CN208112858U - A kind of encapsulating structure of microphone - Google Patents
A kind of encapsulating structure of microphone Download PDFInfo
- Publication number
- CN208112858U CN208112858U CN201820368122.XU CN201820368122U CN208112858U CN 208112858 U CN208112858 U CN 208112858U CN 201820368122 U CN201820368122 U CN 201820368122U CN 208112858 U CN208112858 U CN 208112858U
- Authority
- CN
- China
- Prior art keywords
- airflow duct
- open end
- microphone
- inner chamber
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004891 communication Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a kind of encapsulating structures of microphone, microphone chip, asic chip including the closing inner chamber surrounded by encapsulating housing, and in closing inner chamber；It further include the airflow duct for being located in closing inner chamber and having the first open end, the second open end, the first open end, the second open end of the airflow duct pass through the through-hole being arranged on encapsulating housing respectively and be in communication with the outside；The acoustic aperture for being connected to the airflow duct and closing inner chamber is additionally provided on the side wall of the airflow duct.The encapsulating structure of the utility model can successfully be exported when the external world has larger air-flow to blow over microphone by airflow duct, so as to avoid air-flow from entering the vibrating diaphragm of damage microphone chip in closing inner chamber, improve the anti-insufflation potential of microphone.
Description
Technical field
The utility model relates to electroacoustic conversion arts, more specifically, the utility model relates to a kind of encapsulation knots of microphone
Structure more particularly to a kind of microphone of anti-air blowing.
Background technique
Vibrating diaphragm, back pole plate are the important components in microphone, and vibrating diaphragm, back pole plate constitute capacitor and be integrated in silicon wafer
On, realize the conversion of acoustic-electric.By vibration of membrane of shaking, change the distance between vibrating diaphragm and back pole plate, so that voice signal be turned
It is changed to electric signal.
When MEMS microphone by mechanical shock, blow, fall when, MEMS chip therein will receive the punching of biggish acoustic pressure
It hits, this often makes vibrating diaphragm be caused rupture impaired by excessive pressure, so as to cause the failure of entire microphone.To understand
Certainly this problem, it is common practice to pressure relief device be set on vibrating diaphragm, can be buffered suffered by vibrating diaphragm by the pressure relief device
Impact.This structure there are the drawbacks of be：The lower limit that the quantity of pressure release passage must satisfy blow gas pressure release can be only achieved pre-
Phase effect, but excessive hole is opened on film, the integral rigidity of film will certainly be reduced；And in falling process, mistake
More holes and fluting design easily make vibrating diaphragm generate rupture, and reliability is very poor.In addition pressure relief device is set on vibrating diaphragm, increase
The difficulty and cost of manufacture.
Utility model content
One purpose of the utility model is to provide a kind of encapsulating structure of microphone.
One aspect according to the present utility model provides a kind of encapsulating structure of microphone, including is surrounded by encapsulating housing
Closing inner chamber, and microphone chip, asic chip in closing inner chamber；It further include being located in closing inner chamber and having
The airflow duct of first open end, the second open end, the first open end, the second open end of the airflow duct pass through respectively to be set
The through-hole set on encapsulating housing is in communication with the outside；The connection airflow duct is additionally provided on the side wall of the airflow duct
With the acoustic aperture of closing inner chamber.
Optionally, the encapsulating housing includes package substrate and the package casing that is arranged on package substrate, the envelope
Casing includes cover board and sidewall portion.
Optionally, the microphone chip, asic chip are mounted on package substrate.
Optionally, the first open end of the airflow duct is arranged on the cover board of package casing, the airflow duct
Second open end is arranged in the sidewall portion of package casing.
Optionally, the airflow duct is L-shaped or C-shaped.
Optionally, the airflow duct is straight tube, and the first open end is arranged on the cover board of package casing, the air-flow
Second open end of conduit is arranged on package substrate.
Optionally, the side on airflow duct side wall far from microphone chip is arranged in the acoustic aperture.
Optionally, the package substrate is circuit board.
The encapsulating structure of the utility model can be suitable by airflow duct when the external world has larger air-flow to blow over microphone
It exports sharply, so as to avoid air-flow from entering the vibrating diaphragm of damage microphone chip in closing inner chamber, improves microphone
Anti- insufflation potential.
By the detailed description referring to the drawings to the exemplary embodiment of the utility model, the utility model it is other
Feature and its advantage will become apparent.
Detailed description of the invention
The attached drawing for constituting part of specification describes the embodiments of the present invention, and uses together with the description
In explanation the principles of the present invention.
Fig. 1 is the schematic diagram of the utility model encapsulating structure.
Fig. 2 is the schematic diagram of another embodiment of the utility model encapsulating structure.
Specific embodiment
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should be noted that：Unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
With reference to Fig. 1, a kind of encapsulating structure of microphone provided by the utility model, including the closing surrounded by encapsulating housing
Inner cavity 5, in one specific embodiment of the utility model, the encapsulating housing includes package substrate 1, package casing 2, institute
It states package casing 2 and the attachment of package substrate 1 together, forms the closing inner chamber 5 of microphone.Package substrate 1 can be using this
The circuit board of field technical staff；Package casing 2 may include cover board and the sidewall portion for being formed in side edge thereof position, described
Sidewall portion and cover board are defined with chamber open at one end.The open end of package casing 2 is assemblied on package substrate 1, the two
Together form the encapsulating structure of microphone.
It further include microphone chip 3, asic chip 4 in closing inner chamber, wherein microphone chip 3 is by sound
Signal is converted into the transducer part of electric signal, can be made of MEMS (MEMS) technique.Microphone chip 3 includes
The components such as vibrating diaphragm, the backplane of substrate and setting on substrate.Between vibrating diaphragm and backplane have a certain distance so that the two it
Between constitute a capacitor arrangement.The structure and its working principle of this microphone chip 3 and asic chip 4 belong to this field skill
The common knowledge of art personnel, no longer illustrates herein.
Microphone chip 3 and asic chip 4 may be mounted on the inner wall of package casing 2, at the utility model one
In specific embodiment, microphone chip 3 and asic chip 4 can be mounted on respectively on package substrate 1, two chips it
Between be connected by way of lead.It is also possible that microphone chip 3 and asic chip 4 are welded respectively by way of planting tin ball
It connects on package substrate 1, to realize two chips and the mechanical connection of package substrate 1 and be electrically connected, this belongs to this field skill
The common knowledge of art personnel, no longer illustrates herein.
The encapsulating structure of the utility model, further includes the airflow duct 6 in closing inner chamber 5, and the airflow duct 6 is opposite
Two open ends can be denoted as the first open end 7, the second open end 8.The airflow duct 6 is located in closing inner chamber 5, and the
One open end 7, the second open end 8 are in communication with the outside by the through-hole being arranged on encapsulating housing respectively.
Specifically, in one specific embodiment of the utility model, the first open end 7 of the airflow duct 6 can
To be arranged on the cover board of package casing 2, which is in communication with the outside by the through-hole being arranged on cover board
Get up.Second open end 8 of the airflow duct 6 can be set in the sidewall portion of package casing 2, so that second open end
8 can be in communication with the outside by the through-hole being arranged in sidewall portion.
It, can since the first open end 7 of airflow duct 6, the second open end 8 are located in cover board and sidewall portion
Make the whole L-shaped structure of airflow duct 6 or C-shaped configuration with selection.Airflow duct 6 also can choose straight tube structure, to incline
Oblique mode is arranged in closing inner chamber 5.Certainly, for a person skilled in the art, airflow duct 6 also can choose it
Font no longer illustrates herein.
It is additionally provided with the acoustic aperture 60 of connection closing inner chamber 5 on the side wall of the airflow duct 6, is connected to and is sealed by acoustic aperture 60
Inner cavity 5 and airflow duct 6 are closed, extraneous sound is entered in closing inner chamber 5 by airflow duct 6, acoustic aperture 60,
And be finally applied on microphone chip 3, to drive the vibrating diaphragm sounding of microphone chip 3.
Sound can enter in airflow duct 6 from the first open end 7, certainly, for a person skilled in the art,
Sound can also enter in airflow duct 6 from the second open end 8, and those skilled in the art can carry out certainly according to specific requirements
Row selection, this is not restricted.
With reference to Fig. 1, when the top that the external world has larger air-flow to blow over microphone, extraneous air-flow can be led from cap locations
Enter in airflow duct 6, and smoothly exported from sidewall portion, damages microphone so as to avoid air-flow from entering in closing inner chamber 5
The vibrating diaphragm of chip 3 improves the anti-insufflation potential of microphone.Even if there is air-flow that can enter by acoustic aperture 60 in airflow duct 6
Inside closing inner chamber 5, this air-flow is also weakened by airflow duct 6 significantly, that is to say, that can pass through gas by most air-flow
Conductance pipe 6 exports, and fraction air-flow is entered inside closing inner chamber 5, will not be damaged to microphone chip.
And the airflow duct 6 can stop light to enter directly into closing inner chamber 5, improve the anti-light of microphone and make an uproar
Performance.
In one preferred embodiment of the utility model, the setting of acoustic aperture 60 is separate on 6 side wall of airflow duct
The side of microphone chip 3.Such as the view direction with reference to Fig. 1, the upper wall in airflow duct 6 can be set in acoustic aperture 60, with weak
Change influence of the air-flow flowed out through acoustic aperture 60 to microphone chip 3.
The first open end 7, the second open end 8 of the utility model airflow duct 6 can also be respectively provided on the cover board, side wall
In portion or on package substrate 1.
In another specific embodiment of the utility model, with reference to Fig. 2, the airflow duct 6 is straight tube, the
One open end 7 is arranged on the cover board of package casing 2, allow first open end 7 by the through-hole that is arranged on cover board with
External world's connection is got up.Second open end 8 of the airflow duct 6 can be set on package substrate 1, so that second open end
8 can be in communication with the outside by the through-hole being arranged on package substrate 1.
It, can be in order to the quick export of air-flow using the airflow duct 6 of straight tube-like.Acoustic aperture 60 can be set in airflow duct
Far from the side of microphone chip 3 on 6 side walls, to weaken influence of the air-flow flowed out through acoustic aperture 60 to microphone chip 3, herein
No longer illustrate
Although being described in detail by some specific embodiments of the example to the utility model, this field
It is to be understood by the skilled artisans that above example merely to be illustrated, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case where, to above embodiments
It modifies.The scope of the utility model is defined by the following claims.
Claims (8)
1. a kind of encapsulating structure of microphone, it is characterised in that：Including the closing inner chamber surrounded by encapsulating housing, and it is located at envelope
Close microphone chip, the asic chip in inner cavity；It further include being located in closing inner chamber and there is the first open end, the second open end
Airflow duct, the first open end, the second open end of the airflow duct pass through the through-hole being arranged on encapsulating housing respectively
It is in communication with the outside；The acoustic aperture for being connected to the airflow duct and closing inner chamber is additionally provided on the side wall of the airflow duct.
2. encapsulating structure according to claim 1, it is characterised in that：The encapsulating housing includes package substrate and setting
Package casing on package substrate, the package casing include cover board and sidewall portion.
3. encapsulating structure according to claim 2, it is characterised in that：The microphone chip, asic chip are mounted on envelope
It fills on substrate.
4. encapsulating structure according to claim 2, it is characterised in that：The first open end setting of the airflow duct is being sealed
On the cover board of casing, the second open end of the airflow duct is arranged in the sidewall portion of package casing.
5. encapsulating structure according to claim 4, it is characterised in that：The airflow duct is L-shaped or C-shaped.
6. encapsulating structure according to claim 2, it is characterised in that：The airflow duct is straight tube, the first open end
It is arranged on the cover board of package casing, the second open end of the airflow duct is arranged on package substrate.
7. encapsulating structure according to any one of claims 1 to 6, it is characterised in that：The acoustic aperture is arranged in airflow duct
Far from the side of microphone chip on side wall.
8. encapsulating structure according to claim 2, it is characterised in that：The package substrate is circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820368122.XU CN208112858U (en) | 2018-03-16 | 2018-03-16 | A kind of encapsulating structure of microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820368122.XU CN208112858U (en) | 2018-03-16 | 2018-03-16 | A kind of encapsulating structure of microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208112858U true CN208112858U (en) | 2018-11-16 |
Family
ID=64126800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820368122.XU Expired - Fee Related CN208112858U (en) | 2018-03-16 | 2018-03-16 | A kind of encapsulating structure of microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208112858U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620966A (en) * | 2019-10-21 | 2019-12-27 | 张丁山 | Microphone protective cover |
| CN113766372A (en) * | 2021-09-09 | 2021-12-07 | 维沃移动通信有限公司 | Electronic equipment |
-
2018
- 2018-03-16 CN CN201820368122.XU patent/CN208112858U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620966A (en) * | 2019-10-21 | 2019-12-27 | 张丁山 | Microphone protective cover |
| CN110620966B (en) * | 2019-10-21 | 2020-11-06 | 张丁山 | Microphone protective cover |
| CN113766372A (en) * | 2021-09-09 | 2021-12-07 | 维沃移动通信有限公司 | Electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181116 |