CN208245242U - A kind of carrier for sapphire wafer cleaning process - Google Patents

Abstract

The utility model provides a kind of carrier for sapphire wafer cleaning process, including bottom plate and it is arranged on the bottom plate and the type chamber for placing sapphire wafer, it is provided between the water-carrying groove for collecting cleaning solution and the water outlet for cleaning solution to be discharged and the two and is connected in the bottom surface of the type chamber, multiple handle positions to exert a force for manpower or mechanical arm to bottom plate are provided on the bottom plate, the carrier further includes cover board identical with floor structure and briquetting identical with water outlet mouth-shaped, type chamber is oppositely arranged between the cover board and bottom plate, when carrier is spun upside down, by the way that briquetting to be pressed into the conversion carrying for realizing sapphire wafer in water outlet between bottom plate and the type chamber of cover board from the non-cavity surface of bottom plate or cover board.The carrier structure is simple and easy to use, has good excessively aqueous and gas permeability, can effectively solve the problems, such as that fragment rate height and cleaning efficiency existing for sapphire wafer are low in fullslice processing procedure.

Description

A kind of carrier for sapphire wafer cleaning process

Technical field

The utility model relates to sapphire wafer processing technique fields, and in particular, to one kind is clear for sapphire wafer Wash the carrier of technique.

Background technique

Sapphire main component is aluminium oxide, and since sapphire has, hardness is high, fusing point is high, translucency is good, electrical isolation The advantages that property is excellent, stable chemical performance, is therefore widely used in the technical fields such as machinery, optics, information.When large stretch of blue precious It mainly include following two processing method: 1, small pieces making technology when stone chip is processed small sized camera eyeglass: big Piece sapphire is laser-cut into small pieces sapphire, white tiles cleaning, silk-screen, baking, finished product cleaning, plated film, packaging；2, large stretch of system Journey technique: using laser large stretch of sapphire surface be cut into the sapphire profile groove of small pieces (non-sliver), white tiles cleaning, Silk-screen, baking, finished product cleaning, plated film, sliver, packaging.

In above-mentioned process, due to electrostatic interaction, the various dirt in air are easily adsorbed on the surface of sapphire wafer Angstrom, impurity and pollutant, and wafer surface is solidificated under the conditions of high-temperature baking, and added simultaneously in laser cutting The aluminium oxide and surface layer ink of Ministry of worker position were melted or gasify in moment, melted impurity so that cut place residual is a large amount of and adhered to A large amount of dust, therefore the cleaning process of product seems increasingly important.

Traditional cleaning method mostly uses greatly chemical agent to cooperate ultrasonic cleaning technique, although decontamination dust removal significant effect, But the small particles of sapphire surface stubbornness still cannot be removed effectively, and then cause product cleaning yield it is low, need it is more Secondary return is washed, and cleaning cost is not only increased, and can not meet the high-cleanness, high quality requirements of sapphire camera eyeglass.

A kind of new sapphire wafer cleaning process is had developed in industry at present, by combining physics, chemistry and machinery Means clean the surface of sapphire wafer, and small particles and other stubbornnesses that must can effectively remove sapphire surface are dirty, It is comprised the following specific steps that: plasma cleaning (or UV cleaning), strong acid solution impregnates, alkalescent lotion impregnates, brushing tool dips Basic lotion scrub, ultrasonic cleaning, drying.

In order to improve scrub efficiency, using brushing tool simultaneously to multiple large stretch of or small pieces sapphires in the 4th step scrub operation It is cleaned.But this method is when being applied to large stretch of making technology, since sapphire wafer itself is there are laser cutting trace, because This its jig clamping and scrub operation will be more careful, to guarantee that product is complete as far as possible.But inevitably, large stretch of sapphire Cleaning solution accumulates in bottom when still there is fragmentation phenomenon, and scrubbing slow efficiency, scrub, at its bottom after being put into additionally, due to product Face forms vacuum area, is not easy to the taking-up of product.

The information disclosed in the background technology section is intended only to increase the understanding to the general background of the utility model, and It is not construed as recognizing or implying in any form that information composition is already known to those of ordinary skill in the art existing Technology.

Utility model content

There is excellent support, excessively aqueous and gas permeability the purpose of this utility model is to provide one kind and be conducive to improve The cleaning carrier of large stretch of sapphire wafer scrub efficiency, to solve the problems, such as to propose in background technique.

To achieve the above object, the utility model provides a kind of carrier for sapphire wafer cleaning process, including Bottom plate and at least one be arranged on the bottom plate and from plate upper surface it is recessed down for placing sapphire wafer Type chamber is arranged recessed downly in the bottom surface of the type chamber at least together for collecting the blind slot shape water-carrying groove of cleaning solution, in institute State type chamber bottom surface be provided at least one on base plate thickness direction in through-hole or through slot shape for going out for cleaning solution to be discharged The mouth of a river is connected between the water-carrying groove and water outlet.

Preferably, the carrier also wraps multiple handle positions to exert a force for manpower or mechanical arm to bottom plate, the handle position The region on bottom plate and being located at other than type chamber is set, and the handle position is through-hole structure or groove structure.

Preferably, the depth of the type chamber is more than or equal to the thickness of sapphire wafer.

Preferably, the water-carrying groove is the cyclic annular through slot that type bottom of chamber face circumferential direction is arranged in, and the water outlet is cross knot Structure and the middle position for being set to type bottom of chamber face.

Preferably, the cross-shaped structure crosspoint of the water outlet is located at the symmetrical centre in type bottom of chamber face, and institute Stating water-carrying groove is multiple using the symmetrical centre in type bottom of chamber face as symmetrical centre and ring structure that size is sequentially increased.

Preferably, the carrier further includes cover board, and type chamber is opposite between the cover board is identical as the structure of bottom plate and the two sets It sets, when carrier is spun upside down, the type that the sapphire wafer intracavitary positioned at floor type is transferred to cover board is intracavitary.

Preferably, the carrier further includes briquetting, and the shape of the briquetting is identical as the shape of the water outlet, the pressure Block is separately provided or multiple briquettings are arranged on pressing plate and corresponds respectively with the position of water outlet, and the briquetting is used for the bottom of from It is pressed into water outlet at the non-cavity surface of plate or cover board so that sapphire wafer is successfully converted between bottom plate and cover board holds It carries.

Preferably, the bottom plate and cover board are acrylic material.

Technical solution provided by the utility model at least has the following beneficial effects:

1, the carrier structure is simple and easy to use, can carry out scrub cleaning simultaneously with multi-disc, double up and added Work efficiency rate；The carrier has good excessively aqueous and gas permeability, by setting water outlet and intensive water-carrying groove structure, both divides The pressure that sapphire wafer is subject to when having dissipated scrub plays the role of gentle support, reduces sliver risk when product picks and places, and energy Ensure that cleaning solution flows out in time, it is avoided to accumulate in cavity bottom, ensure that the stability and consistency of washing effect, product is clear Wash yield height；Vacuum area is formed in the two sides of product when also avoiding picking and placing product simultaneously or has gas retention, and then influences to produce The movement of product.

2, the carrier by setting briquetting and have with the mutually isostructural cover board of bottom plate, can be rapidly completed to blue treasured The two-sided cleaning of stone chip, and product breakage rate is low.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described, it should be apparent that, drawings discussed below is only some implementations of the utility model Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings Obtain other attached drawings, in which:

Fig. 1 is the overall structure diagram of carrier described in the utility model；

Fig. 2 is the structure enlargement diagram of A at the local flag of carrier shown in Fig. 1；

In figure: 01 sapphire wafer, 1 bottom plate, 2 type chambers, 3 water-carrying grooves, 4 water outlets, 5 handle positions.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work All other embodiment obtained, fall within the protection scope of the utility model.

Embodiment 1

Referring to Fig. 1 and Fig. 2, a kind of carrier for sapphire wafer cleaning process, including bottom plate 1 and nine arrangements are set Set the type chamber 2 on the bottom plate 1, the type chamber 2 recessed down is formed and for placing sapphire by the upper surface of bottom plate Chip 01 is provided with the blind slot shape water-carrying groove 3 that multiple tracks is used to collect cleaning solution in the bottom surface of the type chamber 2 recessed downly, The bottom surface of the type chamber 2 is provided with one for being discharged the water outlet 4 of cleaning solution, the water outlet 4 be cross-shaped configuration and It is in through hole shape on base plate thickness direction, is connected between the water-carrying groove 3 and water outlet 4.

The depth of the type chamber 2 is 1mm higher than the thickness of sapphire wafer 01, it is ensured that positioning of product during scrub Stability simultaneously prevents its edge damage；In the present embodiment, the bottom plate 1 uses acrylic material.

The water outlet 4 is set to the middle position of 2 bottom surface of type chamber and its cross-shaped structure crosspoint is located at type chamber 2 At the symmetrical centre of bottom surface；The water-carrying groove 3 is the cyclic annular through slot that type bottom of chamber face circumferential direction is arranged in, and the water-carrying groove 3 is more It is a using the symmetrical centre in type bottom of chamber face as symmetrical centre and ring structure that size is sequentially increased.

It is above-mentioned be designed beautifully it is generous, both can enhanced intracavitary excessively aqueous and gas permeability, be conducive to cleaning solution circulation and The discharge of sewage to ensure product cleaning effect, and can avoid forming vacuum area, influence the movement of product.It is described to cross water The pressure that product is subject to when the also dispersible brushing tool of 3 dense arrangement of slot is scrubbed, plays the role of gentle support, reduces big wafer and pick and place When existing sliver risk.

In the present embodiment, the carrier further includes 12 settings on bottom plate 1 and is used for manpower or mechanical arm the bottom of to The handle position 5 of plate force, the handle position 5 be through-hole structure and be separately positioned on type chamber side and type chamber and type chamber it Between.

Embodiment 2

The carrier for sapphire wafer cleaning process provided in the present embodiment, in the structure basis of embodiment 1 Have additional cover board and briquetting.Type chamber is oppositely arranged between the cover board is identical as the structure of bottom plate 1 and material and the two, in cover board and Positioning pin and location hole is respectively set in the edge corresponding position of bottom plate 1, to realize the fractionation between the two and be connected；The briquetting Shape is identical as the shape of water outlet 4, the briquetting is separately provided or multiple briquettings be arranged on pressing plate and respectively with water outlet 4 Position correspond.

The course of work of the carrier is as follows:

1, product positive (ink surface) is placed on one by one upward in the type chamber 2 on bottom plate 1；

2, the front that basic lotion scrubs product back and forth is dipped with scrubbing tool, basic lotion removes during carrying scrub Impurity flow through the gap between product and type cavity wall convergence screw clamp 3 in, then from water outlet 4 flow out；

3, after the positive scrub work of product to be done, cover board is fixedly connected with bottom plate 1 and turns over entire carrier up and down Turn；

4, briquetting is pressed into water outlet 4 from from the non-cavity surface of bottom plate 1, product slowly turns under the thrust of briquetting The type for moving to cover board is intracavitary, and product reverse side (silk-screen face) is upward at this time；

5, bottom plate 1 is removed, the reverse side that basic lotion scrubs product back and forth is dipped with scrubbing tool, realizes to the two-sided of product Rapid Cleaning has saved the artificial pick-and-place time, has improved scrub efficiency.

Carrier provided by the utility model is detailed in following table to the cleaning effect of large stretch of sapphire wafer:

Brushing device	Clean product quantity	Impurity in hole	White edge phenomenon	Fragmentation	Yield
						Traditional sheet pedestal	100pcs	15pcs	8pcs	5pcs	72%
The utility model	100pcs	8pcs	5pcs	0pcs	87%

It can be seen that can significantly promote the product yield in cleaning process using cleaning carrier provided by the utility model, especially It is that fragment rate almost can completely avoid, even if there is part, also there are the products of spot to do over again again, is avoided inferior Product are directly scrapped, and cost loss is mitigated.

The above is only the preferred embodiment of the present invention, is not intended to limit the patent protection model of the utility model It encloses, for those skilled in the art, the present invention may have various modifications and changes.In the spirit of the utility model Within principle, any improvement made by using the description of the utility model and the drawings or equivalent replacement, directly or It is used in other relevant technical fields indirectly, should all include in the scope of patent protection of the utility model.

Claims (8)

1. a kind of carrier for sapphire wafer cleaning process, which is characterized in that including bottom plate (1) and at least one setting On the bottom plate (1) and from plate upper surface it is recessed down for placing the type chamber (2) of sapphire wafer (01), described The bottom surface of type chamber (2) is arranged recessed downly at least together for collecting the blind slot shape water-carrying groove (3) of cleaning solution, in the type chamber (2) bottom surface is provided at least one on base plate thickness direction in through-hole or the water outlet for being used to be discharged cleaning solution of through slot shape (4), it is connected between the water-carrying groove (3) and water outlet (4).

2. carrier according to claim 1, which is characterized in that the carrier also wraps multiple manpowers or mechanical arm of being used for the bottom of to The handle position (5) of plate force, the region that the handle position (5) is arranged on bottom plate (1) and is located at other than type chamber (2), described Hand position (5) is through-hole structure or groove structure.

3. carrier according to claim 1, which is characterized in that the depth of the type chamber (2) is more than or equal to sapphire wafer (01) thickness.

4. carrier according to claim 1, which is characterized in that the water-carrying groove (3) is that type bottom of chamber face circumferential direction is arranged in Cyclic annular through slot, the water outlet (4) are cross-shaped structure and the middle position for being set to type chamber (2) bottom surface.

5. carrier according to claim 4, which is characterized in that the cross-shaped structure crosspoint of the water outlet (4) is located at At the symmetrical centre of type chamber (2) bottom surface, and it is in symmetrical that the water-carrying groove (3), which is multiple symmetrical centres with type bottom of chamber face, The ring structure that the heart and size are sequentially increased.

6. carrier described in any one of -5 according to claim 1, which is characterized in that the carrier further includes cover board, described Type chamber is oppositely arranged between cover board is identical as the structure of bottom plate (1) and the two, intracavitary positioned at floor type when carrier is spun upside down The type that sapphire wafer is transferred to cover board is intracavitary.

7. carrier according to claim 6, which is characterized in that the carrier further includes briquetting, the shape of the briquetting with The shape of the water outlet (4) is identical, the briquetting is separately provided or multiple briquettings be arranged on pressing plate and respectively with water outlet (4) position corresponds, and the briquetting is used to be pressed into from the non-cavity surface of bottom plate or cover board in water outlet so that blue Jewel chip successfully converts carrying between bottom plate and cover board.

8. carrier according to claim 6, which is characterized in that the bottom plate (1) and cover board are acrylic material.