CN208158981U - Heavy copper circuit board - Google Patents
Heavy copper circuit board Download PDFInfo
- Publication number
- CN208158981U CN208158981U CN201820699568.0U CN201820699568U CN208158981U CN 208158981 U CN208158981 U CN 208158981U CN 201820699568 U CN201820699568 U CN 201820699568U CN 208158981 U CN208158981 U CN 208158981U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- foil layer
- copper foil
- prepreg
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model provides a kind of heavy copper circuit board, including the first copper foil layer, the first prepreg under the first copper foil layer, core plate under the first prepreg, the second prepreg under core plate and the second copper foil layer under the second prepreg, first copper foil layer, first prepreg, core plate, second prepreg and the second copper foil layer are pressed into heavy copper circuit board, wherein, heavy copper circuit board offers rivet hole, to pass through rivet hole for the first copper foil layer, first prepreg, core plate, second prepreg and the second copper foil layer carry out riveted, the downside of the upper side of first copper foil layer and the second copper foil layer etches network and/or broached-tooth design, network and/or broached-tooth design are to install circuit connector.The utility model can be improved the structural stability of heavy copper circuit board, and improve the applicability and ease of use of heavy copper circuit board.
Description
Technical field
The utility model relates to circuit board technology fields, and in particular to a kind of heavy copper circuit board.
Background technique
In recent years, with the development of electronic technology, thick copper contact plate is needed to meet the high speed of electronic component, high frequency, electricity
The trend that capacity increases, while with electronic equipment, the electronics electrical equipment power conversion module such as communication base station it is small-sized
Change, multifunction, a large amount of uses of level transformer, market linkage touch panel demand is caused increasingly to increase.However current thick copper
The problems such as layering, cracking, often occurs for contact plate, influences the normal work of electronic equipment.
Utility model content
The utility model is to solve the technical issues of layering, cracking often occur for current thick copper contact plate, provides one kind
Heavy copper circuit board.
The technical solution adopted in the utility model is as follows：
A kind of heavy copper circuit board, including the first copper foil layer, the first prepreg under first copper foil layer, position
Core plate under first prepreg, the second prepreg under the core plate and it is located at described the second half
The second copper foil layer under cured sheets, it is first copper foil layer, first prepreg, the core plate, described the second half solid
Change piece and second copper foil layer is pressed into the heavy copper circuit board, wherein the heavy copper circuit board offers rivet hole, with logical
The rivet hole is crossed by first copper foil layer, first prepreg, the core plate, second prepreg and described
The downside of second copper foil layer progress riveted, the upper side of first copper foil layer and second copper foil layer etches grid knot
Structure and/or broached-tooth design, the network and/or the broached-tooth design are to install circuit connector.
The copper thickness of the heavy copper circuit board is 6 ounces.
The grid spacing of the network is 3.7~3.8mil, and the tooth pitch of the broached-tooth design is 0.3~0.45mm.
The heavy copper circuit board is rectangle, and four angles of the heavy copper circuit board open up a rivet hole respectively.
The diameter of the rivet hole is 3.175mm.
The material of the core plate is FR-4.
Etch depth of the downside of the upper side of first copper foil layer and second copper foil layer in brownification is 4 μ
m。
The beneficial effects of the utility model：
The heavy copper circuit board of the utility model, by offering rivet hole, by the first copper foil layer, the first prepreg, core
Plate, the second prepreg and the second copper foil layer carry out riveted, can be improved the structural stability of heavy copper circuit board, effectively prevent each
The problems such as layering, cracking, occurs for layer, can be convenient in heavy copper circuit board by etching grid broached-tooth design on heavy copper circuit board
Upper connector mounting improves the applicability and ease of use of heavy copper circuit board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the heavy copper circuit board of the utility model one embodiment；
Fig. 2 is the structural schematic diagram of the heavy copper circuit board of another embodiment of the utility model；
Fig. 3 is the grid broached-tooth design schematic diagram of the copper foil layer of the utility model one embodiment.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, the heavy copper circuit board of the utility model, including the first copper foil layer 1, it is located under the first copper foil layer 1
The first prepreg 2, the core plate 3 under the first prepreg 2, the second prepreg 4 under core plate 3 and
The second copper foil layer 5 under the second prepreg 4, the first copper foil layer 1, the first prepreg 2, core plate 3, the second semi-solid preparation
Piece 4 and the second copper foil layer 5 are pressed into heavy copper circuit board.Wherein, heavy copper circuit board offers rivet hole 6, will to pass through rivet hole 6
First copper foil layer 1, the first prepreg 2, core plate 3, the second prepreg 4 and the second copper foil layer 5 carry out riveted.First copper foil layer
The downside of 1 upper side and the second copper foil layer 2 etches network and/or broached-tooth design, network and/or sawtooth knot
Structure is to install circuit connector.
In one embodiment of the utility model, the material of core plate is FR-4, and the copper thickness of heavy copper circuit board is 6 ounces.
When being pressed into 6 ounces of dual platens based on FR-4, prepreg and rolled copper foil, because rolled copper foil roughening face is inadequate, for roughening
Copper foil and prepreg binding force, brownification can increase microetch when producing and sting erosion amount.Specifically, the upper side of the first copper foil layer 1 and
Etch depth of the downside of second copper foil layer 5 in brownification is 4 μm.It, can for general 2 μm of etch depth
The structural stability for effectively improving heavy copper circuit board prevents each layer from the problems such as being layered, cracking occurs.
As shown in Fig. 2, in one embodiment of the utility model, heavy copper circuit board is rectangle, the four of heavy copper circuit board
A angle opens up a rivet hole 6 respectively, and the diameter of rivet hole can be 3.175mm.Riveted is carried out by rivet at rivet hole 6,
The structural stability that heavy copper circuit board can be further increased effectively prevent each layer that the problems such as being layered, cracking occurs.
As shown in figure 3, broached-tooth design and network can be etched in GTL, and broached-tooth design is etched in GBL, with peace
Fill corresponding circuit connector, such as power connector.Wherein, grid spacing of the network after route development can be 3.7
~3.8mil, the tooth pitch of broached-tooth design can be 0.3~0.45mm.
The grid spacing of the utility model embodiment is smaller, if easily being occurred in production using common dry film ill-exposed existing
As, and grid spacing and copper face contact surface are small, occur film after development, influence normal process production.In the utility model
In one embodiment, by adjusting dry film raw material, produced using anti-plate nickel gold dry film, thickness of dry film 1.5mil is exposed
Photodevelopment uses specification by adjusting grid compensation and dry film, and grid spacing when etching is made to be easier to manage.In addition, etching
In the process, plate intermediate region and edges of boards area grid spacing are difficult to etch uniformly, copper face spacing after etch depth to certain depth
There is lateral erosion in side, and etching factor is caused to be difficult to meet the requirements.In one embodiment of the utility model, by adjusting etching
Every section of spray pressure of liquid, above sprays power 3.5kg/cm2, under spray power 3.0kg/cm2, pool effect trend is adjusted, by repeatedly real
It tests, it is ensured that line width spacing is met the requirements after etching.
Heavy copper circuit board according to the present utility model, by offering rivet hole, by the first copper foil layer, the first semi-solid preparation
Piece, core plate, the second prepreg and the second copper foil layer carry out riveted, can be improved the structural stability of heavy copper circuit board, effectively
The problems such as preventing each layer from layering, cracking occurs, can be convenient in thick copper by etching grid broached-tooth design on heavy copper circuit board
Connector mounting on circuit board improves the applicability and ease of use of heavy copper circuit board.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of heavy copper circuit board, which is characterized in that the first half including the first copper foil layer, under first copper foil layer
Cured sheets, the core plate under first prepreg, the second prepreg under the core plate and it is located at
The second copper foil layer under second prepreg, first copper foil layer, first prepreg, the core plate, institute
It states the second prepreg and second copper foil layer is pressed into the heavy copper circuit board, wherein the heavy copper circuit board offers
Rivet hole, with by the rivet hole by first copper foil layer, first prepreg, the core plate, described the second half
Cured sheets and second copper foil layer carry out riveted, the downside of the upper side of first copper foil layer and second copper foil layer
Network and/or broached-tooth design are etched, the network and/or the broached-tooth design are to install circuit connector.
2. heavy copper circuit board according to claim 1, which is characterized in that the copper thickness of the heavy copper circuit board is 6 ounces.
3. heavy copper circuit board according to claim 2, which is characterized in that the grid spacing of the network be 3.7~
3.8mil, the tooth pitch of the broached-tooth design are 0.3~0.45mm.
4. heavy copper circuit board according to claim 3, which is characterized in that the heavy copper circuit board is rectangle, the thickness copper
Four angles of circuit board open up a rivet hole respectively.
5. heavy copper circuit board according to claim 4, which is characterized in that the diameter of the rivet hole is 3.175mm.
6. heavy copper circuit board according to claim 1, which is characterized in that the material of the core plate is FR-4.
7. heavy copper circuit board according to claim 1, which is characterized in that the upper side of first copper foil layer and described
Etch depth of the downside of two copper foil layers in brownification is 4 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820699568.0U CN208158981U (en) | 2018-05-11 | 2018-05-11 | Heavy copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820699568.0U CN208158981U (en) | 2018-05-11 | 2018-05-11 | Heavy copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208158981U true CN208158981U (en) | 2018-11-27 |
Family
ID=64390270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820699568.0U Expired - Fee Related CN208158981U (en) | 2018-05-11 | 2018-05-11 | Heavy copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208158981U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049639A (en) * | 2019-04-28 | 2019-07-23 | 珠海中京电子电路有限公司 | A kind of print circuit plates making method |
| CN111688287A (en) * | 2020-06-14 | 2020-09-22 | 湖南亿润新材料科技有限公司 | Epoxy resin prepreg and production process thereof |
-
2018
- 2018-05-11 CN CN201820699568.0U patent/CN208158981U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049639A (en) * | 2019-04-28 | 2019-07-23 | 珠海中京电子电路有限公司 | A kind of print circuit plates making method |
| CN111688287A (en) * | 2020-06-14 | 2020-09-22 | 湖南亿润新材料科技有限公司 | Epoxy resin prepreg and production process thereof |
| CN111688287B (en) * | 2020-06-14 | 2022-06-10 | 湖南亿润新材料科技有限公司 | Epoxy resin prepreg and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181127 Termination date: 20190511 |