CN208171078U - A kind of microwell array loop heat pipe - Google Patents
A kind of microwell array loop heat pipe Download PDFInfo
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- CN208171078U CN208171078U CN201820525623.4U CN201820525623U CN208171078U CN 208171078 U CN208171078 U CN 208171078U CN 201820525623 U CN201820525623 U CN 201820525623U CN 208171078 U CN208171078 U CN 208171078U
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- microwell array
- heat pipe
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- loop heat
- liquid
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Abstract
The utility model relates to hot pipe technique fields, more particularly to a kind of microwell array loop heat pipe.The microwell array loop heat pipe includes the microwell array transfer conduit being connected between condenser and evaporator, the microwell array transfer conduit includes transfer conduit ontology, it is equipped at least two through-holes in the transfer conduit ontology, and is separated between two adjacent through-holes by partition.Microwell array loop heat pipe described in the utility model, structure is simple, compact, and occupied space is smaller, has better flexible connection effect, it is easier to be bent and be fixed, be convenient for system flexible topology.
Description
Technical field
The utility model relates to hot pipe technique fields, more particularly to a kind of microwell array loop heat pipe.
Background technique
Heat pipe is a kind of efficient heat-transfer equipment, and heat-transfer capability one or two order of magnitude higher than metal heat-conducting is claimed
For the superconductor of heat.Conventional heat pipe mainly includes metal shell, capillary structure and working media, capillary structure usually by conduit or
Sintered porous structure is constituted, and is distributed on entire heat pipe length direction, flexible poor although structure is simple, in addition
Since heat pipe is axially covered with capillary structure, liquid flowing resistance is larger, and liquid with gas in the same space along phase negative side
To flowing, there are problems that carrying, therefore affects the heat-transfer capability of heat pipe.
Loop heat pipe is a kind of thermal control equipment that gas-liquid phase transition progress efficient heat transfer occurs using working media, passes through gas
Evaporator and condenser are attached by pipeline, liquid line, form loop, compared with conventional heat pipe, liquid-sucking core is only
It is present in inside evaporator, is connected between evaporator and condenser by flexible metal thin-wall tube, working medium flows through thin-wall metal pipe
Smaller flow resistance can be obtained, and can be flexibly connected preferably between cold source and heat source, realization is more advantageous to
Remotely transferring, isolation vibration and electromagnetic interference, and gas-liquid working medium is flowed respectively along different paths, avoids occurring to flow taking
Band problem, therefore heat transfer efficiency is higher, is widely used in fields such as space flight, superconduction, electronic devices.
However between the evaporator and condenser of existing loop heat pipe usually tool there are two and more than two transfer conduits,
Structure very complicated, when coupling with radiating element, these transfer conduits need to occupy in cooling system more spaces, and
And arranged in many applications and need to be arranged more fixed structures when pipeline, reality of these factors to loop heat pipe
Border application brings many inconvenience.
Utility model content
(1) technical problems to be solved
The purpose of the utility model is to provide a kind of microwell array loop heat pipes, solve structure existing for existing loop heat pipe
Very complicated, occupied space is larger, the inconvenient problem of pipeline arrangement.
(2) technical solution
In order to solve the above-mentioned technical problem, the utility model provides a kind of microwell array loop heat pipe, including is connected to cold
Microwell array transfer conduit between condenser and evaporator, the microwell array transfer conduit includes transfer conduit ontology, described
It is equipped at least two through-holes in transfer conduit ontology, and is separated between two adjacent through-holes by partition.
Further, the through-hole is divided into two groups, wherein one group is liquid line through-hole, another group logical for gas piping
Hole.
Further, the condenser includes condenser pipe, the import of the condenser pipe and the gas piping through-hole
It is connected, the outlet of the condenser pipe is connected with the liquid line through-hole.
Further, the evaporator includes evaporator shell, at least provided with liquid-sucking core in the evaporator shell.
Specifically, baffle is additionally provided in the evaporator shell, the baffle is connected with the liquid-sucking core, the baffle and
The inner cavity of the evaporator shell is divided into air collecting chamber and liquid collecting cavity by the liquid-sucking core；The liquid collecting cavity and the liquid line
Through-hole is connected, and the air collecting chamber is connected with the gas piping through-hole.
Specifically, capillary structure is equipped in the through-hole, one end of the capillary structure is connect with the condenser pipe, institute
The other end for stating capillary structure is connect with the liquid-sucking core.
Specifically, the capillary structure is by micro groove structure, powder sintered structure, fibre structure, foamed metal structures, metal
Reticular structure made of silk, pencil knot made of reticular structure, fiber filament made of fascicular texture, fiber filament made of wire
At least one of structure structure composition.
Specifically, at least one side wall of at least one through-hole of the microwell array transfer conduit is equipped with micro- wing
Piece, micro- fin and the microwell array transfer conduit are integrally machined molding.
Specifically, the transfer conduit ontology, the partition and the through-hole are integrally machined molding.
Specifically, the section of the through-hole is round, semicircle, ellipse, fan-shaped or polygon.
(3) beneficial effect
Microwell array loop heat pipe provided by the utility model, using microwell array transfer conduit connection condenser and evaporation
Device, by the way that at least two through-holes are arranged in transfer conduit ontology, for carrying out the circulation of gas and liquid respectively, thus by gas
Body pipeline and liquid line become one structure, and structure is simple, compact, and occupied space is smaller, have preferably flexible connection
Effect, it is easier to be bent and be fixed, be convenient for system flexible topology.
Microwell array loop heat pipe provided by the utility model, using microwell array transfer conduit as transfer conduit,
Middle microwell array transfer conduit can be integrally machined molding, under low-temperature working environment, it is easier to carry out insulated heat, reduce outer
The environment of bound pair transfer conduit leaks heat, reduces the refrigeration requirement to cold source, improves loop heat pipe job stability and reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment microwell array loop heat pipe；
Fig. 2 is that the first structure of microwell array transfer conduit in the utility model embodiment microwell array loop heat pipe is shown
It is intended to；
Fig. 3 is that second of structure of microwell array transfer conduit in the utility model embodiment microwell array loop heat pipe is shown
It is intended to；
Fig. 4 is that the third structure of microwell array transfer conduit in the utility model embodiment microwell array loop heat pipe is shown
It is intended to；
Fig. 5 is the sectional structure chart of the utility model embodiment microwell array loop heat pipe；
Fig. 6 is the evaporator the schematic diagram of the section structure of the utility model embodiment microwell array loop heat pipe.
In figure：1：Evaporator；11：Liquid-sucking core；12：Evaporator shell；13：Gas conduit；14：Baffle；15：Liquid collecting cavity；
16：Air collecting chamber；2：Condenser；21：Condenser pipe；22：Condenser ontology；3：Microwell array transfer conduit；31：Through-hole；311：
Gas piping through-hole；312：Liquid line through-hole；32：Partition；33：Transfer conduit ontology.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Example is not intended to limit the scope of the present invention for illustrating the utility model.
As shown in figures 1 to 6, the utility model embodiment provides a kind of microwell array loop heat pipe, including evaporator 1, condensation
Device 2 and the microwell array transfer conduit 3 being connected between the evaporator 1 and the condenser 2, the microwell array pass
Defeated pipeline 3 includes transfer conduit ontology 33, and at least two through-holes 31, and adjacent two are equipped in the transfer conduit ontology 33
It is separated between the through-hole 31 by partition 32.
Wherein, it is two groups that the through-hole 31, which is divided to, wherein one group is gas piping through-hole 311, another group is liquid line
Through-hole 312.The condenser 2, liquid line through-hole 312, evaporator 1, gas piping through-hole 311 are sequentially communicated forming circuit
Structure.
Fig. 2 is the first structure type of the microwell array transfer conduit 3, and the inside of the transfer conduit ontology 33 is empty
Between be separated into multiple through-holes 31, on the length direction of the microwell array transfer conduit 3, between each through-hole 31
It is not connected, wherein the partition 32 not only acts as buffer action, also acts as and improve 3 intensity of microwell array transfer conduit
Effect, can bear higher pressure, it is easier to be bent and be reversed.It is each described in the structure shown in Fig. 2
Through-hole 31 is from left to right arranged successively into one layer of structure.Certainly, multiple through-holes 31 can also be arranged as multilayered structure.
Fig. 3 and Fig. 4 is respectively second and the third structure type of the microwell array transfer conduit 3, both are micro-
Hole array transfer conduit 3 is all made of double-pore structure, that is, set in the inside of the transfer conduit ontology 33 there are two through-hole 31,
One of through-hole 31 is used as liquid line through-hole, another through-hole 31 is used as gas piping through-hole, this microwell array
Transfer conduit 3 can make loop heat pipe structure more compact.Further, it is also possible to according to actual needs in the transfer conduit ontology
33 inside set there are three, four or more multi-through hole 31, and the arrangement mode between each through-hole can also be according to reality
Demand is arbitrarily arranged.
Wherein, the section of the through-hole 31 of the microwell array transfer conduit 3 can be round, semicircle, ellipse, sector
Or polygon, naturally it is also possible to be set as other shapes according to actual needs.Each through-hole of the microwell array transfer conduit 3
31 can all use identical cross sectional shape, can also be using the combining form of two or more different cross section shape.
For example, each through-hole 31 of microwell array transfer conduit described in Fig. 23 uses two different cross sectional shapes, wherein being located at
Three of middle part are rectangle, and two positioned at two sides are rectangle and the semicircle shape being composed.Microwell array described in Fig. 3
Two through-holes 31 of transfer conduit 3 are all made of circle.Two through-holes 31 of microwell array transfer conduit described in Fig. 43 are all made of
It is semicircle.Further, it is also possible to which the shape of the through-hole 31 is arbitrarily arranged according to actual needs.
Wherein, the through-hole 31 in the microwell array transfer conduit 3 and partition 32 can be integrally machined molding, such as can be with
It is simple using extruding, punching press, wire cutting or casting machine-shaping, processing technology.
Wherein, the microwell array transfer conduit 3 can be made of metal, and can also be made of nonmetallic.
Furthermore, it is understood that at least one side wall of at least one through-hole 31 of the microwell array transfer conduit 3
Equipped with micro- fin, that is, can according to actual needs, at one of some through-hole 31 of the microwell array transfer conduit 3
It is provided with micro- fin on inner side edge or multiple inner side edges, it can also be in multiple through-holes 31 of the microwell array transfer conduit 3
Micro- fin is respectively provided on corresponding inner side edge.Micro- fin and the microwell array transfer conduit 3 can be integrally machined molding.It is logical
It crosses and micro- fin is set, the intensity of the microwell array transfer conduit 3 can be further increased, gas-liquid working medium can also be increased
Heat exchange area between wall surface, plays the role of auxiliary heat dissipation.
The both ends of the microwell array transfer conduit 3 are corresponding with the condenser 2, the evaporator 1 respectively to be tightly connected
Fixed, the mode of being connected and fixed can be at least one of welding, gluing, clamping, close-fitting, tube expansion or threaded connection, sealing side
Formula can be at least one of welding, gluing, close-fitting, metal sealing or sealing ring sealing.
Furthermore, it is understood that the evaporator 1 can be tabular, it is also possible to discoid, cylindric, saddle, it can be with
Be pipeline form, can be cavity inside the evaporator 1, micro groove structure also can be set, can also be arranged liquid-sucking core 11 or
Other capillary structures, certain evaporator 1 further include that other can make liquid working substance be evaporated to the structure type of gas.
Furthermore, it is understood that the condenser 2 can be in the certain area of end outer surface of the microwell array transfer conduit 3
The fin or the condenser 2 that domain is directly arranged include condenser pipe 21 and condenser ontology 22 or the condenser 2
Including condenser pipe 21 and fin.Wherein the condenser pipe 21 can be made of copper, aluminium, steel or titanium alloy etc., condenser pipe
Road 21 can be using sinuous coiled pipe structure, can also be using pipeline structure side by side, and certain condenser 2 further includes other
Gas working medium can be made to be condensed into the structure type of liquid.
As shown in figure 5, in the present embodiment, the condenser 2 includes condenser ontology 22 and is arranged in condenser sheet
Condenser pipe 21 in body 22, the microwell array transfer conduit 3 are arranged to " convex " font close to the end of the condenser 2
Structure, and be deep into inside the condenser 2, wherein the gas piping 311 of the microwell array transfer conduit 3 is positioned at outer
Side, liquid line 312 are located inside.The import of the condenser pipe 21 is connected with the gas piping through-hole 311, described cold
The outlet of solidifying pipeline 21 is connected with the liquid line through-hole 12.It can make the microwell array by the design of this structure
The end of transfer conduit 3 and 2 junction of condenser form gas-liquid and be isolateds, be convenient for gas working medium, liquid working substance respectively along
Respective flow direction flow forward.
As shown in Figure 5 and Figure 6, in the present embodiment, the evaporator 1 uses tabular, and the evaporator 1 includes evaporation
Device shell 12 is equipped with liquid-sucking core 11 and baffle 14, the baffle 14 and 11 phase of liquid-sucking core in the evaporator shell 12
The inner cavity of the evaporator shell 12 is divided into liquid collecting cavity 15 and air collecting chamber 16 by company, the baffle 14 and the liquid-sucking core 11.
Wherein the baffle 14 can be made of solid material, can also be made of porous structure material.It is connect with radiating element
The side of touching, the side intimate surface contact of the inner surface of the evaporator shell 12 and the liquid-sucking core 11, for reducing
State the thermal contact resistance between evaporator shell 12 and the liquid-sucking core 11, the evaporator shell 12 inner surface with it is described
Gas conduit 13 can also be opened up between liquid-sucking core 11, for the timely dissipation of gas working medium of 11 surface evaporation of liquid-sucking core,
The gas conduit 13 can be opened in the outer surface of the liquid-sucking core 11, or be opened in the interior of the evaporator shell 12
Surface.The microwell array transfer conduit 3 is also configured as " convex " font structure close to the end of 1 side of evaporator, described
Liquid line through-hole 312 passes through the baffle 14 and is deep into the liquid collecting cavity 15 inside the evaporator 1 containing liquid phase working fluid, makes liquid
Liquid working substance in body tubing through holes 312 can flow directly into the liquid-sucking core 11, the gas piping through-hole 311 with it is described
The air collecting chamber 16 of 14 other side of baffle is connected to, thus enable gas working medium in the gas conduit 13 dissipation in time,
The air collecting chamber 16 flows into the gas piping through-hole 311 after collecting.
The evaporator 1 is more easily fabricated to biggish planar structure in the two-dimensional direction, is more convenient for surface being plane
Radiating element coupled, to the heat of radiating element carry out transmitting and dissipation.In addition liquid storage can also be set as needed
Liquid storage device is connected to the liquid-sucking core 11, for storing excessive liquid working substance, is adjusted by liquid storage device by device (not shown)
The liquid of the liquid-sucking core 11 is fed, and improves the operation stability of loop heat pipe.
It, can in order to make loop heat pipe that there is better heat transfer property and stability under horizontality or antigravity state
Capillary structure is arranged in all or part of liquid line through-hole 312.The capillary structure is by micro groove structure, powder
Sintering structure, fibre structure, foamed metal structures, fascicular texture, fiber made of reticular structure, wire made of wire
At least one of reticular structure made of silk, fascicular texture made of fiber filament structure composition.That is, the capillary structure can
To be made of the single structure in above structure, can also be made of two kinds in above structure and combination of the above.Wherein this reality
Refer to one or more fiber filament being arranged in the liquid line through-hole 312 with the novel fibre structure.
The capillary structure completely or partially occupies Section Space on the section of the liquid line through-hole 312, according to
The heat transfer distances of loop heat pipe, structural parameters, the section for designing the capillary structure such as capillary pressure of the liquid-sucking core 11 are big
Small, porosity and capillary dimensions etc..Described capillary structure one end is connect with the condenser pipe 21, the other end and the imbibition
Core 11 connects, by the capillarity of the capillary structure, drive liquid working substance in the condenser 2 continuously to
The evaporator 1 flows, and guarantees the 11 feed flow abundance of liquid-sucking core and continuous.When carrying out cooling system arrangement, this circuit
Heat pipe only takes up the channel of a very little on the transmit path, and only needs that design is fixed to this transfer conduit,
Therefore system space can be effectively saved, easily facilitates system flexible arrangement.
The working principle of microwell array loop heat pipe described in the utility model embodiment is as follows：
When loop heat pipe work, the liquid working substance in the condenser pipe 21 passes through the microwell array transfer conduit 3
The part for going deep into the condenser 2 enters the liquid line through-hole 312, is flowed into institute along the liquid line through-hole 312
It states in the liquid-sucking core 11 in evaporator 1, after 1 outer surface of evaporator is heated by radiating element, heat is to the evaporation
It is transmitted inside device 1, makes the liquid working substance of 11 outer surface of liquid-sucking core by thermal evaporation, the gas working medium of generation flows into neighbouring
In the gas conduit 13, and then collect into the air collecting chamber 16, then flows into the gas piping through-hole 311, finally
It is condensed into liquid refrigerant again in into the condenser pipe 21, at the same time, in 11 surface capillary of liquid-sucking core
Under driving, make the liquid working substance in the condenser 2 constantly along the liquid line through-hole 312 into the evaporator 1
Flowing and supplement, working medium constantly circulates in circuit and occurs gas-liquid phase transition, by the heat of the evaporator 1 constantly to
The condenser 2 transmits.
When loop heat pipe works in low temperature environment, in order to avoid loop heat pipe internal pressure is more than peace at room temperature
Gamut, therefore loop heat pipe also needs to be arranged an air reservoir (not shown), using bypass line by air reservoir and the gas
Tubing through holes 311 are connected to, can be effectively relieved loop heat pipe at room temperature hypertonia the problem of, while also making circuit hot
Gas working medium when pipe is run at low temperature in air reservoir can be supplemented constantly into loop heat pipe, to guarantee in loop heat pipe
With sufficient gas-liquid two-phase working medium, by the continuous phase transformation of gas-liquid working medium and circulate, by the heat of heat source constantly to cold
Source transmitting and dissipation.When loop heat pipe works in low temperature warm area, since there are the biggish temperature difference with external environment for loop heat pipe, no
It is evitable to there is leakage heat, so that the energy consumption of loop heat pipe heat transfer burden and cold source is increased, when environment leakage heat is larger,
Liquid in liquid line is probably heated, and generation is local to dryout, and causes loop heat pipe job insecurity even to fail, usually
It needs to take many insulations, such as wraps up radiation proof material in the external of loop heat pipe, loop heat pipe is placed in biggish
It can be operated normally in vacuum system.
The utility model embodiment uses the structure type of the microwell array transfer conduit 3, makes the evaporator 1 and institute
It states and seems an only very narrow transfer conduit between condenser 2, it is compact-sized, it occupies little space, easily facilitates package
Radiation proof material, and the vacuum system of very little is only needed just to be able to carry out cryogenic heat transfer work, to significantly reduce and be
The volume of system improves loop heat pipe functional reliability and operation stability.
In conclusion microwell array loop heat pipe provided by the utility model, is connected cold using microwell array transfer conduit
Condenser and evaporator are constituted by the way that at least two through-holes are arranged in transfer conduit ontology, for carrying out gas and liquid respectively
Circulation, so that gas piping and liquid line be become one structure, structure is simple, compact, and occupied space is smaller, has
Better flexible connection effect, it is easier to be bent and be fixed, be convenient for system flexible topology.
Microwell array loop heat pipe provided by the utility model, using microwell array transfer conduit as transfer conduit,
Under low-temperature working environment, it is easier to carry out insulated heat, the environment for reducing outer bound pair transfer conduit leaks heat, reduces to the cold of cold source
Amount demand improves loop heat pipe job stability and reliability.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (10)
1. a kind of microwell array loop heat pipe, it is characterised in that：Including the microwell array being connected between condenser and evaporator
Transfer conduit, the microwell array transfer conduit include transfer conduit ontology, and at least two are equipped in the transfer conduit ontology
Through-hole, and be separated between two adjacent through-holes by partition.
2. microwell array loop heat pipe according to claim 1, it is characterised in that：The through-hole is divided into two groups, wherein one
Group is liquid line through-hole, and another group is gas piping through-hole.
3. microwell array loop heat pipe according to claim 2, it is characterised in that：The condenser includes condenser pipe,
The import of the condenser pipe is connected with the gas piping through-hole, and the outlet of the condenser pipe and the liquid line are logical
Hole is connected.
4. microwell array loop heat pipe according to claim 3, it is characterised in that：The evaporator includes evaporator shell
Body, at least provided with liquid-sucking core in the evaporator shell.
5. microwell array loop heat pipe according to claim 4, it is characterised in that：Gear is additionally provided in the evaporator shell
Plate, the baffle are connected with the liquid-sucking core, and the inner cavity of the evaporator shell is divided by the baffle and the liquid-sucking core
Air collecting chamber and liquid collecting cavity；The liquid collecting cavity is connected with the liquid line through-hole, and the air collecting chamber and the gas piping are logical
Hole is connected.
6. microwell array loop heat pipe according to claim 4, it is characterised in that：Capillary structure is equipped in the through-hole,
One end of the capillary structure is connect with the condenser pipe, and the other end of the capillary structure is connect with the liquid-sucking core.
7. microwell array loop heat pipe according to claim 6, it is characterised in that：The capillary structure by micro groove structure,
Powder sintered structure, fibre structure, foamed metal structures, fascicular texture made of reticular structure, wire made of wire,
At least one of fascicular texture made of reticular structure, fiber filament made of fiber filament structure composition.
8. microwell array loop heat pipe according to claim 1, it is characterised in that：The microwell array transfer conduit is extremely
At least one side wall of a few through-hole is equipped with micro- fin, micro- fin and microwell array transfer conduit one
Machine-shaping.
9. microwell array loop heat pipe according to claim 1, it is characterised in that：The transfer conduit ontology, it is described every
Plate and the through-hole are integrally machined molding.
10. microwell array loop heat pipe according to claim 1, it is characterised in that：The section of the through-hole is circle, half
Round, ellipse, fan-shaped or polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201820525623.4U CN208171078U (en) | 2018-04-13 | 2018-04-13 | A kind of microwell array loop heat pipe |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820525623.4U CN208171078U (en) | 2018-04-13 | 2018-04-13 | A kind of microwell array loop heat pipe |
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| CN208171078U true CN208171078U (en) | 2018-11-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108426476A (en) * | 2018-04-13 | 2018-08-21 | 中国科学院理化技术研究所 | A kind of microwell array loop heat pipe |
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2018
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108426476A (en) * | 2018-04-13 | 2018-08-21 | 中国科学院理化技术研究所 | A kind of microwell array loop heat pipe |
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