CN208336174U - A kind of carrier of intelligent power module - Google Patents

Abstract

The utility model provides a kind of carrier of intelligent power module, which includes: ontology, offers at least one window for running through the body thickness thereon, the window is for accommodating intelligent power module to be bonded；The ontology each extends over out support portion at the opposite edge of surround the window at least two, and the thickness of the support portion is less than the thickness of the ontology, and the support portion is used to support intelligent power module to be bonded；The support portion is less than or equal to the thickness of intelligent power module to be bonded close to the distance between the face of the upper surface of the ontology and the upper surface of the ontology.The carrier includes: that, when transmitting intelligent power module and its disengaging magazine by track, can avoid lead frame deformation, and intelligent power module will not be contacted with track or magazine, will not cause frictionally damage to its substrate by the way that the carrier is arranged.

Description

A kind of carrier of intelligent power module

Technical field

The utility model relates to technical field of integrated circuits more particularly to a kind of carriers of intelligent power module.

Background technique

Intelligent power module (Intelligent Power Module, abbreviation IPM) is a kind of device for power switching, IPM It is integrated with logic circuit, driving circuit and protection circuit, keeps integrated level high, it is small in size, it is widely used in field of power electronics.

Multiple chips and component setting are formed intelligent power module by IPM on a substrate, are usually packaged IPM Formed packaging body, IPM when packaged, using lead frame, by the pad pair on the substrate of each pin and IPM on lead frame Should connect, then the pad on the internal port and substrate of each chip in IPM is subjected to wire bonding, so realize each chip with Connection between substrate and between chip and chip, external interface of the pin as IPM on lead frame, by IPM with The connection of other outer members.

In wire bonding sequence, needs for IPM to be bonded to be placed in magazine, bonding is then sent to by track At the feed mechanism of equipment, IPM to be bonded is placed below the soldering tip of bonding apparatus by feed mechanism carries out wire bonding, complete Pass through track again at the IPM after wire bonding and be sent to magazine, passes through cutting agency blanking.

IPM to be bonded, each pin on pad and lead frame on substrate have been correspondingly connected with, have placed it in When track is transmitted and passes in and out magazine, IPM is supported by lead frame, and the substrate in IPM is added and is disposed on the substrate The volume and weight of each chip is bigger, and lead frame is be easy to cause to deform；It also, is unilateral pin for part IPM, i.e., only There is pin in side, only connect in the wherein side of substrate with each pin on lead frame, place it in track progress It when transmission and disengaging magazine, for the side of no pin, needs to directly support by substrate, is easy to cause friction to damage substrate Wound.

Utility model content

For the problems of the prior art, the utility model provides a kind of carrier of intelligent power module.

First aspect according to the present utility model provides a kind of carrier of intelligent power module, comprising:

Ontology, offers at least one window for running through the body thickness thereon, and the window is to be bonded for accommodating Intelligent power module；

The ontology each extends over out support portion, the support portion at the opposite edge of surround the window at least two Thickness be less than the thickness of the ontology, the support portion is used to support intelligent power module to be bonded；

The support portion close to the distance between the face of the upper surface of the ontology and the upper surface of the ontology be less than etc. In the thickness of intelligent power module to be bonded.

Optionally, in the length direction of the width direction of the ontology and the ontology, the ontology is surrounding the window Each edge of mouth each extends over out at least one described support portion.

Optionally, the window has four corners, is respectively used to accommodate four angles of intelligent power module to be bonded, At least one described support portion is respectively arranged at the edge close to each corner.

Optionally, in the length direction of ontology, the distance between two opposite edges of window are surrounded equal to be bonded The length of intelligent power module.

Optionally, in the width direction of ontology, the distance between two opposite edges of window are surrounded equal to be bonded The width of intelligent power module.

Optionally, in the length direction of the ontology, the middle part of two opposite edges of the window is surrounded respectively to window Outside protrude to be formed it is arc-shaped.

Optionally, in the width direction of the ontology, the middle part of two opposite edges of the window is surrounded respectively to window Outside protrude to be formed it is arc-shaped.

Optionally, the thickness of the outer ledge of the ontology is less than the thickness of the ontology.

Optionally, the outer ledge of the ontology is provided with multiple through-holes.

Optionally, the material of the ontology is aluminium alloy.

Based on the above-mentioned technical proposal, which accommodates intelligent power module by setting window, also, support portion can prop up Intelligent power module is supportted, which can play the role of carrying to intelligent power module, in wire bonding sequence, pass through rail When road transmits intelligent power module and its disengaging magazine, it is no longer rely on lead frame support intelligent power module, but by being somebody's turn to do Carrier carries intelligent power module, can avoid lead frame deformation, also, for the intelligent power module of unilateral pin, also not Its substrate is needed to support, intelligent power module will not be contacted with track or magazine, will not cause frictionally damage to its substrate.

Detailed description of the invention

Fig. 1 is the planar structure signal of the carrier for the intelligent power module that one exemplary embodiment of the utility model provides Figure；

Fig. 2 is that cross section structure of the Fig. 1 along the direction A-A is intended to；

Intelligent power module to be bonded is arranged on carrier for what one exemplary embodiment of the utility model provided by Fig. 3 Structure be intended to；

Fig. 4 is the planar structure signal of the carrier for the intelligent power module that the utility model another exemplary embodiment provides Figure；

Fig. 5 is that cross section structure of the Fig. 4 along the direction B-B is intended to.

Specific embodiment

Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended The example of the consistent device and method of some aspects be described in detail in claims, the application.

It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application. It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority Form, unless the context clearly indicates other meaning.Below with reference to the accompanying drawings each embodiment of the utility model is described in detail.

In the prior art, IPM carry out wire bonding sequence in, IPM to be bonded be placed on track be transmitted and into Out when magazine, its lead frame is be easy to cause to deform or cause frictionally damage, for this problem, the utility model to its substrate A kind of carrier of intelligent power module is provided, as depicted in figs. 1 and 2, which includes:

Ontology 10 offers at least one window 11 for running through body thickness thereon, and window 11 is for accommodating intelligence to be bonded It can power module (not shown)；

Ontology 10 each extends over out support portion 12, the thickness of support portion 12 at the opposite edge of surround window 11 at least two Degree is less than the thickness of ontology 10, and support portion 12 is for placing intelligent power module to be bonded；

Support portion 12 is equal to intelligence to be bonded close to the distance between the face of the upper surface of ontology 10 and the upper surface of ontology 10 D The thickness of energy power module.

The carrier includes substrate and is disposed on the substrate for carrying intelligent power module to be bonded, intelligent power module Each chip, the intelligent power module to be bonded using lead frame realize wire bonding, intelligent power module to be bonded It is connected with lead frame, specifically, each pin on the pad and lead frame on the substrate of intelligent power module is right It should connect.

In wire bonding sequence, intelligent power module to be bonded is placed on the carrier, and intelligent power module can be with For IPM or other kinds of intelligent power module.

Referring to shown in Fig. 3, at least one window 11 is offered on the ontology 10 of carrier, four windows, window are shown in Fig. 3 Mouth 11 is pass-through type window, and through the thickness of ontology 10, window 11 is for accommodating (the intelligent power module packet of intelligent power module 20 Each chip for including substrate and being disposed on the substrate, the size of the size of intelligent power module namely its substrate), the size of window 10 It can match with 20 size of intelligent power module, that is, match with the size of the substrate of intelligent power module 20, it can be by intelligence Energy power module 20 is placed in window 10, and the lead frame 30 connecting with intelligent power module 20 is located at 10 outside of window.

Ontology 10 extends support portion 12 at the opposite edge of surround window 11 at least two, and ontology 10 is in its length in figure Two edges of two opposite edges and its width direction of spending direction each extend over out support portion 12.

Support portion 12 plays a supporting role to intelligent power module 20, after intelligent power module 20 is placed in window 11, Its opposite two sides can be individually positioned on each support portion 12, be contacted respectively with support portion 12, and intelligent power module 20 is not It can leak down from window 11, and support portion 12 has a certain thickness, under the lower surface of intelligent power module 20 and ontology 10 After there is certain distance, intelligent power module 20 to be placed in window 10 on surface, the lower surface of intelligent power module 20 (namely base The lower surface of plate) it will not be contacted with track or charging tray, it avoids making the lower surface of the substrate of intelligent power module due to friction At damage.

Due to being provided with window, other than the side of intelligent power module is contacted with support portion, intelligent power module its He will not avoid causing to damage to the surface of intelligent power module in surface with body contacts.

Referring to shown in Fig. 3, after the usual bending of each pin 31 on lead frame 30 and on the substrate of intelligent power module 20 Pad be correspondingly connected with, therefore there is certain distance, and the thickness of support portion 12 between lead frame 30 and intelligent power module 20 Degree is less than the thickness of ontology 10, and support portion 12 is close to the distance between the face of the upper surface of ontology 10 and the upper surface of ontology 10 D Less than or equal to the thickness of intelligent power module 20, in this way, after intelligent power module 20 is placed on support portion 12, lead frame 30 It will not be contacted with ontology 10, what lead frame 30 suspended is located at 10 top of ontology, and lead frame 30 is avoided to connect with 10 surface of ontology The raw friction of triggering causes to damage to 30 surface of lead frame.

The upper surface of above-mentioned ontology refers in wire bonding sequence, when ontology is placed in track or magazine, ontology court On surface, opposite with the lower surface of ontology, the lower surface of ontology is surface directed downwardly, which is and track or magazine The surface of contact.

Seen from the above description, which accommodates intelligent power module by setting window, also, support portion can support Intelligent power module, which can play the role of carrying to intelligent power module, in wire bonding sequence, pass through track When transmitting intelligent power module and its disengaging magazine, it is no longer rely on lead frame support intelligent power module, but passes through the load Tool carrying intelligent power module, can avoid lead frame deformation, also, for the intelligent power module of unilateral pin, also be not required to Its substrate is wanted to support, intelligent power module will not be contacted with track or magazine, will not cause frictionally damage to its substrate.

In existing wire bonding sequence, multiple repetition leadframes units to interconnect are generally included, The pin of each leadframes unit with an intelligent power module for connecting, after wire bonding sequence, in case of not Qualified product will do it label, then flow into next procedure, until rib cutting gradation process below is (i.e. by the pin in lead frame Cut down from lead frame, the external interface which connect as intelligent power module with other elements) after could incite somebody to action Rejected product is chosen, and the risk that rejected product is mixed into qualified product is increased, also due to rejected product follows qualified product through excessive Procedure causes material waste.

One or more windows have can be set in the carrier of above-described embodiment on the body, and each window is for placing one A intelligent power module, each intelligent power module can be connect with the isolated lead frame being independently arranged, in this manner it is achieved that Wire bonding sequence is carried out for every intelligent power module, it, can be individually by single when rejected product occurs for the procedure Intelligent power module is picked out, it is not necessary to which processes, the rejected product such as road encapsulation will not be mixed with qualified product under inflow, can Reduce the waste of material, saves cost.

In some instances, as shown in Figure 1, in the width direction of ontology 10 and the length direction of ontology 10, ontology 10 exists Each edge for surrounding window each extends over out at least one support portion 12.

Ontology each extends over out support portion at the opposite edge of the two of them for surrounding window and can be realized to intelligent power The support of module, and intelligent power module is usually quadrangle, in order to more preferably support intelligent power module, avoids that position shifting occurs It is dynamic, at least one support portion is respectively set in the width direction of ontology and each edge of length direction, i.e., in the length of ontology An at least support portion is respectively set in two edges in the width direction of two opposite edges and ontology on direction, at four Direction provides support for intelligent power module.

In some instances, window has four corners, is respectively used to four that accommodate intelligent power module to be bonded Angle is respectively arranged at least one support portion at the edge in each corner.

Intelligent power module is usually quadrangle, and the shape of window and the shape of intelligent power module match, therefore, window Mouth has four corners, and after intelligent power module is placed in the window, four angles of intelligent power module are located at window Four corners, be respectively set an at least support portion at the edge close to each corner, four angles point of intelligent power module Wei Yu not be on each support portion, each support portion relatively reliable can provide support to intelligent power module.

For example, it as shown in 4 figures, is opened up on ontology 10 there are four window 11, each window 11 has four corners 110, for example, in Fig. 4 dashed circle position, including be located at the upper left corner, the lower left corner, the upper right corner and the lower right corner four corners, Ontology each extends over out eight support portions 12 at the edge in each corner close to each window 11, close to the angle in 11 upper left corner of window There are two support portion 12, two support portions 12 are located at top edge and left edge for the edge setting in portion 110；It is left close to window 11 There are two support portion 12, two support portions 12 are located at lower edge and left edge for the edge setting in the corner 110 of inferior horn；It is close There are two support portion 12, two support portions 12 are located at top edge and the right side for the edge setting in the corner 110 in 11 upper right corner of window Edge；It is arranged close to the edge in the corner 110 in 11 lower right corner of window there are two support portion 12, two support portions 12 are located at down Edge and right hand edge.

In an optional embodiment, in the length direction of ontology 10, surround window 11 two opposite edges it Between distance be equal to intelligent power module to be bonded length；In the width direction of ontology, two opposite sides of window are surrounded The distance between edge is equal to the width of intelligent power module to be bonded.

In the present embodiment, the length of window is equal to the length of intelligent power module, and the width of window is equal to intelligent power mould The width of block, after intelligent power module is placed in window, surround window edge play the role of to it card and, by intelligent function Rate module is folded in window, and the setting that intelligent power module can be made stronger avoids in window by intelligent power module After placing on the carrier, position movement, support portion and intelligent power module is occurring when transmitting or pass in and out in orbit magazine Friction causes to damage to it.

In some instances, in the length direction of ontology, the middle parts of two opposite edges of window is surrounded respectively to outside window Side protrude to be formed it is arc-shaped；In the width direction of ontology, the middle parts of two opposite edges of window is surrounded respectively to convex on the outside of window It is formed out arc-shaped.

In the present embodiment, the length direction and width direction of ontology opposite edges middle part respectively to convex on the outside of window Formed out arc-shaped, i.e., each edge is respectively formed the radiused edges protruded on the outside of window in medium position, works as intelligent power After module is placed in window, edge of each radiused edges far from intelligent power module, intelligent power module only four Angle is contacted with support portion, and the other positions of intelligent power module will not can play intelligent power module with body contacts Supporting role, and the contact area of intelligent power module and ontology can be reduced, reduce the frictionally damage of intelligent power module.

In above-mentioned carrier, as shown in 4 and Fig. 5, reduction processing can be carried out to the edge of ontology 10, make the outer side edges of ontology 10 The thickness of edge 13 is less than the thickness of ontology 10, and carrier can match with track, when carrier transmits in orbit, by the outer of carrier Side edge is stuck in track two sides and can slide along track.

The outer ledge 13 of above-mentioned ontology 10 is also provided with multiple through-holes 14, which may pass through on bonding apparatus Crochet hook, drive carrier mobile by crochet hook, the intelligent power module being arranged on carrier be moved to designated position, so as to right Intelligent power module carries out wire bonding operation.

The material of ontology preferably uses aluminium alloy, therefore the feature that aluminum alloy materials have intensity high, light-weight carries Tool is not susceptible to deform, and light-weight.

It will be appreciated by those skilled in the art that attached drawing is the schematic diagram of a preferred embodiment, module or stream in attached drawing Journey is not necessarily implemented necessary to the utility model.The foregoing is merely specific embodiment of the present utility model, but this The protection scope of utility model is not limited thereto, and anyone skilled in the art discloses in the utility model It in technical scope, can easily think of the change or the replacement, should be covered within the scope of the utility model.Therefore, this reality It should be based on the protection scope of the described claims with novel protection scope.

Claims (10)

1. a kind of carrier of intelligent power module characterized by comprising

Ontology offers at least one window for running through the body thickness thereon, and the window is for accommodating intelligence to be bonded It can power module；

The ontology each extends over out support portion, the thickness of the support portion at the opposite edge of surround the window at least two Degree is less than the thickness of the ontology, and the support portion is used to support intelligent power module to be bonded；

The support portion close to the distance between the face of the upper surface of the ontology and the upper surface of the ontology be less than or equal to The thickness of the intelligent power module of bonding.

2. carrier according to claim 1, which is characterized in that

In the width direction of the ontology and the length direction of the ontology, the ontology is at each edge for surrounding the window point Do not extend at least one described support portion.

3. carrier according to claim 1, which is characterized in that the window have four corners, be respectively used to accommodate to Four angles of the intelligent power module of bonding are respectively arranged at least one described support at the edge close to each corner Portion.

4. carrier according to claim 3, which is characterized in that

In the length direction of the ontology, the distance between two opposite edges of window are surrounded equal to intelligent power to be bonded The length of module.

5. carrier according to claim 3, which is characterized in that

In the width direction of the ontology, the distance between two opposite edges of window are surrounded equal to intelligent power to be bonded The width of module.

6. carrier according to claim 1-5, which is characterized in that

In the length direction of the ontology, the middle part for surrounding two opposite edges of the window is formed to protrusion on the outside of window respectively It is arc-shaped.

7. carrier according to claim 1-5, which is characterized in that in the width direction of the ontology, surround institute State the middle parts of two opposite edges of window formed respectively to protrusion on the outside of window it is arc-shaped.

8. carrier according to claim 1-5, which is characterized in that

The thickness of the outer ledge of the ontology is less than the thickness of the ontology.

9. carrier according to claim 1-5, which is characterized in that the outer ledge of the ontology is provided with multiple Through-hole.

10. carrier according to claim 1-5, which is characterized in that

The material of the ontology is aluminium alloy.