CN208488627U - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN208488627U CN208488627U CN201821182902.1U CN201821182902U CN208488627U CN 208488627 U CN208488627 U CN 208488627U CN 201821182902 U CN201821182902 U CN 201821182902U CN 208488627 U CN208488627 U CN 208488627U
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Abstract
A kind of backlight module and display device, wherein backlight module includes: backlight FPC, glue frame and reflector plate, and glue frame has opposite first surface and second surface, and the first surface of glue frame is arranged in backlight FPC, and the second surface of glue frame is arranged in reflector plate；Glue frame has conductive segment, and backlight FPC is arranged adjacent to conductive segment；Backlight FPC include FPC ontology and be arranged in FPC ontology a side extension, one end of extension is connect by interconnecting piece with FPC ontology, extension is provided with ground connection golden finger, ground connection golden finger is for being grounded, layers of copper is arranged in the surface of interconnecting piece, the layers of copper of interconnecting piece is connect with ground connection golden finger, and the layers of copper of interconnecting piece is also abutted with conductive segment.Above-mentioned backlight module and display device, charge can be importing directly into the conductive segment of the glue frame neighbouring with reflector plate, and conduct by layers of copper to ground connection golden finger, discharge eventually by the ground terminal for the mainboard connecting with ground connection golden finger.
Description
Technical field
The utility model relates to field of display technology, more particularly to a kind of backlight module and display device.
Background technique
As display market competition is more and more fierce, price guiding is also more and more obvious, backlights for display devices mould
The pressure of group cost is also increasing, and all membrane materials of backlight module are both needed to accomplish that price is optimal.Wherein, backlight module uses
Reflector plate, although high by 10% or so using the brightness of conductive silver-colored reflector plate using the brightness ratio of non-conductive reflector plate, by
It is more much higher than the price of conducting reflective piece in the price of non-conductive reflector plate, the condition of customer specifications can be reached in guarantee brightness
Under, backlight module still uses conducting reflective piece.
Traditional backlight module includes an iron frame, and iron frame plays protection and electrostatic conduction, i.e. electrostatic can pass through
Iron frame imports the earth.But it as display device develops towards ultra-thin and high screen accounting, is all had been left out in existing backlight module
The use of iron frame declines to a great extent so as to cause the anti-static ability of display device.Especially collocation conducting reflective piece uses
When, electrostatic can not import ground by iron frame, but since the section of conducting reflective piece is conductive, in backlight module electrostatic test, lead
Electrostatic is introduced backlight unit by galvanic reflex sector-meeting, to LED (Light Emitting Diode, light emitting diode), IC
(integrated circuit, integrated circuit) and LCD (Liquid Crystal Display, liquid crystal display) are likely to
It damages.During electrostatic test, almost in 4KV, backlight FPC (Flexible Printed Circuit, flexible electrical
Road plate) two LED on side will damage, in 6KV, the IC and LCD of display device, it is also possible to irreversible damage occur
It is bad.
Utility model content
Based on this, it is necessary to which conductive for the section of conducting reflective piece, electrostatic is introduced backlight module by conducting reflective sector-meeting
Inside the problem of damaging to LED, IC and LCD, provides a kind of backlight module and display device.
A kind of backlight module, comprising: backlight FPC, glue frame and reflector plate, the glue frame have opposite first surface and the
The first surface of the glue frame is arranged in two surfaces, the backlight FPC, and the second table of the glue frame is arranged in the reflector plate
Face；The glue frame has conductive segment, and the backlight FPC is arranged adjacent to the conductive segment；The backlight FPC include FPC ontology with
And the extension of a side of the FPC ontology is set, one end of the extension is connected by interconnecting piece and the FPC ontology
It connects, the backlight FPC has opposite the first face and the second face, and the first face of the FPC ontology and the backlight FPC is ipsilateral
Surface is provided with ground connection golden finger, institute for installing LED, the extension surface ipsilateral with the first face of the backlight FPC
Ground connection golden finger is stated for being grounded, layers of copper, the company is arranged in the ipsilateral surface in the first face of the interconnecting piece and the backlight FPC
The layers of copper of socket part is connect with the ground connection golden finger, and the layers of copper of the interconnecting piece is also abutted with the conductive segment of the glue frame.
In one of the embodiments, the conductive segment of the glue frame include glue frame ontology and in the glue frame ontology
The lug boss of side connection, the glue frame ontology have opposite first surface and second surface, and the lug boss has opposite
First surface and second surface, wherein the first surface of the glue frame ontology protrudes from the first surface of the lug boss, described
The second surface of glue frame ontology protrudes from the second surface of the lug boss；The of the lug boss is arranged in the backlight FPC
The second surface of the lug boss is arranged in one surface, the reflector plate, and the lug boss is conductive.
The glue frame ontology is conductive in one of the embodiments,.
The surface of the interconnecting piece covers layers of copper in one of the embodiments,；Or, the surface exposure institute of the interconnecting piece
State the layers of copper of the inside of backlight FPC.
The FPC ontology surface ipsilateral with the first face of the backlight FPC is provided in one of the embodiments,
LED pad and the LED driver circuit structure being electrically connected with the LED pad, the LED pad is for installing the LED, institute
It states the extension surface ipsilateral with the first face of the backlight FPC and is provided with LED driving golden finger；The second of the backlight FPC
Face is provided with wire connection structure, and the LED driver circuit structure drives golden hand by the wire connection structure and the LED
Refer to connection.
The ipsilateral whole surface in the first face of the interconnecting piece and the backlight FPC is arranged in one of the embodiments,
Layers of copper.
End of the extension far from interconnecting piece is arranged in one end of the ground connection golden finger in one of the embodiments,
End of the extension close to interconnecting piece is arranged in the other end of ground connection golden finger.
The extension is provided with conductor wire in one of the embodiments, and the ground connection golden finger is close to the connection
The one end in portion is connect by the conductor wire with layers of copper.
The extension and the ground connection golden finger position are described in the surface exposure of the same side in one of the embodiments,
The layers of copper of the inside of backlight FPC, one end of the layers of copper of the extension are connect with the layers of copper of the interconnecting piece, the extension
The other end of layers of copper is connect with the ground connection golden finger.
A kind of display device, including backlight module described in mainboard and any embodiment as above, the ground terminal of the mainboard
It is electrically connected with the ground connection golden finger.
Above-mentioned backlight module, by the way that one section in the glue frame to insulate in traditional technology to be configured to conductive conduction
Section, and backlight FPC is set adjacent to conductive segment, and layers of copper is set on the surface of the interconnecting piece of backlight FPC, and make conductive segment and company
The layers of copper of socket part abuts, and the layers of copper of interconnecting piece is connect with the ground connection golden finger of extension, so that the conductive segment of glue frame, connection
The layers of copper in portion and ground connection golden finger three form circuit, when reflector plate imports electrostatic adjacent to the section of the part of conductive segment, electricity
Lotus can successively be conducted to layers of copper and ground connection golden finger, and finally lead to by the glue frame with conductive segment contacted with reflector plate
The ground terminal release for crossing and being grounded the mainboard that connect of golden finger, avoid electrostatic be introduced into backlight unit and to LED, IC and
LCD is damaged.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of backlight module in one embodiment；
Fig. 2 is the structural schematic diagram of the first surface of the backlight FPC of backlight module in one embodiment；
Fig. 3 is the structural schematic diagram of the glue frame of backlight module in one embodiment；
Fig. 4 is the schematic diagram of the section structure of backlight module in another embodiment；
Fig. 5 is the structural schematic diagram of the second surface of the backlight FPC of backlight module in one embodiment.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element, unless otherwise restricted clearly.For the common skill of this field
For art personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, upper and lower, left and right are intended merely to illustrate the relativeness for understanding position, but do not constitute contraposition
Set the specific restriction of relationship.
In order to be more convenient for understanding the utility model, in one of the embodiments, please refer to Fig. 1 and Fig. 2, backlight mould
Group 10 includes backlight FPC100, glue frame 200 and reflector plate 300.Glue frame 200 has opposite first surface 201 and second surface
The first surface 201 of glue frame 200 is arranged in 202, backlight FPC100, and the second surface 202 of glue frame 200 is arranged in reflector plate 300.
Glue frame 200 has conductive segment 210, and backlight FPC100 is arranged adjacent to conductive segment 210.
Backlight FPC100 include FPC ontology 110 and be arranged in FPC ontology 110 a side extension 130, extend
The one end in portion 130 is connect by interconnecting piece 120 with FPC ontology 110.
Backlight FPC100 has opposite 102 (not shown) of the first face 101 and the second face, FPC ontology 110 and backlight
For the ipsilateral surface in the first face 101 of FPC100 for installing LED, the first face 101 of extension 130 and backlight FPC100 is ipsilateral
Surface is provided with ground connection golden finger 131, and ground connection golden finger 131 is for being grounded.First face of interconnecting piece 120 and backlight FPC100
Layers of copper 121 is arranged in 101 ipsilateral surfaces, and the layers of copper 121 of interconnecting piece 120 is connect with ground connection golden finger 131, the copper of interconnecting piece 120
Layer is also abutted with the conductive segment 210 of glue frame 200.Specifically, the layers of copper 121 of interconnecting piece 120 is electrically connected with ground connection golden finger 131.
Above-mentioned backlight module, by the way that one section in the glue frame to insulate in traditional technology to be configured to conductive conduction
Section, and backlight FPC is set adjacent to conductive segment, and layers of copper is set on the surface of the interconnecting piece of backlight FPC, and make conductive segment and company
The layers of copper of socket part abuts, and the layers of copper of interconnecting piece is connect with the ground connection golden finger of extension, so that the conductive segment of glue frame, connection
The layers of copper in portion and ground connection golden finger three form circuit, when reflector plate imports electrostatic adjacent to the section of the part of conductive segment, electricity
Lotus can successively be conducted to layers of copper and ground connection golden finger, and finally lead to by the glue frame with conductive segment contacted with reflector plate
The ground terminal release for crossing and being grounded the mainboard that connect of golden finger, avoid electrostatic be introduced into backlight unit and to LED, IC and
LCD is damaged.
Specifically, backlight FPC100 is for welding LED to provide backlight to backlight module, and glue frame 200 is for accommodating back
Each film layer structure in optical mode group, reflector plate 300 are used to reflect the LED light issued to optimize shining for LED.
Specifically, as shown in Figure 2 and Figure 5, the ipsilateral surface in the first face 101 of extension 130 and backlight FPC100 is arranged
There is ground connection golden finger 131, and is grounded the table ipsilateral through the second face 102 of extension 130 and backlight FPC100 of golden finger 131
Face.
Specifically, referring to Fig. 3, glue frame 200 includes conductive segment 210 and is separately connected with the both ends of conductive segment 210 exhausted
Rim segment 220, conductive segment 210 and insulating segment 220 are enclosed the glue frame 200 of frame structure.Wherein, conductive segment 210 is using conductive
Material is made, and insulating segment 220 is made of isolation material.
In one of the embodiments, referring to Fig. 4, the conductive segment 210 of glue frame 200 include glue frame ontology 203 and with
The lug boss 204 of the inside connection of glue frame ontology 203, glue frame ontology 203 have opposite first surface 2031 and second surface
2032, lug boss 204 has opposite first surface 2041 and second surface 2042, wherein the first surface of glue frame ontology 203
2031 protrude from the first surface 2041 of lug boss 204, and the second surface 2032 of glue frame ontology 203 protrudes from lug boss 204
Second surface 2042；The first surface 2041 of lug boss 204 is arranged in backlight FPC100, and reflector plate 300 is arranged in lug boss 204
Second surface 2042, lug boss 204 is conductive.In this way, the first surface of glue frame ontology and the first surface of lug boss form one
Step structure can accommodate one end of backlight FPC, and the second surface of glue frame ontology and the second surface of lug boss form a Step-edge Junction
Structure can accommodate the end of reflector plate, and only with the lug bosses of reflector plate and glue frame body contacts conduction, due to insulating materials at
This is lower than the cost of conductive material, in this way design, compared with traditional glue frame, will only contact with backlight FPC and reflector plate
Lug boss is arranged using conductive material, and other parts still use insulating materials, save the cost of glue frame.
It is designed for the ease of the production of glue frame, in another embodiment, glue frame ontology and lug boss are conductive.For example,
Glue frame ontology and lug boss are integrally formed.In this way, glue frame ontology can produce simultaneously with lug boss, does not have to separately production, be convenient for
The production of glue frame designs.
In order to facilitate the setting of layers of copper, the surface of interconnecting piece covers layers of copper in one of the embodiments,.In this way, directly
Layers of copper is covered on the surface of interconnecting piece, facilitates the setting of layers of copper.
In order to save the use of material, in another embodiment, the copper of the inside of the surface exposure backlight FPC of interconnecting piece
Layer.Since the inside of backlight FPC has layers of copper, but the internal structure in order to protect backlight FPC, layers of copper is by insulation protections such as ink
The surface setting protective layer of layer covering, i.e. backlight FPC has covered layers of copper, it is only necessary to remove the protection on the layers of copper surface of interconnecting piece
Layer, can make the layers of copper of interconnecting piece exposed, the surface of interconnecting piece is made to be provided with layers of copper, this way it is not necessary to again in the table of interconnecting piece
Face covers layers of copper, can save the use of material.
In order to increase the contact area of interconnecting piece layers of copper, to improve conducting power, interconnecting piece in one of the embodiments,
120 are arranged layers of copper with the ipsilateral whole surface in the first face 101 of backlight FPC100.In this way, increasing the area of layers of copper, that is, increase
The contact area of conductive segment and layers of copper, improves conducting power.
It is connect in order to facilitate ground connection golden finger with layers of copper, is grounded one end setting of golden finger in one of the embodiments,
In end of the extension far from interconnecting piece, it is grounded the end that extension is arranged in close to interconnecting piece in the other end of golden finger.In this way,
It is closer apart from layers of copper to be grounded golden finger, it is more convenient to be electrically connected with ground connection golden finger；
In order to be grounded being electrically connected for golden finger and layers of copper, extension is provided with conduction in one of the embodiments,
Line, ground connection golden finger are connect by conductor wire with layers of copper close to one end of interconnecting piece.
In order to save the use of material, in another embodiment, extension and the ground connection golden finger position are in the same side
Surface exposure backlight FPC inside layers of copper, the layers of copper of one end of the layers of copper of extension and interconnecting piece connects, the copper of extension
The other end of layer is connect with ground connection golden finger.In this way, it is only necessary to remove the protective layer of extension part copper layer surface, can make to prolong
The part layers of copper of extending portion is exposed, and the surface of extension is made to be provided with layers of copper, this way it is not necessary to which on the surface of extension, setting is led again
Electric wire can be such that layers of copper is electrically connected with ground connection golden finger, can save the use of material.
There is opposite 101 He of the first face referring to Fig. 2 and Fig. 5, backlight FPC100 in one of the embodiments,
Second face 102, the ipsilateral surface in the first face 101 of FPC ontology 110 and backlight FPC100 be provided with LED pad 111 and with
The ipsilateral table in the first face 101 of the LED driver circuit structure 112 that LED pad 111 is electrically connected, extension 130 and backlight FPC100
Face is provided with LED driving golden finger 132, and LED driver circuit structure 112 is electrically connected with LED driving golden finger 132.
In order to avoid making LED driver circuit structure and LED drive golden finger electricity from the surface cabling of interconnecting piece setting layers of copper
The setting of layers of copper is connected and influences, specifically, referring to Fig. 5, the second face 102 of backlight FPC100 is provided with wire connection structure
412, LED driver circuit structures 112 drive golden finger 132 to connect by wire connection structure 412 with LED.Specifically, LED drives
Moving-wire line structure 112 is electrically connected by the conductive layer inside backlight FPC with wire connection structure 412, LED driver circuit structure
Pass through the conductive layer and LED driving golden finger inside backlight FPC.
Specifically, as shown in Figure 2 and Figure 5, the ipsilateral surface in the first face 101 of extension 130 and backlight FPC100 is arranged
The table for having driving golden finger 132, and driving golden finger 132 ipsilateral through the second face 102 of extension 130 and backlight FPC100
Face.
In order to further protect the LED being arranged on backlight FPC, the first of backlight FPC100 in one of the embodiments,
Surface 101 is covered with high resistant insulating layer, LED pad 111, LED driver circuit structure 112, LED driving golden finger 132, ground connection gold
The layers of copper 121 of finger 131 and interconnecting piece 120 exposes to high resistant insulating layer.Since LED is welded on LED pad, by backlight FPC
First surface covering high resistant insulating layer further protect the FPC ontology and extension of FPC, increase the impedance in LED cabling face,
It prevents electrostatic from directly being contacted from FPC ontology and extension with LED or golden finger, further protects and be arranged on backlight FPC
LED.For example, high resistant insulating layer is the insulating layer with high impedance, for example, high resistant insulating layer is the insulating oil with high impedance
Layer, such as high resistant insulating layer are dirty oil layer.
In order to facilitate each golden finger is designed, golden hand is driven referring to Fig. 2, each LED in one of the embodiments,
Finger 132 and ground connection golden finger 131 are parallel to each other and are alternatively arranged.For example, the quantity of LED driving golden finger 132 is 3.Specifically,
3 LED driving golden fingers 132 include that a LED drives positive golden finger and two LED to drive cathode golden finger, and LED drives just
Pole golden finger and two LED driving cathode golden fingers are respectively used to be electrically connected with LED driver circuit structure 112.Due to existing
The circuit connection of LED designs, and generalling use two includes that the concatenated branch of several LED carries out two-way mixed connection design in parallel,
Anode after the LED series connection of two branches can drive positive golden finger to connect with a LED, after the LED series connection of two branches
Cathode can be connect respectively with two LED driving cathode golden fingers.In this way, the application can will be in traditional backlight FPC structure
One of LED drive positive golden finger to be designed as ground connection golden finger, the quantity without changing golden finger.
Specifically, backlight module further includes LED, and LED is welded on LED pad.LED in one of the embodiments,
Quantity be it is multiple, the quantity of LED pad and the quantity of LED are identical, and every LED is corresponding with a LED pad, and each LED is welded on
On LED pad corresponding to it.
A kind of display device is also disclosed in the utility model comprising backlight mould described in mainboard and any embodiment as above
Group, the ground terminal of the mainboard are electrically connected with the ground connection golden finger.Specifically, display device further includes display panel and display
Center, wherein backlight module and display panel are oppositely arranged, and backlight module and display panel are contained in display center.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of backlight module characterized by comprising backlight FPC, glue frame and reflector plate, the glue frame have opposite the
The first surface of the glue frame is arranged in one surface and second surface, the backlight FPC, and the reflector plate is arranged in the glue frame
Second surface；
The glue frame has conductive segment, and the backlight FPC is arranged adjacent to the conductive segment；
The backlight FPC include FPC ontology and be arranged in the FPC ontology a side extension, the extension
One end is connect by interconnecting piece with the FPC ontology；
The backlight FPC has opposite the first face and the second face, and the first face of the FPC ontology and the backlight FPC is ipsilateral
Surface for installing LED, the surface that the first face of the extension and the backlight FPC are ipsilateral is provided with ground connection golden finger,
For the ground connection golden finger for being grounded, layers of copper is arranged in the ipsilateral surface in the first face of the interconnecting piece and the backlight FPC, described
The layers of copper of interconnecting piece is connect with the ground connection golden finger, and the layers of copper of the interconnecting piece is abutted with the conductive segment of the glue frame.
2. backlight module according to claim 1, which is characterized in that the conductive segment of the glue frame include glue frame ontology and
The lug boss connecting with the inside of the glue frame ontology, the glue frame ontology have opposite first surface and second surface, institute
Lug boss is stated with opposite first surface and second surface, wherein the first surface of the glue frame ontology protrudes from described convex
The first surface in the portion of rising, the second surface of the glue frame ontology protrude from the second surface of the lug boss；
The first surface of the lug boss is arranged in the backlight FPC, and the second table of the lug boss is arranged in the reflector plate
Face, the lug boss are conductive.
3. backlight module according to claim 2, which is characterized in that the glue frame ontology and the lug boss are conductive.
4. backlight module according to claim 1, which is characterized in that the surface of the interconnecting piece covers the layers of copper；Or,
The layers of copper of the inside of backlight FPC described in the surface exposure of the interconnecting piece.
5. backlight module according to claim 1, which is characterized in that the first face of the FPC ontology and the backlight FPC
The LED driver circuit structure that ipsilateral surface is provided with LED pad and is electrically connected with the LED pad, the LED pad are used
In installing the LED, the extension surface ipsilateral with the first face of the backlight FPC is provided with LED driving golden finger；
The second face of the backlight FPC is provided with wire connection structure, and the LED driver circuit structure passes through the connection
Structure is connect with LED driving golden finger.
6. backlight module according to claim 1, which is characterized in that the first face of the interconnecting piece and the backlight FPC
Layers of copper is arranged in ipsilateral whole surface.
7. backlight module according to claim 1, which is characterized in that one end setting of the ground connection golden finger is prolonged described
The other end of end of the extending portion far from the interconnecting piece, the ground connection golden finger is arranged in the extension close to the interconnecting piece
End.
8. backlight module according to claim 1, which is characterized in that the extension is provided with conductor wire, the ground connection
Golden finger is connect by the conductor wire with layers of copper close to one end of the interconnecting piece.
9. backlight module according to claim 1, which is characterized in that the extension is with the ground connection golden finger position in same
The layers of copper of the inside of backlight FPC described in the surface exposure of side, the copper of one end of the layers of copper of the extension and the interconnecting piece
Layer connection, the other end of the layers of copper of the extension are connect with the ground connection golden finger.
10. a kind of display device, which is characterized in that including mainboard and backlight mould as claimed in any one of claims 1-9 wherein
Group, the ground terminal of the mainboard are electrically connected with the ground connection golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821182902.1U CN208488627U (en) | 2018-07-24 | 2018-07-24 | Backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821182902.1U CN208488627U (en) | 2018-07-24 | 2018-07-24 | Backlight module and display device |
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| Publication Number | Publication Date |
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| CN208488627U true CN208488627U (en) | 2019-02-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324202A (en) * | 2021-06-07 | 2021-08-31 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
-
2018
- 2018-07-24 CN CN201821182902.1U patent/CN208488627U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324202A (en) * | 2021-06-07 | 2021-08-31 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
| CN113324202B (en) * | 2021-06-07 | 2022-05-17 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
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