CN208189562U - A kind of calibration system correcting wafer disks - Google Patents
A kind of calibration system correcting wafer disks Download PDFInfo
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- CN208189562U CN208189562U CN201820872341.1U CN201820872341U CN208189562U CN 208189562 U CN208189562 U CN 208189562U CN 201820872341 U CN201820872341 U CN 201820872341U CN 208189562 U CN208189562 U CN 208189562U
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Abstract
The utility model discloses a kind of calibration system for correcting wafer disks, including upper end support plate, it is set in the support plate of upper end, the sensor for obtaining wafer disks location information to be corrected, for fixing the calibration platform of wafer disks to be corrected, for adjusting the sliding support platform of wafer disks position to be corrected, and calibrates platform and be located in the sliding slot of sliding support platform.Calibration system provided by the utility model is by leaving calibration platform for wafer disks to be calibrated jack-up, the mobile wafer disks to be calibrated of sliding support platform are driven by motor, until sensor does not receive feedback signal, realize the function of detecting and adjust wafer disks and calibrate error between platform, compared in the prior art by way of the mobile wafer disks to be calibrated of hand, it avoids and the case where electrostatic occurs, high degree of automation effectively improves calibration accuracy.
Description
Technical field
The utility model relates to semi-conductor device technology field, in particular to a kind of calibration system for correcting wafer disks.
Background technique
Field of semiconductor devices application wafer transport robot carries wafer disks, general compatible 6 cun, 8 cun and
12 cun of wafer disks.Its process flow is general are as follows: the arm end of transfer robot has vacuum ceramic hand, utilizes negative pressure of vacuum
Wafer disks are carried from loading magazine and are come out by the principle of absorption, then above transport to wafer calibration platform, calibrate platform
Effect is that all directions of wafer disks are adjusted to unified direction.After calibration is completed, process equipment is to wafer work platform
On wafer disks carry out subsequent technique processing, after being completely processed, manipulator again by wafer disks transport to wafer disks processing set
Above standby platform, to complete the entire technique transport courses of wafer disks.But in a calibration process, if the circle of wafer disks
There is deviation in the heart and the center of circle for calibrating platform, and calibration is resulted in fail.
In the actual production process, position of the wafer in magazine not can determine that, each layer of magazine is circular trough, each material
There are multi-layer grooves for box, therefore can place multilayer wafer disks.Wafer disks are placed in slot, in horizontal direction left-right position precision compared with
Height, without deviation, but in the longitudinal direction, wafer disks may be protruded, and outside magazine, the distance of protrusion possibly even reaches
To 5-10mm, if do not calibrated to this deviation, wafer disks is carried to come out from magazine in manipulator and transport wafer
To calibration platform, this deviation will be had by calibrating between platform and wafer disks, if deviation is excessive (being greater than 2mm), wafer
The calibration of disk just will fail.
Therefore, a kind of calibration system for having detection and adjust error between wafer disks and calibration platform how is designed, is
Those skilled in the art's technical problem urgently to be resolved.
Utility model content
The purpose of the utility model is to provide a kind of calibration systems for correcting wafer disks, can be realized detection and adjust wafer
The function of error between disk and calibration platform.
In order to solve the above technical problems, the utility model provides a kind of calibration system for correcting wafer disks, including upper end branch
Support plate is set in the upper end support plate, the sensor for obtaining wafer disks location information to be corrected, described in fixed
The calibration platform of wafer disks to be corrected, for adjusting the sliding support platform of the wafer disks position to be corrected, and the calibration
Platform is located in the sliding slot of the sliding support platform.
Preferably, the sensor is laser range sensor.
Preferably, the quantity of the laser range sensor is at least 3, so that the laser range sensor forms circle
Shape calibration region.
It preferably, further include the mandril for being set on the sliding support platform, being used to support the wafer disks to be corrected.
Preferably, the mandril is gas-pressure mandril.
Preferably, the top of the gas-pressure mandril is equipped with the vacuum hole for adsorbing the wafer disks to be corrected.
Preferably, the quantity of the gas-pressure mandril is at least 3, so that the wafer disks to be corrected are in same support and put down
Face.
Preferably, further include be set in the upper end support plate, the connecting plate for fixing the sensor.
Preferably, the connecting plate is removable installed in the threaded hole of the upper end support plate.
The calibration system of correction wafer disks provided by the utility model, includes mainly upper end support plate, is set to upper end
Sensor in support plate, for obtaining wafer disks location information to be corrected, for fixing the calibration platform of wafer disks to be corrected,
For adjusting the sliding support platform of wafer disks position to be corrected, and calibrates platform and be located in the sliding slot of sliding support platform.This
The calibration system that utility model provides, including detect wafer disks to be calibrated whether the inspection within the circular scope of sensor delineation
Part is surveyed, whether within the error range its error is detected first, if it is greater than error range, further includes calibrated section, pass through
The mandril of sliding support platform below wafer disks to be calibrated adsorbs wafer disks to be calibrated, and wafer disks to be calibrated jack-up is left
Platform is calibrated, the mobile wafer disks to be calibrated of sliding support platform are driven by motor, until sensor does not receive feedback signal
Until, that is, the calibration for treating calibration wafer disk is completed, realizes the function of detecting and adjust wafer disks and calibrate error between platform,
Compared in the prior art by way of the mobile wafer disks to be calibrated of hand, avoids and the case where electrostatic occur, automate journey
Degree is high, effectively improves calibration accuracy.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is a kind of overall structure scheme of installation of specific embodiment provided by the utility model；
Fig. 2 is the structural schematic diagram of mandril shown in FIG. 1；
Fig. 3 is the structural schematic diagram of upper end support plate shown in FIG. 1.
Wherein, in Fig. 1-Fig. 3:
Upper end support plate -1, connecting plate -2, sensor -3, mandril -4 slidably support platform -5, calibrate platform -
6, wafer disks -7 to be corrected.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is a kind of overall structure installation of specific embodiment provided by the utility model
Schematic diagram；Fig. 2 is the structural schematic diagram of mandril shown in FIG. 1.
In a kind of specific embodiment provided by the utility model, it mainly includes upper for correcting the calibration system of wafer disks
Support plate 1 is held, is set in upper end support plate 1, the sensor 3 for obtaining 7 location information of wafer disks to be corrected, for fixing
The calibration platform 6 of wafer disks 7 to be corrected for adjusting the sliding support platform 5 of 7 position of wafer disks to be corrected, and calibrates platform 6
In the sliding slot of sliding support platform 5.
Wherein, upper end support plate 1 is fastened on above transfer robot main structure by screw, and sensor 3 passes through fastening
Piece 2 is fixed in upper end support plate 3；The Laser emission mouth and receiving port of sensor 3 perpendicular to horizontal direction, and by wire rod and
Communication module is connected with computer, communication and data transmission is carried out, to obtain the feedback signal of laser sensor；Sliding support is flat
Platform 5 can be moved in horizontal plane direction, and to adjust the position of wafer disks 7 to be corrected, the movement of sliding support platform 5 is
Ball screw turns are driven by the motor in the direction of 5 lower section of sliding support platform, and then drive sliding support platform 5 mobile,
Its moving range is 15mm, meets the regulating error range of wafer disks 7 to be corrected；Calibration platform 6 is set to sliding support platform 5
Sliding slot in, guarantee the mobile position that will not influence calibration platform 6 of sliding support platform 5.
Specifically, wafer transport robot first adsorbs wafer disks in actual calibration process, it is flat to be carried to calibration
On platform 6, whether the automatic detection sensor 3 of calibration system meeting at this time has Laser feedback signal, if there is no Laser feedback signal,
Illustrate there is no error either within the error range, then not need to calibrate between wafer disks at this time and calibration platform 6；Conversely,
If sensor 3 has Laser feedback signal, illustrate the position of wafer disks beyond error range, at this point, turning off calibration platform 6
Negative-pressure adsorption, wafer disks 7 to be calibrated jack-up is left calibration platform 6 by mandril 4, while passing through the vacuum hole negative pressure on 4 top of mandril
Wafer disks 7 to be calibrated are adsorbed, motor is then started, control sliding support platform 5 carries out the movement of internal plane, makes to be calibrated
Wafer disks 7 are within the scope of the correction delineation circle of laser sensor 3, when all sensors 3 all can't detect wafer to be calibrated
After disk 7, just illustrates that correction course is completed, realize correction for drift；It controls mandril 4 again at this time and declines and close its negative pressure,
The deviation at the center of circle of wafer disks 7 to be calibrated and the center of calibration platform 6 is just within the allowable range at this time.The above process is pair
The entire calibration process of wafer disks 7 to be calibrated.
Calibration system provided by the utility model, the circle whether drawn a circle to approve in sensor 3 including detecting wafer disks 7 to be calibrated
Within the scope of, whether within the error range its error is detected first, if it is greater than error range, then pass through wafer disks to be calibrated
The mandril 4 of the sliding support platform 5 of 7 lower sections adsorbs wafer disks 7 to be calibrated, and it is flat that wafer disks 7 to be calibrated jack-up is left calibration
Platform 6 drives the mobile wafer disks 7 to be calibrated of sliding support platform 5 by motor, is until sensor 3 does not receive feedback signal
Only, the calibration for treating calibration wafer disk 7 can be completed, in the prior art by way of the mobile wafer disks 7 to be calibrated of hand
It compares, avoids the case where not allowing electrostatic to occur, and mechanical and communication combines calibration system that can guarantee calibration accuracy more
It is high.
Wafer to be calibrated can be calibrated more accurately in order to optimize the calibration system of correction wafer disks in above-described embodiment
The advantages of disk 7 and calibration platform 6, sensor 3 is laser range sensor；The quantity of laser range sensor is at least 3, with
Laser range sensor is set to form round calibration region.Sensor 3 uses laser range sensor, can make feedback signal more
Sensitivity more accurately can detect and calibrate wafer disks 7 to be calibrated and calibrate the error between platform 6；Laser range sensor
Round calibration region is formed, is set as 3 in this embodiment, certainly can also be other quantity, at least three can just determine one
A calibration border circular areas, in the actual use process, user can determine laser range sensor according to field condition
Number, such as 4,6,8 etc., it is not specifically limited herein.
Further, calibration system further includes being set on sliding support platform 5, being used to support wafer disks 7 to be corrected
Mandril；In addition, mandril 4 is gas-pressure mandril；Meanwhile the top of gas-pressure mandril is equipped with the vacuum for adsorbing wafer disks 7 to be corrected
Hole；The quantity of gas-pressure mandril is at least 3, so that wafer disks to be corrected 7 are in same supporting plane.Mandril in this embodiment
4 use gas-pressure mandril, and gas-pressure mandril can be adsorbed wafer disks 7 to be corrected in softer mode, preferably be protected to be corrected
Wafer disks 7 avoid the case where damaging wafer disks 7 to be corrected generation；Gas-pressure mandril quantity is not limited to 3, this embodiment is adopted
It is because at least three can just determine a supporting plane with 3, can also is other quantity, such as 4,5 or 6,
It is not specifically limited herein.
Referring to FIG. 3, Fig. 3 is the structural schematic diagram of upper end support plate shown in FIG. 1.
Further, calibration system further includes the connecting plate 2 being set in upper end support plate 1, for fixing sensor 3；
Connecting plate 2 is removable installed in the threaded hole of upper end support plate 1.Sensor 3 can be mounted on upper end support by connecting plate 2
The different screw thread hole location of disk 1, can correct the deviations of corresponding 6 cun, 8 cun and 12 cun of wafer disks, solve existing skill
The compatible situation bigger to 12 cun of the wafer disks area of plane of large platform is used in art, optimizes testing calibration technique.
In conclusion the calibration system of correction wafer disks provided by the present embodiment mainly includes upper end support plate, setting
In the sensor in the support plate of upper end, for obtaining wafer disks location information to be corrected, for fixing the school of wafer disks to be corrected
Quasi- platform for adjusting the sliding support platform of wafer disks position to be corrected, and calibrates the cunning that platform is located at sliding support platform
In slot.Calibration system provided by the utility model, the circular scope whether drawn a circle to approve in sensor including detecting wafer disks to be calibrated
Within detection part, whether within the error range detect its error first, further include calibration portion if it is greater than error range
Point, wafer disks to be calibrated are adsorbed by the mandril of the sliding support platform below wafer disks to be calibrated, by wafer disks to be calibrated
Jack-up leaves calibration platform, the mobile wafer disks to be calibrated of sliding support platform is driven by motor, until sensor does not receive
Until feedback signal, that is, the calibration for treating calibration wafer disk is completed, is realized and is detected and adjust between wafer disks and calibration platform accidentally
The function of difference avoids compared in the prior art by way of the mobile wafer disks to be calibrated of hand and the case where electrostatic occurs,
High degree of automation effectively improves calibration accuracy.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (9)
1. a kind of calibration system for correcting wafer disks, which is characterized in that including upper end support plate (1), be set to the upper end branch
Sensor (3) on support plate (1), for obtaining wafer disks to be corrected (7) location information, for fixing the wafer disks to be corrected
(7) calibration platform (6), for adjusting the sliding support platform (5) of wafer disks to be corrected (7) position, and the calibration
Platform (6) is located in the sliding slot of sliding support platform (5).
2. calibration system according to claim 1, which is characterized in that the sensor (3) is laser range sensor.
3. calibration system according to claim 2, which is characterized in that the quantity of the laser range sensor is at least 3
It is a, so that the laser range sensor forms round calibration region.
4. calibration system according to claim 1, which is characterized in that further include being set to the sliding support platform (5)
Mandril (4) that is upper, being used to support the wafer disks to be corrected (7).
5. calibration system according to claim 4, which is characterized in that the mandril (4) is gas-pressure mandril.
6. calibration system according to claim 5, which is characterized in that the top of the gas-pressure mandril is equipped with for adsorbing
State the vacuum hole of wafer disks to be corrected (7).
7. calibration system according to claim 6, which is characterized in that the quantity of the gas-pressure mandril is at least 3, so that
The wafer disks to be corrected (7) are in same supporting plane.
8. calibration system described in -7 any one according to claim 1, which is characterized in that further include being set to the upper end branch
Connecting plate (2) on support plate (1), for fixing the sensor (3).
9. calibration system according to claim 8, which is characterized in that the connecting plate (2) is removable installed in described
In the threaded hole of upper end support plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820872341.1U CN208189562U (en) | 2018-06-06 | 2018-06-06 | A kind of calibration system correcting wafer disks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820872341.1U CN208189562U (en) | 2018-06-06 | 2018-06-06 | A kind of calibration system correcting wafer disks |
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| Publication Number | Publication Date |
|---|---|
| CN208189562U true CN208189562U (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820872341.1U Active CN208189562U (en) | 2018-06-06 | 2018-06-06 | A kind of calibration system correcting wafer disks |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598033A (en) * | 2018-06-06 | 2018-09-28 | 广东工业大学 | A kind of calibration system of correction wafer disks |
| CN113043263A (en) * | 2019-12-26 | 2021-06-29 | 沈阳新松机器人自动化股份有限公司 | Calibration workpiece of robot |
| TWI762874B (en) * | 2019-12-09 | 2022-05-01 | 南亞科技股份有限公司 | Coating system and calibration method thereof |
-
2018
- 2018-06-06 CN CN201820872341.1U patent/CN208189562U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598033A (en) * | 2018-06-06 | 2018-09-28 | 广东工业大学 | A kind of calibration system of correction wafer disks |
| TWI762874B (en) * | 2019-12-09 | 2022-05-01 | 南亞科技股份有限公司 | Coating system and calibration method thereof |
| CN113043263A (en) * | 2019-12-26 | 2021-06-29 | 沈阳新松机器人自动化股份有限公司 | Calibration workpiece of robot |
| CN113043263B (en) * | 2019-12-26 | 2022-07-26 | 沈阳新松机器人自动化股份有限公司 | Calibration workpiece of robot |
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Effective date of registration: 20221019 Address after: 528225 Room B507, Block B, Phase I, Nanhai Industrial Think Tank City, Taoyuan Road, Software Park, Shishan Town, Nanhai District, Foshan City, Guangdong Province (application for residence) Patentee after: GUANGDONG ADA INTELLIGENT EQUIPMENT Co.,Ltd. Address before: No.729, Dongfeng East Road, Yuexiu District, Guangzhou City, Guangdong Province 510060 Patentee before: GUANGDONG University OF TECHNOLOGY |