CN208368489U - sealing structure - Google Patents
sealing structure Download PDFInfo
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- CN208368489U CN208368489U CN201820349442.0U CN201820349442U CN208368489U CN 208368489 U CN208368489 U CN 208368489U CN 201820349442 U CN201820349442 U CN 201820349442U CN 208368489 U CN208368489 U CN 208368489U
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- draw pin
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- cavity
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- 238000007789 sealing Methods 0.000 title claims abstract description 31
- 239000000919 ceramic Substances 0.000 claims abstract description 134
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 239000002184 metal Substances 0.000 claims abstract description 93
- 230000005611 electricity Effects 0.000 claims abstract description 18
- 229910052573 porcelain Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 10
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 7
- 238000005553 drilling Methods 0.000 description 5
- 229910017083 AlN Inorganic materials 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- -1 magnesium aluminate Chemical class 0.000 description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910052596 spinel Inorganic materials 0.000 description 4
- 239000011029 spinel Substances 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
The utility model discloses a kind of sealing structures, including ceramic cavity, ceramic draw pin, metal draw pin and conductive layer, the surface of the ceramic cavity offers through-hole, the hole wall surface of the through-hole is arranged in the conductive layer, the metal draw pin and the ceramic draw pin are arranged in the different sections of the through-hole along its length and seal the through-hole, the metal draw pin is protruded to the ceramic cavity outside, the conductive layer is electrically connected with the metal draw pin, for the metal draw pin to be electrically connected with the electricity component in the ceramic cavity.
Description
Technical field
The utility model relates to ceramic material vacuum seal fields, more particularly to a kind of sealing structure.
Background technique
Ceramics, because it is with excellent mechanical behavior under high temperature and due to distinctive light, sound, electricity, magnetic, heat and function and service benefit
It is widely applied to the high-tech sectors such as communication, electronics, energy environment protection, Aeronautics and Astronautics, military affairs.
The conventional method for solving the electricity component conduction in the insulating ceramics cavity of vacuum environment is, in insulating ceramics cavity
Upper aperture, then draw pin in sealing-in again, to realize ceramic cavity sealing and realize that cavity is interior to leading outside cavity by draw pin
Electricity.If using metal material that can make to seal since the coefficient of expansion of ceramics and metal cannot exactly match as draw pin material
Connect that intensity is lower, air-tightness is not high.
Utility model content
Based on this, it is necessary to provide the sealing structure that a kind of air-tightness is strong, intensity is high.
A kind of sealing structure, including ceramic cavity, ceramic draw pin, metal draw pin and conductive layer, the table of the ceramic cavity
Face offers through-hole, and the hole wall surface of the through-hole is arranged in the conductive layer, and the metal draw pin and the ceramic draw pin are set
Set in the through-hole different sections along its length and seal the through-hole, the metal draw pin is on the outside of the ceramic cavity
Protrusion, the conductive layer is electrically connected with the metal draw pin, for by the electricity in the metal draw pin and the ceramic cavity
Element electrical connection.
In one of the embodiments, the ceramic cavity and the material of the ceramic draw pin include aluminium oxide, zirconium oxide,
At least one of yttrium oxide, magnesium aluminate spinel, silicon carbide, silicon nitride and aluminium nitride.
The coefficient of expansion difference difference of the ceramic cavity and the ceramic draw pin is less than in one of the embodiments,
5%.
The ceramic draw pin is identical with the material of the main component of the ceramic cavity in one of the embodiments, matter
Score difference is measured less than 5%.
The length of the ceramic draw pin is the 1/2~3/4 of the length of the through-hole in one of the embodiments,.
In one of the embodiments, the material of the metal draw pin include can cut down, in titanium, molybdenum, stainless steel and niobium extremely
Few one kind.
The length of the metal draw pin is the 1/2~1/4 of the length of the through-hole in one of the embodiments,.
The material of the conductive layer is in molybdenum manganese composite layer, titanium molybdenum composite layer and carbon-coating in one of the embodiments,
It is at least one.
In the sealing structure, draw pin structure includes metal draw pin and ceramic draw pin, and ceramic draw pin is connected with ceramic cavity,
Material caused by metal draw pin and ceramic cavity can be overcome to be directly connected to mismatches, and the big problem of expansion coefficient difference makes to make pottery
The air-tightness of the junction of porcelain cavity and draw pin is stronger.The flexibility of metal draw pin is stronger than ceramic draw pin, and metal draw pin is to described
Protrusion can make draw pin protrusion part have better toughness on the outside of ceramic cavity, avoid ceramic draw pin when protruding since it is hard crisp
Draw pin structure fragile caused by property.Conductive layer passes through the electricity component and gold being separately connected in ceramic cavity as intermediary
Belong to draw pin, realize the connection of ceramic cavity and metal draw pin while realizing the electrical connection inside and outside ceramic cavity.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the sealing structure of the utility model embodiment；
Fig. 2 is the flow diagram of the preparation method of the sealing structure of the utility model embodiment.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, by the following examples, it and ties
Attached drawing is closed, the sealing structure of the utility model is further elaborated.It should be appreciated that specific implementation described herein
Example only to explain the utility model, is not used to limit the utility model.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes.Various difference objects are in the ratio drafting convenient for enumerating explanation in embodiment attached drawing, rather than press practical group
The ratio of part is drawn.
Referring to Fig. 1, the utility model embodiment provides a kind of sealing structure, including ceramic cavity 1, ceramic draw pin 3, gold
Belong to draw pin 4 and conductive layer 2, the surface of the ceramic cavity 1 offer through-hole, the hole of the through-hole is arranged in the conductive layer 2
Wall surface, the metal draw pin 4 and the ceramic draw pin 3 are arranged in the different sections of the through-hole along its length and seal institute
State through-hole, to protruding on the outside of the ceramic cavity 1, the conductive layer 2 is electrically connected the metal draw pin 4 with the metal draw pin 4,
For the metal draw pin 4 to be electrically connected with the electricity component 5 in the ceramic cavity 1.
In the sealing structure, draw pin structure includes metal draw pin 4 and ceramic draw pin 3, ceramic draw pin 3 and ceramic cavity 1
Connection, material caused by metal draw pin 4 and ceramic cavity 1 can be overcome to be directly connected to mismatch, and expansion coefficient difference is big to ask
Topic, keeps the air-tightness of the junction of ceramic cavity 1 and draw pin stronger.The flexibility of metal draw pin 4 is than ceramic draw pin the last 3, metal
Draw pin 4 can make draw pin protrusion part have better toughness to protrusion on the outside of the ceramic cavity 1, avoid ceramic draw pin 3 convex
The draw pin structure fragile as caused by its hard brittleness when out.Conductive layer 2 is used as intermediary, by being separately connected in ceramic cavity 1
Electricity component 5 and metal draw pin 4, realize that the connection of ceramic cavity 1 and metal draw pin 4 is realized inside and outside ceramic cavity 1 simultaneously
Electrical connection.
The ceramic cavity 1 is for encapsulating the intracorporal electricity component 5 of the chamber.In one embodiment, the electricity component 5
It needs to work under vacuum conditions, vacuum environment can be provided inside the ceramic cavity 1, with the ring outside the ceramic cavity 1
Border isolation.The material of the ceramic cavity 1 can be insulating materials, the material of the ceramic cavity 1 in one of the embodiments,
Material is preferably at least one of aluminium oxide, zirconium oxide, yttrium oxide, magnesium aluminate spinel, silicon carbide, silicon nitride and aluminium nitride.?
In one embodiment, the shape of the ceramic cavity 1 is the cube structure to match with 5 structure of electricity component of receiving, preferably
For the cube structure of regular shape, the cube structure of regular shape is on the one hand easy to manufacture in production, convenient for extensive
Production；The cavity structure rule that the cube structure of another aspect regular shape is formed, the structure when accommodating the electricity component 5
It is compact.It preferably, can be rectangular parallelepiped structure.
The ceramic cavity 1 offers through-hole, and the through-hole is provided with the surface of the ceramic cavity 1, by described logical
Realize the inside and outside connection of ceramic cavity 1 in hole.The through-hole can be provided with any position on the surface of the ceramic cavity 1
It sets, can determine the position setting of the through-hole, according to the position of the electricity component 5 inside the ceramic cavity 1 to facilitate
It states draw pin and the electricity component 5 is connected as friendship.The length direction of the through-hole is the side of 1 interior of ceramic cavity
At an angle to the surface where the opening of, the length direction of the through-hole and the through-hole of the ceramic cavity 1, preferably institute
The length direction and the surface where the opening of the through-hole of the ceramic cavity 1 for stating through-hole are mutually perpendicular to, on the one hand convenient for drilling,
On the other hand the vertical structure of the through-hole is conducive to be further formed the conductive layer 2 and accommodates draw pin.In one embodiment,
The through-hole can be column structure or cone structure.Preferably with the consistent shape of draw pin structure, for example, cylindrical body
Structure.The through-hole is preferably straight hole, but is not limited to straight hole, is also possible to have certain radian or forniciform hole.
The conductive layer 2 is set to the hole wall surface of the through-hole, and the conductive layer 2 is used as the metal draw pin 4 and institute
The bridge that the electricity component 5 inside ceramic cavity 1 is electrically connected is stated, is connected respectively with the metal draw pin 4 and the electricity component 5
It connects.The conductive layer 2 can be the strip structure for being parallel to through-hole length direction, the cyclic annular knot for being continuously provided in hole wall surface
Structure or irregular structure etc..The conductive layer 2 can be distributed in the part of the hole wall surface of the through-hole or be covered on whole
A hole wall surface.Preferably, the conductive layer 2 is distributed in the entirety of the hole wall surface, guarantees the conductive layer 2 and institute
State coming into full contact with for metal draw pin 4 and the electricity component 5.The conductive layer 2 is preferably cyclic structure, cyclic structure center
For the draw pin hole for accommodating draw pin.The draw pin hole and the draw pin shape cooperate.The thickness of the conductive layer 2 to be arranged
There is the through-hole of the conductive layer 2 that can accommodate the draw pin and cooperate with the draw pin shape.Preferably, the conductive layer 2
Thickness makes the aperture in the draw pin hole be equal to or slightly less than the diameter of the ceramic draw pin 3 and the metal draw pin 4, guarantees institute
Ceramic draw pin 3 and the metal draw pin 4 are chimeric with the interference fit of the conductive layer 2, to increase the gas of the sealing structure
Close property.The material of the conductive layer 2 can be in molybdenum manganese composite layer, titanium molybdenum composite layer and carbon-coating in one of the embodiments,
At least one.
The ceramics draw pin 3 and the metal draw pin 4 are contained in the draw pin hole, in one embodiment, the metal
Draw pin 4 and the ceramic draw pin 3 are separately positioned in two sections of the via openings both ends, and the metal draw pin 4 is set to institute
It states in one section inside the separate ceramic cavity 1 of through-hole, the close pottery of the through-hole is arranged in the ceramics draw pin 3
In one section inside porcelain cavity 1, the metal draw pin 4 and the ceramic draw pin 3 are connected in the through hole.One wherein
In embodiment, it is described ceramics draw pin 3 and the metal draw pin 4 at least one be solid construction, guarantee the ceramic cavity 1
Air-tightness.Preferably, the ceramic draw pin 3 and the metal draw pin 4 are solid construction, are guaranteed while the through-hole is sealed
The intensity of draw pin.The length of the ceramic draw pin 3 is the 1/2~3/4 of the through-hole length in one of the embodiments, institute
The length for stating metal draw pin 4 is the 1/4~1/2 of the through-hole length.The length of the ceramics draw pin 3 accounts for the through-hole length
More than half, can guarantee that the draw pin part hardness of the sealing structure is stronger, air-tightness is higher.The ceramics draw pin 3
Length is not more than the length of the through-hole, can guarantee that the ceramic draw pin 3 is unable to described in protrusion not higher than the through-hole
Outside ceramic cavity 1, hard brittle ceramic draw pin 3 is avoided to be lost.Preferably, the metal draw pin 4 is held in the mouth with the via top
The position connect is protruded along the aperture direction of the through-hole, and the opening at the top of the through-hole is blocked, the sealing structure is increased
Air-tightness.The conductive layer 2 is overlapped with the metal draw pin 4, to be electrically connected.Preferably, the conductive layer 2 is around described
Metal draw pin 4 is located at the part in the through-hole.
In one embodiment, the material of the ceramic draw pin 3 is similar with the component of material of the ceramic cavity 1, expansion
Coefficient is close, it is preferred that the ceramics draw pin 3 and the coefficient of expansion difference of the ceramic cavity 1 are differed less than 5%, Neng Goushi
The better sealing of existing 1 junction of draw pin and ceramic cavity.In one embodiment, the material of the ceramic draw pin 3 can be with
For one of aluminium oxide, zirconium oxide, yttrium oxide, magnesium aluminate spinel, silicon carbide, silicon nitride and aluminium nitride or a variety of.The pottery
The material of porcelain cavity 1 can be in aluminium oxide, zirconium oxide, yttrium oxide, magnesium aluminate spinel, silicon carbide, silicon nitride and aluminium nitride
It is one or more.Preferably, the material phase of the main component of the material of the material and ceramic cavity 1 of the ceramic draw pin 3
Together.Preferably, the mass fraction of the material of the ceramic draw pin 3 and the main component of the ceramic cavity 1 is differed less than 5%.
It is furthermore preferred that the ceramics draw pin 3 is identical with the material of the ceramic cavity 1.The main component, which for example can be, to be accounted for
The ingredient of 50% or more gross mass, more preferably 80% or more ingredient.
The material of the metal draw pin 4 is that flexibility is strong, is capable of the metal material of conduction in one of the embodiments,
Can for that can cut down, at least one of titanium, molybdenum, stainless steel and niobium, can preferably be cut down without magnetic, no magnetic can cut down be it is a kind of it is electrically conductive not
The metal material of magnetic conduction, have with the coefficient of expansion similar in glass, and have good cryo tissue stability, be welding performance and
The excellent sealing alloy of plating performance.
Referring to Fig. 2, the utility model embodiment also provides the preparation method of sealing structure described in one kind, comprising:
S100, provides ceramic cavity 1, and the surface of the ceramic cavity 1 offers through-hole；
S200 forms conductive layer 2 in the hole wall surface of the through-hole；
Ceramic draw pin 3 is placed in the through-hole along its length one section by S300, and by the conductive layer 2, described
Ceramic draw pin 3 and the ceramic cavity 1 weld；And
S400, metal draw pin 4 is placed in the through-hole along its length another section and make the metal draw pin 4 to
It is protruded on the outside of the ceramic cavity 1, and the conductive layer 2, the metal draw pin 4 and the ceramic draw pin 3 is welded, thus close
Seal the through-hole.
In step s 200, the conductive layer 2 is further formed by coating metal paste in the hole wall surface.?
In one embodiment, the step S200 may include:
Metal paste is coated on the hole wall surface of the through-hole of the ceramic cavity 1 by S210；
S220, the metal paste of the dry hole wall surface, forms metal coating；
S230 carries out shape modification along metal coating drilling of the through-hole length direction to the drying, makes drying
The metal coating forms the conductive layer 2, and so that the through-hole for being formed with the conductive layer 2 is accommodated the ceramics and draw
Needle 3 and the metal draw pin 4.
S240, the sintering ceramic cavity 1 for having the conductive layer 2.
In step S210, the metal paste includes in the compound paste of molybdenum manganese, the compound paste of titanium molybdenum and carbon paste agent
It is at least one.The thickness of the metal paste of coating can be adjusted according to the actual situation, the thickness after metal paste is dry
Degree has a degree of reduction, metal layer of paste that can be thick as far as possible.
In step S220, the method for the dry metal paste can make described to dry the mixed paste
Paste forms the metal coating of solid-like, and the drying temperature can be 50 DEG C~150 DEG C.In step S230, due to coating
The internal diameter of the metal coating formed may not be exactly matched with the diameter of the draw pin, can be by drilling equipment along institute
It states through-hole length direction and drilling modification is carried out to the internal diameter of the metal coating, formed and drawn with what the diameter of the draw pin matched
Pin hole.Preferably, the aperture in the draw pin hole is equal to or slightly less than the diameter of the ceramic draw pin 3 and the metal draw pin 4, protects
Card institute ceramics draw pin 3 and the metal draw pin 4 it is chimeric with the interference fit of the conductive layer 2, to increase the sealing structure
Air-tightness.
In step S240, by sintering processing, by the material of the conductive layer 2 and the hole wall surface of the ceramic cavity 1
Material connection.The vigorous mixture being added in the metal paste described in step S210 can be conducive to 2 He of conductive layer described in step S240
The combination of the material of the ceramic cavity 1.In one embodiment, the sintering temperature can be 1450 DEG C~1550 DEG C.
It, can be by molybdenum-manganese method to the conductive layer 2, the ceramic draw pin 3 and the ceramic chamber in step S300
Body 1 carries out high-temperature soldering.Molybdenum-manganese method ceramicto-metal seal is with metal powder (molybdenum manganese powder end, manganese glass etc.) to ceramics and gold
Belong to the method that soldering forms Leakless sealing.The welding temperature of the step S300 can be 1300 DEG C~1700 DEG C.Molybdenum-manganese method
Sealing strength is high, air-tightness is good.In welding, in one embodiment, the ceramic draw pin 3 is placed in the through-hole along long
It spends in one section inside the ceramic cavity 1 in direction.It preferably, can be by mold by the position of the ceramic draw pin 3
Fixation is set, avoiding the position movement of ceramics draw pin described in welding process 3 is the position inaccuracy welded.
It, can be by active metal method to by the conductive layer 2, the metal draw pin 4 and the pottery in step S400
Porcelain draw pin 3 carries out low-temperature welding.In one embodiment, by formed at a lower temperature alloy brazing metal (as silver, copper,
Nickel etc.) realize the welding of the conductive layer 2, the metal draw pin 4 and the ceramic draw pin 3.Preferably, in vacuum or indifferent gas
It is heated in atmosphere and conductive layer 2, the metal draw pin 4 and the ceramic draw pin 3 is made to form Leakless sealing structure, avoid metal
Draw pin 4 is oxidized.Active metal method has that process is few, the period is short, porcelain piece will not deform, and high yield rate, sealing temperature be low, without crisp
Property fracture the advantages of.In one embodiment, the welding temperature of the S400 can be 700 DEG C~1000 DEG C.In welding, one
In embodiment, the metal draw pin 4 is placed in one section inside the separate ceramic cavity 1 of the through-hole along its length
In, and be connected with the ceramic draw pin 3.Preferably, the position of the metal draw pin 4 can be fixed by mold, avoids welding
The position movement of metal draw pin described in termination process 4 is the position inaccuracy of welding.
The preparation of 1 sealing structure of embodiment
The ceramic cavity 1 for offering through-hole is provided first, the sealing structure of draw pin is then had by following steps preparation:
(1) molybdenum manganese metal paste is prepared, and carries out ball milling mixing；
(2) it will be applied in the through-hole of ceramic cavity 1 and be covered with prepared molybdenum manganese Metal paste, form metal coating；
(3) the metal paste in the hole wall surface for the through-hole for drying ceramic cavity 1 at 100 DEG C, forms metal coating；
(4) drill bit is used, the metal coating dried is drilled, forms draw pin identical with draw pin outer diameter hole, drilling
Metal coating afterwards is as conductive layer 2；
(5) ceramic cavity 1 of conductive layer 2 is had in 1500 DEG C of sintering；
(6) ceramic draw pin 3 is filled in draw pin hole, pushes down ceramic draw pin 3 with mold, at 1500 DEG C to ceramic 1 He of draw pin
Conductive layer 2 carries out high intermediate temperature sealing；
(7) metal draw pin 4 is filled in draw pin hole, pushes down metal draw pin 4 with mold, at 870 DEG C to metal draw pin 4 and leading
Electric layer 2 carries out low temperature brazing.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (4)
1. a kind of sealing structure, which is characterized in that including ceramic cavity, ceramic draw pin, metal draw pin and conductive layer, the ceramics
The surface of cavity offers through-hole, and the hole wall surface of the through-hole, the metal draw pin and the pottery is arranged in the conductive layer
Porcelain draw pin is arranged in the different sections of the through-hole along its length and seals the through-hole, and the metal draw pin is to the ceramics
Protrusion, the conductive layer are electrically connected with the metal draw pin on the outside of cavity, are used for the metal draw pin and the ceramic cavity
In electricity component electrical connection.
2. sealing structure according to claim 1, which is characterized in that the expansion of the ceramic cavity and the ceramic draw pin
Coefficient differentials are differed less than 5%.
3. sealing structure according to claim 1, which is characterized in that the length of the ceramics draw pin is the length of the through-hole
The 1/2~3/4 of degree.
4. sealing structure according to claim 1, which is characterized in that the length of the metal draw pin is the length of the through-hole
The 1/2~1/4 of degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820349442.0U CN208368489U (en) | 2018-03-14 | 2018-03-14 | sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820349442.0U CN208368489U (en) | 2018-03-14 | 2018-03-14 | sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208368489U true CN208368489U (en) | 2019-01-11 |
Family
ID=64921993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820349442.0U Active CN208368489U (en) | 2018-03-14 | 2018-03-14 | sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208368489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108461451A (en) * | 2018-03-14 | 2018-08-28 | 清华大学 | sealing structure and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461451A (en) * | 2018-03-14 | 2018-08-28 | 清华大学 | sealing structure and preparation method thereof |
| CN108461451B (en) * | 2018-03-14 | 2024-06-25 | 清华大学 | Sealing structure and preparation method thereof |
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