CN208191007U - A kind of flexible circuit board - Google Patents

A kind of flexible circuit board Download PDF

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Publication number
CN208191007U
CN208191007U CN201820607598.4U CN201820607598U CN208191007U CN 208191007 U CN208191007 U CN 208191007U CN 201820607598 U CN201820607598 U CN 201820607598U CN 208191007 U CN208191007 U CN 208191007U
Authority
CN
China
Prior art keywords
pad
groove
substrate
flexible
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820607598.4U
Other languages
Chinese (zh)
Inventor
童章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN TONGCHUANGXIN ELECTRONIC Co Ltd
Original Assignee
SHENZHEN TONGCHUANGXIN ELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN TONGCHUANGXIN ELECTRONIC Co Ltd filed Critical SHENZHEN TONGCHUANGXIN ELECTRONIC Co Ltd
Priority to CN201820607598.4U priority Critical patent/CN208191007U/en
Application granted granted Critical
Publication of CN208191007U publication Critical patent/CN208191007U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of flexible circuit boards, the wiring board includes PCB substrate, the PCB substrate includes multiple base board units, multiple base board units are evenly distributed in passing through environmentally friendly glue bond on flexible substrate and with flexible substrate from top to bottom, V-groove is formed between adjacent base board unit, there are two symmetrical T-slots, the V-groove to be provided with flexible software fill-in pad for setting on two inclined-planes of V-groove.The flexible circuit board of the utility model is to stick at the PCB substrate of rigidity on flexible substrate by environment-friendlyadhesive adhesive, forms V-groove between the PCB substrate of rigidity, software fill-in pad is provided in V-groove, in bending, positive can be bent, can also back-flexing, software fill-in pad has elastic and ductility, wiring board is in forward direction bending, software fill-in pad is pressurized, and when wiring board back-flexing, software fill-in pad is stretched, two movements link together wiring board, are not in phenomenon of rupture.

Description

A kind of flexible circuit board
Technical field
The utility model relates to a kind of flexible circuit boards.
Background technique
Wiring board is also known as printed circuit board, is the supplier of electronic component electrical connection, its development is more than 100 years existing History, its design is mainly layout design, and the major advantage using circuit board is to greatly reduce the difference of wiring and assembly Mistake improves the gentle productive labor rate of Automated water.
In LED industry, the shape design of LED is varied, and flexible circuit board is also applied in LED light.And it is current Rigid pcb board can not be bent, and therefore, it is necessary to some other auxiliary accessories to solve problems.
Utility model content
Aiming at the shortcomings in the prior art, the technical problem to be solved by the present invention is to provide a kind of bendable curves Road plate.
In order to solve the above technical problems, the utility model is realized by following scheme: a kind of flexible circuit board, the line Road plate includes PCB substrate, and the PCB substrate includes multiple base board units, and multiple base board units are evenly distributed in soft from top to bottom Property substrate on and with flexible substrate pass through environmentally friendly glue bond, V-groove is formed between adjacent base board unit, in V-groove There are two symmetrical T-slots, the V-groove to be provided with flexible software fill-in pad for setting on two inclined-planes.
Further, the base board unit top surface is provided with circuit layer.
Further, the software fill-in pad is integrally V-shaped, and top surface is cambered surface, and two along software fill-in pad are oblique Face is provided with the T-type column with T-slot cooperation;
The T-type column inserts in the T-slot, makes the software fill-in pad that two adjacent base board units are connected to one It rises.
Further, the software fill-in pad is soft CP thermal conductive silicon rubber mat.
Further, the circuit layer is provided with LED array.
Further, the flexible substrate is soft CP heat conductive silica gel substrate.
Compared with the existing technology, the beneficial effects of the utility model are: the flexible circuit board of the utility model is will be rigid The PCB substrate of property is sticked on flexible substrate by environment-friendlyadhesive adhesive, is formed V-groove between the PCB substrate of rigidity, is set in V-groove Be equipped with software fill-in pad, in bending, positive can be bent, can also back-flexing, software fill-in pad has elastic and ductility, line In forward direction bending, software fill-in pad is pressurized road plate, and when wiring board back-flexing, software fill-in pad is stretched, and two movements will Wiring board links together, and is not in phenomenon of rupture.
Detailed description of the invention
Fig. 1 is that the utility model base board unit is set to structural schematic diagram on flexible substrate;
Fig. 2 is the utility model software fill-in pad structural schematic diagram;
Fig. 3 is the schematic diagram after the utility model base board unit and the assembling of software fill-in pad;
Fig. 4 is the positive schematic diagram after bending of the utility model wiring board.
Specific embodiment
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear Define.
Attached drawing 1-4 is please referred to, a kind of flexible circuit board of the utility model, which includes PCB substrate 1, described PCB substrate 1 include multiple base board units, multiple base board units from top to bottom it is evenly distributed on flexible substrate 2 and with flexibility Substrate 2 passes through environmentally friendly glue bond, forms V-groove 4 between adjacent base board unit, is provided on two inclined-planes of V-groove 4 Two symmetrical T-slots 5, the V-groove 4 are provided with flexible software fill-in pad 6.
Preferred embodiment: the base board unit top surface is provided with circuit layer 3.
Preferred embodiment: the software fill-in pad 6 is whole V-shaped, and top surface is cambered surface, under two of software fill-in pad 6 Inclined-plane is provided with the T-type column 61 with the T-slot 5 cooperation;
The T-type column 61 inserts in the T-slot 5, connects the software fill-in pad 6 by two adjacent base board units Together.
Preferred embodiment: the software fill-in pad 6 is soft CP thermal conductive silicon rubber mat.
Preferred embodiment: the circuit layer 3 is provided with LED array.
Preferred embodiment: the flexibility substrate 2 is soft CP heat conductive silica gel substrate.
The flexible circuit board of the utility model is to stick at the PCB substrate of rigidity on flexible substrate by environment-friendlyadhesive adhesive, V-groove is formed between the PCB substrate of rigidity, software fill-in pad is provided in V-groove, in bending, positive can be bent, Can back-flexing, software fill-in pad have elasticity and ductility, wiring board forward direction bending when, software fill-in pad be pressurized, route When plate back-flexing, software fill-in pad is stretched, and it is not in phenomenon of rupture that two movements, which link together wiring board,.
The flexible circuit board of the utility model can be applied on the mounting plate plate body of a variety of radians, and CP heat conductive silica gel Substrate and CP thermal conductive silicon rubber mat also have conductive force, are additionally provided with aluminum substrate heat dissipation in CP heat conductive silica gel substrate bottom surface Device, for reinforcing heat dissipation.
Above description is merely a prefered embodiment of the utility model, is not intended to limit the patent model of the utility model Enclose, equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, or directly or It connects and is used in other relevant technical fields, be also included in the patent protection scope of the utility model.

Claims (6)

1. a kind of flexible circuit board, which includes PCB substrate (1), it is characterised in that: the PCB substrate (1) includes more A base board unit, multiple base board units are evenly distributed from top to bottom to be passed through on flexible substrate (2) and with flexible substrate (2) Environmentally friendly glue bond forms V-groove (4) between adjacent base board unit, and there are two right for setting on two inclined-planes of V-groove (4) The T-slot (5) of title, the V-groove (4) are provided with flexible software fill-in pad (6).
2. a kind of flexible circuit board according to claim 1, it is characterised in that: the base board unit top surface is provided with electricity Road floor (3).
3. a kind of flexible circuit board according to claim 1, it is characterised in that: the software fill-in pad (6) is integrally in V Type, top surface are cambered surface, and two lower inclined planes of software fill-in pad (6) are provided with the T-type column with the T-slot (5) cooperation (61);
The T-type column (61) inserts in the T-slot (5), connects the software fill-in pad (6) by two adjacent base board units It is connected together.
4. a kind of flexible circuit board according to claim 1, it is characterised in that: the software fill-in pad (6) is soft CP thermal conductive silicon rubber mat.
5. a kind of flexible circuit board according to claim 2, it is characterised in that: the circuit layer (3) is provided with LED times Column.
6. a kind of flexible circuit board according to claim 1, it is characterised in that: the flexibility substrate (2) is soft CP heat conductive silica gel substrate.
CN201820607598.4U 2018-04-26 2018-04-26 A kind of flexible circuit board Expired - Fee Related CN208191007U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820607598.4U CN208191007U (en) 2018-04-26 2018-04-26 A kind of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820607598.4U CN208191007U (en) 2018-04-26 2018-04-26 A kind of flexible circuit board

Publications (1)

Publication Number Publication Date
CN208191007U true CN208191007U (en) 2018-12-04

Family

ID=64435209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820607598.4U Expired - Fee Related CN208191007U (en) 2018-04-26 2018-04-26 A kind of flexible circuit board

Country Status (1)

Country Link
CN (1) CN208191007U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112040635A (en) * 2020-09-04 2020-12-04 珠海市航达科技有限公司 Soft-hard combined PCB and preparation method thereof
CN112105170A (en) * 2020-09-28 2020-12-18 捷卡(厦门)工业科技有限公司 Method for gluing small circuit hard board and small circuit hard board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112040635A (en) * 2020-09-04 2020-12-04 珠海市航达科技有限公司 Soft-hard combined PCB and preparation method thereof
CN112105170A (en) * 2020-09-28 2020-12-18 捷卡(厦门)工业科技有限公司 Method for gluing small circuit hard board and small circuit hard board

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181204