CN208241588U - Highly integrated intelligent power module and electrical equipment - Google Patents
Highly integrated intelligent power module and electrical equipment Download PDFInfo
- Publication number
- CN208241588U CN208241588U CN201820918320.9U CN201820918320U CN208241588U CN 208241588 U CN208241588 U CN 208241588U CN 201820918320 U CN201820918320 U CN 201820918320U CN 208241588 U CN208241588 U CN 208241588U
- Authority
- CN
- China
- Prior art keywords
- foot
- wiring substrate
- power module
- highly integrated
- pfc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 238000009434 installation Methods 0.000 claims abstract description 34
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 abstract description 5
- 206010037660 Pyrexia Diseases 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 102100039435 C-X-C motif chemokine 17 Human genes 0.000 description 5
- 101000889048 Homo sapiens C-X-C motif chemokine 17 Proteins 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Rectifiers (AREA)
Abstract
It includes: wiring substrate that the utility model, which discloses a kind of highly integrated intelligent power module and electrical equipment, the highly integrated intelligent power module, and a side surface of wiring substrate is provided with multiple installation positions；Control module, rectifier bridge, PFC power switching modules and multiple power modules, are set on corresponding installation position；Wherein, pass through the electrical connection of the wiring of respective installation position and wiring substrate between control module and PFC power switching modules；Pass through the electrical connection of the wiring of respective installation position and wiring substrate between control module and multiple power modules.The utility model solves when electric-controlled plate is realized using multiple discrete components that device is more, assembly it is complicated and itself power consumption it is larger, fever etc. is also more serious, the problem of causing the thermal efficiency of air-conditioning low, be unfavorable for air conditioner energy-saving emission reduction.
Description
Technical field
The utility model relates to electronic circuit technology field, in particular to a kind of highly integrated intelligent power module and electric appliance are set
It is standby.
Background technique
With the development of scientific and technological progress and social productive forces, resource consumed excessively, environmental pollution, ecological disruption, weather become
The problems such as warm, becomes increasingly conspicuous, and Green Development, energy-saving and emission-reduction become the transformation developing direction of each enterprise and industrial circle.Therefore, empty
How the biggish refrigeration equipment of the energy consumption such as tune, refrigerator realizes reduction energy consumption, and saving energy becomes the striving direction of researcher.
Utility model content
The main purpose of the utility model is to propose a kind of highly integrated intelligent power module and electrical equipment, it is intended to improve collection
At the integrated level of intelligent power module, realizes the integrated drive control of blower and compressor, reduce the volume of electric-controlled plate, it is convenient
The problem of installation, realizes energy-saving and emission-reduction.
To achieve the above object, the utility model proposes a kind of highly integrated intelligent power module, the highly integrated intelligent function
Rate module includes:
One side surface of wiring substrate, the wiring substrate is provided with multiple installation positions；
Control module, rectifier bridge, PFC power switching modules and multiple power modules are set to the corresponding installation position
On；
Wherein, pass through respective installation position and the circuit between the control module and the PFC power switching modules
The wiring of circuit board is electrically connected；Pass through respective installation position between the control module and the multiple power module
It is electrically connected with the wiring of the wiring substrate.
Optionally, the highly integrated intelligent power module further includes heat sink,
The heat sink is set to the wiring substrate equipped with the control module, rectifier bridge, power switching modules
And the side of multiple power modules, the heat sink and the control module, rectifier bridge, power switching modules and multiple power moulds
Block reclines setting or gap setting；
Alternatively, the heat sink is set to the wiring substrate back to the control module, rectifier bridge, power switch
The side of module and multiple power modules.
Optionally, the multiple power module includes at least blower driving power module and driven compressor power module.
Optionally, the highly integrated intelligent power module further includes insulating layer, and the insulating layer is attached at the heat sink
Close to the side of the wiring substrate.
Optionally, the highly integrated intelligent power module further includes to the wiring substrate, heat sink, control mould
The encapsulating housing that block, rectifier bridge, PFC power switching modules and multiple power modules are packaged.
Optionally, the heat sink is in inside the encapsulating housing or is at least partly revealed in outside encapsulating housing,
And/or the wiring substrate is in inside the encapsulating housing or is at least partly revealed in encapsulating housing
Outside.
Optionally, the wiring substrate has the first end and second end opposite in its length direction,
A side of the wiring substrate from the first end to the second extreme direction be disposed with the first supply pin,
Second source foot, serial input foot, Serial output foot, relay control port foot, temperature sampling port foot, is adjusted power ground pin
Examination platelet port foot, EE programming port foot, MCU sweep write port foot and electronic expansion valve controls port foot；
It is defeated that another side of the wiring substrate from the first end to the second extreme direction is disposed with the first U phase
Foot, the first V phase output pin, the first W phase output pin, the 2nd U phase output pin, the 2nd V phase output pin, the 2nd W phase output pin, exchange
Electric input pin, alternating current output pin, PFC input pin, PFC output pin, busbar voltage anode foot and busbar voltage cathode foot.
Optionally, there is the first end and second end opposite in its length direction,
A side of the wiring substrate from the first end to the second extreme direction be disposed with the first supply pin,
Second source foot, power ground pin, serial input foot, Serial output foot, MCU sweep write port foot, busbar voltage anode foot and bus
Voltage cathode foot；
It is defeated that another side of the wiring substrate from the first end to the second extreme direction is disposed with the first U phase
Foot, the first V phase export out, the first W phase exports, the 2nd U phase output pin, the 2nd V phase exports, the 2nd W phase exports, alternating current input
Foot, alternating current output pin, PFC input pin and PFC output pin.
The utility model also proposes a kind of electrical equipment, including highly integrated intelligent power module as described above；Circuit cloth
One side surface of line substrate, the wiring substrate is provided with multiple installation positions；
Control module, rectifier bridge, PFC power switching modules and multiple power modules are set to the corresponding installation position
On；
Wherein, pass through respective installation position and the circuit between the control module and the PFC power switching modules
The wiring of circuit board is electrically connected；Pass through respective installation position between the control module and the multiple power module
It is electrically connected with the wiring of the wiring substrate.
Optionally, the electrical equipment is air conditioner or refrigerator.
The highly integrated intelligent power module of the utility model by by control module and rectifier bridge, PFC power switching modules and
Multiple power module integrated installations are connected without conducting wire on a side surface corresponding installation position on wiring substrate, can be with
Shorten the distance between control module and rectifier bridge, PFC power switching modules and multiple power modules, and reduce wire jumper it is too long and
Furthermore above each functional module is integrated on a wiring substrate, can be improved integrated by electromagnetic interference caused by excessive
The integrated level of intelligent power module realizes multiple loads, such as the integrated drive control of blower and compressor, to reduce electricity
The volume for controlling plate, facilitates installation.The component that electric-controlled plate can also be reduced simultaneously simplifies the pcb board layout of electric-controlled plate, effectively
The production cost for reducing air conditioner.The utility model solves device when electric-controlled plate is realized using multiple discrete components
More, the power consumption for occurring the problem of assembly difficulty and itself when electric-controlled plate being caused to be assembled to electrical equipment is larger, fever etc.
It is more serious, cause the thermal efficiency of air-conditioning low, is unfavorable for the problem of air conditioner realizes energy-saving and emission-reduction.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of highly integrated one embodiment of intelligent power module of the utility model；
Fig. 2 is the structural schematic diagram of the another embodiment of the highly integrated intelligent power module of the utility model；
Fig. 3 is the structural schematic diagram of the highly integrated intelligent power module another embodiment of the utility model；
Fig. 4 is the electrical block diagram of highly integrated one embodiment of intelligent power module of the utility model；
Fig. 5 is the structural schematic diagram of one embodiment of control module in Fig. 4；
Fig. 6 is the pin configuration schematic diagram of highly integrated one embodiment of intelligent power module of the utility model；
Fig. 7 is the pin configuration schematic diagram of an another embodiment of the highly integrated intelligent power module of the utility model.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | Wiring substrate | 11 | PFC driving chip |
| 130 | Pin | 12 | Power of fan driving chip |
| 10 | Control module | 13 | Compressor horsepower driving chip |
| 20 | Rectifier bridge | 60 | Heat sink |
| 30 | PFC power switching modules | 70 | Encapsulating housing |
| 40 | Multiple power modules | 80 | Metal lead wire |
| 50 | Insulating layer |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture)
Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.It in addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Based on personnel can be realized, this technical side will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection scope of the requires of the utility model.
The utility model proposes a kind of highly integrated intelligent power module.
In the electrical equipments such as air conditioner, washing machine, refrigerator, it is provided with motor mostly, and other are driven by motor
Loaded work piece.Such as air conditioner, traditional air conditioner generally comprise indoor unit and outdoor unit, are respectively provided in outdoor unit and indoor unit
Motor and the electric-controlled plate of driving motor work.Electric-controlled plate with outdoor unit is provided on the electric-controlled plate of outdoor unit mostly for being
The intelligent power module for driving compressor, drives the intelligent power module of blower, main control module, the functions mould such as power module
Block.These functional modules mostly use greatly circuit module discrete or that part is integrated to realize, and that disperses is arranged in automatically controlled PCB
The various pieces of plate, but since electric-controlled plate self structure, strong and weak electric isolution, anti-signal interference, heat dissipation etc. require, it is desirable that each function
Spacing between energy module guarantees in safe distance, so that the volume of outdoor unit electric-controlled plate is larger, is unfavorable for installing.Or it will
These are dispersed on muti-piece circuit board, then are realized between main control module and other function module by the way of wire jumper, with
And mutual electrical connection between each functional module, but to will lead to wire jumper more and long for each functional module of scattering device, causes
The decline of electric appliance EMC performance.And the device that the electric-controlled plate of both structures will appear electric-controlled plate is more, leads to the dress of outdoor unit
It with complexity, while also will increase the production cost of air conditioner, and maintenance rate also will increase, be unfavorable for stablizing for air conditioner and use.
Importantly, electric-controlled plate, when using multiple components to realize, the energy consumption of multiple components itself is larger, fever etc. also compared with
Seriously, cause the thermal efficiency of air-conditioning low, be unfavorable for air conditioner and realize energy-saving and emission-reduction.
To solve the above-mentioned problems, referring to figs. 1 to Fig. 5, in an embodiment of the utility model, the highly integrated intelligent power
Module 40 includes:
One side surface of wiring substrate 100, the wiring substrate 100 is provided with multiple installation positions；
Control module 10, rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40 are set to corresponding institute
It states on installation position；
Wherein, by respective installation position and described between the control module 10 and the PFC power switching modules 30
Wiring electrical connection inside wiring substrate 100；Between the control module 10 and the multiple power module 40
It is electrically connected by the wiring inside respective installation position and the wiring substrate 100.
It is the electrical block diagram of highly integrated 40 1 embodiment of intelligent power module referring to Fig. 4, Fig. 4；Wherein, described whole
The input terminal of stream bridge 20 is for accessing AC power source, the output end of the rectifier bridge 20 and the PFC power switching modules 30
Input terminal connection；The output end of the PFC power switching modules 30 is connect with the power input of multiple power modules 40；
The controlled end and multiple power modules 40 of multiple control terminals of the control module 10 and the PFC power switching modules 30
Controlled end connect one to one.Control module 10 drives the PFC power switching modules 30 to export the rectifier bridge 20
Output to provide stable operating voltage for control module 10, while will also to control module 10 after DC voltage is corrected
DC power supply after carrying out Active PFC is exported to each power module 40, and exports corresponding control letter in control module 10
Number, corresponding loaded work piece is driven to control multiple power modules 40.
In the present embodiment, wiring substrate 100 can use pcb board, lead frame, cardboard, half glass-fiber-plate, glass
Circuit substrate made by the materials such as plate is realized, for control module 10, rectifier bridge 20, PFC power switching modules 30 and multiple
The equal circuit modules of power module 40 provide installation base plate, are provided with wiring and installation position on wiring substrate 100, that is, weld
Disk.Wiring forms corresponding line according to the circuit design of highly integrated intelligent power module 40 on wiring substrate 100
Road and pad, copper foil paving can be used specifically to realize in wiring, and etches the copper foil according to preset circuit design, from
And form circuit-wiring layer.Pass through respective installation position and wiring between control module 10 and PFC power switching modules 30
Electrical connection；And electrically connected between control module 10 and multiple power modules 40 by respective installation position and wiring
It connects.The shape of wiring substrate 100 can be according to the control module 10 and rectifier bridge being arranged on wiring substrate 100
20, the specific location and size of PFC power switching modules 30 and multiple power modules 40 determine, can be rectangular, but be not limited to
It is rectangular.It is understood that control module 10 and PFC power switching modules 30 can be also electrically connected by metal lead wire 80, with
And it can also be electrically connected by metal lead wire 80 between control module 10 and multiple power modules 40.
In the present embodiment, rectifier bridge 20 can combine realization, four stamp-mounting-paper diode groups using four stamp-mounting-paper diodes
At rectifier bridge 20 alternating current of input is converted into direct current after export.
In the present embodiment, PFC power switching modules 30 can be realized only by PFC switch, or also with diode, inductance
Pfc circuit is formed Deng other components to realize the Active PFC to DC power supply.Pfc circuit can use passive PFC
Circuit is realized, to constitute boost PFC circuit perhaps voltage-dropping type pfc circuit or buck-boost type pfc circuit.It is understood that
, in practical applications, PFC power switching modules 30 can be set with 20 position of rectifier bridge and connection relationship according to pfc circuit
It sets type to be adaptively adjusted, herein with no restrictions.Control of the PFC power switching modules 30 based on control module 10, and will
Rectifier bridge 20 input direct current carry out power factor (PF) adjustment, direct current adjusted can by external switch power circuit,
The driving voltage of various numerical value is generated, such as generates the voltages such as 5V, 15V, is respectively used to MCU and each IPM driving IC power supply.
In the present embodiment, drive circuit unit and control circuit unit, driving circuit list can have in control module 10
It is also integrated in member and can continuously detect rectifier bridge 20, each element current, temperature in PFC power switching modules 30 and power module 40
The real-time detection circuit of the parameters such as degree and voltage, and heavy overload even direct short-circuit or temperature overheating, driving is occurring
When the failures such as electric voltage over press, the power device soft switching in power module 40 can be controlled, is simultaneously emitted by fault-signal to control
Circuit unit, so that control circuit unit controls the work of other circuit modules, to avoid damaging other circuit moulds because of failure
Block.In addition, bridge arm can also be integrated in control module 10 to pipe interlock circuit and driving power under-voltage protecting circuit, thus
Guarantee that power module 40 can be safely and steadily run.
In the present embodiment, multiple power switch tubes are integrated in each power module 40, multiple power switch tube compositions drive
Dynamic inverter circuit, such as three-phase inversion bridge circuit can be made of six power switch tubes, or by four power switch tube groups
At two-phase inverter bridge circuit.Wherein, each power switch tube can be realized using metal-oxide-semiconductor or IGBT.
The utility model is by by control module 10 and rectifier bridge 20, PFC power switching modules 30 and multiple power modules
40 integrated installations connect without conducting wire in corresponding installation position on 100 1 side surface of wiring substrate, can shorten control mould
The distance between block 10 and rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40, and reduce that wire jumper is too long and mistake
Furthermore above each functional module is integrated on a wiring substrate 100, can be improved integrated by electromagnetic interference caused by more
The integrated level of intelligent power module 40 realizes multiple loads, such as the integrated drive control of blower and compressor, to reduce
The volume of electric-controlled plate facilitates installation.The component that electric-controlled plate can also be reduced simultaneously simplifies the pcb board layout of electric-controlled plate, has
The production cost for reducing air conditioner of effect.The utility model solves device when electric-controlled plate is realized using multiple discrete components
Part is more, and the power consumption for occurring the problem of assembly difficulty and itself when electric-controlled plate being caused to be assembled to electrical equipment is larger, fever etc.
Also more serious, cause the thermal efficiency of air-conditioning low, is unfavorable for the problem of air conditioner realizes energy-saving and emission-reduction.
Referring to figs. 1 to Fig. 5, in an alternative embodiment, the highly integrated intelligent power module 40 further includes heat sink 60,
The heat sink 60 is set to the wiring substrate 100 equipped with the control module 10, rectifier bridge 20, power
The side of switch module and multiple power modules 40, the heat sink 60 and the control module 10, rectifier bridge 20, power switch
Module and multiple power modules 40 recline setting or gap setting；
Alternatively, the heat sink 60 is set to the wiring substrate 100 back to the control module 10, rectifier bridge
20, the side of power switching modules and multiple power modules 40.
In the present embodiment, heat sink 60 can perhaps the materials such as ceramics be made or using upper using copper, aluminum substrate
It states material and the heat sink 60 to be formed is made by mixing.Heat sink 60 is close to rectifier bridge 20, PFC power switching modules 30 and multiple power
The side of module 40 is arranged or the side far from rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40 is arranged,
Heat to accelerate rectifier bridge 20, PFC power switching modules 30 and the generation of multiple power modules 40 increases high collection to air transmitted
At intelligent power heat-sinking capability.
Referring to figs. 1 to Fig. 5, in an alternative embodiment, the multiple power module 40 includes at least blower driving power
Module 40 and driven compressor power module 40.
In the present embodiment, the blower driving power module 41 integrated in highly integrated intelligent power module 40 is for driving wind wheel
Motor, driven compressor power module 42 is for driving compressor electric motor, and certainly in other embodiments, power module 40 may be used also
With for driving the frequency converter and various inverters of other motors, and it is applied to frequency control, metallurgical machinery, electric propulsion,
In the fields such as the frequency-conversion domestic electric appliances such as servo-drive and air-conditioning.In blower driving power module 41 and driven compressor power module 42
It is integrated with multiple IGBT, metal-oxide-semiconductor constant power switching tube respectively, the quantity of multiple power switch tubes can be four or six,
Particular number can be arranged according to motor type, driving power etc., herein with no restrictions.
Referring to Fig. 5, in an alternative embodiment, control module 10 includes MCU, PFC driving chip 11, power of fan driving
The signal of chip 12 and compressor horsepower driving chip 13, the first control terminal of the MCU and the PFC driving chip 11 inputs
End connection；Multiple second control terminals of the MCU and multiple signal input parts one of the power of fan driving chip 12 are a pair of
It should connect；Multiple signal input parts of multiple third control terminals of the MCU and the compressor horsepower driving chip 13 are one by one
It is correspondingly connected with；Multiple output ends of the power of fan driving chip 12 are multiple controlled with the blower driving power module 40
End connects one to one；Multiple output ends of the compressor horsepower driving chip 13 and the driven compressor power module 40
Multiple controlled ends connect one to one.
It is integrated with sequence controller, memory, data processor in the present embodiment, in MCU, and is stored in the storage
On device and the software program and/or module that can run on the data processor, MCU is by operation or executes and is stored in storage
Software program and/or module in device, and the data being stored in memory are called, export corresponding timing control signal extremely
PFC driving chip 11, power of fan driving chip 12 and compressor horsepower driving chip 13, so set, PFC is made to drive core
The timing control signal received is converted into corresponding driving signal by piece 11, to drive the function in PFC power switching modules 30
The work of rate switching tube.The timing control signal received is then converted into corresponding driving signal by power of fan driving chip 12,
To drive corresponding power switch tube ON/OFF in power of fan driving chip 12, so that blower be driven to work.And pressure
The timing control signal received is converted into corresponding driving signal by contracting machine power drive chip 13, to drive each power module
Corresponding power switch tube ON/OFF in 40, to drive compressor operating.
Referring to figs. 1 to Fig. 5, in an alternative embodiment, the highly integrated intelligent power module 40 further includes insulating layer 50,
The insulating layer 50 is attached at the heat sink 60 close to the side of the wiring substrate 100.
In the present embodiment, which can be using insulating materials systems such as insulating cement, silicon nitride, organic insulation membrane materials
, such as when using insulating cement to realize, insulating cement can be covered on to rectifier bridge 20, PFC power switching modules 30 and more
On the element of a power module 40 etc., to reflect external electromagnetic interference, to avoid external electromagnetic radiation interference rectification
Bridge 20, PFC power switching modules 30 and multiple power modules 40 work normally, and the electromagnetic radiation reduced in ambient enviroment collects height
At the interference effect of the electronic component in intelligent power module 40.Or realize rectifier bridge 20, PFC power switching modules 30 and more
The electric isolution of non-electrical coupling part between a power module 40.Wherein, heat sink 60 and insulating layer 50 can use it is ceramic with
And metal integrally pressing setting, by the high-insulativity and high-termal conductivity of ceramics to accelerate dissipating for highly integrated intelligent power module 40
Thermal energy power.In the present embodiment, heat sink 60 can pass through insulating layer 50 and control module 10, rectifier bridge 20, PFC power switch mould
Block 30 and the fitting setting of multiple power modules 40, to improve the radiating efficiency of each electronic component.
Referring to figs. 1 to Fig. 5, in an alternative embodiment, the highly integrated intelligent power module 40 further includes to the electricity
Road circuit board 100, heat sink 60, control module 10, rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40
The encapsulating housing 70 being packaged.
In the present embodiment, encapsulating housing 70 can be the resin scaffold of epoxy resin mould produced compounds, and encapsulating housing 70 can
To be formed by any one of thermosetting material, thermoplastic material.
Specifically, encapsulating housing 70 can cover on heat sink 60, and by wiring substrate 100, insulating layer 50, control
Molding block 10, rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40 are packaged in encapsulating housing 70, in this way,
One surface of heat sink 60 is all or part of exposed outside encapsulating housing 70, to accelerate the heat dissipation of each element.Or encapsulation
Shell 70 is wrapped in wiring substrate 100, heat sink 60, insulating layer 50, control module 10, rectifier bridge 20, PFC power switch
The periphery of module 30 and multiple power modules 40, so that encapsulating housing 70 and wiring substrate 100, control module 10, rectification
Bridge 20, PFC power switching modules 30 and multiple power modules 40 are integrally formed setting.In encapsulating housing 70 and wiring substrate
100, heat sink 60, insulating layer 50, control module 10, rectifier bridge 20, PFC power switching modules 30 and multiple power modules 40 1
When body formed setting, setting can be integrally formed by plastic packaging or dosing technology.
Referring to figs. 1 to Fig. 5, in an alternative embodiment, the heat sink 60 be in 70 inside of the encapsulating housing or
It is at least partly revealed in outside encapsulating housing 70,
And/or
The wiring substrate 100 is in 70 inside of encapsulating housing or is at least partly revealed in encapsulating housing 70
Outside.
It is understood that above-mentioned alternative embodiment, heat sink 60 be may be inside encapsulating housing 70, or at least portion
Divide and is revealed in outside encapsulating housing 70.When heat sink 60 is in 70 inside of encapsulating housing, rectifier bridge 20, PFC power switching modules
30, the heat that multiple power modules 40 generate is conducted by insulating layer 50 to heat sink 60, then is extremely sealed through the conduction of heat sink 60
It after filling shell 70, is conducted heat in air by encapsulating housing 70, accelerates rectifier bridge 20, PFC power switching modules 30, more
The rate of heat dispation of a power module 40.Or heat sink 60 side it is some or all of be revealed in outside encapsulating housing 70, so
Setting, so that the heat that rectifier bridge 20, PFC power switching modules 30, multiple power modules 40 generate is conducted by insulating layer 50
It directly radiates to air to heat sink 60, then through heat sink 60, further increases the contact area of heat and air, improve and dissipate
Hot rate.
In the present embodiment, the wiring substrate 100 is set to equipped with the control module 10, rectification in heat sink 60
When the side of bridge 20, power switching modules and multiple power modules 40, the side of the not set circuit element of wiring substrate 100
It some or all of can equally be revealed in outside encapsulating housing 70, so set, making rectifier bridge 20, PFC power switching modules
30, the heat that multiple power modules 40 generate can directly be radiated to air by wiring substrate 100, further increase heat
The contact area of amount and air improves rate of heat dispation.
It is understood that some or all of being revealed in encapsulating housing 70 the side of wiring substrate 100 is same
When outer, insulating layer 50 is provided between the wiring and substrate on wiring substrate 100.
Referring to Fig. 6 or Fig. 7, in an alternative embodiment, the wiring substrate 100 has opposite in its length direction
First end A and second end B,
Referring to Fig. 6, a side of the wiring substrate 100 is set gradually in direction from the first end A to second end B
There are the first supply pin VCC1, second source foot VCC2, power ground pin COM, serial input foot RXD, Serial output foot TXD, relay
Device control port foot (FAN-HCON, FAN-LCON, WAY-CON, POWERCON and HEATCON), temperature sampling port foot (TH1
~TH2), debugging platelet port foot (T-CLK, T-DATA), EE programming port foot (WC, SCL, SDA), MCU sweep write port foot
(ELME, MD0, MD1, RES, TRST, TMS, TDI, TDO and TCK) and electronic expansion valve controls port foot (PMV1~PMV4)；
Another side of the wiring substrate 100 is disposed with first in direction from the first end A to second end B
U phase output pin U1, the first V phase output pin V1, the first W phase output pin W1, the 2nd U phase output pin U2, the 2nd V phase output pin V2,
2nd W phase output pin W3, alternating current input pin AC-L, alternating current output pin AC-N, PFC input pin PFC+, PFC output pin
PFC-, busbar voltage anode foot P and busbar voltage cathode foot N.
Referring to Fig. 7, alternatively, a side of the wiring substrate 100 from the first end A to the direction second end B according to
It is secondary to be provided with the first supply pin VCC1, second source foot VCC2, power ground pin COM, serial input foot RXD, Serial output foot
TXD, MCU sweep write port foot (ELME, MD0, MD1, RES, TRST, TMS, TDI, TDO and TCK), busbar voltage anode foot P and mother
Line voltage cathode foot N；
Another side of the wiring substrate 100 is disposed with first in direction from the first end A to second end B
U phase output pin U1, the first V phase output pin V1, the first W phase output pin W1, the 2nd U phase output pin U2, the 2nd V phase output pin V2,
2nd W phase output pin W2, alternating current input AC-L foot, alternating current output pin AC-N, PFC input pin PFC+ and PFC output pin
PFC-。
In the present embodiment, VCC1 is that the power positive end VCC1, VCC1 of intelligent power module 40 are generally 15V, for connecing function
The on high-tension side power supply of rate module 40, VCC2 are generally 5V, and for connecing the power supply of 40 low-pressure side of power module, power ground COM is electricity
Source publicly, serial input foot RXD and Serial output foot TXD for realizing MCU and external equipment communication connection.Relay control
The quantity of port processed is provided with multiple, and respectively FAN-HCON, FAN-LCON, WAY-CON, POWERCON and HEATCON.Temperature
The quantity for spending sample port includes TH1, TH2, TH3.Platelet port foot is debugged for accessing test platelet, and there is T-CLK, T-
Two feet of DATA.Burning of the EE programming port foot for program software in MCU, and there are tri- pins of WC, SCL, SDA.MCU is swept
Write port foot has the pins such as ELME, MD0, MD1, RES, TRST, TMS, TDI, TDO and TCK.Electronic expansion valve controls port foot
It is provided with multiple, and respectively PMV1, PMV2, PMV3, PMV4.First U phase output pin U1, the first V phase output pin V1, the first W
Phase output pin W1 is respectively used to connect the three-phase windings of DC fan.2nd U phase output pin U2, the 2nd V phase output pin V2, the 2nd W
Phase output pin W2 is used to access the three-phase windings of compressor.Alternating current input pin AC-L, alternating current output pin AC-N are respectively used to
Access alternating current.PFC input pin PFC+, PFC output pin PFC- is for accessing PFC inductance, so that PFC power switch and two poles
Pipe, PFC inductance etc. form pfc circuit.It is defeated that busbar voltage anode foot P and busbar voltage cathode foot N is respectively used to access pfc circuit
Direct current out.
It is understood that in above-described embodiment, due to control module 10, rectifier bridge 20, power switching modules and multiple
Each electronic component in power module 40 can be using the element after encapsulation to realize, and carries out secondary envelope with encapsulating housing 70
Dress.Or realized using bare chip, to reduce the packaging technology in highly integrated 40 manufacturing process of intelligent power module.This is practical
It is novel that each port pinout is combed again, original all multiport specifications are simplified, it is possible to reduce port pinout number is convenient for
With the connection of external circuit, the pcb board for simplifying highly integrated intelligent object in installation to electric-controlled plate is laid out, and the utility model is high
The pin of Integrated Smart Power module 40 is less, it is possible to reduce and detail port is internalized by by external welding foot number and difficulty,
Make the relatively sharp simplicity in each port.
It is understood that above-mentioned pin 130 is set on the corresponding installation position of wiring substrate 100, and pass through electricity
Road wiring is electrically connected with control module 10, rectifier bridge 20, PFC power switching modules 30, multiple power modules 40 respectively.
In the present embodiment, pin 130 can be wing using gull or direct plugging-in, multiple pins 130 are welded on wiring
Substrate 100 be provided with control module 10, rectifier bridge 20, PFC power switching modules 30, multiple power modules 40 a plate on,
Or another plate opposite with control module 10, rectifier bridge 20, PFC power switching modules 30, multiple power modules 40 is set
Face, and the pad locations being welded on corresponding installation position, and pass through wiring and control module 10, rectifier bridge 20, PFC function
The realizations such as rate switch module 30 and multiple power modules 40 electrical connection.
The utility model also proposes that a kind of electrical equipment, the electrical equipment include highly integrated intelligent power as described above
Module.The detailed construction of the highly integrated intelligent power module can refer to above-described embodiment, and details are not described herein again；It is understood that
It is, due to having used above-mentioned highly integrated intelligent power module in the utility model air conditioner, the utility model air conditioner
Embodiment include above-mentioned highly integrated intelligent power module whole embodiments whole technical solutions, and technical effect achieved
Also identical, details are not described herein.
In the present embodiment, which can be the refrigeration equipments such as air conditioner, refrigerator.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of highly integrated intelligent power module, which is characterized in that the highly integrated intelligent power module includes:
One side surface of wiring substrate, the wiring substrate is provided with multiple installation positions；
Control module, rectifier bridge, PFC power switching modules and multiple power modules are set on the corresponding installation position；
Wherein, pass through respective installation position and the wiring between the control module and the PFC power switching modules
The wiring of substrate is electrically connected；Pass through respective installation position and institute between the control module and the multiple power module
State the wiring electrical connection of wiring substrate.
2. highly integrated intelligent power module as described in claim 1, which is characterized in that the highly integrated intelligent power module is also
Including heat sink,
The heat sink is set to the wiring substrate equipped with the control module, rectifier bridge, power switching modules and more
The side of a power module, the heat sink and the control module, rectifier bridge, power switching modules and multiple power modules paste
By setting or gap setting；
Alternatively, the heat sink is set to the wiring substrate back to the control module, rectifier bridge, power switching modules
And the side of multiple power modules.
3. highly integrated intelligent power module as described in claim 1, which is characterized in that the multiple power module includes at least
Blower driving power module and driven compressor power module.
4. highly integrated intelligent power module as claimed in claim 2, which is characterized in that the highly integrated intelligent power module is also
Including insulating layer, the insulating layer is attached at the heat sink close to the side of the wiring substrate.
5. highly integrated intelligent power module as described in claim 1, which is characterized in that the highly integrated intelligent power module is also
Including to the wiring substrate, heat sink, control module, rectifier bridge, PFC power switching modules and multiple power modules into
The encapsulating housing of row encapsulation.
6. highly integrated intelligent power module as claimed in claim 5, which is characterized in that
The heat sink is in inside the encapsulating housing or is at least partly revealed in outside encapsulating housing,
And/or
The wiring substrate is in inside the encapsulating housing or is at least partly revealed in outside encapsulating housing.
7. the highly integrated intelligent power module as described in claim 1 to 6 any one, which is characterized in that the wiring
Substrate has the first end and second end opposite in its length direction,
A side of the wiring substrate is disposed with the first supply pin, second from the first end to the second extreme direction
Supply pin, power ground pin, serial input foot, Serial output foot, relay control port foot, temperature sampling port foot, debugging are small
Plate port foot, EE programming port foot, MCU sweep write port foot and electronic expansion valve controls port foot；
Another side of the wiring substrate from the first end to the second extreme direction be disposed with the defeated foot of the first U phase,
First V phase output pin, the first W phase output pin, the 2nd U phase output pin, the 2nd V phase output pin, the 2nd W phase output pin, alternating current
Input pin, alternating current output pin, PFC input pin, PFC output pin, busbar voltage anode foot and busbar voltage cathode foot.
8. the highly integrated intelligent power module as described in claim 1 to 6 any one, which is characterized in that have in its length
The opposite first end and second end in direction,
A side of the wiring substrate is disposed with the first supply pin, second from the first end to the second extreme direction
Supply pin, power ground pin, serial input foot, Serial output foot, MCU sweep write port foot, busbar voltage anode foot and busbar voltage
Cathode foot；
Another side of the wiring substrate is disposed with the first U phase from the first end to the second extreme direction and exports
Foot, the first V phase export, the first W phase exports, the 2nd U phase output pin, the 2nd V phase exports, the 2nd W phase exports, alternating current input
Foot, alternating current output pin, PFC input pin and PFC output pin.
9. a kind of electrical equipment, which is characterized in that including the highly integrated intelligent power as described in claim 1 to 8 any one
Module.
10. electrical equipment as claimed in claim 9, which is characterized in that the electrical equipment is air conditioner or refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918320.9U CN208241588U (en) | 2018-06-13 | 2018-06-13 | Highly integrated intelligent power module and electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918320.9U CN208241588U (en) | 2018-06-13 | 2018-06-13 | Highly integrated intelligent power module and electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208241588U true CN208241588U (en) | 2018-12-14 |
Family
ID=64576741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820918320.9U Expired - Fee Related CN208241588U (en) | 2018-06-13 | 2018-06-13 | Highly integrated intelligent power module and electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208241588U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110391757A (en) * | 2019-07-04 | 2019-10-29 | 珠海格力新元电子有限公司 | Intelligent power module, circuit board and electrical equipment |
| CN110601549A (en) * | 2018-06-13 | 2019-12-20 | 重庆美的制冷设备有限公司 | High-integration intelligent power module and electrical equipment |
| US20210320585A1 (en) * | 2018-12-29 | 2021-10-14 | Gd Midea Air-Conditioning Equipment Co., Ltd. | Highly integrated power module and electrical appliance |
-
2018
- 2018-06-13 CN CN201820918320.9U patent/CN208241588U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110601549A (en) * | 2018-06-13 | 2019-12-20 | 重庆美的制冷设备有限公司 | High-integration intelligent power module and electrical equipment |
| US20210320585A1 (en) * | 2018-12-29 | 2021-10-14 | Gd Midea Air-Conditioning Equipment Co., Ltd. | Highly integrated power module and electrical appliance |
| CN110391757A (en) * | 2019-07-04 | 2019-10-29 | 珠海格力新元电子有限公司 | Intelligent power module, circuit board and electrical equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208257678U (en) | Highly integrated intelligent power module and electrical equipment | |
| CN208240659U (en) | Highly integrated intelligent power module and air conditioner | |
| CN208241588U (en) | Highly integrated intelligent power module and electrical equipment | |
| CN209545420U (en) | Intelligent power module and air conditioner | |
| CN208596670U (en) | Highly integrated intelligent power module and air conditioner | |
| CN202135044U (en) | Composite power module of intelligent frequency conversion | |
| CN208257677U (en) | Highly integrated intelligent power module and electrical equipment | |
| CN109980955A (en) | Intelligent power module and air conditioner | |
| CN208253884U (en) | Electrically-controlled component, outdoor unit and air conditioner | |
| CN208240660U (en) | Highly integrated intelligent power module and air conditioner | |
| CN107231032A (en) | A kind of DC charging module of concentration radiating high-power | |
| CN110112111A (en) | Intelligent power module, electric-controlled plate and air conditioner | |
| CN109300883A (en) | Highly integrated electric-controlled plate and electric appliance | |
| JP2022519175A (en) | Electrically controlled assembly and air conditioner | |
| CN110060991B (en) | Intelligent power module and air conditioner | |
| CN208240652U (en) | Power module and air conditioner | |
| CN209545454U (en) | Intelligent power module and air conditioner | |
| CN208241587U (en) | Highly integrated intelligent power module and electrical equipment | |
| CN208596669U (en) | Highly integrated intelligent power module and air conditioner | |
| CN108054148A (en) | Intelligent power module and its manufacturing method, air conditioner | |
| CN110085579B (en) | High-integration intelligent power module, manufacturing method thereof and air conditioner | |
| CN208238065U (en) | Outdoor unit and air conditioner | |
| CN208387212U (en) | Highly integrated intelligent power module and air conditioner | |
| CN110601552A (en) | High-integration intelligent power module and electrical equipment | |
| CN110601549A (en) | High-integration intelligent power module and electrical equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |