CN208401974U - A kind of camera image converting system of Vacuum Package image sensor chip - Google Patents

Abstract

The utility model discloses a kind of camera image converting systems of Vacuum Package image sensor chip, a kind of camera image converting system of Vacuum Package image sensor chip of its drip irrigation device, including shell, the intracorporal image conversion module of shell, the power module being powered to image conversion module and the data processing module handled the signal of image conversion module are set, the shell offers sealing cavity, and vacuum-degree monitoring module is provided in the sealing cavity；Terminal control module is provided on the outside of the sealing cavity, the vacuum-degree monitoring module is connected with terminal control module.Can to the vacuum degree in sealing cavity carry out real-time monitoring, vacuum degree signal be sent in real time, can it is more accurate and timely learn the vacuum degree in sealing cavity change.

Description

A kind of camera image converting system of Vacuum Package image sensor chip

Technical field

The utility model relates to camera vacuum processing techniques, more specifically, it relates to a kind of Vacuum Package image sensing The camera image converting system of device chip.

Background technique

Camera is a kind of equipment for forming image using optical imaging concept and using negative writing image, and subject is anti- After the light of injection is focused by the shutter of photographic film (taking the photograph scenery mirror) and control light exposure, sense of the subject in camera bellows Sub-image is formed in luminescent material.

The imaging sensor that existing camera uses is respectively SMOS imaging sensor and ccd image converter, both It is to carry out photoelectric conversion using light sensitive diode (photodiode), converts the image into numerical data, and its main difference is The mode of numerical data transmission is different.

It, can be easily by peripheral circuit since cmos sensor uses the most common CMOS technology of general semiconductor circuit (such as AGC, CDS, Timing generator or DSP) is integrated into sensor chip, therefore can save peripheral chip Cost;In addition to this, since CCD transmits data by the way of charge transfer, as long as soon as wherein have a pixel that cannot run, The data that will lead to an entire row cannot transmit, therefore the yield rate for controlling ccd sensor is more difficult than cmos sensor many, because This, the cost of ccd sensor can be higher than cmos sensor.

When carrying out image conversion using cmos sensor or ccd image converter, when the working time is longer, chip temperature Degree increases, and can generate heat, so as to cause thermal noise, generates interference to image forming, therefore is needed in use to CMOS Sensor or ccd image converter freeze, and thermal noise phenomenon is reduced by way of refrigeration；Due in cmos sensor Perhaps there are vapor around ccd image converter in order to reduce the air around cmos sensor or ccd image converter Content usually will be set as vacuum state in objective lens, to prevent steam present in air etc. from condensing on objective lenses, Influence imaging.

It can be visually noticeable after only being condensed due to the steam in air, when the vacuum degree in objective lens is relatively low When, air is entered in objective lens, as long as will not condense droplet on objective lenses, user is difficult to learn objective lens Interior vacuum degree already changes.However these enter the air in objective lens, the steam etc. included equally will affect object The precision and clarity of lens head.

Utility model content

In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of Vacuum Package imaging sensors The camera image converting system of chip can carry out real-time monitoring to the vacuum degree in sealing cavity, and vacuum degree signal is real-time Send, can it is more accurate and timely learn the vacuum degree in sealing cavity change.

To achieve the above object, the utility model provides following technical solution:

A kind of camera image converting system of Vacuum Package image sensor chip, including shell are arranged intracorporal in shell Image conversion module, the power module being powered to image conversion module and the signal of image conversion module is handled Data processing module, the shell offers sealing cavity, vacuum-degree monitoring module is provided in the sealing cavity；? It is provided with terminal control module on the outside of the sealing cavity, the vacuum-degree monitoring module is connected with terminal control module.

By using above-mentioned technical proposal, when in use, camera lens can be by optical signal transfer to sensor chip, sensor Optical signalling is converted electric signal by chip, is transferred to data processing module, meanwhile, by electric power source pair of module sensor chip into Row power supply.Image conversion module is vacuum-treated by the sealing cavity of setting, is imaged when in use relatively clear.Together When, the real-time monitoring to vacuum degree in sealing cavity is realized by the vacuum-degree monitoring module being arranged in sealing cavity, it will be true Cycle signal is sent in real time, can it is more accurate and timely learn the vacuum degree in sealing cavity change.

The sealing cavity side offers the first seal, the second seal is offered in the other side, described first It is sealed and installed with seal glass at seal, is sealed and installed with pcb board at second installing port；Described image conversion module and Vacuum-degree monitoring module is connect on the inside of sealing cavity with pcb board, the power module, terminal control module and data processing mould Block on the outside of sealing cavity with pcb board by connecting；The vacuum exhaust pipe being connected to sealing cavity is provided on the shell.

Preferably, in the shell and being located on the inner wall of sealing cavity integrally formed with step；In the step upper cover Equipped with the first sealing ring, the seal glass is folded between step and the first sealing ring.

Seal glass is fixed by the step and sealing ring of setting by using above-mentioned technical proposal, optics letter It number is transmitted by seal glass.

Preferably, offering the first seal groove on the step, the first sealing ring is provided in first seal groove； First sealing ring offers the second seal groove close to the side of step, is provided with the second sealing in second seal groove Circle, the seal glass are folded between the first sealing ring and the second sealing ring.

By using above-mentioned technical proposal, by the first sealing ring of setting and it is arranged in the second seal groove second close Seal carries out grip seal to seal glass in the two sides of seal glass, and when vacuumizing, sealing effect is preferable.

Preferably, second seal groove is being formed with rib by paracentral side, the width of the rib is less than institute State the thickness of the first sealing ring, diameter of the diameter less than the second seal groove and the diameter greater than rib of the seal glass；Institute The first sealing ring is stated to be bolted on step.

By using above-mentioned technical proposal, by the rib of setting, so as to be limited in second close for the position of seal glass In sealing groove, keep its relatively stable, meanwhile, the first sealing ring is detachably secured on step by using bolt, so as to It is more convenient that it is dismantled, is replaced.

Preferably, the side in the sealing cavity and close to the second seal is integrally formed with mounting ring；Described image Conversion module is mounted on mounting ring close to the side of the first seal, and it is close close to second that the pcb board is sealingly mounted at mounting ring The side of sealing.

By using above-mentioned technical proposal, pcb board by setting is to being sealed fixation, pcb board at the second seal In sealing, the circuit element of two sides can be both electrically connected, meanwhile, it is arranged by the multilayered structure of pcb board, so that The connection jaws of two sides are not connected between each other, so that the vacuum sealing better effect in sealing cavity.

Preferably, on the shell and being located at the mounting ring upper cover equipped with the second sealing ring, the pcb board seals sandwiched Between the second sealing ring and mounting ring.

By using above-mentioned technical proposal, clamping is fixed to pcb board by the second sealing ring and mounting ring of setting.

Preferably, the mounting ring offers third seal groove, the third sealing in the side close to the second sealing ring Third sealing ring is provided in slot, the pcb board is crimped on third sealing ring.

Third is installed in seal groove by opening up third seal groove in mounting ring by using above-mentioned technical proposal Sealing ring, so that pcb board is sealed processing to sealing cavity.

Preferably, offering blind hole in the mounting ring and on the outside of third seal groove；On second sealing ring and pcb board Location hole is offered, location hole is passed through by the bolt of setting and is threaded in blind hole.

By using above-mentioned technical proposal, the second sealing ring is fixed by bolt, so that pcb board is detachably fixed Between the second sealing ring and mounting ring.

Preferably, described image conversion module includes that the sensor chip being mounted in mounting ring and setting are sensing Semiconductor chilling plate between device chip and mounting ring.

By using above-mentioned technical proposal, reception conversion is carried out to optical signalling by the sensor chip of setting, is being passed In sensor chip operation engineering, heat can be generated, so that thermal noise is generated, by the semiconductor chilling plate of setting to sensor core Piece freezes, to more effectively reduce thermal noise.

In conclusion the utility model has the following beneficial effects:

1, when in use, optical signalling can be converted optical signal transfer to sensor chip, sensor chip by camera lens For electric signal, it is transferred to data processing module, meanwhile, it is powered by electric power source pair of module sensor chip.Pass through setting Sealing cavity is vacuum-treated image conversion module, is imaged when in use relatively clear.Meanwhile it is empty in sealing by setting Intracavitary vacuum-degree monitoring module is realized to the real-time monitoring of vacuum degree in sealing cavity, vacuum degree signal can be sent out in real time Send, can it is more accurate and timely learn the vacuum degree in sealing cavity change；

2, by the first sealing ring of setting and the second sealing ring being arranged in the second seal groove, the two of seal glass Side carries out grip seal to seal glass；

3, by the pcb board of setting to fixation is sealed at the second seal, pcb board, both can be to two in sealing The circuit element of side is electrically connected, meanwhile, be arranged by the multilayered structure of pcb board so that the connection jaws of two sides mutually it Between be not connected to so that the vacuum sealing better effect in sealing cavity.

Detailed description of the invention

Fig. 1 is a kind of perspective view of the explosion of the camera image converting system of Vacuum Package image sensor chip；

Fig. 2 is the section view of image conversion module in a kind of camera image converting system of Vacuum Package image sensor chip Figure；

Fig. 3 is prominent vacuum-degree monitoring module in a kind of camera image converting system of Vacuum Package image sensor chip The flow chart of work；

Fig. 4 is the explosion of image conversion module in a kind of camera image converting system of Vacuum Package image sensor chip Schematic diagram；

Fig. 5 is the structural schematic diagram of shell in a kind of camera image converting system of Vacuum Package image sensor chip；

Fig. 6 is that showing for the first sealing ring is protruded in a kind of camera image converting system of Vacuum Package image sensor chip It is intended to；

Fig. 7 is that the explosion of prominent pcb board in a kind of camera image converting system of Vacuum Package image sensor chip is shown It is intended to；

Fig. 8 is the structural schematic diagram of shell in a kind of camera image converting system of Vacuum Package image sensor chip.

Appended drawing reference: 1, shell；11, sealing cavity；111, the first seal；112, the second seal；12, glass is sealed Glass；13, step；131, the first seal groove；132, the first sealing ring；14, the first sealing ring；141, the second seal groove；142, Two sealing rings；143, rib；15, mounting ring；151, third seal groove；152, blind hole；153, third sealing ring；16, pcb board； 17, the second sealing ring；171, location hole；18, vacuum exhaust pipe；2, image conversion module；21, sensor chip；22, sensor Circuit board；23, semiconductor chilling plate；3, power module；4, data processing module；5, vacuum-degree monitoring module；6, terminal control Module；7, shell；8, signal receiving module.

Specific embodiment

The utility model is described in further detail below in conjunction with attached drawing, wherein the identical attached drawing of identical components Label indicates.It should be noted that word "front", "rear" used in the following description, "left", "right", "up" and "down", " bottom Face " and " top surface " refer to that the direction in attached drawing, word "inner" and "outside" are referred respectively to towards or away from particular elements geometry The direction at center.

A kind of camera image converting system of Vacuum Package image sensor chip, referring to figs. 1 and 2, including shell Body 1, the image conversion module 2 being arranged in shell 1, the power module 3 being powered to image conversion module 2 and to image The data processing module 4 that the signal of conversion module 2 is handled, wherein when in use, converted on shell 1 and close to image 2 side of module is equipped with camera lens, right by image conversion module 2 by camera lens by optical signal transfer to image conversion module 2 Optical signalling is handled, and then converts electric signal for optical signalling, is then passed to data processing module 4 and is handled, In use, data processing module 4, image conversion module 2 etc. are powered by power module 3.

As shown in Figure 1, it is further, shell 7 is installed in shell 1 and close to 112 side of the second seal, passes through shell 7 are located at power module 3,4 outside of data processing module, to protect to the two.

In conjunction with shown in Fig. 2 and Fig. 3, shell 1 is cylindrical, and sealing cavity 11, image modulus of conversion are offered on the inside of shell 1 Block 2 is mounted in sealing cavity 11, and sealing cavity 11 is vacuum structure.

In conjunction with shown in Fig. 3 and Fig. 4, further, vacuum-degree monitoring module 5 is provided in sealing cavity 11；It is sealing It is provided with terminal control module 6 on the outside of cavity 11, the connection type of vacuum-degree monitoring module 5 and terminal control module 6 can be Bluetooth signal connection, wireless network connection or telecommunications connection etc..

By the vacuum-degree monitoring module 5 being arranged in sealing cavity 11, the vacuum structure in sealing cavity 11 is carried out Real-time monitoring, meanwhile, outside is provided with signal receiving module 8, the vacuum degree signal for issuing to terminal control module 6 is real When receive, can it is more accurate and timely learn the vacuum degree in sealing cavity 11 change；When the vacuum degree in sealing cavity When dropping to influence imaging, it can timely replace, repair.

In conjunction with shown in Fig. 2 and Fig. 4, wherein form two openings, respectively the first seal at the both ends of sealing cavity 11 111 and second seal 112, wherein optical signalling is transmitted by the first seal 111, the second seal 112 is used for and power supply Module 3(is shown in Fig. 1), data processing module 4(see Fig. 1) be electrically connected.

Wherein, image conversion module 2 includes sensor chip 21 and setting in sensor chip 21 and close to second close Seal the semiconductor chilling plate 23 of 112 sides, wherein sensor chip 21 can turn for SMOS imaging sensor and ccd image Parallel operation, wherein sensor chip 21 and vacuum-degree monitoring module 5 are fixedly mounted on sensor circuit board 22, semiconductor refrigerating Piece 23 carries out cooling down to sensor circuit board 22.

In use, semiconductor chilling plate 23 carries out in process of refrigerastion sensor chip 21, when in sealing cavity 11 memories can generate thermal convection in case of air, in imaging process, can produce bigger effect to imaging effect, therefore will be close Envelope cavity 11 is set as vacuum structure, so that without air around sensor chip 21, so that sensor chip 21 Imaging effect is more preferable.

In conjunction with shown in Fig. 4 and Fig. 5, carried out in the seal glass 12 that one end close to the first seal 111 passes through setting close Envelope, thus, optical signalling is transmitted on sensor chip 21 through seal glass 12.

In conjunction with shown in Fig. 4 and Fig. 6, radially it is integrally formed in 1 cavity of shell and close to one end of the first seal 111 There is step 13, the first seal groove 131 is offered on step 13, by the way that the first sealing ring is arranged in the first seal groove 131 132, so that seal glass 12 can be crimped on the first sealing ring 132, at the same time, being provided with can be crimped on seal glass 12 The first sealing ring 14, meanwhile, offer the second seal groove 141 close to the side of seal glass 12 in the first sealing ring 14, The second sealing ring 142 is provided in second seal groove 141, thus when being crimped to seal glass 12, so that seal glass 12 are between the first sealing ring 132 and the second sealing ring 142, meanwhile, pass through in the deep side of the first seal groove 131 The first sealing ring 14 is fixed on step 13 using bolt, so that seal glass 12 is able to maintain impaction state, thus Realize sealing state.

Further, the second seal groove 141 is being formed with rib 143 by paracentral side, and the width of rib 143 is small In the thickness of the first sealing ring 14, and the diameter of seal glass 12 less than the second seal groove 141 diameter and be greater than rib 143 Diameter, thus, in fixing seal glass 12, seal glass 12 is connected in the second seal groove 141, it is radial to close Envelope glass 12 is limited, so that seal glass 12 is relatively stable when the first sealing ring 14 is fixed.

Referring to figs. 7 and 8, wherein the side in sealing cavity 11 and close to the second seal 112 is integrally formed There is mounting ring 15, wherein side of the mounting ring 15 far from the second seal 112 is arranged in image conversion module 2, in mounting ring 15 Upper and close to the second seal 112 side is sealed and installed with pcb board 16, wherein by pcb board 16 to the second seal 112 Side is sealed fixation, meanwhile, sensor chip 21 and semiconductor chilling plate 23 and pcb board 16 are electrically connected, and pcb board 16 exists Far from sensor chip 21 side with power module 3(ining conjunction with Fig. 1), data processing module 4 electric connection, thus realization number On the basis of transmitting function, better vacuum sealing is carried out.

Wherein, third seal groove 151 is offered far from the side of sensor chip 21 in mounting ring 15, in third seal groove It is provided with third sealing ring 153 in 151, pcb board 16 is connected on third sealing ring 153, meanwhile, it is crimped on pcb board 16 Second sealing ring 17 makes to crimp between pcb board 16 and third sealing ring 153 more closely, to make by the second sealing ring 17 Obtain the sealing effect of pcb board 16 more.

Further, blind hole 152 is offered in mounting ring 15 and in the deep side of third seal groove 151, The location hole 171 cooperated with blind hole 152 is offered on second sealing ring 17 and pcb board 16, thus, successively by the bolt of setting Low temperature inner hole rear thread on the second sealing ring 17 and pcb board 16 is connected in blind hole 152, to realize to pcb board 16 Fixation.

It should be noted that pcb board 16 is set as multi-layer PCB board 16, two sides respectively with sensor chip 21, power module 3 and the interface that is electrically connected of data processing module 4 be not interconnected, preferably sealing cavity can be sealed.

Meanwhile in order to vacuumize to sealing cavity 11, the vacuum being connected to sealing cavity 11 is provided on shell 1 Seal glass 12, pcb board 16 are carried out installation fixation first when in use by exhaust tube 18, then right by vacuum exhaust pipe 18 Sealing cavity 11 is vacuumized.

This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but As long as all by the protection of Patent Law in the scope of the claims of the utility model.

Claims (10)

1. a kind of camera image converting system of Vacuum Package image sensor chip, including shell (1) are arranged in shell (1) Interior image conversion module (2), the power module (3) being powered to image conversion module (2) and to image conversion module (2) data processing module (4) that signal is handled, it is characterised in that:

The shell (1) offers sealing cavity (11), is provided with vacuum-degree monitoring module in the sealing cavity (11) (5),

It is provided with terminal control module (6) on the outside of the sealing cavity (11), the vacuum-degree monitoring module (5) and terminal control Molding block (6) connection.

2. the camera image converting system of Vacuum Package image sensor chip according to claim 1, it is characterized in that:

Sealing cavity (11) side offers the first seal (111), offers the second seal (112) in the other side, It is sealed and installed with seal glass (12) at first seal (111), is sealed and installed at second seal (112) Pcb board (16)；

Described image conversion module (2) and vacuum-degree monitoring module (5) are connect on the inside of sealing cavity (11) with pcb board (16), The power module (3), terminal control module (6) and data processing module (4) are by sealing cavity (11) outside and pcb board (16) Connection；

The vacuum exhaust pipe (18) being connected to sealing cavity (11) is provided on the shell (1).

3. the camera image converting system of Vacuum Package image sensor chip according to claim 2, it is characterized in that:

In the shell (1) and it is located on the inner wall of sealing cavity (11) integrally formed with step (13)；

The first sealing ring (14) are equipped in the step (13) upper cover, the seal glass (12) is folded in step (13) and first Between sealing ring (14).

4. the camera image converting system of Vacuum Package image sensor chip according to claim 3, it is characterized in that:

The first seal groove (131) are offered on the step (13), are provided with the first sealing in first seal groove (131) It encloses (132)；

First sealing ring (14) offers the second seal groove (141) close to the side of step (13), second seal (112) it is provided with the second sealing ring (142) in, the seal glass (12) is folded in the first sealing ring (132) and the second sealing It encloses between (142).

5. the camera image converting system of Vacuum Package image sensor chip according to claim 4, it is characterized in that:

Second seal groove (141) is formed with rib (143) by paracentral side, and the width of the rib (143) is small In the thickness of first sealing ring (14), the diameter of the seal glass (12) less than the second seal groove (141) diameter and Greater than the diameter of rib (143)；

First sealing ring (14) is bolted on step (13).

6. the camera image converting system of Vacuum Package image sensor chip according to claim 2, it is characterized in that:

Side in the sealing cavity (11) and close to the second seal (112) is integrally formed with mounting ring (15)；

Described image conversion module (2) is mounted on the side of mounting ring (15) close to the first seal (111), the pcb board (16) it is sealingly mounted at the side of mounting ring (15) close to the second seal (112).

7. the camera image converting system of Vacuum Package image sensor chip according to claim 6, it is characterized in that:

On the shell (1) and it is located at the mounting ring (15) upper cover equipped with the second sealing ring (17), pcb board (16) sealing It is folded between the second sealing ring (17) and mounting ring (15).

8. the camera image converting system of Vacuum Package image sensor chip according to claim 6, it is characterized in that:

The mounting ring (15) offers third seal groove (151) in the side close to the second sealing ring (17), and the third is close It is provided with third sealing ring (153) in sealing groove (151), the pcb board (16) is crimped on third sealing ring (153).

9. the camera image converting system of Vacuum Package image sensor chip according to claim 8, it is characterized in that:

It is offered blind hole (152) on the mounting ring (15) and on the outside of third seal groove (151)；

Location hole (171) are offered on second sealing ring (17) and pcb board (16), location hole is passed through by the bolt of setting (171) it is threaded on blind hole (152).

10. the camera image converting system of Vacuum Package image sensor chip according to claim 1, it is characterized in that:

Described image conversion module (2) includes that the sensor chip (21) being mounted on mounting ring (15) and setting are sensing Semiconductor chilling plate (23) between device chip (21) and mounting ring (15).