is illustrated.Monitoring device 140, such as laser
Semi-conductor cell 130 is divided into many section 130a, 130b, 130c by scanner.The division processing of monitoring device can be virtually
It carries out, without having physical influence to battery.Monitoring device is configured to monitor feature as described herein, wherein particular section
In 130, the defect of the semi-conductor cell in this example section 130c passes through the feature that semi-conductor cell is monitored in this section
To detect.Particular section 130c correspond to printing screen on specific region, wherein can determine the specific region of printing screen with
It is cleaned.Defect 132 on the semi-conductor cell of printing can be drawn by the obstruction or closed area in the opening of silk screen or hole or hole
It rises.Cleaning procedure can be only limitted to the region of the determination on cleaning silk screen, or be only limitted to more meticulously clean determining region, this can
It is interpreted as example being more concentrated at cleaning using the repetition of bigger pressure or more.Adjustable cleaning device is for example, by inciting somebody to action
The aligned in position of the friction element of the section 130c and cleaning device of the detection of semi-conductor cell with defect 132 and only clean
Or intensively clean silk screen on determination region.
According to the implementation that can be combined with some other implementations described herein, cleaning device can have and partly lead
The identical size of body battery, wherein friction element may be arranged on cleaning device, wherein the defect detected is on semi-conductor cell
Position be similar to position of the friction element on cleaning device.Defect may include dirt, insufficient slurry or printed patterns
Discontinuities.In addition, monitoring device can more frequently clean the corresponding region of silk screen, this be understood to be compared to silk screen other
Region makes friction element more frequently pass through the congested areas of silk screen.Cleaning procedure can be concentrated more and more purposefully be carried out,
This can lead to the cleaning time of better cleaning result and reduction.
According to the implementation that can be combined with some other implementations as described herein, the feature of semi-conductor cell includes
Finger-shaped material discontinuities.Finger-shaped material discontinuities are printed on semi-conductor cell, are especially printed on the solar cell.In figure 9 a,
The schematic diagram of semi-conductor cell 130 by printing equipment printing is shown.Semi-conductor cell 130 includes busbar 610, is connected to
Many finger-shaped materials 620, especially example 620a, 620b and 620c.Between two neighbouring finger-shaped material 620a and finger-shaped material 620b
Distance 640 is very crucial for the performance of semi-conductor cell 130 (especially solar battery 130).In the example described herein, finger-like
Object does not include discontinuities.
Fig. 9 B shows semi-conductor cell 130, the especially enlarged drawing similar to the solar battery 130 of above-mentioned example, wherein
Semi-conductor cell 130 has finger-shaped material discontinuities 625a, finger-shaped material discontinuities in the finger-shaped material 620 for being connected to busbar 610
625b, finger-shaped material discontinuities 625c.Finger-shaped material discontinuities can be by having dirty or having dirty printing equipment to cause.Particularly, it prints
The silk screen or mask of device can at least partly block, wherein the slurry to be applied to semi-conductor cell cannot correctly apply simultaneously
And finger-shaped material discontinuities possibly are present on semi-conductor cell.By the finger-shaped material discontinuities on monitoring printed battery, can trigger
Or initiate the cleaning of the printing equipment as described in this paper implementation.Between two neighbouring finger-shaped materials, such as neighbouring finger
The distance between shape object 620a and finger-shaped material 620b 640 is smaller, just will use finer screen openings or hole or hole, wherein needing
It more to clean.By monitoring the finger-shaped material discontinuities of battery, the matter of semi-conductor cell can be measured based on the finger-shaped material of interruption
Amount, and can highly precisely trigger cleaning treatment.
According to the implementation that can be combined with some other implementations as described herein, cleaning device includes that friction is single
Member.Friction element also is understood as friction head, and wherein friction element can be made of at least one of following material: tissue paper, rubber,
Fabric, textile etc..Friction element is arranged on cleaning device, and wherein the position of friction element can be configured as printing equipment
One of at least one portion.In addition, can be based on the position of the Character adjustment friction element of the monitoring of semi-conductor cell.Adjustment
It can be carried out by operator or automatically be carried out by cleaning supporting element arrangement as described herein.Friction element can be clamped in protrusion
On object, especially on cylindrical bosses, wherein diameter of the protrusion for example with 40mm to 60mm.Cylindrical bosses can be consolidated
It is scheduled on the surface of cleaning device.
According to implementation, as described herein, the cleaning device for cleaning printing equipment may be arranged at semi-conductor cell
At supporting element.According to implementation, cleaning device is configured at least one portion of cleaning printing equipment, and printing equipment is extremely
A few part corresponds at least one section of semi-conductor cell.
According to present disclosure, the exemplary behaviour for cleaning printing equipment in semi-conductor cell production equipment is described
Make, wherein operation includes the feature of monitoring semi-conductor cell, and the feature based on monitoring cleans at least one of printing equipment
Part.According to implementation, monitoring can be supported by operator.Monitoring may include record visual parameters, wherein visual parameters by
Operator, the especially mankind sense.The feature of semi-conductor cell may include the visual parameters sensed by operator.
According to present disclosure, in addition operation is described, wherein in addition operation includes semi-conductor cell being divided via monitoring
At several sections, section is distributed to the part of printing equipment, and the feature of the monitoring of the section based on semi-conductor cell is clear
The part of the printing equipment of section of the clean distribution to semiconductor device.According to implementation, monitoring includes the finger-like of detection battery
Object discontinuities.According to implementation, operation includes being arranged in cleaning device on semi-conductor cell supporting element, and by semiconductor
Battery support is sent to printing equipment.According to implementation, cleaning includes mobile friction element, and wherein friction element is by being used for
Transferring semiconductor battery, the shipping configuration movement particularly for semi-conductor cell supporting element to be transmitted to printing equipment.
Example of the Figure 10 according to implementation as described herein description for the printing equipment of clean semiconductor battery apparatus
Property operation flow chart.Operation 400 includes printed semiconductor battery 410, monitors the feature 420 of the semi-conductor cell of printing, base
Printing equipment 430 is cleaned in the feature of the monitoring of the semi-conductor cell of printing, and further printed semiconductor battery 440.It is above-mentioned
Operation can be repeated over and over again.The operation described in Figure 10 allows closed loop printing treatment, wherein being carried out previously by monitoring
The feature of semi-conductor cell after cleaning treatment and for example pass through the position of the fine position cleaning device of opposite screen process press
It sets to adapt to subsequent cleaning treatment, or by adjusting cleaning device with respect to printing equipment (especially with respect to the silk screen of printing equipment)
Repetition or movement, and improve cleaning treatment step by step.
The implementation of present disclosure allows to improve the cleaning procedure of printing equipment.Cleaning, especially cleaning procedure or journey
Sequence can be improved based on the feature of the monitoring of semi-conductor cell as described herein by cleaning printing equipment.Particularly, clearly
The clean time can be reduced by only cleaning part or the component of the feature of the semi-conductor cell for leading to printing of printing equipment.This
Outside, cleaning can be more effective via the feature for monitoring printed battery and the briefly part of cleaning printing equipment or the impurity of component
Ground carries out.In addition, the quality of semi-conductor cell can be improved.As cleaning device above can also be saved by producing compared with less waste material
Time and cost.Cleaning treatment can be carried out semi-automatically, the low cost improvement of semi-automatic realization cleaning treatment.According to being described herein
The cleaning treatment of implementation can fully automatically carry out, automatically can accelerate cleaning treatment during cleaning treatment and reduce
The downtime of printing equipment.
Although above content is directed to some implementations, other can also be designed in the case where not departing from base region
With the mode that further realizes, and range is determined by appended claims.
Claims (20)
1. a kind of equipment for producing semi-conductor cell, it is characterized in that, the equipment includes:
Printing equipment, for being printed on semi-conductor cell；
Monitoring device is configured to monitor the feature of the semi-conductor cell of the printing, and
Cleaning device is configured as being cleaned the printing equipment based on the feature of the monitoring of the semi-conductor cell extremely
A few part.
2. equipment as described in claim 1, it is characterized in that, the printing equipment includes silk screen, and the cleaning device passes through
It constructs to clean a part of the silk screen.
3. equipment as described in claim 1, it is characterized in that, it provides for the fortune to printing equipment supply semi-conductor cell
Defeated configuration, the shipping configuration form the transport road for semi-conductor cell between the printing equipment and the monitoring device
Diameter.
4. equipment as claimed in claim 3, it is characterized in that, the shipping configuration includes turntable.
5. equipment as claimed in claim 4, it is characterized in that, the turntable has the star main body including tip.
6. equipment as claimed in claim 5, it is characterized in that, the star main body has curved shape, and the curved shape exists
Recess is provided in lateral side regions between the tip.
7. equipment as claimed in claim 3, it is characterized in that, the shipping configuration includes shuttle.
8. equipment as claimed in claim 3, it is characterized in that,
Semi-conductor cell supporting element is arranged on the shipping configuration, wherein the cleaning device may be arranged at the semi-conductor electricity
On the supporting element of pond.
9. equipment as claimed in claim 4, it is characterized in that,
Semi-conductor cell supporting element is arranged on the shipping configuration, wherein the cleaning device may be arranged at the semi-conductor electricity
On the supporting element of pond.
10. equipment as claimed in any one of claims 1-9 wherein, it is characterized in that, the monitoring device is configured to described half
Conductor battery is divided into several sections and is configured to monitor the feature of at least one section of the semi-conductor cell, wherein
Described at least one portion of the printing equipment corresponds at least one section of the semi-conductor cell.
11. equipment as claimed in any one of claims 1-9 wherein, it is characterized in that, the feature of the semi-conductor cell includes
Finger-shaped material discontinuities.
12. equipment as claimed in claim 10, it is characterized in that, the feature of the semi-conductor cell includes that finger-shaped material interrupts
Portion.
13. equipment as claimed in any one of claims 1-9 wherein, it is characterized in that, the cleaning device includes friction element.
14. equipment as claimed in claim 10, it is characterized in that, the cleaning device includes friction element.
15. equipment as claimed in claim 12, it is characterized in that, the cleaning device includes friction element.
16. equipment as claimed in any one of claims 1-9 wherein, it is characterized in that, the cleaning device may be arranged at semi-conductor electricity
Chi Zhichengjianchu.
17. it is a kind of for cleaning the cleaning device of printing equipment, it is characterized in that, the cleaning device may be arranged at semi-conductor cell
At supporting element.
18. cleaning device as claimed in claim 17, it is characterized in that, the cleaning device includes friction element.
19. cleaning device as claimed in claim 18, it is characterized in that, the friction element can be clamped to cylindrical bosses
On, the cylindrical bosses can be fixed on the surface of the cleaning device.
20. cleaning device as claimed in claim 17, it is characterized in that, the cleaning device is configured to clean the printing dress
At least several parts set, several parts of the printing equipment correspond to several sections of semi-conductor cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820392369.5U CN208507633U (en) | 2018-03-22 | 2018-03-22 | Cleaning device for producing the equipment of semi-conductor cell and for cleaning printing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820392369.5U CN208507633U (en) | 2018-03-22 | 2018-03-22 | Cleaning device for producing the equipment of semi-conductor cell and for cleaning printing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507633U true CN208507633U (en) | 2019-02-15 |
Family
ID=65295938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820392369.5U Active CN208507633U (en) | 2018-03-22 | 2018-03-22 | Cleaning device for producing the equipment of semi-conductor cell and for cleaning printing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208507633U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819701A (en) * | 2018-03-22 | 2020-10-23 | 应用材料意大利有限公司 | Device and method for cleaning a printing unit |
-
2018
- 2018-03-22 CN CN201820392369.5U patent/CN208507633U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819701A (en) * | 2018-03-22 | 2020-10-23 | 应用材料意大利有限公司 | Device and method for cleaning a printing unit |
| CN111819701B (en) * | 2018-03-22 | 2024-07-23 | 应用材料意大利有限公司 | Device for producing semiconductor cells, printing device for cleaning printing device and method for cleaning printing device in semiconductor production device |
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