CN208241076U - A kind of heat radiating type opto chip - Google Patents

Abstract

The utility model discloses a kind of heat radiating type opto chips, including the plate that radiates, the heat dissipation sheet material base is fixedly connected with heat dissipation plate support base, and through-hole groove body is inlaid with inside heat dissipation plate, connector sleeve is provided on the outside of the heat dissipation plate support base, and heat dissipation plate support base bottom is equipped with connection convex block, described connection convex block or so end is provided with heat absorption patch, and connection convex block bottom is provided with chip carrier, thermally conductive link block is installed among the heat absorption patch, the chip carrier surface inserting has connecting groove, and chip carrier is internally provided with electronic chip.The heat radiating type opto chip is provided with the heat dissipation plate of combination, and heat dissipation plate is connected to by thermally conductive link block with heat absorption patch, can be carried out heat absorption by heat absorption patch in this way, is then introduced into heat dissipation plate, rapid cooling, good heat dissipation effect are carried out by its air flow structure.

Description

A kind of heat radiating type opto chip

Technical field

The utility model relates to electronic chip devices technical field, specially a kind of heat radiating type opto chip.

Background technique

With the continuous development of micro-nano optoelectronic integrated technology, the integrated level of chip is higher and higher, and the size of device constantly contracts It is small, and the operating rate of device is then continuously improved, and in terms of optical active component, is based on III-V race's material (such as InP, GaAs etc.) Laser and integrated Electroabsorption Modulated Laser develop to mass production from chip research, packaging has been made It is mature light source applications in photoelectric fields such as optic communication, light medical treatment, rate can be from several hundred megabits per second to tens gigabits It is per second, and with the diminution of its size, the difficulty of heat dissipation also increases accordingly.

But existing heat dissipation multi-pass is excessively air-cooled or water cooling radiates, and can not directly be bonded at that time to chip Heat dissipation, effect are general.

Summary of the invention

The purpose of this utility model is to provide a kind of heat radiating type opto chips, to solve to propose in above-mentioned background technique But existing heat dissipation multi-pass is excessively air-cooled or water cooling radiates, and directly can not carry out fitting heat dissipation, effect to chip at that time General problem.

To achieve the above object, the utility model provides the following technical solutions: a kind of heat radiating type opto chip, including dissipates Hot sheet, the heat dissipation sheet material base are fixedly connected with heat dissipation plate support base, and are inlaid with through-hole groove body inside the plate that radiates, Connector sleeve is provided on the outside of the heat dissipation plate support base, and plate support base bottom of radiating is equipped with connection convex block, the company It connects convex block or so end and is provided with heat absorption patch, and connect convex block bottom and be provided with chip carrier, installation among the heat absorption patch There is thermally conductive link block, the chip carrier surface inserting has connecting groove, and chip carrier is internally provided with electronic chip.

Preferably, the quantity of the heat dissipation plate has and at least ten, and the plate that radiates is in heat dissipation plate support base table Face is installed in homogeneous texture, and the plate that radiates is wavy shaped configuration.

Preferably, the heat dissipation plate support base is made up of to fasten and live in connecting groove connection convex block with chip carrier Dynamic connection structure.

Preferably, the through-hole groove body is cylindrical structure, and through-hole groove body is in equidistant parallel knot inside heat dissipation plate Structure distribution.

Preferably, the position of the heat absorption patch matches with the position of heat dissipation plate, and the patch that absorbs heat passes through thermally conductive company It connects block and heat dissipation plate constitutes connectivity structure, and the seamless connectivity between patch and chip carrier that absorbs heat.

Compared with prior art, the utility model has the beneficial effects that the heat radiating type opto chip is provided with combination Radiate plate, and the plate that radiates is connected to by thermally conductive link block with heat absorption patch, can carry out heat by heat absorption patch in this way It absorbs, is then introduced into heat dissipation plate, rapid cooling, good heat dissipation effect are carried out by its air flow structure.The heat dissipation of the device The quantity of plate has and at least ten, and the plate that radiates in heat dissipation plate support base surface in homogeneous texture installation, and dissipate Hot sheet is wavy shaped configuration, so that heat dissipation plate forms heat dissipation wind channel, and heat, and wave can be quickly taken away by air-flow Unrestrained structure makes contact area bigger, and heat dissipation effect is more preferable, and the heat dissipation plate support base of the device is being connected by connecting convex block It is constituted in groove with chip carrier and fastens movable connection structure, so that heat dissipation plate support base can be dismantled and be pacified Entirely, dust is facilitated to clear up, easy to use, the through-hole groove body of the device is cylindrical structure, and through-hole groove body is in heat dissipation plate Portion is in equidistant parallel structure distribution, so that and the area of device air flowing is more, and the area that can be radiated is more, Heat dissipation effect is more preferable, and the position of the heat absorption patch of the device matches with the position of heat dissipation plate, and the patch that absorbs heat pass through it is thermally conductive Link block and heat dissipation plate constitute connectivity structure, and the seamless connectivity between patch and chip carrier that absorbs heat, so that should The heat-conducting effect of device is more preferable, so that heat dissipation is more rapidly, effect is more preferable.

Detailed description of the invention

Fig. 1 is the utility model schematic view of the front view；

Fig. 2 is the utility model schematic diagram of internal structure；

Fig. 3 is the utility model dress heat dissipation plate support base present invention looks up structural representation；

Fig. 4 is enlarged structure schematic diagram at A in the utility model Fig. 2.

In figure: 1, radiate plate, 2, heat dissipation plate support base, 3, chip carrier, 4, through-hole groove body, 5, electronic chip, 6, Connector sleeve, 7, heat absorption patch, 8, thermally conductive link block, 9, connection convex block, 10, connecting groove.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of heat radiating type opto chip, including heat dissipation Plate 1, heat dissipation plate support base 2, chip carrier 3, through-hole groove body 4, electronic chip 5, connector sleeve 6, heat absorption patch 7, thermally conductive company Block 8, connection convex block 9 and connecting groove 10 are connect, heat dissipation 1 bottom of plate is fixedly connected with heat dissipation plate support base 2, and the plate that radiates It is inlaid with through-hole groove body 4 inside 1, the quantity of heat dissipation plate 1 has and at least ten, and the plate 1 that radiates is in heat dissipation plate support 2 surfaces of seat are installed in homogeneous texture, and the plate 1 that radiates is wavy shaped configuration, and heat dissipation plate support base 2 passes through connection convex block 9 It is constituted in connecting groove 10 with chip carrier 3 and fastens movable connection structure, through-hole groove body 4 is cylindrical structure, and through-hole groove Body 4 is in equidistant parallel structure distribution inside heat dissipation plate 1, so that heat dissipation plate 1 forms heat dissipation wind channel, can pass through gas Stream quickly takes away heat, and wave structure makes contact area bigger, and heat dissipation effect is more preferable, in this way but also heat dissipation plate support Seat 2 can carry out disassembly and dust safe and convenient cleaning, it is easy to use, in this way but also the device air flow area more More, the area that can be radiated is more, and heat dissipation effect is more preferable, connector sleeve 6 is provided on the outside of the plate support base 2 that radiates, and dissipate 2 bottom of hot sheet support base is equipped with connection convex block 9, and connection convex block 9 or so end is provided with heat absorption patch 7, and connects 9 bottom of convex block Portion is provided with chip carrier 3, and the position for the patch 7 that absorbs heat matches with the position of heat dissipation plate 1, and the patch 7 that absorbs heat pass through it is thermally conductive Link block 8 and heat dissipation plate 1 constitute connectivity structure, and the seamless connectivity between patch 7 and chip carrier 3 that absorbs heat, and make in this way The heat-conducting effect for obtaining the device is more preferable, so that heat dissipation is more rapidly, effect is more preferable, is equipped with thermally conductive company among the patch 7 that absorbs heat Block 8 is connect, 3 surface inserting of chip carrier has connecting groove 10, and chip carrier 3 is internally provided with electronic chip 5.

Working principle: when using the heat radiating type opto chip, the device is checked first, confirms errorless rear It can be used, then take out the device, be then linked in the heat dissipation plate support base 2 of the device outside chip by connector sleeve 6 3 surface of shell, and it is fastened and connected by connecting the cooperation of convex block 9 and connecting groove 10, then make heat sink The heat absorption patch 7 of 2 bottom of material support base is fitted closely with 3 surface of chip carrier, then in a device by chip installation, when setting When standby starting, so that the chip is run, so that it be made to generate heat, then heat can be absorbed by the patch 7 that absorbs heat, and be led to Thermally conductive link block 8 is crossed to import in heat dissipation plate 1, and air-flow can form air duct between heat dissipation plate 1, so that heat is taken away, And it is equipped with through-hole groove body 4 among heat dissipation plate 1, keep its receptor area more, faster, here it is the heat radiating type photoelectron cores for heat dissipation The use process of piece.

Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all It is included within the scope of protection of this utility model.

Claims (5)

1. a kind of heat radiating type opto chip, including heat dissipation plate (1), it is characterised in that: heat dissipation plate (1) bottom is fixed It is connected with heat dissipation plate support base (2), and is inlaid with through-hole groove body (4) inside heat dissipation plate (1), the heat dissipation plate support base (2) outside is provided with connector sleeve (6), and plate support base (2) bottom of radiating is equipped with connection convex block (9), the connection convex block (9) left and right end is provided with heat absorption patch (7), and connects convex block (9) bottom and be provided with chip carrier (3), the heat absorption patch (7) Centre is equipped with thermally conductive link block (8), and chip carrier (3) surface inserting has connecting groove (10), and in chip carrier (3) Portion is provided with electronic chip (5).

2. a kind of heat radiating type opto chip according to claim 1, it is characterised in that: the number of heat dissipation plate (1) Amount has and at least ten, and radiate plate (1) in heat dissipation plate support base (2) surface in homogeneous texture installation, and radiate Plate (1) is wavy shaped configuration.

3. a kind of heat radiating type opto chip according to claim 1, it is characterised in that: the heat dissipation plate support base (2) it is made up of in connecting groove (10) with chip carrier (3) connection convex block (9) and fastens movable connection structure.

4. a kind of heat radiating type opto chip according to claim 1, it is characterised in that: the through-hole groove body (4) is circle Column construction, and through-hole groove body (4) is in equidistant parallel structure distribution inside heat dissipation plate (1).

5. a kind of heat radiating type opto chip according to claim 1, it is characterised in that: the position of heat absorption patch (7) It sets and matches with the position of heat dissipation plate (1), and heat absorption patch (7) constitutes company by thermally conductive link block (8) and heat dissipation plate (1) Logical structure, and seamless connectivity between the patch that absorbs heat (7) and chip carrier (3).