CN208127155U - A kind of ejecting device and wet-method etching equipment - Google Patents
A kind of ejecting device and wet-method etching equipment Download PDFInfo
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- CN208127155U CN208127155U CN201820394361.2U CN201820394361U CN208127155U CN 208127155 U CN208127155 U CN 208127155U CN 201820394361 U CN201820394361 U CN 201820394361U CN 208127155 U CN208127155 U CN 208127155U
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Abstract
The utility model discloses a kind of ejecting device and wet-method etching equipments, including：Storage box, liquid-in pipe and several nozzles, the storage box includes the reservoir cavity that box body and the box body are formed, the liquid-in pipe is connected to the reservoir cavity, the box body includes bottom wall, the bottom wall offers several liquid outlets being connected to the reservoir cavity, each nozzle is each attached to a liquid outlet, and several nozzles are anisotropically arranged in the bottom wall.So when the storage box of the utility model ejecting device is provided with etching liquid, etching liquid by non-uniform Distribution nozzles spray, and then the film product the thickness uniformity after raising etching.
Description
Technical field
The utility model belongs to field of semiconductor devices, in particular to ejecting device and wet-method etching equipment.
Background technique
Currently, often ejecting device is applied in wet-method etching equipment, by sprinkling etching liquid, thus wet etching shape
At the film in substrate surface.
Existing ejecting device, nozzle are generally uniformly arranged, so that etching liquid is evenly distributed in the thin of substrate surface
It is performed etching on film and to it.But since the film thickness of substrate surface is often unevenly distributed, thus when nozzle equably to
It sprays etching liquid and is easy for that the film of the film etching deficiency of thickness larger part or thickness smaller part is caused to spend quarter, causes to carve
Film product thickness after erosion is still uneven, and then influences the performance of subsequent product.
Utility model content
The utility model embodiment provides a kind of ejecting device, the film product the thickness uniformity after effectively improving etching.
To achieve the above object, the utility model embodiment adopts the following technical solutions：
A kind of ejecting device, including：Storage box, liquid-in pipe and several nozzles, the storage box include box body and institute
The reservoir cavity of box body formation is stated, the liquid-in pipe is connected to the reservoir cavity, and the box body includes bottom wall, and the bottom wall opens up
There are several liquid outlets being connected to the reservoir cavity, each nozzle is each attached to a liquid outlet, and several nozzles are anisotropically
It is arranged in the bottom wall.
Preferably, the ejecting device further includes plug, and the liquid outlet quantity is greater than the nozzle quantity, the plug
The liquid outlet of nozzle is not installed in blocking.
Preferably, several liquid outlets are evenly distributed on the entire bottom wall.
Preferably, the storage box forms several liquid inlets being connected to the reservoir compartment, and the liquid-in pipe is installed to institute
State liquid inlet.
Preferably, the liquid-in pipe includes several branch pipes be responsible for be connected to the supervisor, and the branch pipe is installed to described
Liquid inlet.
Preferably, the storage box further includes the roof being oppositely arranged with the bottom wall and connect the roof and bottom wall
Side wall, the liquid inlet is located at the roof.
Preferably, the nozzle also has flow-regulating components.
Preferably, several liquid outlet bores are different.
Preferably, several liquid outlet shapes can be round, oval, rectangular or triangle.
A kind of wet-method etching equipment, which is characterized in that including etch chamber, sample stage and above-mentioned ejecting device, the sample
Sample platform and the ejecting device are located in the etch chamber, and the ejecting device is located above the sample stage.
At least one above-mentioned technical solution that the utility model embodiment uses can reach following beneficial effect：
Compared with prior art, ejecting device provided by the utility model includes storage box, and the storage box includes box body
And the reservoir cavity that the box body is formed, the box body includes bottom wall, and the bottom wall offers several and reservoir cavity
The liquid outlet of connection, each nozzle are each attached to a liquid outlet, and several nozzles are anisotropically arranged in the bottom wall.So this is practical
When the storage box of novel spray-head device is provided with etching liquid, etching liquid by non-uniform Distribution nozzles spray, and then raising quarter
Film product the thickness uniformity after erosion.
Detailed description of the invention
Attached drawing described herein is used to provide a further understanding of the present invention, and constitutes one of the utility model
Point, the exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the utility model
Improper restriction.In the accompanying drawings：
Fig. 1 is the schematic diagram of wet-method etching equipment in the application first embodiment；
Fig. 2 is another angle schematic diagram of ejecting device shown in Fig. 1；
Fig. 3 is the schematic diagram of ejecting device in the application second embodiment.
Specific embodiment
It is specific below in conjunction with the utility model to keep the purpose of this utility model, technical solution and advantage clearer
Technical solutions of the utility model are clearly and completely described in embodiment and corresponding attached drawing.Obviously, described embodiment
It is only the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field
Those of ordinary skill's every other embodiment obtained without making creative work, belongs to the utility model
The range of protection.
Below in conjunction with attached drawing, the technical solution that the utility model preferred embodiment provides is described in detail.
First embodiment
As shown in Figure 1 to Figure 2, the present embodiment provides a kind of wet-method etching equipments, including etch chamber 1, sample stage 2 and spray
Head device 3.Sample stage 2 and ejecting device 3 are located in etch chamber 1, and ejecting device 3 is located at 2 top of sample stage.
Etch chamber 1 is inside placed with sample stage 2 and ejecting device 3 for providing wet etching cavity.
Sample stage 2 is for carrying the film (not shown) sample being formed on substrate S.The substrate S that surface forms film is put
It is placed on sample stage 2, sample stage 2 and ejecting device 3 are staggered relatively, and the film on the surface substrate S is towards ejecting device 3.
Ejecting device 3 is located at 2 top of sample stage, including：Storage box, storage box include 31 inside shape of box body 31 and box body
At reservoir cavity (not shown).Ejecting device 3 further includes plug 32, several nozzles 33 and liquid-in pipe 34.Plug 32 blocks
Reservoir cavity, several nozzles 33 are connected to reservoir cavity with liquid-in pipe 34.
Box body 31 includes bottom wall 311, the roof 312 being oppositely arranged with bottom wall 311 and connect roof 312 and bottom wall 311
Side wall 313.When wet-method etching equipment performs etching work, the reservoir cavity formed inside box body 31 stores etching liquid.
Bottom wall 311 offers several liquid outlets 3111 being connected to reservoir cavity, and several liquid outlets 3111 are uniformly distributed
On entire bottom wall 311.3111 shape of the present embodiment liquid outlet is circle, and certain other embodiments may be ellipse, side
Shape or triangle etc., here with no restrictions.Outflux of the liquid outlet 3111 as the intracorporal etching liquid of reservoir compartment, opening and closing are determined
Determine etching liquid whether outflow.The distribution of liquid outlet 3111 in the open state etches distribution, that is, etching liquid of liquid stream out position
Spray range.
Roof 312 offers several liquid inlets 3121 being connected to reservoir compartment, for importing etching liquid into reservoir compartment body.
The present embodiment offers multiple liquid inlets 3121 in roof 312, and multiple liquid inlets 3121 are uniformly distributed, and can make etching liquid
More uniformly flow into reservoir cavity.Liquid inlet 3121 can also only be arranged one in certain the utility model other embodiments,
But etching liquid splash in reservoir compartment body is easily caused when individually 3121 flow velocity of liquid inlet is excessive, flow velocity is too small to easily lead to reservoir compartment
Internal etching liquid is insufficient, therefore this embodiment scheme is preferred embodiment；3121 position of liquid inlet is also not necessarily positioned to roof 312
On, also can be set on its elsewhere, such as side wall 313, and the shape of box body 31 also not necessarily with the complete phase of the present embodiment
Together, the size of box body 31 and height can also be adjusted according to actual needs.
Plug 32 prevents etching liquid in unwanted place outflow for blocking liquid outlet 3111.
Several installations of nozzle 33 are to part liquid outlet 3111, wherein each nozzle 33 is each attached to a liquid outlet 3111.Spray
33 quantity of mouth is less than 3111 quantity of liquid outlet, and plug 32 blocks the liquid outlet 3111 for not installing nozzle 33, so that several nozzles 33
It can be anisotropically arranged in bottom wall 311, non-homogeneous i.e. at least two groups two adjacent nozzles 33 are apart from difference.Each nozzle 33
All have controlled valve.
Before etching work, the thickness distribution for the film sample to be etched is measured first, surface is formed with film sample
Substrate S is placed on the sample platform 2 under storage box, i.e., sample thin film is placed on sample platform 2；According to the survey of sample film thickness
It measures result and several 33 positions of nozzle is set, less nozzle 33 is arranged compared with multiinjector 33, film thickness thin location in the distribution of film thickness thicker part, this
When each nozzle 33 valve close.
When wet-method etching equipment performs etching work, the valve of each nozzle 33 is opened, and is in corresponding liquid outlet 3111
Opening state, nozzle 33 is distributed more place etching liquid hold-up and pressure is larger, film thickness larger to film layer etch rate
What is reduced is more；Nozzle 33 is distributed less place etching liquid hold-up and pressure is smaller, and smaller to film layer etch rate, film is thick
Degree reduces less, i.e., film thickness thicker part thickness reduces more, and film thickness thin location thickness reduces less, so that etching
Uniformity of film afterwards is more preferable, improves subsequent product quality, and several liquid outlets 3111 are evenly distributed on entire bottom wall 311, make
Obtaining easily to adjust several 33 positions of nozzle according to the film sample thickness distribution on sample platform 2, realize to different thin
The uniform etching of film.
In certain other embodiments, several liquid outlets 3111 can also be different from the present embodiment distribution mode, can be according to tool
The distribution of body situation may be non-uniform or not be covered with entire bottom wall 311.And in the utility model, each nozzle 33 is also
It can connect flow-regulating components (not shown), adjust the etching flow quantity that each nozzle 33 flows out, pass through 33 position of nozzle first
It is distributed the spray range of etching liquid roughly, then adjusts the flow of each nozzle 33, further accurate etching by flow-regulating components
The spray range of liquid, so it is more accurate film sample is etched according to film thickness distribution so that the film sample after etching
Thickness is more uniform.
Liquid-in pipe 34 is installed to liquid inlet 3121.Specifically, if liquid-in pipe 34, which includes supervisor 341, is responsible for 341 with being connected to
Heavenly Stems and Earthly Branches pipe 342.Supervisor 341 connects external etching liquid source.Each branch pipe 342 is installed to each liquid inlet 3121, and then will etching
Liquid equably imports reservoir cavity.
The present embodiment is uniformly provided with several liquid outlets 3111 in the bottom wall 311 of box body 31, and part liquid outlet 3111 is installed
There is nozzle 33.Test obtains being formed in the film thickness distribution situation of the film on the surface substrate S, and according to film thickness selection liquid out appropriate
Mouth 3111 installs nozzles 33, other liquid outlets 3111 are blocked by plug 32.Etching liquid is first sent to by storage by liquid-in pipe 34 first
In sap cavity body, then etching liquid is sprayed by film surface by nozzle 33, controls etching liquid by installing the position of nozzle 33
Spray range achieve the purpose that improve film thickness uniformity to control the etch amount of film layer everywhere.When the film thickness of sample thin film
When distribution situation changes, by changing the position of the installation of nozzle 33 and remaining liquid outlet 3111 can be blocked with plug 32, to change
The installation site of nozzle 33 can be adjusted flexibly in the spray situation of etching liquid according to film thickness distribution at any time.
Second embodiment
As shown in figure 3, ejecting device provided in this embodiment 3 with first embodiment the difference is that, the present embodiment liquid outlet
The film thickness distribution situation for the sample thin film for 3111 and being not uniformly distributed on entire bottom wall 311, but being obtained according to measurement,
311 appropriate location of bottom wall of box body 31 offers liquid outlet 3111 and installs nozzle 33, so that several nozzles 33 are anisotropically pacified
It is filled to several liquid outlets 3111 and is connected to reservoir cavity, 3111 quantity of liquid outlet is equal to 33 quantity of nozzle.Pass through 33, nozzle
It sets to adjust the distribution of etching liquid everywhere in film surface, so as to improve film thickness uniformity.The present embodiment is with respect to first embodiment
3 structure of ejecting device is simpler, and when the relatively uniform batches of film of film thickness distribution performs etching, the present embodiment can be used
Ejecting device 3 performs etching.Several 3111 bores of liquid outlet can also be designed to not by certain the utility model other embodiments
It is consistent, and then further pass through the spray range of 3111 caliber size auxiliary adjustment etching liquid of liquid outlet, so that after etching
Film sample thickness is more uniform.
Certain ejecting device 3 provided by the utility model is other than for wet-method etching equipment, it may also be used for action principle
The other equipment of chemical attack are similarly, cleaning equipment is such as used for, nozzle 33 is arranged according to the Impurity Distribution situation of substrate surface
Position, and then realize effective cleaning to substrate surface impurity.
In conclusion being carved when etching liquid is housed in the reservoir compartment body of the storage box of ejecting device 3 provided by the utility model
Losing liquid, by non-uniform Distribution nozzle 33 sprays, and then improves the film product the thickness uniformity after etching.
The above description is only the embodiments of the present invention, is not intended to limit the utility model.For this field
For technical staff, various modifications and changes may be made to the present invention.All institutes within the spirit and principle of the utility model
Any modification, equivalent substitution, improvement and etc. of work, should be included within the scope of the claims of the utility model.
Claims (10)
1. a kind of ejecting device, which is characterized in that including：Storage box, liquid-in pipe and several nozzles, the storage box include box
The reservoir cavity that body and the box body are formed, the liquid-in pipe are connected to the reservoir cavity, and the box body includes bottom wall, described
Bottom wall offers several liquid outlets being connected to the reservoir cavity, and each nozzle is each attached to a liquid outlet, several nozzles
Anisotropically it is arranged in the bottom wall.
2. ejecting device according to claim 1, which is characterized in that the ejecting device further includes plug, the liquid out
Mouth quantity is greater than the nozzle quantity, and the liquid outlet of nozzle is not installed in the plug blocking.
3. ejecting device according to claim 1, which is characterized in that several liquid outlets are evenly distributed on entire described
On bottom wall.
4. ejecting device according to claim 1, which is characterized in that the storage box forms several and reservoir compartment and connects
Logical liquid inlet, the liquid-in pipe are installed to the liquid inlet.
5. ejecting device according to claim 4, which is characterized in that the liquid-in pipe includes being responsible for and being connected to the supervisor
Several branch pipes, the branch pipe installs to the liquid inlet.
6. ejecting device according to claim 4, which is characterized in that the storage box further includes sets opposite with the bottom wall
The side wall of the roof and the connection roof and bottom wall set, the liquid inlet are located at the roof.
7. ejecting device according to claim 1, which is characterized in that the nozzle also has flow-regulating components.
8. ejecting device according to claim 1, which is characterized in that several liquid outlet bores are different.
9. ejecting device according to claim 1, which is characterized in that the liquid outlet shape can be round, ellipse, side
Shape or triangle.
10. a kind of wet-method etching equipment, which is characterized in that including described in etch chamber, sample stage and claim any one of 1-9
Ejecting device, the sample stage and the ejecting device be located in the etch chamber, and the ejecting device be located at it is described
Above sample stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820394361.2U CN208127155U (en) | 2018-03-22 | 2018-03-22 | A kind of ejecting device and wet-method etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820394361.2U CN208127155U (en) | 2018-03-22 | 2018-03-22 | A kind of ejecting device and wet-method etching equipment |
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| Publication Number | Publication Date |
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| CN208127155U true CN208127155U (en) | 2018-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820394361.2U Active CN208127155U (en) | 2018-03-22 | 2018-03-22 | A kind of ejecting device and wet-method etching equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112730146A (en) * | 2021-03-30 | 2021-04-30 | 武汉大学 | Etching rate testing device and method for etching solution |
-
2018
- 2018-03-22 CN CN201820394361.2U patent/CN208127155U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112730146A (en) * | 2021-03-30 | 2021-04-30 | 武汉大学 | Etching rate testing device and method for etching solution |
| CN112730146B (en) * | 2021-03-30 | 2021-08-17 | 武汉大学 | Etching rate testing device and method for etching solution |
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