CN208210421U - circuit board structure - Google Patents
circuit board structure Download PDFInfo
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- CN208210421U CN208210421U CN201820610117.5U CN201820610117U CN208210421U CN 208210421 U CN208210421 U CN 208210421U CN 201820610117 U CN201820610117 U CN 201820610117U CN 208210421 U CN208210421 U CN 208210421U
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- Prior art keywords
- circuit board
- protective layer
- flexible circuit
- board structure
- layer
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a kind of circuit board structure, including flexible circuit board；The bonding area of the flexible circuit board is arranged in protective layer, the protective layer, and the protective layer is formed at least one hollowed out area；And shielded layer, the shielded layer are arranged in the hollowed out area.By the way that there is the shielded layer with protective layer condition of equivalent thickness in the setting of the bonding area of the flexible circuit board, the signal transmission of electromagnetic signal interference flexible circuit board is avoided；Moreover, the surface in the entire bonding area of the flexible circuit board is flat, it is ensured that the explosion particle of ACF is uniform when pressure head is subdued.
Description
Technical field
The utility model relates to a kind of circuit board structures, hardened more particularly, to a kind of route with function of shielding
Structure.
Background technique
In existing electronic equipment, generally included display screen and driving chip etc., wherein display screen and driving chip it
Between need by connection line plate realize signal transmission.And due to FPC (FlexiblePrinted Circuit, flexible circuitry
Plate) have many advantages, such as that light-weight, thickness is thin, Distribution density is high, reelability is strong, it is the best connection line in existing electronic equipment
Road plate.
Such as in mobile phone comprising have display screen and driving chip, wherein display screen and driving chip pass through connecting line
Road plate is connected, which is usually flexible circuit board.But existing flexible circuit board wraps up the insulating film of its route
The function of unshielded outer signals, therefore the electromagnetism etc. that existing flexible circuit board is issued vulnerable to other signalling arrangements in mobile phone is believed
Number interference, prevent flexible circuit board influences properties of product from normal transmission signal.
Utility model content
For above-mentioned drawback existing in the prior art, the purpose of the utility model is to provide a kind of circuit board structures, should
The bonding area of circuit board structure has the shielded layer with protective layer condition of equivalent thickness, avoids electromagnetic signal interference flexible circuit board
Signal transmission.
It the purpose of this utility model and solves its technical problem and adopts the following technical solutions to realize.
According to the utility model proposes a kind of circuit board structure, including flexible circuit board；Protective layer, the protective layer are set
It sets in the bonding area of the flexible circuit board, the protective layer is formed at least one hollowed out area；And shielded layer, institute
Shielded layer is stated to be arranged in the hollowed out area.
It the purpose of this utility model and solves its technical problem also following technical measures can be used to further realize.
In an embodiment of the utility model, the shielded layer is copper shield.
It further include signal wire in an embodiment of the utility model, the signal wire is connect with the copper shield, institute
State the outer surface setting copper protective layer of signal wire.
In an embodiment of the utility model, the guarantor is run through along the thickness direction of the protective layer in the hollowed out area
Sheath.
In an embodiment of the utility model, the protective layer is polyimide covercoat.
In an embodiment of the utility model, the flexible circuit board is single-layer flexible wiring board or layer flexible route
Plate.
Correspondingly, the utility model additionally provides a kind of electronic equipment, comprising: display panel；Driving chip；And route
Hardened structure, the first end of the circuit board structure are connect with the display panel, the second end of the circuit board structure with it is described
Driving chip connection, the circuit board structure are above-mentioned circuit board structure.
In an embodiment of the utility model, the protective layer and the shielded layer are arranged in the first end.
In an embodiment of the utility model, the flexible circuit board is set to described by bending the first end
The back side of display panel.
In an embodiment of the utility model, the flexible circuit board is electrically connected by connector and the driving chip
It connects.
The circuit board structure of the utility model embodiment has the advantage that by being arranged in the bonding area of flexible circuit board
With the shielded layer with protective layer condition of equivalent thickness, the bonding area that flexible circuit board can be effectively protected is not believed by external electromagnetic etc.
Number interference so that flexible circuit board normal transmission signal；In addition, the surface in the entire bonding area of flexible circuit board is flat,
It can guarantee that the explosion particle of ACF when pressure head is subdued is uniform；It, can be with moreover, mipi signal wire is connect with copper shield
Realize that the impedance of whole signal path is continuous.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of circuit board structure provided by the embodiment of the utility model.
Fig. 2 is shielded layer provided by the embodiment of the utility model and signal wire structural schematic diagram interconnected.
Fig. 3 is the structural schematic diagram of a kind of electronic equipment provided by the embodiment of the utility model.
Specific embodiment
Further to illustrate that the utility model is the technical means and efficacy reaching predetermined purpose of utility model and being taken,
Below in conjunction with attached drawing and preferred embodiment, to according to the utility model proposes circuit board structure its specific embodiment, structure,
Feature and its effect, detailed description is as follows.Obviously, described embodiment is a part of the embodiment of the utility model, without
It is whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work
Under the premise of every other embodiment obtained, belong to the protection scope of the utility model.
Referring to Fig. 1, Fig. 1 is a kind of schematic diagram of circuit board structure provided by the embodiment of the utility model.
As shown in Figure 1, a kind of circuit board structure 100, including flexible circuit board 101；Protective layer 102, the protective layer 102
The bonding area of the flexible circuit board 101 is set, and 102 surface of protective layer is formed at least one hollowed out area；And
Shielded layer 103, the shielded layer 103 are arranged in the hollowed out area.
In the present embodiment, the protective layer 102 is run through along the thickness direction of the protective layer 102 in the hollowed out area；
Specifically, the setting of shielded layer 103 is in the hollowed out area, i.e., thickness and the protective layer 102 of the described shielded layer 103
Thickness is consistent, and guarantees that the surface in the entire bonding area of flexible circuit board 101 is flat, it is ensured that when pressure head is subdued
The explosion particle of ACF is uniform.
In the present embodiment, the protective layer 102 is polyimide covercoat.Wherein, protective layer 102 can be insulation
Layer, protective layer 102 provided in this embodiment include but is not limited to polyimide covercoat.
In the present embodiment, the flexible circuit board 101 is single-layer flexible wiring board or multi-layer flexible circuit board.Flexible wires
Road plate 101 is mainly used for transmitting signal, and flexible circuit board can be lamina flexible circuit board, or be doubling plate flexible circuitry
The multi-layer boards flexible circuit board such as plate, three ply board flexible circuit board, are not particularly limited this application, need according to practical application
Specifically designed.
In the present embodiment, the shielded layer 103 is copper shield；Shielded layer is for shielding the signals such as external electromagnetic to soft
Property wiring board signal transmission interfere, guarantee flexible circuit board transmission signal it is normal；Moreover, the shielded layer of the present embodiment is also
It can be the material other than copper removal, this application is not particularly limited, needs specifically to be designed according to practical application.
Referring to Fig. 2, Fig. 2 is shielded layer provided by the embodiment of the utility model and signal wire structural representation interconnected
Figure.
As shown in Fig. 2, the signal wire 201 is connect with the copper shield 103, the outer surface of the signal wire 201 is set
Set copper protective layer.
In the present embodiment, flexible circuit board 101 has bent area 202, is connected with bonding on the upper surface of bent area 202
Area；Bonding area is the golden finger area that multiple sheet metals are formed, to the bonding end being connected on display panel.Wherein, the guarantor
Sheath 102 is arranged in the bonding area.
In the present embodiment, signal wire 201 is the high speeds signal leads such as display screen mipi signal；201 one end of signal wire
The back side increases copper shield 103, reduces the electromagnetic interference in flexible circuit board bonding area；Moreover, the present embodiment is bonding
(bonding) area also spreads copper, and the conducting that is connected with signal wire 201, really realizes that the impedance in whole path is continuous；Bonding
(bonding) the high speeds signal lead such as the area mipi signal back side only spreads copper, and comparison other positions have lacked PI, but to the shadow of impedance
Sound is very small.
In the present embodiment, protective layer 102 has PI protective film but without copper, and PI protects film thickness 12um；It is set in protective layer 102
Hollowed out area is set, shielded layer 103 is filled in hollowed out area, guarantees that also there is shielding action at pressing end.Specifically, this block hollowed out area is gone
Except PI protective film, it is filled only with copper, copper sheet thickness 12um；And the left and right sides 102 increases PI protective film, guarantees that bonding area is smooth
Degree；Wherein, it is film class insulating materials that PI protective film, which is Kapton (PolyimideFilm), by Pyromellitic Acid two
Acid anhydride (PMDA) and diaminodiphenyl ether (DDE) are formed through imidization in intensive polar solvent through polycondensation and casting film-forming again.
In the present embodiment, bonding area is arranged in the outer surface of the flexible circuit board bent area 202, protective layer 102 with
Shielded layer 103 is all in bonding area.
Correspondingly, the embodiment of the present application also provides a kind of electronic equipment, referring to Fig. 3, Fig. 3 is the utility model implementation
The structural schematic diagram for a kind of electronic equipment that example provides.
As shown in figure 3, a kind of electronic equipment, comprising: display panel 301；Driving chip 302；And circuit board structure
100, the first end A of the circuit board structure 100 is connect with the display panel 301, the second end of the circuit board structure 100
B is connect with the driving chip 302, and the circuit board structure is above-mentioned circuit board structure.
In the present embodiment, the shape of circuit board structure 100 is not specifically limited, and needs to be carried out according to practical application specific
Design.
In the present embodiment, bonding area is located at 100 first end A of circuit board structure；Wherein, display panel 301 and FPC is (soft
Property wiring board) be by FOG Bonding (bonding of FPC On Glass Bonding, FPC glass) technology bind, certain
In the case where temperature and pressure, the output imported on pad and FPC on display panel 301 is welded by anisotropic conductive film
Disk conducting connection；Under normal conditions, FPC is made of using the big material of the coefficients of expansion such as polyimides or polyester film as substrate.
In the present embodiment, the protective layer and the shielded layer are arranged in the first end A.
In order to further reduce the overall space of display panel 301, keep it more lightening, circuit board structure
The 100 first end A that it connect with display panel 301 by bending are to be set to the display panel 301 for circuit board structure 100
The back side, greatly to save the inner space of display panel.
In the present embodiment, circuit board structure 100 is electrically connected by connector with the driving chip 302.
In the present embodiment, electronic equipment is mobile terminal.Preferably, mobile terminal is mobile phone, tablet computer etc..
The utility model is by having the shielded layer with protective layer condition of equivalent thickness, energy in the setting of the bonding area of flexible circuit board
The bonding area of flexible circuit board is enough effectively protected not by the interference of the signals such as external electromagnetic, so that flexible circuit board normal transmission
Signal；In addition, the surface in the entire bonding area of flexible circuit board is flat, it is ensured that the explosion grain of ACF when pressure head is subdued
Son is uniform；Moreover, mipi signal wire is connect with copper shield, the impedance that whole signal path may be implemented is continuous.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation be not intended to limit the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe
Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, but all without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (10)
1. a kind of circuit board structure characterized by comprising
Flexible circuit board；
The bonding area of the flexible circuit board is arranged in protective layer, the protective layer, and the protective layer is formed at least one
A hollowed out area；And
Shielded layer, the shielded layer are arranged in the hollowed out area.
2. circuit board structure according to claim 1, which is characterized in that the shielded layer is copper shield.
3. circuit board structure according to claim 2, which is characterized in that further include signal wire, the signal wire with it is described
Copper protective layer is arranged in the outer surface of copper shield connection, the signal wire.
4. circuit board structure according to claim 1, which is characterized in that thickness of the hollowed out area along the protective layer
The protective layer is run through in direction.
5. circuit board structure according to claim 1, which is characterized in that the protective layer is polyimide covercoat.
6. circuit board structure according to claim 1, which is characterized in that the flexible circuit board is single-layer flexible wiring board
Or multi-layer flexible circuit board.
7. a kind of electronic equipment characterized by comprising
Display panel；
Driving chip；And
Circuit board structure, the first end of the circuit board structure are connect with the display panel, and the second of the circuit board structure
End is connect with the driving chip, and the circuit board structure is circuit board structure as claimed in any one of claims 1 to 6.
8. electronic equipment according to claim 7, which is characterized in that the protective layer is arranged with the shielded layer described
First end.
9. electronic equipment according to claim 7, which is characterized in that the flexible circuit board is by bending the first end
To be set to the back side of the display panel.
10. electronic equipment according to claim 7, which is characterized in that the flexible circuit board by connector with it is described
Driving chip electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610117.5U CN208210421U (en) | 2018-04-26 | 2018-04-26 | circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610117.5U CN208210421U (en) | 2018-04-26 | 2018-04-26 | circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208210421U true CN208210421U (en) | 2018-12-07 |
Family
ID=64521379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820610117.5U Active CN208210421U (en) | 2018-04-26 | 2018-04-26 | circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208210421U (en) |
-
2018
- 2018-04-26 CN CN201820610117.5U patent/CN208210421U/en active Active
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