CN208141126U - Developing machine with exposure function - Google Patents
Developing machine with exposure function Download PDFInfo
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- CN208141126U CN208141126U CN201820708262.7U CN201820708262U CN208141126U CN 208141126 U CN208141126 U CN 208141126U CN 201820708262 U CN201820708262 U CN 201820708262U CN 208141126 U CN208141126 U CN 208141126U
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- wafer
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- exposure
- light source
- developing machine
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Abstract
The utility model provides a kind of developing machine with exposure function, including：Wafer storage device, for storing wafer；Wafer edge exposure device, the photoresist for exposed wafer edge；Developing cell, the photoresist being exposed for removing crystal column surface；It is hard to dry unit, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；Manipulator unit, for transferring wafer mutually between unit in the wafer storage device, wafer edge exposure device, developing cell and hard dry.Using optical principle, the photoresist at exposed wafer edge, and pass through the photoresist of development removal crystal round fringes, the precision of removing photoresist of crystal round fringes photoresist can be greatly improved, to improve the yield rate of product；On the other hand, wafer edge exposure device and traditional developing machine are become one, enhances the integrated level of board, to improve working efficiency and reduce the pollution in wafer operation process and the probability of mechanical damage.
Description
Technical field
The utility model relates to semiconductor crystal wafer manufacturing fields, more particularly to a kind of developing machine with exposure function.
Background technique
Photoetching technique (Photolithography) refers under illumination effect, by photoresist (also known as photoresist)
By the technology in the pattern transfer to substrate on mask plate.With the development of semiconductor technology, photoetching technique transmits the ruler of figure
Very little limit reduces 2~3 orders of magnitude (from grade to submicron order), develops to applying electronic from normal optical technology
The new technologies such as beam, X-ray, ion microbeam, laser；0.1 angstrom of order of magnitude range is expanded to from 4000 angstroms using wavelength.Photoetching skill
Art becomes a kind of micrometer-nanometer processing technology of precision.
Photoetching is processing procedure important in semiconductor technology, mainly includes gluing, exposes, development and etc..Wherein gluing
It (Coating) is the process that photoresist (Photoresist, PR) is uniformly coated onto crystal column surface.Existing gluing generallys use
Revolving glue spreading method has the heap of photoresist at the edge of wafer after wafer carries out gluing operation by coating unit
Product, the photoresist at edge is generally unevenly coated, and cannot obtain good figure, and be easy to happen removing (Peeling) and
The figure for influencing other parts, so needing to remove.
In prior art, generally had after wafer gluing using chemical method removal crystal round fringes photoresist
The top that the mechanical arm of EBR (Edge bead removal) nozzle can be moved to crystal round fringes corresponding position passes through injection trimming
The photoresist of solvent removal crystal round fringes.So crystal round fringes remove photoresist, precision is directly sprayed by the mobile accuracy of mechanical arm and EBR
The accuracy of spray of mouth influences, if EBR nozzle is abnormal, the direction of ejection of solvent can be made to change, lead to crystal round fringes
Normal coating area is also by solvent cleaning；In addition thinner and mechanical arm mechanical movement precision can not be accomplished by being limited to EBR nozzle,
The precision that makes to remove photoresist can not further increase, and especially in convex block (Bumping) technique, the removal precision of crystal round fringes photoresist is wanted
It will be higher for asking, so traditional chemical flush method is difficult to meet technique requirement.
Therefore, it is necessary to propose a kind of developing machine, to improve the removal precision of crystal round fringes photoresist, and then product is improved
Yield rate, while the integrated level of board is improved, to improve working efficiency.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of with exposure function
Developing machine, for solving the prior art in wafer photo-etching technological, crystal round fringes photoresist removes the low problem of precision.
In order to achieve the above objects and other related objects, the utility model provides a kind of developing machine with exposure function,
The developing machine includes at least：
Wafer storage device, for storing wafer；
Wafer edge exposure device, the photoresist for exposed wafer edge；
Developing cell, the photoresist being exposed for removing crystal column surface；
It is hard to dry unit, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；
Manipulator unit, for making wafer in the wafer storage device, wafer edge exposure device, developing cell and hard
It dries and is mutually transferred between unit.
Preferably, the wafer edge exposure device includes：
Exposure light path system, the exposure light path system include exposure light source, light source conduction device and light source emitting head,
In, the exposure light source is connect with the light source conduction device, and the light source conduction device is connect with the light source emitting head, institute
The light for stating exposure light source transmitting is transmitted to the light source emitting head by the light source conduction device, and the light source emitting head will
The light, which emits to crystal round fringes, to be exposed；
Wafer bearing device, the wafer bearing device include chuck and are set to a plurality of of chuck periphery
Support PIN, wherein the support PIN can stretch up and down, and wafer is sent to the support PIN, the branch by the manipulator unit
PIN decline is supportted, wafer is sent on the chuck.
Further, the wafer edge exposure device further includes：Wafer position identification device, for detecting determining for wafer
Position label, to determine the position of wafer.
Further, the wafer position identification device includes iraser and receiver, for identification wafer
The telltale mark.
Further, the exposure light source includes forming one of group by halogen light source, xenon source.
Further, the wafer bearing device includes 3 support PIN.
Further, the chuck includes the vacuum chuck that can be rotated in the horizontal direction.
Preferably, the hard baking unit includes hot plate case and cold plate case, wherein the hot plate case passes through heating removal development
The aqueous vapor on wafer afterwards and the solvent in photoresist；The cold plate case makes wafer cool down.
Preferably, the wafer storage device includes front open type wafer box.
Preferably, the developing machine with exposure function include 4 developing cells, 2 hard baking units with
And 2 wafer storage devices.
As described above, the developing machine with exposure function of the utility model, including：Wafer storage device, for storing
Wafer；Wafer edge exposure device, the photoresist for exposed wafer edge；Developing cell is exposed for removing crystal column surface
The photoresist of light；It is hard to dry unit, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；Manipulator list
Member, for passing on from one to another wafer mutually between unit in the wafer storage device, wafer edge exposure device, developing cell and hard dry
It send.Using optical principle, the photoresist at exposed wafer edge, and pass through the photoresist of development removal crystal round fringes, due to using
Light irradiates crystal round fringes photoresist, and exposure accuracy is determined by the wavelength of light source, is not related to mechanical movement, will not be sprayed by EBR
The accuracy of spray of mouth influences, and the precision of removing photoresist of crystal round fringes photoresist can be greatly improved, to improve the yield rate of product；Separately
On the one hand, wafer edge exposure device and traditional developing machine are become one, enhances the integrated level of board, to improve
Working efficiency and the probability of pollution and mechanical damage in reduction wafer operation process
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the developing machine with exposure function of the utility model.
Fig. 2 is shown as the structural schematic diagram of the wafer edge exposure device of the utility model.
Fig. 3 is shown as the structural schematic diagram of the wafer edge exposure device exposure process of Fig. 2.
Component label instructions
1 wafer storage device
2 wafer edge exposure devices
21 exposure light sources
22 light source conduction devices
23 light source emitting heads
24 chucks
25 support PIN
26 wafer position identification devices
3 developing cells
4 hard baking units
41 hot plate casees
42 cold plate casees
5 manipulator units
6 wafers
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
It please refers to Fig.1 to Fig.3.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, is not intended to limit the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model
Revealed technology contents obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model
Scope.
As shown in Figure 1, the utility model provides a kind of developing machine with exposure function, including：
Wafer storage device 1, for storing wafer；
Wafer edge exposure device 2, the photoresist for exposed wafer edge；
Developing cell 3, the photoresist being exposed for removing crystal column surface；
It is hard to dry unit 4, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；
Manipulator unit 5, for making wafer in the wafer storage device 1, wafer edge exposure device 2, developing cell 3
And hard dry mutually transfers between unit 4.
As an example, the developing cell 3 when removing the photoresist that crystal column surface is exposed, first uses developing solution dissolution
Then the photoresist being exposed reuses deionized water hydro-peening wafer.
As an example, wafer is avoided while carrying by extraneous pollution, the wafer storage device 1 for convenience
Using front open type wafer box (Front Open Unit Pod, abbreviation F0UP), preferably each development with exposure function
2 wafer storage devices 1 are arranged in board, one of them is for storing undeveloped wafer, another is for storing development
And the wafer after hard baking technique, production needs are both able to satisfy, while reducing board occupied space.Certainly, each tool
The wafer can also be adjusted according to factors such as production efficiency, the amount of storage of wafer storage device 1 by having the developing machine platform of exposure function
The setting quantity of storage device 1, such as 2 or more.
In photoetching process, wafer after gluing, photoresist will become solid film but still have 10%~30% solvent,
It is easy pickup dust, so after gluing, soft baking technique can be carried out to wafer, to promote the abundant of most of solvent in photoresist film
Volatilization.But still have least a portion of solvent and reside in photoresist, in addition, surface can accumulated water in developing process for wafer
Stain, so also being toasted to the wafer after development to remove the aqueous vapor on remaining photoresist film solvent and wafer.Make
For preferable example, the utility model removes the aqueous vapor on photoresist film solvent and wafer by the way of the baking of vacuum flat plate heat,
As shown in Figure 1, the hard baking unit 4 includes hot plate case 41 and cold plate case 42, wherein the hot plate case 41 is aobvious by heating removal
The solvent in aqueous vapor and photoresist on the wafer of movie queen, since wafer is after hot plate case 41 removes solvent and aqueous vapor, wafer temperature
Degree is higher, so wafer can be made to cool down by cold plate case 42.Preferably, each developing machine platform with exposure function is arranged
2 hard baking units 4.Wafer falls the solvent inside photoresist by drying evaporating completely firmly, when can avoid subsequent ion injection
Cause photoresist locally to burst, while the ability that photoresist protects lower surface in ion implanting or etching can also be improved, into
One step enhances the adhesiveness between photoresist and crystal column surface and reduces standing wave effect.
Preferably, 4 developing cells 3 are arranged in each developing machine platform with exposure function.
As shown in Figure 1, the course of work of the developing machine with exposure function is specially：The manipulator unit 5 will
The wafer being stored in the wafer storage device 1 takes out, and is then fed into the wafer edge exposure device 2, completes wafer side
The exposure of edge photoresist；The manipulator unit 5 takes out wafer from the wafer edge exposure device 2, is then fed into institute
Developing cell 3 is stated, wafer completes the removal for the photoresist being exposed in the developing cell 3；The manipulator unit 5 will be brilliant
Circle takes out from the developing cell 3, is then fed into the hot plate case 41, completes photoresist film solvent by the hot plate case 41
With the removal of the aqueous vapor on wafer；The manipulator unit 5 41 taking-up from the hot plate case by wafer, is then fed into described cold
Plate case 42 reduces the temperature of wafer by the cold plate case 42；The manipulator unit 5 takes wafer from the cold plate case 42
Out, it is then fed into the wafer storage device 1 and stores, to complete the developing process of wafer.The utility model uses optics
Principle, the photoresist at exposed wafer edge, and by the photoresist of development removal crystal round fringes, due to using light to irradiate wafer side
Edge photoresist, exposure accuracy is determined by the wavelength of light source, is not related to mechanical movement, will not be by the accuracy of spray of EBR nozzle
It influences, the precision of removing photoresist of crystal round fringes photoresist can be greatly improved, to improve the yield rate of product；It on the other hand, will be brilliant
The edge of the circle exposure device 2 becomes one with traditional developing machine, enhances the integrated level of board, thus improve working efficiency with
And reduce the pollution in wafer operation process and the probability of mechanical damage.
As shown in Fig. 2, the wafer edge exposure device 2 includes：
Exposure light path system, the exposure light path system include exposure light source 21, light source conduction device 22 and light source transmitting
First 23, wherein the exposure light source 21 is connect with the light source conduction device 22, the light source conduction device 22 and the light source
Emitting head 23 connects, and the light that the exposure light source 21 emits is transmitted to the light source transmitting by the light source conduction device 22
First 23, the light source emitting head 23, which emits the light to crystal round fringes, to be exposed；
Wafer bearing device, the wafer bearing device include chuck 24 and the plural number for being set to 24 periphery of chuck
A support PIN25, wherein the support PIN25 can stretch up and down, and wafer is sent to the support by the manipulator unit 5
PIN25, the support PIN25 decline, wafer is sent on the chuck 24.
Preferably, the wafer edge exposure device 2 further includes wafer position identification device 26, on exposed wafer side
The telltale mark that wafer is detected before edge photoresist, to determine the position of wafer, as an example, the wafer position identification device
26 include iraser and receiver, for identification the telltale mark of wafer, and specifically, wafer vacuum, which is drawn, to be fixed
On the rotatable chuck 24, infrared laser machine emits infrared light, when receiver can receive laser, then it represents that inspection
The telltale mark of wafer is measured, otherwise the telltale mark not detect wafer.
As an example, the exposure light source 21 includes forming one of group by halogen light source, xenon source, it is described
Wafer bearing device includes 3 support PIN25, and the chuck 24 includes the vacuum chuck that can be rotated in the horizontal direction.
As shown in figure 3, the course of work of the wafer edge exposure device 2 is specially：The manipulator unit 5 is by wafer
6 are sent on a plurality of support PIN25；General who has surrendered's wafer 6 is sent on the vacuum chuck 24 under the support PIN25；
Wafer position identification device 26 detects the telltale mark of wafer 6, to determine the position of wafer；Exposure light source 21 is opened, light warp
It crosses the light source conduction device 22 and is transmitted to the light source emitting head 23, the light source emitting head 23 emits the light to institute
It states 6 edge of wafer to be exposed, in exposure process, the wafer 6 is fixed by the vacuum chuck 24, and the vacuum chuck 24
It is rotated along the direction A, i.e., the described wafer 6 is rotated along the direction A, naturally it is also possible to which the opposite direction that the vacuum chuck 24 is arranged along A revolves
Turn.
In conclusion the utility model provides a kind of developing machine with exposure function, including：Wafer storage device 1 is used
In storage wafer；Wafer edge exposure device 2, the photoresist for exposed wafer edge；Developing cell 3, for removing wafer
The photoresist that surface is exposed；It is hard to dry unit 4, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；
Manipulator unit 5, for keeping wafer single in the wafer storage device 1, wafer edge exposure device 2, developing cell 3 and hard baking
It is mutually transferred between member 4.Using optical principle, the photoresist at exposed wafer edge, and pass through the light of development removal crystal round fringes
Photoresist, due to using light to irradiate crystal round fringes photoresist, exposure accuracy is determined by the wavelength of light source, is not related to mechanical movement,
It will not be influenced by the accuracy of spray of EBR nozzle, the precision of removing photoresist of crystal round fringes photoresist can be greatly improved, to improve production
The yield rate of product；On the other hand, wafer edge exposure device and traditional developing machine are become one, enhances the collection of board
Cheng Du, to improve working efficiency and reduce the pollution in wafer operation process and the probability of mechanical damage.So this is practical
It is novel effectively to overcome various shortcoming in the prior art and have high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of developing machine with exposure function, which is characterized in that the developing machine includes at least：
Wafer storage device, for storing wafer；
Wafer edge exposure device, the photoresist for exposed wafer edge；
Developing cell, the photoresist being exposed for removing crystal column surface；
It is hard to dry unit, for evaporating the aqueous vapor on the wafer after developing and the solvent in photoresist；
Manipulator unit, for keeping wafer single in the wafer storage device, wafer edge exposure device, developing cell and hard baking
It is mutually transferred between member.
2. the developing machine according to claim 1 with exposure function, which is characterized in that the wafer edge exposure device
Including：
Exposure light path system, the exposure light path system include exposure light source, light source conduction device and light source emitting head, wherein
The exposure light source is connect with the light source conduction device, and the light source conduction device is connect with the light source emitting head, described
The light of exposure light source transmitting is transmitted to the light source emitting head by the light source conduction device, and the light source emitting head is by institute
It states light and emits to crystal round fringes and be exposed；
Wafer bearing device, the wafer bearing device include chuck and a plurality of supports for being set to the chuck periphery
PIN, wherein the support PIN can stretch up and down, and wafer is sent to the support PIN, the support by the manipulator unit
PIN decline, wafer is sent on the chuck.
3. the developing machine according to claim 2 with exposure function, it is characterised in that：The wafer edge exposure device
Further include：Wafer position identification device, for detecting the telltale mark of wafer, to determine the position of wafer.
4. the developing machine according to claim 3 with exposure function, it is characterised in that：The wafer position identification device
Including iraser and receiver, the telltale mark of wafer for identification.
5. the developing machine according to claim 2 with exposure function, it is characterised in that：The exposure light source includes by halogen
One of plain lamp source, xenon source composition group.
6. the developing machine according to claim 2 with exposure function, it is characterised in that：The wafer bearing device includes
3 support PIN.
7. the developing machine according to claim 2 with exposure function, it is characterised in that：The chuck includes can be along level
The vacuum chuck that direction rotates.
8. the developing machine according to claim 1 with exposure function, it is characterised in that：The hard baking unit includes hot plate
Case and cold plate case, wherein the hot plate case passes through the aqueous vapor on the wafer after heating removal development and the solvent in photoresist；Institute
Stating cold plate case makes wafer cool down.
9. the developing machine according to claim 1 with exposure function, it is characterised in that：The wafer storage device includes
Front open type wafer box.
10. the developing machine according to claim 1 with exposure function, it is characterised in that：It is described with exposure function
Developing machine includes 4 developing cells, 2 hard baking units and 2 wafer storage devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820708262.7U CN208141126U (en) | 2018-05-14 | 2018-05-14 | Developing machine with exposure function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820708262.7U CN208141126U (en) | 2018-05-14 | 2018-05-14 | Developing machine with exposure function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208141126U true CN208141126U (en) | 2018-11-23 |
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ID=64313604
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820708262.7U Active CN208141126U (en) | 2018-05-14 | 2018-05-14 | Developing machine with exposure function |
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| CN (1) | CN208141126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112799282A (en) * | 2020-12-30 | 2021-05-14 | 六安优云通信技术有限公司 | Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof |
-
2018
- 2018-05-14 CN CN201820708262.7U patent/CN208141126U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112799282A (en) * | 2020-12-30 | 2021-05-14 | 六安优云通信技术有限公司 | Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof |
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |