CN208125949U - The coupling unit and opto-electronic device of a kind of lens fiber array, itself and chip - Google Patents
The coupling unit and opto-electronic device of a kind of lens fiber array, itself and chip Download PDFInfo
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- CN208125949U CN208125949U CN201820609627.0U CN201820609627U CN208125949U CN 208125949 U CN208125949 U CN 208125949U CN 201820609627 U CN201820609627 U CN 201820609627U CN 208125949 U CN208125949 U CN 208125949U
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Abstract
The utility model discloses a kind of lens fiber arrays, the coupling unit and opto-electronic device of itself and chip, the spacing of each tapered lensed fiber and the setting of V-groove in the lens fiber array, to realize that the alignment of each tapered lensed fiber and chip coupling region is provided convenience.Furthermore, coupling unit is formed on substrate using said lens fiber array and silicon-based electro-optic chip, it only needs to be aligned so that being fixed on stating on substrate and removing the optical fiber of coat in lens fiber array with the coupling regime realization waveguide on silicon-based electro-optic chip, meets the matched requirement of coupled mode spot.The coupled structure of the utility model can be improved the intensity of electronic component, structural stability, while improve its heat dissipation performance.
Description
Technical field
The utility model embodiment is related to technical field of photo communication, more particularly, to a kind of lens fiber array, itself and core
The coupling unit and opto-electronic device of piece.
Background technique
The key component of silicon-based electro-optic chip encapsulation technology is the optical signal and external optical signal (majority realized in chip slapper
For optical fiber) be of coupled connections.End coupling has obtained widely answering because having the characteristics that packaging technology is simple, coupling efficiency is high
With.Under normal circumstances, the mould spot diameter of silicon substrate optical chip end face spot-size converter coupling regime is generally 2.5 microns, works as silicon substrate
Optical chip has and can be coupled by single tapered lensed fiber when single input/output.However, with optic communication, internet
Deng rapid development, data transmission and processing speed develop to higher rate, realize high-performance, low cost, small size and highly integrated
The on piece optical interconnection of degree.Multiple optical devices are integrated on base photoelectric chip, have multiple smooth input/output end ports, this is just needed
Fiber array (FA, Fiber Array) is coupled with die terminals in face of standard.
It is a kind of ultraviolet solid that the coupling process of conventional plane waveguide class chip is that the coupling end face of chip and fiber array uses
Change glue and realizes index matching and bonding.But the thickness of silicon-based electro-optic chip generally only has 0.7 millimeter, is bonded in coupling end face
Area is smaller it cannot be guaranteed that adhesive strength, and the coupling end face fibre-optic mode field diameter of conventional fiber array is 10 microns, not into
The processing of row mode-expansion, cannot match with the end coupling mould spot of silicon substrate optical chip.
During realizing the utility model embodiment, inventor has found the coupled end of existing fiber array and chip
Face is not able to satisfy the matched requirement of coupled mode spot, and the adhesive strength for being directly bonded the end face of fiber array and chip is not high, scattered
Hot property is poor.
Utility model content
Technical problem to be solved in the utility model is how to solve fiber array and the coupling end face of chip to expire
The sufficient matched requirement of coupled mode spot, and the adhesive strength for being directly bonded the end face of fiber array and chip is not high, heat dissipation performance is poor
The problem of.
Against the above technical problems, the embodiments of the present invention provide a kind of lens fiber array, including V-groove base
The tapered lensed fiber of plate, cover board and preset quantity；
Be provided on the first surface of the V-groove substrate item number be equal to the preset quantity V-groove, each V-groove it
Between it is parallel to each other；
Each tapered lensed fiber is mounted in a V-groove on the V-groove substrate, and by the V-groove base
The second surface of plate and third surface are protruding；
The cover board is fixed on the first surface, with the tapered lensed fiber of fixed installation；
Wherein, the second surface and the third surface are one group of opposite face of the V-groove substrate；Each taper is saturating
Between spacing and desire between mirror optical fiber and the lens fiber array are formed between the coupling regime on the chip of coupling unit
Away from matching.
It optionally, further include tail glue；
The region except the cover board of the tail glue setting on the first surface, to fix taper lens light
It is fine.
Optionally, it is in same plane in the cover board close to the end face of the second surface and the second surface；
The optical fiber extension elongation that each tapered lensed fiber stretches out the second surface is the first preset length, and any
Difference between the corresponding optical fiber extension elongation of two tapered lensed fibers is less than the second preset length.
Optionally, it the angle on the V-groove substrate between two groove faces of each V-groove and is mounted in the V-groove
Tapered lensed fiber angle of taper matching.
Second aspect present embodiments provides the coupling unit of a kind of chip and lens fiber array, including claim
Above-described any lens fiber array, silicon-based electro-optic chip, substrate, die bonding glue, ultraviolet glue and matching fluid；
The die bonding glue is arranged between the silicon-based electro-optic chip and the loading end of the substrate, by the silicon
Base photoelectric chip is fixed on the loading end；
The ultraviolet glue is arranged between the lens fiber array and the loading end, by the lens fiber array
It is fixed on the loading end；
Have in the tapered lensed fiber and the silicon-based electro-optic chip stretched out by the second end face of the lens fiber array
There is the coupled end face contact of coupling regime and realizes that waveguide is aligned；
The matching fluid be arranged in by the lens fiber array second end face stretching tapered lensed fiber with it is described
At the position of coupled end face contact；
Wherein, optical fiber clad has been removed by the tapered lensed fiber that the second end face of the lens fiber array is stretched out.
Optionally, the thickness of the prominent first surface of the cover board is equal to the thickness of the silicon-based electro-optic chip.
Optionally, the matched coefficients of thermal expansion of the substrate and the silicon-based electro-optic chip.
Optionally, the substrate is made of ceramic material or silica glass material.
The third aspect present embodiments provides a kind of opto-electronic device, chip and lens light including any description above
The coupling unit of fibre array.
The embodiments of the present invention provide the coupling unit and photoelectron device of a kind of lens fiber array, itself and chip
Part the spacing of each tapered lensed fiber and is intended to form the chip of coupling unit with the lens fiber array in the lens fiber array
On coupling regime correspond, realize the alignment of each tapered lensed fiber and coupling regime in waveguide alignment to facilitate.
Secondly, the V-groove being arranged on V-groove substrate ensure that is put into tapered lens light therein before being fixed by cover board
Fine position is constant, provides convenience to be fixed by cover board to tapered lensed fiber, it is easy to accomplish and ensure that the steady of structure
It is qualitative.In addition, forming coupling unit on substrate using said lens fiber array and silicon-based electro-optic chip, only need so that fixed
The coupling regime stated on the optical fiber and silicon-based electro-optic chip that remove coat in lens fiber array on substrate realizes waveguide
Alignment meets the matched requirement of coupled mode spot.Substrate is as loading end, on the one hand to the lens fiber being fixed thereon
Array and silicon-based electro-optic chip play the role of fixing and supporting, and on the other hand, substrate, can be in time to coupling as thermal component
It closes component to radiate, avoids superheating phenomenon in the coupling unit course of work.Therefore, the coupled structure of the utility model can
Intensity, the structural stability of electronic component are improved, while improving its heat dissipation performance.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the top view for the lens fiber array that the utility model one embodiment provides；
Fig. 2 is the front view for the lens fiber array that another embodiment of the utility model provides；
Fig. 3 is the coupling pair of the coupling unit of the chip that another embodiment of the utility model provides and lens fiber array
Quasi- structural schematic diagram.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
A kind of lens fiber array is present embodiments provided, Fig. 1 is the vertical view of lens fiber array provided in this embodiment
Figure, Fig. 2 are the front view of lens fiber array, and referring to Fig. 1 and Fig. 2, provided in this embodiment includes V-groove substrate 101, cover board
103 and preset quantity tapered lensed fiber 102；
The V-groove that item number is equal to the preset quantity, each V-groove are provided on the first surface of the V-groove substrate 101
Between it is parallel to each other；
Each tapered lensed fiber 102 is mounted in a V-groove on the V-groove substrate 101, and by the V
The second surface of type groove substrate and third surface are protruding；
The cover board 103 is fixed on the first surface, with the tapered lensed fiber 102 of fixed installation；
Wherein, the second surface and the third surface are one group of opposite face of the V-groove substrate；Each taper is saturating
Between spacing and desire between mirror optical fiber and the lens fiber array are formed between the coupling regime on the chip of coupling unit
Away from matching.
It should be noted that be intended to the lens fiber array formed coupling unit chip coupling end face on have by
The area array of coupling regime composition, the spacing in lens fiber array between each tapered lensed fiber are equal to each on area array
The spacing of coupling regime realizes waveguide alignment to facilitate.The V-groove being arranged on V-groove substrate can be to being put into cone therein
Shape lens fiber plays fixed function, and it is inclined to avoid the position that tapered lensed fiber occurs before being fixed by cover board
It moves.
Further, the preset quantity is according to the coupling on the chip for being intended to be formed coupling unit with the lens fiber array
Region is closed to determine.For example, preset quantity is equal to the middle coupling in the area array being made of on the coupling end face of chip coupling regime
Close the quantity in region.
In general, V-groove substrate is cuboid, first surface is the top surface or ground of the cuboid, second surface and the
Three surfaces are one group of side of cuboid.On a second surface, another end face exists for one end face of the V-groove on first surface
On third surface, each V-groove is parallel to each other and is parallel to V-groove substrate rib, for example, being parallel to where first surface
Rectangular long side.
Cover board is used to surround the space of fixed tapered lensed fiber with each V-groove, and cover board is also cuboid, generally, lid
The height of plate is equal with the thickness for the silicon-based electro-optic chip for being intended to be coupled, and the length of cover board is less than the rectangle where first surface
Long side, the width of the plate is equal to the rectangular broadside where first surface.Preferably, cover board is close to second surface, in cover board
In in the contact surface that is contacted with first surface, the long side of contact surface is contacted in the rectangular long side where first surface, touching
The broadside in face is contacted in the rectangular broadside where first surface.It will be appreciated that cover board also can according to need setting
In the other positions of first surface.Above-mentioned contact surface is also possible to square, and the present embodiment is not particularly limited this.
Present embodiments provide a kind of lens fiber array, in the lens fiber array spacing of each tapered lensed fiber with
It is intended to be formed the coupling regime on the chip of coupling unit with the lens fiber array to correspond, it is real in waveguide alignment to facilitate
The alignment of existing each tapered lensed fiber and coupling regime.Passing through secondly, the V-groove being arranged on V-groove substrate ensure that
It is constant that cover board is put into tapered lensed fiber position therein before being fixed, to be consolidated by cover board to tapered lensed fiber
It is fixed that convenience is provided, it is easy to accomplish and ensure that the stability of structure.
It further, on the basis of the above embodiments, as depicted in figs. 1 and 2, further include tail glue 104；
The region except the cover board 103 of the setting of tail glue 104 on the first surface, it is saturating to fix taper
Mirror optical fiber.
A kind of lens fiber array is present embodiments provided, after through the fixed tapered lensed fiber of cover board, then passes through tail
Tapered lensed fiber is fixed in glue, has fully ensured that the structural stability of lens fiber array.
Further, on the basis of the various embodiments described above, in the cover board close to the second surface end face with
The second surface is in same plane；
The optical fiber extension elongation that each tapered lensed fiber stretches out the second surface is the first preset length, and any
Difference between the corresponding optical fiber extension elongation of two tapered lensed fibers is less than the second preset length.
It is in same plane in cover board close to the end face of second surface and second surface, i.e., as shown in Figure 1, cover board 103
It is flushed with V-groove substrate 101 in certain one end.
Further, first preset length is 0.5-1.0mm, and second preset length is 10um (i.e. uniformity
Control is in 10um).
A kind of lens fiber array is present embodiments provided, second surface is stretched out in the installation and tapered lensed fiber to cover board
Length be defined, ensure that can preferably match when being coupled with silicon-based electro-optic chip.
Further, on the basis of the various embodiments described above, two groove faces of each V-groove on the V-groove substrate
Between angle matched with the angle of taper for the tapered lensed fiber being mounted in the V-groove.
For example, the angle of taper of every tapered lensed fiber 102 is 92.5 ± 2.5 °, then the two of each V-groove groove face
Between angle tapered lensed fiber 102 should be made to be mountable in slot, and play certain fixed function.
A kind of lens fiber array is present embodiments provided, each V-groove has and tapered lensed fiber on V-groove substrate
The matched included angle of angle of taper, it is convenient that tapered lensed fiber is installed and fixed.
Specifically, tapered lensed fiber array 100 provided in this embodiment, as depicted in figs. 1 and 2, including V-groove base
Plate 101, several tapered lensed fibers 102, cover board 103 and tail glue 104. wherein, the upper surface of V-groove substrate 101 be equipped with
The one-to-one V-shaped groove of tapered lensed fiber 102, V-groove spacing form coupling part according to desire and tapered lensed fiber array 100
The coupling regime spacing of the end face of the silicon-based electro-optic chip 301 of part determines that usual V-groove spacing uses 250um or 127um.
The coupling regime spacing and quantity Matching of tapered lensed fiber array 100 and silicon-based electro-optic chip 301, every taper
Lens fiber 102 is arranged in corresponding V-shaped groove, and the angle of taper of every tapered lensed fiber 102 is 92.5 ±
2.5°.The one end coupled in tapered lensed fiber array 100 with silicon-based electro-optic chip 301 removes one section of coat.Tapered lens
Optical fiber 102 stretches out V-groove substrate 101 and 103 0.5-1.0mm of end face of cover board, and uniformity controls in 10um.103 thickness of cover board
With 301 thickness matching of silicon-based electro-optic chip, for example, 0.6 ± 0.05mm.Cover board 103 and each V-shaped groove are encircled into fixed taper
The space of lens fiber 102.Tapered lensed fiber 102 is wrapped up wherein in 101 back segment point tail glue 104 of V-groove substrate, is increased viscous
Connect intensity and reliability.
On the basis of lens fiber array provided by the above embodiment, a kind of chip and lens light are present embodiments provided
The coupling unit of fibre array, Fig. 3 be the coupling unit the structural schematic diagram that is coupled and aligned, referring to Fig. 3, the coupling unit include with
Upper described in any item lens fiber arrays 100, silicon-based electro-optic chip 301, substrate 302, die bonding glue 303, ultraviolet glue 304
With matching fluid 305；
The die bonding glue 303 is arranged between the silicon-based electro-optic chip 301 and the loading end of the substrate 302,
The silicon-based electro-optic chip 301 to be fixed on the loading end；
The ultraviolet glue 304 is arranged between the lens fiber array 100 and the loading end, by the lens light
Fibre array 100 is fixed on the loading end；
The tapered lensed fiber and the silicon-based electro-optic chip stretched out by the second end face of the lens fiber array 100
There is the coupled end face contact of coupling regime in 301 and realize that waveguide is aligned；
The matching fluid 305 is arranged in by the tapered lensed fiber of the second end face stretching of the lens fiber array 100
At the position of the coupled end face contact；
Wherein, optical fiber cladding has been removed by the tapered lensed fiber that the second end face of the lens fiber array 100 is stretched out
Layer.
Wherein, die bonding glue is conductive silver glue.
It should be noted that having on the coupling end face of silicon-based electro-optic chip 301 provided in this embodiment by coupling regime group
At area array, the spacing in lens fiber array 100 between each tapered lensed fiber is equal to each coupled zone on area array
The spacing in domain.Based on this mating structure, can be easier to realize the waveguide pair of tapered lensed fiber and corresponding coupling regime
Standard realizes the matching of mould spot.For example, the spacing of the end coupling area array of silicon-based electro-optic chip 301 is 250um, then lens light
Spacing in fibre array between each tapered lensed fiber is 250um；Alternatively, the end coupling region battle array of silicon-based electro-optic chip 301
The spacing of column is 127um, then the spacing in lens fiber array between each tapered lensed fiber is 127um.
Specifically, as shown in figure 3, in coupling unit provided in this embodiment, tapered lensed fiber array 100, silicon substrate
Photoelectric chip 301, substrate 302, die bonding glue 303 (wherein, die bonding glue 303 is usually conductive silver glue), ultraviolet glue
304, matching fluid 305 forms.Silicon-based electro-optic chip 301 be based on SOI technology production silicon photon chip or photoelectricity integrated chip,
Used silicon-based electro-optic chip 301 with a thickness of 0.7mm.The spacing of the end coupling area array of silicon-based electro-optic chip 301
Generally 250um or 127um.
Loading end is any surface of substrate, and the present embodiment is not specifically limited in this embodiment.Matching fluid is to realize that taper is saturating
The index matching of mirror optical fiber and coupling regime, therefore, when carrying out the assembling of the coupling unit, realize lens fiber array and
After the waveguide alignment of silicon-based electro-optic chip, only need to by matching fluid point at the position of tapered lensed fiber and coupled end face contact,
Realize index matching.
The coupling unit of chip provided in this embodiment and lens fiber array, using said lens fiber array and silicon substrate
Photoelectric chip forms coupling unit on substrate, only needs so that being fixed on stating in lens fiber array on substrate removes coat
Optical fiber on silicon-based electro-optic chip coupling regime realize waveguide be aligned, meet the matched requirement of coupled mode spot.Base
On the one hand plate plays the work fixed and supported to the lens fiber array and silicon-based electro-optic chip that are fixed thereon as loading end
With on the other hand, substrate can in time radiate to coupling unit as thermal component, it is worked to avoid coupling unit
Superheating phenomenon in journey.
Further, on the basis of the various embodiments described above, the thickness of the cover board is equal to the silicon-based electro-optic chip
Thickness.
The thickness of the coupling unit of chip provided in this embodiment and lens fiber array, cover board is equal to base photoelectric chip
Thickness, the coupling unit that ensure that assembling obtains are compact-sized.
Further, on the basis of the various embodiments described above, the thermal expansion system of the substrate and the silicon-based electro-optic chip
Number matching.
For example, using with the ceramics of silicon-based electro-optic chip similar thermal expansion coefficient or silica glass material as substrate.
The thermal expansion of the coupling unit of chip provided in this embodiment and lens fiber array, substrate and silicon-based electro-optic chip
Coefficient is equal, avoids after substrate and silicon-based electro-optic chip are heated, the deformation of the coupling unit as caused by degrees of expansion or
Person's damage.
Further, on the basis of the various embodiments described above, the substrate is by ceramic material or silica glass material structure
At.
Specifically, referring to Fig. 3, in coupling unit provided in this embodiment, the inversion of lens fiber array 100 is put in substrate
On 302 (i.e. the cover board of lens fiber array 100 is contacted with substrate 302, and V-groove is backwards to substrate), in lens fiber array 100
Tapered lensed fiber 102 is led with 301 coupled end surface wave of silicon-based electro-optic chip and is aligned.Lens fiber array 100 and silicon based opto-electronics core
Piece 301 is all bonded on substrate 302, and substrate 302 is directed at carrying platform as optical path, plays the fixed work with chip cooling of structure
With.Matching fluid 305 is added as needed in the coupling endface coupling regime of silicon-based electro-optic chip 301, realizes refraction of light path rate
Matching.
The present embodiment additionally provides a kind of opto-electronic device, the coupling including above-described chip Yu lens fiber array
Component.
Opto-electronic device can be photodetector, image intensifer etc., and the present embodiment is not particularly limited this.
Opto-electronic device provided in this embodiment includes said lens fiber array and the silicon-based electro-optic chip shape on substrate
At coupling unit, the coupling unit formation only need so that being fixed on stating in lens fiber array on substrate removes coat
Optical fiber on silicon-based electro-optic chip coupling regime realize waveguide be aligned, meet the matched requirement of coupled mode spot.Base
On the one hand plate plays the work fixed and supported to the lens fiber array and silicon-based electro-optic chip that are fixed thereon as loading end
With on the other hand, substrate can in time radiate to coupling unit as thermal component, it is worked to avoid coupling unit
Superheating phenomenon in journey.
A kind of method for assembling chip and the coupling unit of lens fiber array is present embodiments provided, including：
Step 1：Silicon-based electro-optic chip is fixed on to one end of substrate using bonded adhesives, the coupling end face with coupling regime
Close to substrate middle position.
For example, as shown in figure 3, silicon-based electro-optic chip 301 to be fixed on to one end of substrate 302 using die bonding glue 303,
Conductive silver glue is selected close to 302 middle position of substrate, die bonding glue 303 in end face with coupling regime, and gluing is uniform, no sky
Glue, glue thickness are controlled in 50 ± 20um.
Step 2：The inversion of tapered lensed fiber array is put on substrate, i.e., the cover board of fiber array is close to substrate, V-groove base
Backboard is to substrate.
For example, inversion is put on substrate 302, i.e. fiber array 100 using coupling cramp fixed lens fiber array 100
Cover board 103 close to substrate 302, V-groove substrate 101 is backwards to substrate 302.
Step 3：Tapered lensed fiber array and chip end face coupling regime are coupled and aligned using micropositioning stage, are adjusted to conjunction
It is filled after suitable coupling spacing using ultraviolet glue and is adhesively fixed in the gap of fiber array cover board and substrate.
For example, using micropositioning stage by tapered lensed fiber array 100 and 301 end coupling region couples of silicon-based electro-optic chip
Alignment is adjusted to suitable coupling spacing, is adjusted to after IL index is optimal, fills lens fiber array using ultraviolet glue 304
Cover board 103 and substrate 302 gap in, be adhesively fixed using ultraviolet light curing.
Step 4：Silicon-based electro-optic chip coupling end face and tapered lensed fiber array optical fiber head point on matching fluid with
Realize index matching.
For example, the taper as needed in the end coupling region of silicon-based electro-optic chip 301 and lens fiber array 100 is saturating
Upper matching fluid 305 is put between the conical head of mirror optical fiber 102 to realize index matching.
Present embodiments provide the tapered lensed fiber array with special requirement of customization, ceramic material or quartz material
Substrate, with end coupling region silicon-based electro-optic chip and fixed chip and fiber array bonded adhesives.Conical fiber
Array includes V-groove, cover board, and several tapered lensed fibers, the tapered lensed fiber that are clipped between V-groove substrate and cover board
It is fixed by V-groove, tapered lensed fiber grows V-groove substrate and cover board end face 0.5-1.0mm, the taper of tapered lensed fiber
Angle is 92.5 ± 2.5 °.
Coupling unit provided in this embodiment realizes fiber array and silicon based opto-electronics with more tapered lensed fibers
The coupling of chip, while meeting array coupling and being matched with mould spot, it is easy to accomplish.In addition, chip provided in this embodiment and thoroughly
The fixed method of mirror fiber array is simple and reliable, easily operated.The coupled structure of formation is simple, compact, minimizes convenient for product
Encapsulation.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the embodiments of the present invention, and
It is non-that it is limited；Although the embodiments of the present invention are described in detail referring to foregoing embodiments, this field
Those of ordinary skill should understand that：It is still possible to modify the technical solutions described in the foregoing embodiments or right
Some or all of the technical features are equivalently replaced；And these are modified or replaceed, and do not make corresponding technical solution
Essence is detached from the range of each embodiment technical solution of the embodiment of the present invention.
Claims (9)
1. a kind of lens fiber array, which is characterized in that the tapered lensed fiber including V-groove substrate, cover board and preset quantity；
The V-groove that item number is equal to the preset quantity is provided on the first surface of the V-groove substrate, between each V-groove that
This is parallel；
Each tapered lensed fiber is mounted in a V-groove on the V-groove substrate, and by the V-groove substrate
Second surface and third surface are protruding；
The cover board is fixed on the first surface, with the tapered lensed fiber of fixed installation；
Wherein, the second surface and the third surface are one group of opposite face of the V-groove substrate；Each tapered lens light
Spacing and desire between fibre and the lens fiber array form the spacing between the coupling regime on the chip of coupling unit
Match.
2. lens fiber array according to claim 1, which is characterized in that further include tail glue；
The region except the cover board of the tail glue setting on the first surface, to fix tapered lensed fiber.
3. lens fiber array according to claim 1, which is characterized in that close to the second surface in the cover board
End face and the second surface are in same plane；
The optical fiber extension elongation that each tapered lensed fiber stretches out the second surface is the first preset length, and any two
Difference between the corresponding optical fiber extension elongation of tapered lensed fiber is less than the second preset length.
4. lens fiber array according to claim 1, which is characterized in that the two of each V-groove on the V-groove substrate
Angle between a groove face is matched with the angle of taper for the tapered lensed fiber being mounted in the V-groove.
5. the coupling unit of a kind of chip and lens fiber array, which is characterized in that described in any item including claim 1-4
Lens fiber array, silicon-based electro-optic chip, substrate, die bonding glue, ultraviolet glue and matching fluid；
The die bonding glue is arranged between the silicon-based electro-optic chip and the loading end of the substrate, by the silicon substrate light
Electrical chip is fixed on the loading end；
The ultraviolet glue is arranged between the lens fiber array and the loading end, and the lens fiber array is fixed
On the loading end；
There is coupling in the tapered lensed fiber and the silicon-based electro-optic chip stretched out by the second end face of the lens fiber array
It closes the coupled end face contact in region and realizes that waveguide is aligned；
The matching fluid, which is arranged in, to be coupled by the tapered lensed fiber of the second end face stretching of the lens fiber array with described
At the position of end face contact；
Wherein, optical fiber clad has been removed by the tapered lensed fiber that the second end face of the lens fiber array is stretched out.
6. coupling unit according to claim 5, which is characterized in that the thickness of the cover board is equal to the silicon based opto-electronics core
The thickness of piece.
7. coupling unit according to claim 5, which is characterized in that the heat of the substrate and the silicon-based electro-optic chip is swollen
Swollen coefficients match.
8. coupling unit according to claim 5, which is characterized in that the substrate is by ceramic material or quartz glass material
Material is constituted.
9. a kind of opto-electronic device, which is characterized in that including the described in any item chips of claim 5-8 and lens fiber array
Coupling unit.
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| CN111948761A (en) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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