CN208157163U - Ceramic insulator used for electronic packaging - Google Patents
Ceramic insulator used for electronic packaging Download PDFInfo
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- CN208157163U CN208157163U CN201820776707.5U CN201820776707U CN208157163U CN 208157163 U CN208157163 U CN 208157163U CN 201820776707 U CN201820776707 U CN 201820776707U CN 208157163 U CN208157163 U CN 208157163U
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- ceramic insulator
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Abstract
The utility model provides a kind of ceramic insulator used for electronic packaging, belongs to ceramic shell preparation technical field, including the ceramic insulator ontology as made of the compacting of several layers potsherd；Potsherd is equipped with the through-hole of polygon；Metal layer is coated on the hole wall of through-hole.Ceramic insulator used for electronic packaging provided by the utility model, the through-hole of polygon is set on potsherd, coating metal layer, metal layer and metal block welding are applied on the hole wall of through-hole, metal block can weld the volume that ceramet package casing is reduced in the inside of ceramic insulator ontology.
Description
Technical field
The utility model belongs to ceramic shell preparation technical field, is to be related to a kind of pottery used for electronic packaging more specifically
Porcelain insulator.
Background technique
Ceramic insulator used for electronic packaging is most important component part in ceramet package casing, large-scale application in
Photoelectric communication field.Ceramic insulator used for electronic packaging need to metallize to its certain side, i.e., add one on its lateral surface
Layer securely and is not easy the metallic film being melted with ceramic bonding, so as to here with high-temperature solder by ceramic insulator with it is golden
Belong to part to weld together.
The quality good or not of ceramic insulator metallization depends on ceramic sole mass and metallization process.In metallization process
Influence factor to metallization quality is mainly thickness and its uniformity, sintering processing of metalization layer etc..Currently, ceramic insulation
There are two types of the coating methods of sub- side metal：1. hand-screen, refer to ceramic insulator green part preparation process most
Afterwards, by way of hand-screen, the side of ceramic insulator is printed one by one；2. manual brush, refers in green
Part preparation process finally, with brush mode, the cream that will metallize one by one is coated on the side of ceramic insulator.
In the prior art, metal parts is welded on the side of ceramic insulator, and metal parts occupies certain volume, causes to make pottery
Porcelain metal-packaged shell size is larger.And above two application pattern is only suitable for being applied to the side metal to ceramic insulator
Change, for due to surface covered and metallization position, silk screen can not be placed in the coated inner wall metal of ceramic insulator
Hand-printing is carried out, manual brush can only be used, this process not only causes the increase of time and human cost, but also will lead to
The metallization coating of ceramic insulator cavity inner wall is uneven, not can guarantee the quality and appearance consistency of cavity inner wall metallization.
Utility model content
The purpose of this utility model is to provide a kind of ceramic insulators used for electronic packaging, to solve to exist in the prior art
Metal parts can only be welded on the big technical problem of ceramet package casing size caused by ceramic insulator outside.
To achieve the above object, the technical solution adopted in the utility model is：A kind of ceramic insulation used for electronic packaging is provided
Son, including the ceramic insulator ontology as made of the compacting of several layers potsherd；The potsherd is equipped with the through-hole of polygon；Institute
It states on the hole wall of through-hole coated with metal layer.
Further, the through-hole is the structure of concave shape；The metal layer is set to two roofs of concave shape through-hole
On.
Further, the corner point of two roofs of the concave shape through-hole is respectively equipped with semi-circular hole.
Further, chamfered transition is respectively adopted between the two side walls and bottom wall of the through-hole.
Further, the ceramic insulator ontology is equipped with framework.
The beneficial effect of ceramic insulator used for electronic packaging provided by the utility model is：Compared with prior art, originally
The through-hole of polygon is arranged on potsherd, applies deposit on the hole wall of through-hole for utility model ceramic insulator used for electronic packaging
Belong to layer, metal layer and metal block welding, so that metal block is welded on the inside of ceramic insulator ontology, and then reduces ceramic metal
Belong to the volume of package casing.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of ceramic insulator used for electronic packaging provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of the potsherd of ceramic insulator used for electronic packaging provided by the embodiment of the utility model；
Fig. 3 makes pottery in the step A for the production method of ceramic insulator used for electronic packaging provided by the embodiment of the utility model
The structural schematic diagram of tile；
Fig. 4 makes pottery in the step B for the production method of ceramic insulator used for electronic packaging provided by the embodiment of the utility model
The structural schematic diagram of tile；
Fig. 5 makes pottery in the step C for the production method of ceramic insulator used for electronic packaging provided by the embodiment of the utility model
The structural schematic diagram one of tile；
Fig. 6 makes pottery in the step C for the production method of ceramic insulator used for electronic packaging provided by the embodiment of the utility model
The structural schematic diagram two of tile；
Fig. 7 makes pottery in the step E for the production method of ceramic insulator used for electronic packaging provided by the embodiment of the utility model
The structural schematic diagram of tile and ceramic insulator.
In figure：1, ceramic insulator ontology；2, potsherd；3, through-hole；4, semi-circular hole；5, metal layer；6, framework；7, golden
Belong to block；8, slot；9, polygonal hole.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features." multiple ", " several " are meant that two in the description of the present invention,
It is a or more than two, unless otherwise specifically defined.
Also referring to Fig. 1 and Fig. 2, now ceramic insulator used for electronic packaging provided by the utility model is illustrated.
The ceramic insulator used for electronic packaging, including the ceramic insulator ontology 1 as made of the compacting of several layers potsherd 2；Potsherd 2
It is equipped with the through-hole 3 of polygon；Metal layer 5 is coated on the hole wall of through-hole 3, metal layer 5 is used for and 7 high-temperature soldering of metal block.
Ceramic insulator used for electronic packaging provided by the utility model is arranged more on potsherd 2 compared with prior art
The through-hole 3 of side shape applies coating metal layer 5 on the hole wall of through-hole 3, and metal layer 5 and metal block 7 weld, so that metal block 7 is welded on
The inside of ceramic insulator ontology 1, and then reduce the volume of ceramet package casing.
Further, referring to Fig. 2, one kind as ceramic insulator used for electronic packaging provided by the utility model is specific
Embodiment, through-hole 3 are the structure of concave shape；Metal layer 5 is set on two roofs of concave shape through-hole 3.Multiple potsherds 2
After being pressed into ceramic insulator ontology 1, the cavity of concave-shaped structure is just had on ceramic insulator ontology 1, metal block 7 is welded in
In the two spaces on cavity top, as shown in Figure 1.Cavity is arranged to concave-shaped structure, convenient for 7 positioning welding of metal block.
Further, referring to Fig. 2, one kind as ceramic insulator used for electronic packaging provided by the utility model is specific
Embodiment, the corner point of two roofs of concave shape through-hole 3 are respectively equipped with semi-circular hole 4, one end side wall of semi-circular hole 4 with
The side wall of concave shape through-hole 3 connects, and the other end side wall of semi-circular hole 4 connects with the roof of concave shape through-hole 3.Multiple potsherds
After 2 are pressed into ceramic insulator ontology 1, four angle points of the cavity top of the concave-shaped structure of ceramic insulator ontology 1 are punished
Not will form semicircular cavity, since metal block 7 and metal layer 5 weld, semicircular cavities be set so that metal block 7 with it is recessed
There is spacing between the cavity wall of the cavity of font, under the premise of the one side and metal layer 5 for guaranteeing metal block 7 weld completely, keeps away
Exempt from metal block 7 to contact with insulator body 1.
Further, referring to Fig. 2, one kind as ceramic insulator used for electronic packaging provided by the utility model is specific
Chamfered transition is respectively adopted between the two side walls and bottom wall of through-hole 3 in embodiment.
Further, referring to Fig. 2, one kind as ceramic insulator used for electronic packaging provided by the utility model is specific
Embodiment, ceramic insulator ontology 1 are equipped with framework 6, for becket in welding ceramics metal-packaged shell.
Also referring to Fig. 3 to Fig. 7, one kind as ceramic insulator used for electronic packaging provided by the utility model is specific
Embodiment, ceramic insulator used for electronic packaging provided by the utility model the production method is as follows：
A. metal is required on the punching press slot 8 on potsherd 2, one of hole wall of slot 8 and potsherd 2
The position of change is overlapped；Refering to Fig. 3；
B. hollow metal is carried out to slot 8；Refering to Fig. 4；
C. the punching press polygonal hole 9 on potsherd 2, at least one hole wall of polygonal hole 9 and the hole wall weight of slot 8
It closes；Refering to Fig. 5 and Fig. 6；
D. step A-C is repeated, multiple potsherds 2 for having through-hole 3 are made；
E. multiple potsherds 2 are pressed into ceramic insulator ontology 1, refering to Fig. 7.
The production method of ceramic insulator used for electronic packaging provided by the utility model, compared with prior art, by
Punching press slot 8 on potsherd 2 carries out hollow metal and punching press polygonal hole 9 to slot 8, so that potsherd
2 coated inner wall has metal layer 5, and the production method is real in such a way that punching technology and hole hollow metal chemical industry skill combine
The metallization coating of the cavity inner wall of existing ceramic insulator ontology 1, and the thickness of the metalization layer applied and its uniformity are preferable,
Metallization quality is high, and production method is simple, applied widely.
Further, Fig. 3 and Fig. 5 is please referred to, there are two the slots 8 of punching press in step A；Polygon in step C
Hole 9 and slot 8 form the through-hole 3 of concave-shaped structure after splicing；The hole wall of two slots 8 is respectively concave shape through-hole
3 two roofs.Punching press polygonal hole 9, so that the metal layer 5 on three side walls of slot 8 is removed, only in rectangle
Retain metal layer 5 on one of side wall in hole 8.
Further, referring to Fig. 3, the connection side of the adjacent two sidewalls of slot 8 uses chamfered transition in step A,
It is easy to implement 8 hollow metal of slot.
It further, further include step F after step E：It is sintered ceramic insulator ontology 1.
It further, further include step G after step F：Framework 6 is suppressed on ceramic insulator ontology 1.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (6)
1. ceramic insulator used for electronic packaging, it is characterised in that：Including the ceramic insulator as made of the compacting of several layers potsherd
Ontology；The potsherd is equipped with the through-hole of polygon；Metal layer is coated on the hole wall of the through-hole.
2. ceramic insulator used for electronic packaging as described in claim 1, it is characterised in that：The through-hole is the knot of concave shape
Structure；The metal layer is set on two roofs of concave shape through-hole.
3. ceramic insulator used for electronic packaging as claimed in claim 2, it is characterised in that：Two tops of the concave shape through-hole
The corner point of wall is respectively equipped with semi-circular hole.
4. ceramic insulator used for electronic packaging as claimed in any one of claims 1-3, it is characterised in that：The two of the through-hole
Chamfered transition is respectively adopted between a side wall and bottom wall.
5. ceramic insulator used for electronic packaging as claimed in any one of claims 1-3, it is characterised in that：The ceramic insulation
Sub- ontology is equipped with framework.
6. ceramic insulator used for electronic packaging as claimed in claim 4, it is characterised in that：It is set on the ceramic insulator ontology
There is framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820776707.5U CN208157163U (en) | 2018-05-23 | 2018-05-23 | Ceramic insulator used for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820776707.5U CN208157163U (en) | 2018-05-23 | 2018-05-23 | Ceramic insulator used for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157163U true CN208157163U (en) | 2018-11-27 |
Family
ID=64388555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820776707.5U Active CN208157163U (en) | 2018-05-23 | 2018-05-23 | Ceramic insulator used for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208157163U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108399988A (en) * | 2018-05-23 | 2018-08-14 | 河北中瓷电子科技有限公司 | Ceramic insulator used for electronic packaging and preparation method thereof |
-
2018
- 2018-05-23 CN CN201820776707.5U patent/CN208157163U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108399988A (en) * | 2018-05-23 | 2018-08-14 | 河北中瓷电子科技有限公司 | Ceramic insulator used for electronic packaging and preparation method thereof |
| CN108399988B (en) * | 2018-05-23 | 2024-01-05 | 河北中瓷电子科技股份有限公司 | Ceramic insulator for electronic packaging and manufacturing method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 050200 No. 21 Changsheng Street, Luquan Economic Development Zone, Shijiazhuang City, Hebei Province Patentee after: Hebei Zhongchi Electronic Technology Co., Ltd. Address before: 050200 No. 21 Changsheng Street, Luquan Economic Development Zone, Shijiazhuang City, Hebei Province Patentee before: HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |