CN208201120U - A kind of pedestal suitable for CVD Process - Google Patents
A kind of pedestal suitable for CVD Process Download PDFInfo
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- CN208201120U CN208201120U CN201820740303.0U CN201820740303U CN208201120U CN 208201120 U CN208201120 U CN 208201120U CN 201820740303 U CN201820740303 U CN 201820740303U CN 208201120 U CN208201120 U CN 208201120U
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- substrate
- pressure roller
- fixedly connected
- elastic balloon
- cvd process
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Abstract
The pedestal that the utility model discloses a kind of suitable for CVD Process, including substrate, the upper surface of substrate offers the first groove by rolling device, rolling device includes pressure roller, through-hole is provided on pressure roller side wall, pressure roller one end is connected with bottom plate, plate inner wall offers annular slide track, being slidably connected in annular slide track, there are two draw runners, two draw runners are fixedly connected with one end of the same elastic balloon far from one end face of bottom plate, elastic balloon internal slide has piston, one end face of piston is fixedly connected with connecting rod, the other end of connecting rod sequentially passes through the roof of elastic balloon, the roof of pressure roller reaches external and is fixedly connected with push plate, the side wall perforation of elastic balloon is connected with gas pipeline, the other end of gas pipeline is fixedly connected with elastic packing head.The unified substrate of the quality that the utility model is produced may be implemented to carry out efficient heat transfer on substrate, can prevent electric arc, and can prevent substrate damage in technique, have stronger practicability.
Description
Technical field
The utility model relates to a kind of pedestal more particularly to a kind of pedestals suitable for CVD Process.
Background technique
In the prior art, it during the processing and manufacturing of semiconductor devices, needs to generate on semiconductor wafer (wafer) and lead
The various film layers such as thin film layer, insulating thin layer (thin-film) and various grooves, opening etc. generate film layer and ditch
The step of slot etc. is vital link for semiconductor device fabrication.
Under normal circumstances, the generation of film layer can pass through PVD (physical vapor deposition also known as sputters), thermal oxide and CVD
Means such as (chemical vapor depositions) realize that groove, opening etc. can be realized by way of etching.CVD in the prior art, heat
The common ground of oxidation and etching apparatus is to be both needed to place chip to be processed on the base, later in the cavity of equipment into
The corresponding reaction process of row, in the process of chip, in order to accelerate reaction speed, raising processing efficiency etc., often to anti-
The temperature of environment is answered to have certain requirement.In the method for control equipment cavity temperature, a kind of more commonly used mode is exactly
It is heated to pedestal, the chip above pedestal is transferred heat to by pedestal later, to control reaction speed etc..
But effective heat transfer can not be formed by traditional technology substrate, concurrently there are because electric arc make substrate by
The problem of damage.For this purpose, proposing a kind of plasma-reinforced chemical vapor deposition support base.
Utility model content
The shortcomings that effective heat transfer can not be formed purpose of the utility model is to solve substrate in the prior art, and
A kind of pedestal suitable for CVD Process of proposition.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of pedestal suitable for CVD Process, including substrate are designed, the lower surface of substrate offers
Two grooves, the second groove are irregular shape, and the second inside grooves are equipped with thermal conductive wire, and the matching of substrate lower end surface is covered equipped with substrate
Cap rock, substrate-covering layer middle part, which is run through, is connected with shaft；The upper surface of substrate offers several first grooves by rolling device,
Rolling device includes pressure roller, pressure roller inner hollow, offers several through-holes on pressure roller side wall, pressure roller one end is fixedly connected with bottom
Plate, plate inner wall offer annular slide track, and being slidably connected in annular slide track, there are two draw runners, and two draw runners are far from one end face of bottom plate
It is fixedly connected with one end of the same elastic balloon, elastic balloon internal slide has piston, and one end face of piston is fixedly connected with company
Extension bar, the other end of connecting rod sequentially passes through the roof of elastic balloon, the roof of pressure roller reaches outside and is fixedly connected with push plate,
The side wall perforation of elastic balloon is connected with one end of gas pipeline, and the other end of gas pipeline reaches outside pressure roller simultaneously through through-hole
It is fixedly connected with elastic packing head.
Preferably, it is enclosed with shaft coating outside shaft, shaft coating is identical as substrate-covering layer thickness, material phase
Together.
Preferably, the shape of elastic packing head is rectangle, spherical shape, any one in taper.
Preferably, the both ends of two draw runners are connected by connecting spring respectively.
Preferably, shaft is hollow structure.
The utility model proposes a kind of pedestal suitable for CVD Process, beneficial effect is: this reality
Pass through setting elastic balloon and the piston, connecting rod, push plate, the gas pipeline that are equipped with the rolling device of novel middle setting
With replaceable elastic packing head, it can reach and pressurize according to demand to elastic balloon, and then elastic packing head is carried out
The control of pressure achievees the purpose that the depth for controlling the first groove, meanwhile, the elastic packing head of different shapes can be made not
First groove of similar shape is adapted to semiconductor fabrication demand of various shapes.
The unified substrate of the quality produced may be implemented to carry out efficient heat transfer on substrate, can prevent electricity
Arc occurs, and can prevent substrate damage in technique, has stronger practicability.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model.
Fig. 2 is the structural schematic diagram of the utility model.
Fig. 3 is the rolling structure schematic diagram of the utility model.
Fig. 4 is the bottom plate schematic top plan view of the utility model.
In figure: 1- substrate, 2- substrate-covering layer, 3- shaft, 4- thermal conductive wire, the first groove of 5-, the second groove of 6-, 7- pressure
Roller, 8- through-hole, 9- bottom plate, 10- annular slide track, 11- draw runner, 12- elastic balloon, 13- piston, 14- connecting rod, 15- push plate,
16- connecting spring, 17- shaft coating, 18- gas pipeline, 19- elastic packing head.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1-4, a kind of pedestal suitable for CVD Process, including substrate 1, the lower surface of substrate 1
The second groove 6 is offered, the second groove 6 is irregular shape, and 6 laid inside of the second groove has thermal conductive wire 4,1 lower end surface of substrate
Matching is equipped with substrate-covering layer 2, runs through in the middle part of substrate-covering layer 2 and is connected with shaft 3, and shaft 3 is hollow structure；Substrate 1 it is upper
End face offers several first grooves 5 by rolling device, and rolling device includes pressure roller 7,7 inner hollow of pressure roller, 7 side wall of pressure roller
On offer several through-holes 8,7 one end of pressure roller is fixedly connected with bottom plate 9, and 9 inner wall of bottom plate offers annular slide track 10, annular slide track
It is slidably connected in 10 there are two draw runner 11, two draw runners 11 are fixedly connected with the same elastic balloon 12 far from 9 one end face of bottom plate
One end, 12 internal slide of elastic balloon has a piston 13, and 13 1 end face of piston is fixedly connected with connecting rod 14, connecting rod 14 it is another
One end sequentially passes through the roof of elastic balloon 12, the roof of pressure roller 7 reaches external and is fixedly connected with push plate 15, elastic balloon 12
Side wall perforation be connected with one end of gas pipeline 18, the other end of gas pipeline 18 reaches 7 outside of pressure roller and solid through through-hole 8
Surely it is connected with the elastic packing head 19 that shape is rectangle.
It is enclosed with shaft coating 17 outside shaft 3, shaft coating 17 is identical as 2 thickness of substrate-covering layer, material phase
Together.
The both ends of two draw runners 11 pass through connecting spring 16 respectively and are connected.
Working principle: push push plate 15, to elastic balloon 12 inside be inflated, gas by gas pipeline 18 input bullet
Property seal head 19 inside form, more hard after the molding of elastic packing head 19 due to suppressing under state, pressure roller 7 is on substrate 1
End face rolls, and hard elastic packing head 19 can make 1 upper surface of substrate form the first groove 5 when moving above, and produces
The base body of matter equalization.
The rolling device being arranged in the present apparatus by setting elastic balloon and be equipped with piston, connecting rod, push plate,
Gas pipeline and replaceable elastic packing head, can reach and pressurize according to demand to elastic balloon, and then close to elasticity
End socket carries out the control of pressure, achievees the purpose that the depth for controlling the first groove, meanwhile, the elastic packing head energy of different shapes
The first groove of different shapes is enough made, is adapted to semiconductor fabrication demand of various shapes.
The unified substrate of the quality produced may be implemented to carry out efficient heat transfer on substrate, can prevent electricity
Arc occurs, and can prevent substrate damage in technique, has stronger practicability.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. a kind of pedestal suitable for CVD Process, including substrate (1), it is characterised in that: the substrate (1)
Lower surface offers the second groove (6), and second groove (6) is irregular shape, and the second groove (6) laid inside has
Thermal conductive wire (4), substrate (1) the lower end surface matching is equipped with substrate-covering layer (2), through solid in the middle part of the substrate-covering layer (2)
It is connected to shaft (3)；The upper surface of the substrate (1) offers several first grooves (5), the rolling device by rolling device
Including pressure roller (7), pressure roller (7) inner hollow offers several through-holes (8), the pressure roller on pressure roller (7) side wall
(7) one end is fixedly connected with bottom plate (9), and bottom plate (9) inner wall offers annular slide track (10), in the annular slide track (10)
It is slidably connected there are two draw runner (11), two draw runners (11) are fixedly connected with the same elasticity far from (9) one end face of bottom plate
One end of air bag (12), elastic balloon (12) internal slide have piston (13), and (13) one end face of piston is fixedly connected
Have connecting rod (14), the other end of the connecting rod (14) sequentially passes through the roof of elastic balloon (12), the roof of pressure roller (7) arrives
It up to outside and is fixedly connected with push plate (15), the side wall perforation of the elastic balloon (12) is connected with the one of gas pipeline (18)
The other end at end, the gas pipeline (18) reaches pressure roller (7) outside through through-hole (8) and is fixedly connected with elastic packing head
(19).
2. a kind of pedestal suitable for CVD Process according to claim 1, it is characterised in that: the axis
It is enclosed with shaft coating (17) outside bar (3), the shaft coating (17) is identical as substrate-covering layer (2) thickness, material
It is identical.
3. a kind of pedestal suitable for CVD Process according to claim 1, it is characterised in that: the bullet
Property seal head (19) shape be rectangle, spherical shape, any one in taper.
4. a kind of pedestal suitable for CVD Process according to claim 1, it is characterised in that: two institutes
The both ends for stating draw runner (11) pass through connecting spring (16) respectively and are connected.
5. a kind of pedestal suitable for CVD Process according to claim 1, it is characterised in that: the axis
Bar (3) is hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820740303.0U CN208201120U (en) | 2018-05-18 | 2018-05-18 | A kind of pedestal suitable for CVD Process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820740303.0U CN208201120U (en) | 2018-05-18 | 2018-05-18 | A kind of pedestal suitable for CVD Process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208201120U true CN208201120U (en) | 2018-12-07 |
Family
ID=64517518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820740303.0U Active CN208201120U (en) | 2018-05-18 | 2018-05-18 | A kind of pedestal suitable for CVD Process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208201120U (en) |
-
2018
- 2018-05-18 CN CN201820740303.0U patent/CN208201120U/en active Active
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 230000 No. 1766, Jiudingshan Road, Xinzhan District, Hefei City, Anhui Province Patentee after: Hefei Weirui Technology Co.,Ltd. Address before: 230000 east of Jiudingshan road and south of Zhucheng Road, Xinzhan District, Hefei City, Anhui Province Patentee before: HEFEI WEIRUI OPTOELECTRONIC TECHNOLOGY CO.,LTD. |