CN208270917U - Liquid cooling radiator - Google Patents
Liquid cooling radiator Download PDFInfo
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- CN208270917U CN208270917U CN201820798827.5U CN201820798827U CN208270917U CN 208270917 U CN208270917 U CN 208270917U CN 201820798827 U CN201820798827 U CN 201820798827U CN 208270917 U CN208270917 U CN 208270917U
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- radiating fin
- liquid cooling
- cooling radiator
- fin groups
- plate
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Abstract
The utility model provides a kind of liquid cooling radiator, including shell, at least two radiating fin groups, input pipe and efferent duct.Shell has the accommodating space constituted with top plate and bottom plate, foreboard, back plate and both side plate.At least two radiating fin groups are configured in accommodating space.Input pipe is configured at top plate, foreboard, back plate or in which the side plate of shell and connection accommodating space.Efferent duct is configured at top plate, foreboard, back plate or in which another side plate of shell and connection accommodating space.At least two radiating fin groups have different fin thickness from least two radiating fin groups with different arranging densities.The liquid cooling radiator of the utility model can heat radiation fins group whole thermal conductivity and heat transfer property energy.
Description
Technical field
The utility model is about a kind of radiator, and especially with regard to a kind of liquid cooling radiator.
Background technique
Traditional projector mostly uses light source of the high-pressure sodium lamp as projection when, recently as manufacture of semiconductor into
Step, has been developed using light source made by the semiconductor elements such as light emitting diode or laser.Because made by semiconductor element
Light source have the advantages that small in size, light-source brightness is high.However, small in size then have semiconductor element heat generation density is higher to lack
Point, therefore requirement of the semiconductor element for heat radiation function is higher.
Now, water-cooling radiating module is used to be attached at heat source to radiate, the waste heat that heat source is first generated conduct to
Radiating fin, while flow into cooling water in radiating module, therefore waste heat is transferred in cooling water by radiating fin again.Cooling water
Waste heat is taken away into water-cooling radiating module, then waste heat scatters and disappears in the external world through the modes such as conduction and convection current.However, existing water cooling
Radiating module majority uses the radiating fin stamping with sheet metal, and thermal conduction effect is poor.Cooling water enters heat dissipation
In module and radiating fin is contacted, for the temperature of radiating fin with declining far from heat source (height rises), this illustrates heat radiating fin
Radiating efficiency at the top of piece is simultaneously bad.
Utility model content
The utility model provides a kind of liquid cooling radiator, can heat radiation fins group whole thermal conductivity and heat transfer property energy.
The liquid cooling radiator of the utility model includes a shell, at least two radiating fin groups, input pipe and efferent duct.
Shell has top plate and bottom plate, foreboard, back plate and two opposite side plates, and top plate and bottom plate, foreboard, back plate and both side plate structure
At accommodating space.At least two radiating fin groups are configured in accommodating space.Input pipe is configured at the top plate, foreboard, back plate of shell
Or in which side plate and connection accommodating space.Efferent duct is configured at top plate, foreboard, back plate or in which another side plate of shell and company
Logical accommodating space.At least two radiating fin groups have different fins thick with different arranging densities from least two radiating fin groups
Degree.Coolant liquid flows into shell from input pipe, and by least two radiating fin groups, then flows out shell by efferent duct.
Based on above-mentioned, heat dissipation of the liquid cooling radiator of the utility model for heat source, with different arranging densities and not
With at least two radiating fin groups of fin thickness.Wherein, by arranging density is smaller but the biggish radiating fin group of fin thickness
One of them configuration is on the bottom plate of shell, by arranging density is larger but the lesser another radiating fin group configuration of fin thickness exists
The top of one of radiating fin group.Since the fin thickness of radiating fin group is larger, and be conducive to absorb heat source transmitting
To bottom plate waste heat.On the other hand, when coolant liquid enters shell and pass through at least two radiating fin group from an at least input pipe, by
In the biggish another radiating fin group of arranging density there is biggish heat to pass area, the waste heat of radiating fin group can quickly be transmitted
Waste heat is taken away into shell to coolant liquid, then by coolant liquid.Therefore the liquid cooling radiator of the utility model, in conjunction with different characteristics
At least two radiating fin groups can promote the heat transfer property energy and heat radiation function of liquid cooling radiator entirety.
In order to make the above-mentioned features and advantages of the utility model more obvious and understandable, special embodiment below, and appended by cooperation
Figure is described in detail below.
Detailed description of the invention
Figure 1A is the appearance diagram of the liquid cooling radiator of an embodiment of the present invention.
Figure 1B is painted the perspective diagram of the liquid cooling radiator of Figure 1A.
Fig. 1 C is painted the Section A-A schematic diagram of the liquid cooling radiator of Figure 1A.
Specific embodiment
Figure 1A is the appearance diagram of the liquid cooling radiator of an embodiment of the present invention.Figure 1B is painted the liquid cooling of Figure 1A
The perspective diagram of formula radiator.Fig. 1 C is painted the Section A-A schematic diagram of the liquid cooling radiator of Figure 1A.
Figure 1A is please referred to, the liquid cooling radiator 100 of the present embodiment is for being configured at heat source 200, for heat source 200
It radiates, avoids the temperature of heat source 200 excessively high.It is, for example, light emitting diode that wherein heat source 200, which is, for example, the light source of projector,
Either laser diode and the light emitting diode arranged with array manner or laser diode, light modulator are, for example, to reflect
The spatial light modulator of formula or transmission-type, by taking Reflective spatial light modulator as an example, reflective liquid crystal on silicon (Liquid
Crystal on Silicon, LCOS) or digital micromirror elements (Digital Micro-mirror Device, DMD), thoroughly
Penetrate the spatial light modulator of formula, such as light transmitting liquid crystal panel (Transparent Liquid Crystal Panel).Computer
Central processing unit (CPU), graphics processor (GPU) or other electronic components that can generate high fever.Liquid cooling radiator 100 connects
The surface of heat source 200 is touched, and through waste heat caused by the mode conduction heat sources 200 of heat transfer to cold type radiator 100, in heat
Source 200 can reach cooling effect when operating, and heat source 200 is avoided to influence its running because temperature is excessively high.
Figure 1A to Fig. 1 C is please referred to, the liquid cooling radiator 100 of the present embodiment includes shell 110, at least two radiating fins
Group 120, input pipe 130 and efferent duct 140.
Shell 110 has top plate 111, bottom plate 112, foreboard 113, back plate 114 and two opposite side plates 115.And top plate
111, bottom plate 112, foreboard 113, back plate 114 and both side plate 115 contact with each other, to constitute closed accommodating space AS.In addition,
Bottom plate 112 includes opposite inner surface IS and outer surface OS, and outer surface OS is for direct contact heat source 200 to carry out heat transfer
Heat dissipation.
In the present embodiment, at least two radiating fin groups 120 are, for example, two, and the first radiating fin group 120A, second dissipate
Hot fins group 120B is respectively provided with different arranging density and different fin thickness, and wherein arranging density is to have in unit area
Some number of fins.First radiating fin group 120A and the second radiating fin group 120B are respectively provided with multiple fins.First heat dissipation
Fins group 120A, the second radiating fin group 120B are all configured in the accommodating space AS of shell 110 and contact with each other, the first heat dissipation
Fins group 120A is set on bottom plate 112 and contacts inner surface IS, and the second radiating fin group 120B is arranged in the first radiating fin
The top of group 120A and the medial surface of the top plate 111 of contact shell 110, wherein the first radiating fin group 120A is set to bottom plate
112 and second between radiating fin group 120B.In other embodiments, at least the quantity of two radiating fin groups can be multiple, and
Be stacked between the top plate and bottom plate of shell, this depend on liquid cooling radiator size or radiating requirements and
It is fixed.
In the present embodiment, the arranging density of the first radiating fin group 120A of the inner surface IS of contact base plate 112 is less than
Contact the arranging density of the second radiating fin group 120B of the medial surface of top plate 111.And first radiating fin group 120A any
Fin thickness W1 is greater than any fin thickness W2 of the second radiating fin group 120B.Herein, due to the first radiating fin group 120A
Fin thickness W1 it is larger, and be conducive to absorb the waste heat that heat source 200 is transferred to bottom plate 112 in thermo-conducting manner, so that
One radiating fin group 120A is higher for the radiating efficiency of bottom plate 112, furthermore the arranging density of the first radiating fin group 120A compared with
It is small, coolant liquid 300 can be allowed to be easier to pass through, that is, have a large amount of coolant liquid 300 that can flow through the first radiating fin group 120A's
Space between fin.Since the fin thickness W2 of the second radiating fin group 120B is smaller and arranging density is higher, and allow second
There is the fin of radiating fin group 120B biggish heat to pass area, this is conducive to conduct heat to the second radiating fin group 120B's
Waste heat is rapidly transferred to coolant liquid 300 in such a way that heat passes, and takes away waste heat by coolant liquid 300.
Input pipe 130 is selectively configured at top plate 111, foreboard 113, back plate 114 or in which the side plate of shell 110
115 and connection accommodating space AS.Efferent duct 140 be selectively configured at the top plate 111 of shell 110, foreboard 113, back plate 114 or
Wherein another side plate 115 and connection accommodating space AS with input pipe 130 and efferent duct 140 (shown in Figure 1A, 1B, before being arranged at
For on plate 113).Wherein, external coolant liquid 300 flows into shell 110 from input pipe 130, and passes through the first radiating fin group
To absorb waste heat, coolant liquid 300 flows out shell via efferent duct 140 again for 120A, the second radiating fin group 120B coolant liquid 300
110, to complete the heat dissipation cyclic process of single.
For supplement, the axial A1 of input pipe 130 and the axial A2 of efferent duct 140 are, for example, perpendicular or parallel to shell
110 bottom plate 112 and the normal direction of 200 plane of heat source.Or the axial A2 of the axial A1 of input pipe 130 and efferent duct 140
It can be respectively perpendicular or be parallel to the normal direction of bottom plate 112 and 200 plane of heat source.Above-mentioned a variety of state sample implementations, depending on liquid-cooled
Depending on the specification or demand of radiator, the utility model is simultaneously without restriction.In addition, when input pipe 130 axial A1 perpendicular to
When the bottom plate 112 of shell 110, make coolant liquid 300 by input pipe 130, coolant liquid 300 can enter accommodating space AS and directly touch
Plate 112 is bottomed out, to generate impinging cooling effect.
In the present embodiment, the first radiating fin group 120A, the second radiating fin group 120B configuration are accommodating space AS's
Centre, and be spaced apart from each other with the both side plate of shell 110 115, to constitute two circulation road WP.Wherein the first radiating fin group
120A, the second radiating fin group 120B are set between two circulation road WP.In addition, the first radiating fin group 120A, the second heat dissipation
Fins group 120B relative to both side plate 115 spacing distance be it is identical, and input pipe 130 be respectively communicated with to efferent duct 140 it is corresponding
Two circulation road WP.
Furthermore, the first radiating fin group 120A, the second radiating fin group 120B extending direction LD having the same,
Extending direction LD is parallel to foreboard 113 and back plate 114, that is, the first radiating fin group 120A, the second radiating fin group 120B
Extending direction LD perpendicular to foreboard 113 and back plate 114 normal direction.First radiating fin group 120A, the second radiating fin
Group 120B is respectively provided with multiple fin space Ds 1, D2, and multiple fin space Ds 1, the opening of D2 are respectively facing both side plate 115.
Any fin space D 1 of first radiating fin group 120A is greater than any fin space D 2 of the second radiating fin group 120B.From defeated
The coolant liquid 300 for entering the inflow of pipe 130, from a wherein circulation road WP along the extending direction LD of two radiating fin groups 120A, 120B
Flow to another circulation road WP.
In flow process, coolant liquid 300 separately flows into multiple fin space Ds 1, D2 to pass through and contact the first heat radiating fin
Piece group 120A, the second radiating fin group 120B, wherein coolant liquid 300 is greater than multiple fins by the flow of multiple fin space Ds 1
The flow of space D 2.In the present embodiment, the ratio of fin space D 1 and fin space D 2 is 1.2~2.5, but not as
Limit, can according to coolant liquid 300 flow and change the ratio of fin space D 1 Yu fin space D 2.
The effect of reaching the flow resistance optimization and flow distribution of coolant liquid 300 with this, coolant liquid 300 can effectively be applied
To promote whole thermal conductivity and heat transfer property energy.
With reference to Fig. 1 C, in the present embodiment, liquid cooling radiator 100 further includes partition 150, is configured at the first radiating fin
Between group 120A, the second radiating fin group 120B and against the foreboard of shell 110 113 and back plate 114.Partition 150 is for separating
First radiating fin group 120A, the second radiating fin group 120B make coolant liquid 300 generate shunting in flow process to flow respectively
Enter multiple fin space Ds 1, D2.In the present embodiment, partition 150 and the first radiating fin group 120A, the second radiating fin group
The forging structure that 120B is integrally formed.In other embodiments, two radiating fin groups with partition are connected as through welding
One or two radiating fin groups are only abutting contact partitions rather than are integrated.In other embodiments, two radiating fin groups without
Palpus partition, two radiating fin groups directly contact.
In conclusion the liquid cooling radiator of the utility model is used for the heat dissipation of heat source, with different arranging densities and not
With two radiating fin groups of fin thickness.Wherein, by arranging density is smaller but the biggish radiating fin group configuration of fin thickness exists
On the bottom plate of shell, by arranging density is larger but the lesser radiating fin group configuration of fin thickness above.Since wherein one dissipates
The fin thickness of hot fins group is larger, and is conducive to absorb the waste heat that heat source is transferred to bottom plate.On the other hand, when coolant liquid is from defeated
Enter pipe and enter shell and when by two radiating fin groups, the biggish another radiating fin group of arranging density has biggish hot biography face
Radiating fin group waste heat, can be quickly transferred to coolant liquid, then waste heat is taken away shell by coolant liquid by product.Therefore the utility model
Liquid cooling radiator can promote thermal conductivity, the heat of liquid cooling radiator entirety in conjunction with two radiating fin groups of different characteristics
Transfer performance and heat radiation function.Furthermore, coolant liquid passes through the flows of multiple fin spacing of two radiating fin groups not phase
Together.The effect of reaching the flow resistance optimization and flow distribution of coolant liquid with this, and by coolant liquid effectively using to promote liquid cooling
The overall thermal transfer performance of formula radiator.
The above, the only preferred embodiment of the utility model cannot limit the utility model implementation with this
Range, i.e., it is all according to simple equivalent changes and modifications made by the utility model claims book and description, all
Still belong in the range of the utility model patent covers.In addition, any embodiment or claim of the utility model are not necessary to reach
Whole purposes or advantage or feature disclosed by the utility model.In addition, abstract of description and utility model title are intended merely to
Auxiliary patent document retrieval is used, and not is used to limit the interest field of the utility model.In addition, this specification or claim
The terms such as " first " that is referred in book, " second " only to name element (element) title or the different embodiments of difference or
Range, and not it is used to the quantitative upper limit of restriction element or lower limit.
Reference signs list
100: liquid cooling radiator；
110: shell
111: top plate
112: bottom plate
113: foreboard
114: back plate
115: side plate
120,120A, 120B: radiating fin
130: input pipe
140: efferent duct
150: partition
200: heat source
300: coolant liquid
AS: accommodating space
A1, A2: axial
D1, D2: fin spacing
LD: extending direction
IS: inner surface
OS: outer surface
WP: circulation road
W1, W2: fin thickness
Claims (11)
1. a kind of liquid cooling radiator, which is characterized in that the liquid cooling radiator include shell, at least two radiating fin groups,
Input pipe and efferent duct,
The shell has top plate and bottom plate, foreboard, back plate and a two opposite side plates, and the top plate, the bottom plate, described
Foreboard, the back plate and the both side plate constitute accommodating space；
At least two radiating fin groups are configured in the accommodating space；
The input pipe is configured at the top plate, the foreboard, the back plate or in which a side plate for the shell and company
Lead to the accommodating space；
The efferent duct be configured at the top plate, the foreboard, the back plate or in which another side plate of the shell and
It is connected to the accommodating space,
Wherein, at least two radiating fin groups have different fins from at least two radiating fin groups with different arranging densities
Piece thickness, coolant liquid flow into the shell from the input pipe, and by at least two radiating fin groups, then by the output
Pipe flows out the shell.
2. liquid cooling radiator as described in claim 1, which is characterized in that at least two radiating fin groups and the two sides
Plate is spaced apart from each other, and to constitute two circulation roads, the input pipe and the efferent duct are respectively communicated with two circulation road.
3. liquid cooling radiator as claimed in claim 2, which is characterized in that the extending direction of at least two radiating fin groups
It is parallel to the foreboard and the back plate, the coolant liquid flows to from a wherein circulation road along the extending direction another
The circulation road.
4. liquid cooling radiator as described in claim 1, which is characterized in that the bottom plate includes opposite inner surface and appearance
Face, wherein described at least one of two radiating fin groups contact the another of the inner surface and at least two radiating fin groups
The one contact top plate, the outer surface is for contacting heat source.
5. liquid cooling radiator as claimed in claim 4, which is characterized in that contact wherein described at least the two of the inner surface
The arranging density of one of radiating fin group is less than another arranging density of at least two radiating fin groups.
6. liquid cooling radiator as claimed in claim 4, which is characterized in that described at least one of two radiating fin groups
Any fin thickness be greater than another any fin thickness of at least two radiating fin groups.
7. liquid cooling radiator as described in claim 1, which is characterized in that at least two radiating fin groups are respectively provided with more
A fin spacing, and the multiple fin spacing is respectively facing the both side plate, the coolant liquid flows between the multiple fin
Away to pass through at least two radiating fin groups.
8. liquid cooling radiator as claimed in claim 7, which is characterized in that described at least one of two radiating fin groups
Any fin spacing be greater than another any fin spacing of at least two radiating fin groups.
9. liquid cooling radiator as described in claim 1, which is characterized in that the quantity of at least two radiating fin groups is more
It is a, and be stacked between the top plate and the bottom plate.
10. liquid cooling radiator as described in claim 1, which is characterized in that the liquid cooling radiator further includes at least one
Partition is configured between at least two radiating fin groups and against the foreboard and the back plate.
11. liquid cooling radiator as claimed in claim 10, which is characterized in that an at least partition is dissipated with described at least two
Hot fins group is integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820798827.5U CN208270917U (en) | 2018-05-28 | 2018-05-28 | Liquid cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820798827.5U CN208270917U (en) | 2018-05-28 | 2018-05-28 | Liquid cooling radiator |
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| Publication Number | Publication Date |
|---|---|
| CN208270917U true CN208270917U (en) | 2018-12-21 |
Family
ID=64684213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820798827.5U Active CN208270917U (en) | 2018-05-28 | 2018-05-28 | Liquid cooling radiator |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110300509A (en) * | 2019-06-29 | 2019-10-01 | 联想(北京)有限公司 | A kind of radiator |
| CN110543069A (en) * | 2018-05-28 | 2019-12-06 | 中强光电股份有限公司 | Liquid cooling type radiator |
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| CN112698541A (en) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | Heat dissipation module and projection device using same |
-
2018
- 2018-05-28 CN CN201820798827.5U patent/CN208270917U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110543069A (en) * | 2018-05-28 | 2019-12-06 | 中强光电股份有限公司 | Liquid cooling type radiator |
| US10976116B2 (en) | 2018-05-28 | 2021-04-13 | Coretronic Corporation | Liquid cooled heat dissipation device |
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| US11194238B2 (en) | 2019-03-29 | 2021-12-07 | Coretronic Corporation | Heat dissipation module and projection apparatus |
| CN110300509A (en) * | 2019-06-29 | 2019-10-01 | 联想(北京)有限公司 | A kind of radiator |
| CN112698541A (en) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | Heat dissipation module and projection device using same |
| US11506961B2 (en) | 2019-10-22 | 2022-11-22 | Coretronic Corporation | Heat dissipation module and projection apparatus using the same |
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