CN208269306U - A kind of semiconductor demoistener - Google Patents
A kind of semiconductor demoistener Download PDFInfo
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- CN208269306U CN208269306U CN201820751982.1U CN201820751982U CN208269306U CN 208269306 U CN208269306 U CN 208269306U CN 201820751982 U CN201820751982 U CN 201820751982U CN 208269306 U CN208269306 U CN 208269306U
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Abstract
The utility model discloses a kind of semiconductor demoisteners, belong to dehumidifier technical field.A kind of semiconductor demoistener of the utility model, including the mounting plate with mounting hole, the two sides of mounting hole are had family inner housing and outdoor cabinets, further include controller and the first sensor for detecting indoor humidity and temperature；There is cool guide sheet in indoor shell, indoor entry/exit air port is provided on indoor shell, there is conduction cooling blower on indoor air inlet or/and indoor air outlet, indoor shell is additionally provided with drainage mechanism；There is cooling fin in outdoor cabinets, outdoor entry/exit air port is provided on outdoor cabinets, has cooling fan on outdoor air inlet or/and outdoor air outlet；There is semiconductor chilling plate in mounting hole, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is close to cool guide sheet, cooling fin is close in hot face；Further include the second sensor for detecting coldface temperature, detects the 3rd sensor of hot-face temperature.The utility model can treat dehumidified environment and carry out automatically controlling semiconductor demoistener working condition except wet construction.
Description
Technical field
The utility model relates to a kind of semiconductor demoisteners, belong to dehumidifier technical field.
Background technique
Semiconductor demoistener is a kind of dehumidifier to be dehumidified by semiconductor chilling plate, relative to compressor dehumidifier and
For rotary wheel type Dehumidifier, the price of semiconductor demoistener is relatively cheap.
Semiconductor chilling plate has two sides, on one side for absorbing heat, another side for releasing heat, absorbs heat that
It is known as the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate on one side, the exothermic side is known as the hot face of semiconductor chilling plate.
After semiconductor demoistener starting in the prior art, the power of semiconductor chilling plate is constant (partly lead in other words
The input voltage of body cooling piece is constant), this has resulted in the unobvious or not energy-efficient situation of indoor dehumidification effect and has occurred, because
This, it is extremely urgent to design a kind of semiconductor demoistener that can automatically control working condition.
Summary of the invention
The goal of the invention of the utility model is: in view of the above problems, providing a kind of semiconductor demoistener, this reality
Semiconductor demoistener working condition can be automatically controlled with novel semiconductor demoistener.
The technical solution adopted in the utility model is as follows:
A kind of semiconductor demoistener, including the mounting plate with mounting hole, the side of mounting hole is equipped with indoor shell, another
Side is equipped with outdoor cabinets, further includes first sensor for detecting indoor air humidity and temperature and for controlling half
The controller of conductor dehumidifier working condition；The side of the mounting hole is also equipped with the cool guide sheet of negotiable room air, should
Cool guide sheet is located in indoor shell, and the indoor air inlet for room air disengaging and indoor outlet air are offered on indoor shell
Mouthful, it is equipped with conduction cooling blower on indoor air inlet or/and indoor air outlet, indoor housing bottom is additionally provided with drainage mechanism；Institute
The other side for stating mounting hole is also equipped with the cooling fin of negotiable outdoor air, which is located outside in shell, chamber enclosure
The outdoor air inlet for outdoor air disengaging and outdoor air outlet, outdoor air inlet or/and outdoor air outlet are offered on body
On be equipped with cooling fan；It is provided with semiconductor chilling plate in the mounting hole, the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is close to conduction cooling
The hot face abutting cooling fin of piece, semiconductor chilling plate；It further include the second sensing for detecting semiconductor chilling plate coldface temperature
Device, and the 3rd sensor for detecting semiconductor chilling plate hot-face temperature.
Using the utility model semiconductor demoistener when, mounting plate is fixed on (bright on the shell siding of environment to be dehumidified
Aobvious, the shell siding of environment to be dehumidified can also directly be mounting plate), indoor shell is located at the interior of environment to be dehumidified, room
Outer housing is located at the outdoor of environment to be dehumidified.For interior: under the action of conduction cooling blower, room air is from indoor air inlet
Mouth enters the room shell, after flowing through cool guide sheet, is discharged to interior from indoor air outlet；Air flows through the process of cool guide sheet indoors
In, since cool guide sheet is mutually close to the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, cool guide sheet (huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate in other words) is just inhaled
The heat of room air is walked, so that indoor air temperature reduces, the partial moisture in room air condenses on cool guide sheet surface
Droplet, which is precipitated, is discharged to outdoor by drainage mechanism, removes wet construction which achieves room air.For outdoor: radiating
Under the action of blower, outdoor air enters outdoor cabinets from outdoor air inlet, after flowing through cooling fin, is discharged to room from outdoor air outlet
Outside；During outdoor air flows through cooling fin, since cooling fin is mutually close to the hot face of semiconductor chilling plate, outdoor air
Just the heat in cooling fin (the hot face of semiconductor chilling plate in other words) is siphoned away, which achieves the heat dissipations of semiconductor demoistener
Journey.And in above-mentioned dehumidification process, first sensor detects that the humidity of room air is detected with temperature, second sensor
Temperature, the 3rd sensor of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) detect the temperature in the hot face of semiconductor chilling plate and by 3 sensors
The signal detected is transferred to controller, and controller is made to automatically control the work of semiconductor chilling plate, conduction cooling blower, cooling fan
State is achieved the purpose for automatically controlling semiconductor demoistener working condition.
A kind of semiconductor demoistener of the utility model, the second sensor insertion cool guide sheet and close semiconductor refrigerating
The huyashi-chuuka (cold chinese-style noodles) of piece, 3rd sensor are inserted into cooling fin and the hot face close to semiconductor chilling plate.
A kind of semiconductor demoistener of the utility model, the first sensor are Temperature Humidity Sensor, second sensor
It is temperature sensor for temperature sensor, 3rd sensor.
A kind of semiconductor demoistener of the utility model is additionally provided with heat insulating mattress between the cool guide sheet and cooling fin, and
Semiconductor chilling plate runs through heat insulating mattress.
Further, the heat insulating mattress is assemblied on mounting hole, and heat insulating mattress is between mounting plate and cooling fin.I.e. every
Heat pad is assemblied in the side of the mounting plate (mounting hole in other words) towards cooling fin.
A kind of semiconductor demoistener of the utility model, the conduction cooling blower are assemblied on indoor air inlet.At this point, room
Interior air is pumped into indoor shell from indoor air inlet by conduction cooling blower, flows through after cool guide sheet is dehumidified, arranges from indoor air outlet
To interior.
A kind of semiconductor demoistener of the utility model, the cooling fan are assemblied in outdoor air inlet.At this point, room
Outer air is pumped into outdoor cabinets from outdoor air inlet by cooling fan, after flowing through cooling fin and siphoning away heat, from outdoor outlet air
Mouth is discharged to outdoor.
A kind of semiconductor demoistener of the utility model, for the indoor air outlet in grid-like, outdoor air outlet is in grid
Shape.
A kind of semiconductor demoistener of the utility model, the drainage mechanism include being set to catchmenting for indoor housing bottom
Slot and the drainpipe for being connected to the trench bottom that catchments.
A kind of semiconductor demoistener of the utility model, the semiconductor chilling plate have 2.
In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:
A kind of semiconductor demoistener of the utility model can be realized and treat dehumidified environment and dehumidifying except wet construction
In the process, it is capable of the relative humidity and temperature and semiconductor chilling plate of real-time detection feedback environment (room air) to be dehumidified
Huyashi-chuuka (cold chinese-style noodles) and hot-face temperature, automatically control semiconductor demoistener working condition.It is unobvious and remove to improve indoor dehumidification effect
Wet not energy-efficient situation, it is practical, there is good usage experience.
Detailed description of the invention
Fig. 1 is structural schematic diagram when the first visual angle semiconductor demoistener is split;
Fig. 2 is structural schematic diagram when second of visual angle semiconductor demoistener is split;
Fig. 3 is the top view that semiconductor demoistener splits structure;
Fig. 4 is the side view that semiconductor demoistener splits structure;
Structural schematic diagram when Fig. 5 is semiconductor demoistener combination;
Fig. 6 is the structural schematic diagram of indoor shell；
Fig. 7 is the structural schematic diagram of cool guide sheet；
Fig. 8 is the structural schematic diagram of cooling fin；
Fig. 9 is the flow chart of the dehumidification control method of semiconductor demoistener.
Marked in the figure: 1- conduction cooling blower, 11- conduction cooling fan shroud, shell in the room 2-, 21- indoor air inlet, going out in the room 22-
Air port, 23- catch basin, 231- baffle, 24- drainpipe, 3- cool guide sheet, 31- conduction cooling fin, 32- conduction cooling plate, 4- mounting plate, 41-
Mounting hole, 42- heat insulating mattress, 5- semiconductor chilling plate, 6- cooling fin, 61- vertical plate, 62- vertical plate channel, 63- transverse slat, 64- heat dissipation
Fin, 7- outdoor cabinets, 71- outdoor air inlet, air outlet, 8- cooling fan, 81- radiation air hood, 9- control outside the room 72-
Device, 91- first sensor, 92- second sensor, 93- 3rd sensor.
Specific embodiment
With reference to the accompanying drawing, the utility model is described in detail.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As shown in Figures 1 to 8, a kind of semiconductor demoistener of the present embodiment, including the mounting plate 4 with mounting hole 41,
The side of mounting hole 41 is equipped with indoor shell 2, the other side is equipped with outdoor cabinets 7, further includes wet for detecting room air
Controller 9 of the degree with the first sensor 91 of temperature and for controlling semiconductor demoistener working condition；The mounting hole 41
Side be also equipped with the cool guide sheet 3 of negotiable room air, which is located in indoor shell 2, opens on indoor shell 2
Equipped with the indoor air inlet 21 and indoor air outlet 22 passed in and out for room air, indoor air inlet 21 or/and indoor air outlet
Conduction cooling blower 1 is equipped on 22, indoor 2 bottom of shell is additionally provided with drainage mechanism；It also assembles the other side of the mounting hole 41
There is the cooling fin 6 of negotiable outdoor air, which is located outside in shell 7, is offered on outdoor cabinets 7 for outdoor
It is equipped on the outdoor air inlet 71 of air disengaging and outdoor air outlet 72, outdoor air inlet 71 or/and outdoor air outlet 72 scattered
Air-heater 8；It is provided with semiconductor chilling plate 5 in the mounting hole 41, the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate 5 is close to cool guide sheet 3, half
It is close to cooling fin 6 in the hot face of conductor cooling piece 5；It further include the second sensor for detecting semiconductor chilling plate coldface temperature
92, and the 3rd sensor 93 for detecting semiconductor chilling plate hot-face temperature.
Using the utility model semiconductor demoistener when, mounting plate 4 is fixed on (bright on the shell siding of environment to be dehumidified
Aobvious, the shell siding of environment to be dehumidified can also directly be mounting plate 4), indoor shell 2 is located at the interior of environment to be dehumidified,
Outdoor cabinets 7 are located at the outdoor of environment to be dehumidified.For interior: under the action of conduction cooling blower 1, room air is from interior
Air inlet 21 enters the room shell 2, after flowing through cool guide sheet 3, is discharged to interior from indoor air outlet 22；Air flows through conduction cooling indoors
During piece 3, since cool guide sheet 3 is mutually close to the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 5, cool guide sheet 3(semiconductor chilling plate in other words
5 huyashi-chuuka (cold chinese-style noodles)) heat of room air is just siphoned away, so that indoor air temperature reduces, the partial moisture in room air is in conduction cooling
3 surface of piece condenses into droplet precipitation and is discharged to outdoor by drainage mechanism, removes wet construction which achieves room air.For room
For outer: under the action of cooling fan, outdoor air enters outdoor cabinets 7 from outdoor air inlet 71, after flowing through cooling fin 6,
Outdoor is discharged to from outdoor air outlet 72；During outdoor air flows through cooling fin 6, due to cooling fin 6 and semiconductor refrigerating
The hot face of piece 5 is mutually close to, and outdoor air just siphons away the hot face of cooling fin 6(semiconductor chilling plate 5 in other words) heat, this is just real
The radiation processes of semiconductor demoistener are showed.And in above-mentioned dehumidification process, first sensor 91 detects room air
Humidity and temperature, second sensor 92 detect that the temperature of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles), 3rd sensor 93 detect semiconductor
The signal that 3 sensors detect simultaneously is transferred to controller 9 by the temperature in the hot face of cooling piece, and controller 9 is made to automatically control half
The working condition of conductor cooling piece 5, conduction cooling blower 1, cooling fan 8 is achieved and automatically controls semiconductor demoistener work shape
The purpose of state.It will be evident that first sensor 91, second sensor 92,3rd sensor 93 are connected with controller 9 respectively；Partly lead
Body cooling piece 5, conduction cooling blower 1, cooling fan 8 are connected with controller 9 respectively.Alternative, controller 9 is also connected with alarm
Device (not shown).
It is alternative, in one embodiment, as shown in Figure 1 to Figure 4 and shown in Fig. 7, specifically devise cool guide sheet 3
A kind of structure type, the cool guide sheet 3 include multiple conduction cooling fins 31 being spaced apart from each other, and the side of conduction cooling fin 31 is connected with conduction cooling
Plate 32, the conduction cooling plate 32 are close to the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 5；The gap of each 31 other side of conduction cooling fin is as in circulation chamber
The channel of air.It is alternative, in another embodiment, as shown in Figure 1 to Figure 4 and shown in Fig. 8, specifically devise cooling fin 6
A kind of structure type, the cooling fin 6 include in I-shaped radiating block (including vertical plate and transverse slat), 61 shape of vertical plate of the radiating block
At have along 61 length direction of the vertical plate distribution vertical plate channel 62,61 two sides of vertical plate setting transverse slat 63 between have it is multiple mutually
The radiating fin 64 at interval, radiating fin 64 are connected with vertical plate 61；One of transverse slat 63 is close to the heat of semiconductor chilling plate 5
Face, the gap between gap and transverse slat 63 and radiating fin 64 between vertical plate channel 62, radiating fin 64 is as circulation chamber
The channel of outer air.
Further optimization based on the present embodiment, in another embodiment, as shown in figure 3, the second sensor 92
It is inserted into cool guide sheet 3 and the huyashi-chuuka (cold chinese-style noodles) close to semiconductor chilling plate 5,3rd sensor 93 is inserted into cooling fin 6 and close to semiconductor refrigerating
The hot face of piece 5.As the design of 93 specific location of second sensor 92 and 3rd sensor, second sensor 92 is able to detect
To the coldface temperature of semiconductor chilling plate 5,3rd sensor 93 is able to detect that the hot-face temperature of semiconductor chilling plate 5.Certainly,
Second sensor 92 can also abut directly on the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 5, and 3rd sensor 93 abuts directly on semiconductor refrigerating
The hot face of piece 5.
Further optimization based on the present embodiment, in another embodiment, the first sensor 91 are temperature and humidity biography
Sensor, second sensor 92 are temperature sensor, 3rd sensor 93 is temperature sensor.Certainly, first sensor 91 may be used also
Think seperated humidity sensor and temperature sensor.
Further optimization based on the present embodiment, in another embodiment, as shown in Figures 1 to 4, the cool guide sheet 3
Heat insulating mattress 42 is additionally provided between cooling fin 6, and semiconductor chilling plate 5 runs through heat insulating mattress 42.The design of heat insulating mattress 42, can
Efficiently reduce the phenomenon of Heat between cool guide sheet 3 and cooling fin 6.Alternative, heat insulating mattress 42 is heat insulation foam.
Further, in another embodiment, the heat insulating mattress 42 is assemblied on mounting hole 41, and heat insulating mattress 42 is located at peace
Between loading board 4 and cooling fin 6.I.e. heat insulating mattress 42 is assemblied in the mounting hole 41 in other words of the mounting plate 4(towards cooling fin 6) that
Face.
Further optimization based on the present embodiment, in another embodiment, the conduction cooling blower 1 are assemblied in indoor air inlet
On mouth 21.At this point, room air is pumped into indoor shell 2 from indoor air inlet 21 by conduction cooling blower 1, flows through cool guide sheet 3 and removed
After wet, interior is discharged to from indoor air outlet 22.Preferably, conduction cooling fan shroud 11 is equipped on conduction cooling blower 1.Certainly, conduction cooling wind
Machine 1 can also be assemblied in indoor air outlet 22；At this point, under the action of conduction cooling blower 1, room air is by from indoor air inlet
Mouthfuls 21 enter the room shell 2, flow through after cool guide sheet 3 is dehumidified, are discharged to interior from indoor air outlet 22 by the extraction of conduction cooling blower 1.
Certainly, indoor air inlet 21 and indoor air outlet 22 can assemble conduction cooling blower 1 simultaneously, and principle repeats no more.
Further optimization based on the present embodiment, in another embodiment, the cooling fan 8 are assemblied in outdoor air inlet
On mouth 71.At this point, outdoor air is pumped into outdoor cabinets 7 from outdoor air inlet 71 by cooling fan 8, flows through cooling fin 6 and inhale
After walking heat, outdoor is discharged to from outdoor air outlet 72.Preferably, radiation air hood 81 is equipped on cooling fan 8.Certainly, it dissipates
Air-heater 8 can also be assemblied on outdoor air outlet 72；At this point, under the action of cooling fan 8, outdoor air is from outdoor air inlet
Mouth 71 enters outdoor cabinets 7, after flowing through cooling fin 6 and siphoning away heat, is discharged to room from outdoor air outlet 72 by the extraction of cooling fan 8
Outside.Certainly, outdoor air inlet 71 and outdoor air inlet 71 can assemble cooling fan 8 simultaneously, and principle repeats no more.
Further optimization based on the present embodiment, in another embodiment, the indoor air outlet 22 are in grid-like, room
Outgoing tuyere 72 is in grid-like.
Further optimization based on the present embodiment, in another embodiment, as shown in fig. 6, the drainage mechanism includes
The catch basin 23 for being set to indoor 2 bottom of shell and the drainpipe 24 for being connected to 23 bottom of catch basin.Preferably, indoor shell 2
Bottom forms catch basin 23 towards that side setting baffle 231 of mounting plate 4.
Further optimization based on the present embodiment, in another embodiment, the semiconductor chilling plate 5 have 2.When
So, semiconductor chilling plate 5 can also have 1,3 or more.
In one embodiment, as shown in Figures 1 to 9, room is carried out using the semiconductor demoistener of the utility model
Interior to remove wet construction, dehumidification control method includes the following steps: setting procedure (setting on controller 9): setting room air
Humidity threshold R1, room air temperature threshold T1, the lower temperature threshold T2 of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles), room air with
The temperature difference upper limit threshold of the temperature difference lower threshold T121 of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles), room air and semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles)
The input voltage lower threshold Y1 of semiconductor chilling plate, value T122, the high limit temperature threshold T3 in semiconductor chilling plate hot face are partly led
The upper limit of input voltage threshold value Y2 of body cooling piece；
Detection judges that (first sensor 91, second sensor 92 and 3rd sensor 93 detect and transmit letter rate-determining steps
Number give controller 9, controller 9 judgement control semiconductor demoistener working condition), comprising the following steps:
S1: detect the real-time humidity r1 of room air, the real time temperature t1(first sensor 91 of room air detect r1 with
T1), and judge the relationship of r1 Yu R1, t1 and T1, if r1≤R1 or t1≤T1, if enter step S2, if r1 > R1 and t1 > T1,
Then enter step S3；
S2: semiconductor demoistener is standby and enters step S1；
S3: semiconductor demoistener dehumidifying, and enter step S4, wherein the input voltage of semiconductor chilling plate is Y and Y1
< Y < Y2；(i.e. semiconductor chilling plate 5, conduction cooling blower 1, cooling fan 8 are started to work)
S4: the real time temperature t3(3rd sensor 93 in the detection hot face of semiconductor chilling plate detects t3), and judge t3 and T3
Relationship, if t3 < T3, if enter step S5, if t3 >=T3, entering step S41；
S41: gradually reducing the input voltage Y of semiconductor chilling plate, and judge the relationship of t3 Yu T3, Y and Y1, if t3 < T3
And Y >=Y1, then enter step S5, if Y < Y1, if enter step S8；
S5: the real time temperature t2(second sensor 92 of detection semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) detects t2), and judge t2 and T2
Relationship, if t2 > T2, if enter step S6, if t2≤T2, entering step S51；
S51: gradually reducing the input voltage Y of semiconductor chilling plate, and judge the relationship of t2 Yu T2, Y and Y1, if t2 > T2
And Y >=Y1, then enter step S6, if Y < Y1, if enter step S8；
S6: the real time temperature difference t12(controller 9 for calculating room air and semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) calculates t12), t12=
T1-t2, and judge the relationship of t12 and T121, if t12 > T121, if enter step S7, if t12≤T121, entering step
S61；
S61: it is stepped up the input voltage Y of semiconductor chilling plate, and judges the relationship of t12 Yu T121, Y and Y2, if t12
> T121 and Y≤Y2, then enter step S7, if Y > Y2, if enter step S8；
S7: judging the relationship of t12 and T122, if t12 < T122, if enter step S1, if t12 >=T122, enter step
Rapid S71；
S71: the input voltage Y of semiconductor chilling plate is gradually reduced, and judges the relationship of t12 Yu T122, Y and Y1, if t12
< T122 and Y >=Y1, then enter step S1, if Y < Y1, if enter step S8；
S8: semiconductor demoistener is shut down.
Setting procedure preset parameters threshold value (preferably factory setting, certainly, also allow user voluntarily set
It is fixed)；After semiconductor demoistener booting, in dehumidification process, rate-determining steps, real-time detection ring to be dehumidified are judged according to above-mentioned detection
The relative humidity and temperature in border (room air) and the huyashi-chuuka (cold chinese-style noodles) and hot-face temperature of semiconductor chilling plate, with corresponding threshold value
Make comparative judgments control, realizes the purpose for automatically controlling semiconductor demoistener working condition.
Further, in setting procedure, R1 70%, T1 are 10 DEG C, T2 is 1 DEG C, T121 is 10 DEG C, T122 is 20 DEG C,
T3 is 60 DEG C.
Further, in setting procedure, Y1 5V, Y2 24V.Above-mentioned threshold value is alternative design value.Certainly,
Above-mentioned threshold value can also be set as other values according to actual needs.
Further, in step S3, Y is 0.8 × Y2.Certainly, in step S3, semiconductor demoistener dehumidifying, initial half
The input voltage of conductor cooling piece is that Y can also be other numerical value, such as 20V, 18V or 0.5 × Y2.
Further, step S41, in S51, S71, the input voltage Y of semiconductor chilling plate is gradually reduced as every 30s reduction
1V。
Further, in step S61, the input voltage Y for being stepped up semiconductor chilling plate is that every 30s increases 1V.
It further, further include semiconductor demoistener fault alarm in step S8
In conclusion using a kind of semiconductor demoistener of the utility model, it can be realized and treat dehumidified environment and removed
Wet construction, in dehumidification process, be capable of real-time detection feed back environment (room air) to be dehumidified relative humidity and temperature and
The huyashi-chuuka (cold chinese-style noodles) and hot-face temperature of semiconductor chilling plate automatically control semiconductor demoistener working condition.Improve indoor dehumidification effect
The situation that fruit is unobvious and dehumidifying is not energy-efficient, it is practical, there is good usage experience.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of semiconductor demoistener, it is characterised in that: including the mounting plate (4) with mounting hole (41), mounting hole (41)
Side is equipped with indoor shell (2), the other side is equipped with outdoor cabinets (7), further includes for detecting indoor air humidity and temperature
The first sensor (91) of degree and controller (9) for controlling semiconductor demoistener working condition；
The side of the mounting hole (41) is also equipped with the cool guide sheet (3) of negotiable room air, which is located at interior
In shell (2), the indoor air inlet (21) and indoor air outlet for room air disengaging are offered on indoor shell (2)
(22), it is equipped with conduction cooling blower (1) in indoor air inlet (21) or/and indoor air outlet (22), indoor shell (2) bottom is also set
It is equipped with drainage mechanism；
The other side of the mounting hole (41) is also equipped with the cooling fin (6) of negotiable outdoor air, which is located at room
In outer housing (7), the outdoor air inlet (71) for outdoor air disengaging and outdoor air outlet are offered on outdoor cabinets (7)
(72), cooling fan (8) are equipped on outdoor air inlet (71) or/and outdoor air outlet (72)；
Semiconductor chilling plate (5) are provided in the mounting hole (41), the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (5) is close to cool guide sheet
(3), cooling fin (6) are close in the hot face of semiconductor chilling plate (5)；
It further include for detecting the second sensor of semiconductor chilling plate coldface temperature (92), and for detecting semiconductor refrigerating
The 3rd sensor (93) of piece hot-face temperature.
2. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the second sensor (92) is inserted into conduction cooling
Piece (3) and the huyashi-chuuka (cold chinese-style noodles) of close semiconductor chilling plate (5), 3rd sensor (93) are inserted into cooling fin (6) and close to semiconductor refrigeratings
The hot face of piece (5).
3. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the first sensor (91) is temperature and humidity
Sensor, second sensor (92) are temperature sensor, 3rd sensor (93) is temperature sensor.
4. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the cool guide sheet (3) and cooling fin (6) it
Between be additionally provided with heat insulating mattress (42), and semiconductor chilling plate (5) run through heat insulating mattress (42).
5. a kind of semiconductor demoistener as claimed in claim 4, it is characterised in that: the heat insulating mattress (42) is assemblied in mounting hole
(41) on, and heat insulating mattress (42) is located between mounting plate (4) and cooling fin (6).
6. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the conduction cooling blower (1) is assemblied in interior
On air inlet (21).
7. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the cooling fan (8) is assemblied in outdoor
On air inlet (71).
8. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the indoor air outlet (22) is in grid
Shape, outdoor air outlet (72) is in grid-like.
9. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the drainage mechanism includes being set to interior
The catch basin (23) of shell (2) bottom and the drainpipe (24) for being connected to catch basin (23) bottom.
10. a kind of semiconductor demoistener as described in claim 1, it is characterised in that: the semiconductor chilling plate (5) has 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820751982.1U CN208269306U (en) | 2018-05-21 | 2018-05-21 | A kind of semiconductor demoistener |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820751982.1U CN208269306U (en) | 2018-05-21 | 2018-05-21 | A kind of semiconductor demoistener |
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| CN208269306U true CN208269306U (en) | 2018-12-21 |
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ID=64684909
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| CN201820751982.1U Active CN208269306U (en) | 2018-05-21 | 2018-05-21 | A kind of semiconductor demoistener |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108613294A (en) * | 2018-05-21 | 2018-10-02 | 德阳智科电子有限公司 | A kind of dehumidification control method and semiconductor demoistener of semiconductor demoistener |
-
2018
- 2018-05-21 CN CN201820751982.1U patent/CN208269306U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108613294A (en) * | 2018-05-21 | 2018-10-02 | 德阳智科电子有限公司 | A kind of dehumidification control method and semiconductor demoistener of semiconductor demoistener |
| CN108613294B (en) * | 2018-05-21 | 2024-02-09 | 德阳智科电子有限公司 | Dehumidification control method of semiconductor dehumidifier and semiconductor dehumidifier |
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