CN208111467U - A kind of infrared array detector novel package structure - Google Patents
A kind of infrared array detector novel package structure Download PDFInfo
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- CN208111467U CN208111467U CN201820778896.XU CN201820778896U CN208111467U CN 208111467 U CN208111467 U CN 208111467U CN 201820778896 U CN201820778896 U CN 201820778896U CN 208111467 U CN208111467 U CN 208111467U
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- supporting plate
- array detector
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Abstract
The utility model relates to infrared array detector encapsulating structure, specifically a kind of infrared array detector novel package structure.The utility model solve the problems, such as traditional infrared array detector encapsulating structure be unfavorable for encapsulation miniaturization, manufacturing process is cumbersome, cost of manufacture is high.A kind of infrared array detector novel package structure, including cup-shaped casing, cover board, window glass, TEC chip, red copper supporting plate, glass circuit board, readout circuit chip, sensitive detector, pin；Wherein, the rim of a cup of cup-shaped casing is upward；Cover board is covered on the rim of a cup of cup-shaped casing, and the face center perforation of cover board offers optical transmission window；Window glass is in optical transmission window；The lower surface of TEC chip and the inner bottom wall center of cup-shaped casing are fixed；The lower surface center of red copper supporting plate and the upper surface of TEC chip are fixed；The lower surface of glass circuit board and the upper surface of red copper supporting plate are brazed and fix.The utility model is encapsulated suitable for infrared array detector.
Description
Technical field
The utility model relates to infrared array detector encapsulating structure, specifically a kind of infrared array detector novel encapsulated
Structure.
Background technique
Traditional infrared array detector encapsulating structure is typically based on ceramic circuit board and is made, and causes its generally existing
It is unfavorable for the miniaturization of encapsulation, the problem that manufacturing process is cumbersome, cost of manufacture is high, is specifically described as follows：First, due to ceramic electrical
The hardness of road plate is very high, causes its surface to be difficult to form location structure, therefore in the production process：1, readout circuit chip
It can only be adhered to the upper surface of ceramic circuit board, thus cause the integral thickness of encapsulating structure larger, to be unfavorable for encapsulation
Miniaturization.2, the method that readout circuit chip and ceramic circuit board can only rely on alignment mark（This method needs under the microscope
Operation）It is positioned, thus causes the manufacturing process of encapsulating structure cumbersome.Second, the processing cost due to ceramic circuit board is high,
Cause the cost of manufacture of encapsulating structure high.Based on this, it is necessary to a kind of completely new infrared array detector encapsulating structure is invented, with
Solve the above problem existing for traditional infrared array detector encapsulating structure.
Summary of the invention
The utility model is unfavorable for the miniaturization of encapsulation, production in order to solve traditional infrared array detector encapsulating structure
The problem that process is cumbersome, cost of manufacture is high provides a kind of infrared array detector novel package structure.
The utility model adopts the following technical scheme that realization：
A kind of infrared array detector novel package structure, including cup-shaped casing, cover board, window glass, TEC chip, purple
Copper supporting plate, glass circuit board, readout circuit chip, sensitive detector, pin；Wherein, the rim of a cup of cup-shaped casing is upward；Cover board envelope
It is placed on the rim of a cup of cup-shaped casing, and the face center perforation of cover board offers optical transmission window；Window glass is flush-mounted in light inlet window
In mouthful；The lower surface of TEC chip and the inner bottom wall center of cup-shaped casing are fixed；The lower surface center of red copper supporting plate and TEC chip
Upper surface fix；The lower surface of glass circuit board and the upper surface of red copper supporting plate are brazed and fix, and the front of glass circuit board
Edge and back edge exceed the leading edge and back edge of red copper supporting plate respectively；The face center perforation of glass circuit board offers rectangular
Location hole；The leading edge and back edge of glass circuit board respectively offer the round small gap of one and a half；The left edge of glass circuit board
A pair of semicircle big gap is respectively offered with right hand edge；Readout circuit chip is flush-mounted in rectangular positioning hole, and reading circuit core
The upper surface of piece is flushed with the upper surface of glass circuit board；In the lower surface of sensitive detector and the upper surface of readout circuit chip
Centre is fixed；The number of pin is two rows；Two rows of pins extend through the bottom wall leading edge for being fixed on cup-shaped casing and bottom wall back
Edge, and the upper end of two rows of pins is arranged in respectively in two rows of semicircle small gap.
Compared with traditional infrared array detector encapsulating structure, a kind of infrared array detector described in the utility model
Novel package structure, instead of ceramic circuit board, thus has following advantage using red copper supporting plate and glass circuit board：First,
Compared to ceramic circuit board, the surface of glass circuit board formation location structure easy to process.Therefore, the utility model passes through in glass
The surface of fine circuit board processes to form rectangular location hole and two rows of semicircle small gap, has following advantage：1, practical at this
In novel, readout circuit chip is flush-mounted in rectangular positioning hole, the integral thickness of encapsulating structure is thus effectively reduced, to have
Conducive to the miniaturization of encapsulation.2, in the present invention, only readout circuit chip need to be flush-mounted in rectangular positioning hole can be real
The positioning of circuit chip is now read out, only ceramic circuit board need to be can be realized in two rows of semicircle small gap and two rows of pin cooperations
Positioning, the two are not necessarily to be positioned by the method for alignment mark, are thus effectively simplified the manufacturing process of encapsulating structure.Its
Two, compared to ceramic circuit board, the processing cost of glass circuit board is lower, thus effectively reduces being fabricated to for encapsulating structure
This.In addition, compared to ceramic circuit board, the heating conduction of red copper supporting plate is more preferable, so that TEC chip can be quickly to glass
Circuit board, readout circuit chip, sensitive detector freeze.
The utility model is structurally reasonable, ingenious in design, efficiently solves traditional infrared array detector encapsulating structure not
Conducive to the miniaturization of encapsulation, the problem that manufacturing process is cumbersome, cost of manufacture is high, it is suitable for infrared array detector and encapsulates.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the partial structure diagram of the utility model.
Fig. 3 be red copper supporting plate in the utility model, glass circuit board, readout circuit chip, sensitive detector structure show
It is intended to.
Fig. 4 is that red copper supporting plate in the utility model, glass circuit board, readout circuit chip, the structure of sensitive detector are quick-fried
Fried figure.
In figure：1- cup-shaped casing, 2- cover board, 3- window glass, 4-TEC chip, 5- red copper supporting plate, 6- glass circuit board,
7- readout circuit chip, 8- sensitive detector, 9- pin, the semicircle small gap of 10-, the semicircle big gap of 11-.
Specific embodiment
A kind of infrared array detector novel package structure, including cup-shaped casing 1, cover board 2, window glass 3, TEC chip
4, red copper supporting plate 5, glass circuit board 6, readout circuit chip 7, sensitive detector 8, pin 9；Wherein, the rim of a cup of cup-shaped casing 1
Upward；Cover board 2 is covered on the rim of a cup of cup-shaped casing 1, and the face center perforation of cover board 2 offers optical transmission window；Window glass
Glass 3 is in optical transmission window；The lower surface of TEC chip 4 and the inner bottom wall center of cup-shaped casing 1 are fixed；Under red copper supporting plate 5
The upper surface of face center and TEC chip 4 is fixed；The lower surface of glass circuit board 6 and the upper surface soldering of red copper supporting plate 5 are solid
It is fixed, and the leading edge of glass circuit board 6 and back edge exceed the leading edge and back edge of red copper supporting plate 5 respectively；Glass circuit board 6
Face center perforation offer rectangular location hole；The leading edge and back edge of glass circuit board 6 respectively offer one and a half circle
Small gap 10；The left edge and right hand edge of glass circuit board 6 respectively offer a pair of semicircle big gap 11；Readout circuit chip 7
Flush-mounted in rectangular positioning hole, and the upper surface of readout circuit chip 7 is flushed with the upper surface of glass circuit board 6；Photosensitive detection
The lower surface of device 8 and the upper face center of readout circuit chip 7 are fixed；The number of pin 9 is two rows；Two rows of pins 9 pass through respectively
The bottom wall leading edge and bottom wall back edge due to cup-shaped casing 1 are fastened, and the upper end of two rows of pins 9 is arranged in two rows of semicircles respectively
In the small gap 10 of shape.
When it is implemented, the output end of readout circuit chip 7 is connect with the input terminal of glass circuit board 6；Sensitive detector 8
Output end connect with the input terminal of readout circuit chip 7；The upper end of two rows of pins 9 is connect with the output end of glass circuit board 6.
The lower surface of readout circuit chip 7 is adhesively fixed by high thermal conductivity glue-line and the upper face center of red copper supporting plate 5.Red copper supporting plate 5
With a thickness of 0.2mm；The thickness of glass circuit board 6, the thickness of readout circuit chip 7 are 0.8mm.
Claims (4)
1. a kind of infrared array detector novel package structure, it is characterised in that：Including cup-shaped casing（1）, cover board（2）, window
Glass（3）, TEC chip（4）, red copper supporting plate（5）, glass circuit board（6）, readout circuit chip（7）, sensitive detector（8）, draw
Foot（9）；Wherein, cup-shaped casing（1）Rim of a cup upward；Cover board（2）It is covered in cup-shaped casing（1）Rim of a cup on, and cover board（2）'s
Face center perforation offers optical transmission window；Window glass（3）In optical transmission window；TEC chip（4）Lower surface and cup
Shape shell（1）Inner bottom wall center fix；Red copper supporting plate（5）Lower surface center and TEC chip（4）Upper surface fix；Glass
Fine circuit board（6）Lower surface and red copper supporting plate（5）Upper surface be brazed and fix, and glass circuit board（6）Leading edge and after
Edge exceeds red copper supporting plate respectively（5）Leading edge and back edge；Glass circuit board（6）Face center perforation offer it is rectangular
Location hole；Glass circuit board（6）Leading edge and back edge respectively offer the round small gap of one and a half（10）；Glass circuit board
（6）Left edge and right hand edge respectively offer a pair of semicircle big gap（11）；Readout circuit chip（7）Flush-mounted in rectangular positioning
In hole, and readout circuit chip（7）Upper surface and glass circuit board（6）Upper surface flush；Sensitive detector（8）Following table
Face and readout circuit chip（7）Upper face center fix；Pin（9）Number be two rows；Two rows of pins（9）It extends through solid
Due to cup-shaped casing（1）Bottom wall leading edge and bottom wall back edge, and two rows of pin（9）Upper end be arranged in two rows of semicircles respectively
The small gap of shape（10）It is interior.
2. a kind of infrared array detector novel package structure according to claim 1, it is characterised in that：Reading circuit core
Piece（7）Output end and glass circuit board（6）Input terminal connection；Sensitive detector（8）Output end and readout circuit chip
（7）Input terminal connection；Two rows of pins（9）Upper end and glass circuit board（6）Output end connection.
3. a kind of infrared array detector novel package structure according to claim 1, it is characterised in that：Reading circuit core
Piece（7）Lower surface pass through high thermal conductivity glue-line and red copper supporting plate（5）Upper face center be adhesively fixed.
4. a kind of infrared array detector novel package structure according to claim 1, it is characterised in that：Red copper supporting plate
（5）With a thickness of 0.2mm；Glass circuit board（6）Thickness, readout circuit chip（7）Thickness be 0.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820778896.XU CN208111467U (en) | 2018-05-24 | 2018-05-24 | A kind of infrared array detector novel package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820778896.XU CN208111467U (en) | 2018-05-24 | 2018-05-24 | A kind of infrared array detector novel package structure |
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| CN208111467U true CN208111467U (en) | 2018-11-16 |
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| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN111031727A (en) * | 2019-12-26 | 2020-04-17 | 中国电子科技集团公司第四十四研究所 | Parallel seam welding packaging point frequency source assembly and manufacturing method thereof |
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| US11191477B2 (en) | 2017-11-16 | 2021-12-07 | Bruin Biometrics, Llc | Strategic treatment of pressure ulcer using sub-epidermal moisture values |
| US11253192B2 (en) | 2010-05-08 | 2022-02-22 | Bruain Biometrics, LLC | SEM scanner sensing apparatus, system and methodology for early detection of ulcers |
| US11284810B2 (en) | 2015-04-24 | 2022-03-29 | Bruin Biometrics, Llc | Apparatus and methods for determining damaged tissue using sub-epidermal moisture measurements |
| US11304652B2 (en) | 2017-02-03 | 2022-04-19 | Bbi Medical Innovations, Llc | Measurement of tissue viability |
| US11337651B2 (en) | 2017-02-03 | 2022-05-24 | Bruin Biometrics, Llc | Measurement of edema |
| US11471094B2 (en) | 2018-02-09 | 2022-10-18 | Bruin Biometrics, Llc | Detection of tissue damage |
| US11627910B2 (en) | 2017-02-03 | 2023-04-18 | Bbi Medical Innovations, Llc | Measurement of susceptibility to diabetic foot ulcers |
| US11642075B2 (en) | 2021-02-03 | 2023-05-09 | Bruin Biometrics, Llc | Methods of treating deep and early-stage pressure induced tissue damage |
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| US11779265B2 (en) | 2010-05-08 | 2023-10-10 | Bruin Biometrics, Llc | SEM scanner sensing apparatus, system and methodology for early detection of ulcers |
| US11253192B2 (en) | 2010-05-08 | 2022-02-22 | Bruain Biometrics, LLC | SEM scanner sensing apparatus, system and methodology for early detection of ulcers |
| US11832929B2 (en) | 2015-04-24 | 2023-12-05 | Bruin Biometrics, Llc | Apparatus and methods for determining damaged tissue using sub-epidermal moisture measurements |
| US11284810B2 (en) | 2015-04-24 | 2022-03-29 | Bruin Biometrics, Llc | Apparatus and methods for determining damaged tissue using sub-epidermal moisture measurements |
| US11534077B2 (en) | 2015-04-24 | 2022-12-27 | Bruin Biometrics, Llc | Apparatus and methods for determining damaged tissue using sub epidermal moisture measurements |
| US11627910B2 (en) | 2017-02-03 | 2023-04-18 | Bbi Medical Innovations, Llc | Measurement of susceptibility to diabetic foot ulcers |
| US11304652B2 (en) | 2017-02-03 | 2022-04-19 | Bbi Medical Innovations, Llc | Measurement of tissue viability |
| US11337651B2 (en) | 2017-02-03 | 2022-05-24 | Bruin Biometrics, Llc | Measurement of edema |
| US11191477B2 (en) | 2017-11-16 | 2021-12-07 | Bruin Biometrics, Llc | Strategic treatment of pressure ulcer using sub-epidermal moisture values |
| US11426118B2 (en) | 2017-11-16 | 2022-08-30 | Bruin Biometrics, Llc | Strategic treatment of pressure ulcer using sub-epidermal moisture values |
| US11471094B2 (en) | 2018-02-09 | 2022-10-18 | Bruin Biometrics, Llc | Detection of tissue damage |
| US11980475B2 (en) | 2018-02-09 | 2024-05-14 | Bruin Biometrics, Llc | Detection of tissue damage |
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| US11342696B2 (en) | 2018-10-11 | 2022-05-24 | Bruin Biometrics, Llc | Device with disposable element |
| US11600939B2 (en) | 2018-10-11 | 2023-03-07 | Bruin Biometrics, Llc | Device with disposable element |
| GB2591711A (en) * | 2018-10-11 | 2021-08-04 | Bruin Biometrics Llc | Device with disposable element |
| US11824291B2 (en) | 2018-10-11 | 2023-11-21 | Bruin Biometrics, Llc | Device with disposable element |
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN109346534B (en) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | Ceramic tube shell structure and packaging structure thereof |
| CN111031727B (en) * | 2019-12-26 | 2021-07-06 | 中国电子科技集团公司第四十四研究所 | Parallel seam welding packaging point frequency source assembly and manufacturing method thereof |
| CN111031727A (en) * | 2019-12-26 | 2020-04-17 | 中国电子科技集团公司第四十四研究所 | Parallel seam welding packaging point frequency source assembly and manufacturing method thereof |
| US11642075B2 (en) | 2021-02-03 | 2023-05-09 | Bruin Biometrics, Llc | Methods of treating deep and early-stage pressure induced tissue damage |
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