CN208111438U - Mixed printing circuit board - Google Patents
Mixed printing circuit board Download PDFInfo
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- CN208111438U CN208111438U CN201820219230.0U CN201820219230U CN208111438U CN 208111438 U CN208111438 U CN 208111438U CN 201820219230 U CN201820219230 U CN 201820219230U CN 208111438 U CN208111438 U CN 208111438U
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Abstract
This application discloses a kind of mixed printing circuit boards, it includes low frequency substrate, high frequency substrate and the monolithic integrated microwave circuit crystal grain being mounted on low frequency substrate, low frequency substrate includes the first low frequency substrate and the second low frequency substrate, high frequency substrate includes the first high frequency substrate and the second high frequency substrate, first high frequency substrate and the second high frequency substrate are laminated to the surface of the second low frequency substrate, and first is provided with interval between high frequency substrate and the second high frequency substrate, first low frequency substrate is located in interval and is laminated to the surface of the second low frequency substrate, monolithic integrated microwave circuit crystal grain is located in interval and is installed on a surface of the first low frequency substrate, first high frequency substrate and the second high frequency substrate surface are respectively equipped with first, second radiating element, first, second radiating element is electrically connected with monolithic integrated microwave circuit crystal grain respectively.The application improves the functional complexity of circuit, reduces costs, and reduces stray inductance to obtain better bandwidth of operation and improves the radio-frequency performance of system.
Description
Technical field
This application involves technical field of integrated circuits, and more specifically, this application involves a kind of mixed printing circuit boards.
Background technique
Currently, traditional chip module encapsulation is by using multiple discrete ICs in technical field of integrated circuits
(IC, Integrated Circuits) and multiple active and passive electronic components composition.Using lacking for these conventional methods
Point is that volume is big, and power consumption is big, signal wire length, as working frequency is continuously improved, has become a restriction and improves modularity
The serious problems of energy.With use the legacy system of multiple discrete ICs and multiple active and passive electronic components composition not
Together, defect of multi-chip module (MCM, the Multi-Chip Module) encapsulation technology due to overcoming discrete component, is obtained in recent years
Obtained significant progress.
But system in package (SiP, System-In- are given in the reduction of package dimension and the raising of running frequency
Package) manufacturer brings some challenges.Due to the limitation of technology and integrated, the cost of circuit substrate of different characteristics material
It greatly improves.In addition, being then likely to require on the high frequency performance of module sometimes due to manufacturability issues and making compromise.
Industrial widely used typical case's MCM substrate is low-temperature co-fired ceramics (LTCC, Co-fired Ceramics), pottery
Porcelain and laminated glass fiber printed circuit board, every kind of material have its merits and demerits：
1, LTCC, although it has good radio-frequency performance since loss tangent constant is low, substrate is easy warpage, schemes
Case is lower than the ceramic substrate accuracy that film is handled, and manufacturing cost is high.
2, ceramic, the substrate based on film has radio frequency and microwave property best in above-mentioned all material.But due to
Its cost is very high, so should be used for necessary place.Meanwhile material itself is very frangible, it should be specifically noted that installation.This
Outside, alternative substrate thickness is also limited, therefore limits the flexibility of design.
3, laminated glass fibrous material selects the cost of thickness low, and flexibility is big.It is multiple to realize that a large amount of number of plies can be imputed
Miscellaneous performance.However, having a disadvantage in that them in the high loss characteristic of microwave frequency band.
Fig. 1 shows a kind of MCM scheme using conventional hybrid substrate design.In this type of design, high frequency monolithic is micro-
Wave integrated circuit (MMIC, Monolithic Microwave Integrated Circuits) crystal grain is mounted on by ceramics and has
On the electric hybrid board of machine laminated printed circuit boards composition.It is electrically connected between MMIC crystal grain and substrate by bonding wire.Due to logical
The physical thickness of the difference in height and MMIC crystal grain that are frequently located between the bonding welding pad and substrate surface at the top of crystal grain, bonding
The length of lead cannot be too short, and in practical situations, the length of bonding wire is about between 50 μm to 100 μm.Due to this
Too long bonding wire lengths, and its significant intrinsic stray inductance, therefore will limit the radio-frequency performance of system.
In addition, the number of plies for being laminated with machine laminated printed circuit boards in structure shown in FIG. 1 is very limited, it is possible to reduce whole
The complexity of a system function, this is undesirable.
In view of this, it is necessory to provide, a kind of manufacturing cost is low, circuit function is complicated and bandwidth of operation preferably mixes
Close printed circuit board.
Summary of the invention
The purpose of the application is：Overcome the deficiencies of the prior art and provide a kind of manufacturing cost is low, circuit function it is complicated with
And the better mixed printing circuit substrate of bandwidth of operation.
In order to realize above-mentioned application purpose, this application provides a kind of mixed printing circuit boards comprising low frequency substrate, height
Frequency substrate and monolithic integrated microwave circuit (MMIC, Multi-Chip Module) crystal grain, the MMIC crystal grain is installed on described low
On frequency substrate, wherein the low frequency substrate includes the first low frequency substrate and the second low frequency substrate, and the high frequency substrate includes first
High frequency substrate and the second high frequency substrate, first high frequency substrate and the second high frequency substrate are laminated to the second low frequency substrate
One surface, and interval is provided between first high frequency substrate and the second high frequency substrate, the first low frequency substrate is located at institute
The surface of the second low frequency substrate is stated in interval and is laminated to, the MMIC crystal grain is located in the interval and is installed on
One surface of the first low frequency substrate, first high frequency substrate and the second high frequency substrate surface are respectively equipped with the first radiation list
Member and the second radiating element, first radiating element and the second radiating element are electrically connected with the MMIC crystal grain respectively.
As a kind of embodiment of the application, the surface of first, second radiating element and the MMIC are brilliant
The surface of grain is in same plane.
As a kind of embodiment of the application, the low frequency substrate may include N block lamination low frequency substrate, the N block
Lamination low frequency substrate is stacked gradually since the first low frequency substrate, the second low frequency substrate.
As a kind of embodiment of the application, the surface area of the first low frequency substrate is less than the second low frequency substrate
Surface area.
As a kind of embodiment of the application, the surface area of the MMIC grained region is less than the first low frequency substrate
Surface area.
As a kind of embodiment of the application, first high frequency substrate and the second high frequency substrate and MMIC crystal grain and the
Gap is respectively arranged between one low frequency substrate.
As a kind of embodiment of the application, the gap between the MMIC crystal grain and high frequency substrate is less than or equal to 50 μ
m。
As a kind of embodiment of the application, set respectively on the MMIC crystal grain and first, second radiating element
There is pad, is realized and be electrically connected by bonding wire between the MMIC crystal grain and the pad of first, second radiating element.
As a kind of embodiment of the application, it is arranged between the MMIC crystal grain and first, second radiating element
A plurality of parallel high-frequency lead.
As a kind of embodiment of the application, the high-frequency lead is the ribbon conductor that width is 100 μm.
As a kind of embodiment of the application, it is connected electrically in the weldering of MMIC crystal grain and first, second radiating element
The side profile of the high-frequency lead between disk is wedge shape.
As a kind of embodiment of the application, the material of high frequency substrate be selected from aluminium oxide, aluminium nitride, beryllium oxide, quartz,
One of ceramics and sapphire are a variety of.This kind of material has excellent material property, extremely low loss tangent coefficient.Cause
This, microwave signal can range with long distance transmission without having too many loss, much higher than 50GHz.
As a kind of embodiment of the application, being electrically connected by low between the MMIC crystal grain and the first low frequency substrate
Frequency connecting line is realized, passes through the through-hole opened up between low frequency substrate and the internal layer across through-hole between the N block lamination low frequency substrate
Conducting wire realizes electrical connection.
Compared with the existing technology, the application mixed printing circuit board can arbitrarily increase the number of plies of substrate, so that circuit
Functional complexity be improved.Simultaneously as expensive high performance material be on crucial radio frequency and microwave circuit,
Therefore cost can be reduced.In addition, by using the low frequency substrate of different-thickness, can obtain low frequency substrate and high frequency substrate it
Between Desired Height it is poor so that high-frequency lead length more section between MMIC crystal grain and the first, second radiating element, height are lower,
The stray inductance of high-frequency lead can be substantially reduced, to obtain better bandwidth of operation, improves the radio-frequency performance of system.
Detailed description of the invention
It in order to more clearly explain the technical solutions in the embodiments of the present application, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only some of the application
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 show the schematic diagram of conventional hybrid substrate design.
Fig. 2 is the schematic diagram of the application mixed printing circuit board.
Fig. 3 is the schematic diagram of the internal layer connection of mixed printing circuit board shown in Fig. 2.
Fig. 4 is the schematic diagram of the high-frequency lead of mixed printing circuit board shown in Fig. 3.
Fig. 5 is the frequency response characteristic using two kinds of Amplifier Designs of traditional circuit-board.
Fig. 6 is the frequency response characteristic using two kinds of Amplifier Designs of the application mixed printing circuit board.
Wherein, the reference numerals are as follows：
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown is merely for convenience of description the application and simplifies description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limit to the application
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present application, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in this application.
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.
It please refers to shown in Fig. 2, this application provides a kind of mixed printing circuit boards comprising low frequency substrate 10, high frequency base
Plate 20 and monolithic integrated microwave circuit (MMIC, Multi-Chip Module) crystal grain 30, MMIC crystal grain 30 are installed on low frequency substrate
On 10, wherein low frequency substrate 10 includes the first low frequency substrate 10a and the second low frequency substrate 10b, and high frequency substrate 20 includes first high
Frequency substrate 20a and the second high frequency substrate 20b, the first high frequency substrate 20a and the second high frequency substrate 20b are laminated to the second low frequency substrate
A surface of 10b, and interval 60 is provided between the first high frequency substrate 20a and the second high frequency substrate 20b, the first low frequency substrate
10a is located in interval 60 and is laminated to the surface of the second low frequency substrate 10b, and MMIC crystal grain 30 is located in interval 60 and installs
In a surface of the first low frequency substrate 10a, the first high frequency substrate 20a and the second surface high frequency substrate 20b are respectively equipped with the first spoke
Penetrate unit 200a and the second radiating element 200b, the first radiating element 200a and the second radiating element 200b respectively with MMIC crystal grain
30 electrical connections.Wherein, the high-frequency signal between MMIC crystal grain 30 and the first high frequency substrate 20a and the second high frequency substrate 20b passes through
High-frequency lead 40 realizes that low frequency signal between MMIC crystal grain 30 and the first low frequency substrate 10a is by low frequency lead 50 come real
It is existing.
As a kind of embodiment of the application, low frequency substrate 10 may include N block lamination low frequency substrate 10a, 10b ...
10n, N block lamination low frequency substrate 10a, 10b ... the 10n is since the first low frequency substrate 10a, the second low frequency substrate 10b to N
Low frequency substrate 10n is sequentially laminated.In this application, these lamination knots can be constructed with common soldering paste or conductive silver epoxy
Structure.
Low frequency substrate 10 used by the application is the organic substrate of low cost, such as FR-4 (epoxy glass fabric lamination
Plate).This organic material substrate to provide the high-density circuit solution of low cost for printed circuit board, and
It is widely used in most of electronic systems.The disadvantage is that their high frequency characteristics (loss tangent coefficient), this is being higher than it
Loss is very big when working under the high frequency of 5GHz.It, can be excellent using having for high frequency substrate 20 used by the application
One of aluminium oxide, aluminium nitride, beryllium oxide, quartz, ceramics and the sapphire of material property (extremely low loss tangent coefficient)
Or it is a variety of.
First high frequency substrate 20a and the second high frequency substrate 20b is installed on the second low frequency substrate 10b, in the first high frequency base
Plate 20a and the second high frequency substrate 20b reserves the interval 60 of one fixed width, and MMIC crystal grain 30 is placed for rationally arriving in interval 60,
MMIC crystal grain 30 is located at the top of the second low frequency substrate 10b.In order to obtain ideal MMIC crystal grain 30 and the first high frequency substrate 20a
And the second relative position between high frequency substrate 20b, the MMIC crystal grain 30 and the second low frequency substrate 10b being located in interval 60 it
Between pad set the first low frequency substrate 10a so that the first low frequency substrate 10a be located at interval 60 in and be laminated to the second low frequency substrate 10b
Surface, MMIC crystal grain 30 is installed on the surface of the first low frequency substrate 10a.
Under normal circumstances, the thickness of the MMIC crystal grain 30 of standard include 50 μm, 100 μm, 250 μm, 400 μm, 600 μm and
725/775 μm, meanwhile, the thickness of standard ceramic high frequency substrate 20 includes：0.254mm, 0.381mm, 0.508mm, 0.635mm,
0.762mm, 1.016mm and 2.159mm, therefore, in the design process of circuit board, between high frequency substrate 20 and MMIC crystal grain 30
There can be difference in height.Optionally, the first low frequency substrate 10a can use the low frequency substrate of different-thickness, or including multi-layer phase
The low frequency substrate for the different size being mutually laminated, to obtain the opposite position between most reasonable MMIC crystal grain 30 and high frequency substrate 20
It sets, and improves the complexity of whole laminate boards system.
The surface of first high frequency substrate 20a and the second high frequency substrate 20b are respectively equipped with the first radiating element 200a and second
Radiating element 200b, the first radiating element 200a and the second radiating element 200b are electrically connected with MMIC crystal grain 30 respectively.As this
A kind of embodiment of application, by selecting the thickness of reasonable first low frequency substrate 10a so that the first radiating element 200a and
The surface of second radiating element 200b and MMIC crystal grain 30 is in same plane.Such design enables to high-frequency lead
40 length is shorter, effectively prevents leading to significant intrinsic stray inductance because high-frequency lead 40 is too long, can be improved system
Radio-frequency performance.
In order to obtain good processing technology and guarantee stable working performance, as shown in Figure 2, the first low frequency substrate
Surface area of the surface area of 10a less than the second low frequency substrate 10b.As a kind of embodiment of the application, 30th area of MMIC crystal grain
Surface area of the surface area in domain less than the first low frequency substrate 10a.Meanwhile first high frequency substrate 20a and the second high frequency substrate 20b with
Gap is respectively arranged between MMIC crystal grain 30 and the first low frequency substrate 10a.Please in combination with shown in Fig. 3, it is located at high-frequency lead
Gap between 40 is sized to be less than or equal to 50 μm, can make the length of high-frequency lead 40 so as far as possible more
It is short, to reduce its intrinsic stray inductance, improve the radio-frequency performance of system.In addition, it is brilliant to be located at the first low frequency substrate 10a and MMIC
Width between grain 30 for space that low frequency lead 50 is arranged can be set between 100 μm~150 μm, be used for soldering paste or
The purposes of conductive epoxy overflow.These low frequency leads 50 are connected to the first low frequency substrate 10a from the engagement of MMIC crystal grain 30,
And the through-hole 102 and inner conductor 100 that low frequency substrate 10a, 10b ... 10n are equipped with are laminated by N block, realize multilayer low frequency base
Signal transmitting between plate 10.
Shown in please see Fig. 2 to Fig. 4, weldering is respectively equipped on MMIC crystal grain 30 and first, second radiating element 200a, 200b
Disk 400 realizes electricity by high-frequency lead 40 between MMIC crystal grain 30 and the pad 400 of first, second radiating element 200a, 200b
Connection.
A plurality of parallel high-frequency lead can be set between MMIC crystal grain 30 and first, second radiating element 200a, 200b
40.The a plurality of leads being arranged in parallel can reduce parasitic inductance.The quantity of lead depends on the size and angle of pad 400.?
On 80 μ m, 150 μ m in size bonding welding pad 400, the common quantity of bonding wire is 2 to 3, i.e., every additional bonding wire
Need 50 μm~80 μm of space.
As a kind of embodiment of the application, the high-frequency lead of the application is the ribbon conductor that width is 100 μm, to obtain
Obtain best RF/Microwave performance.
As a kind of embodiment of the application, be connected electrically in MMIC crystal grain 30 and the first, second radiating element 200a,
The side profile of high-frequency lead 40 between the pad 400 of 200b is wedge shape.The height of wedge type of wire is about 100 μm, can be had
Effect reduces parasitic inductance, to obtain better bandwidth of operation.
Fig. 4 and Fig. 5 compares the frequency response of two kinds of different driving amplifier MMIC designs (amplifier 1 and amplifier 2)
Characteristic, Fig. 4 indicate the frequency response characteristic of two kinds of designs using traditional circuit-board, and Fig. 5 statement uses the mixing electricity of the application
The frequency response characteristic of two kinds of designs of road plate.Wherein, y-axis indicates the gain of amplifier, and x-axis indicates frequency.Amplifier 1 designs
Typical three dB bandwidth increase to 44GHz from 35GHz, increase about 20%, the typical three dB bandwidth that amplifier 2 designs is from 27GHz
Increase to 32GHz, increases about 18%.In low frequency, traditional broad band amplifier can achieve required gain without asking
Topic.With the increase of frequency, gain is gradually reduced, and amplifier circuit does not catch up with speed (or frequency).Obviously, these performances improve
Mainly from the reduction of stray inductance.Higher bandwidth may be implemented in the mixed printing circuit board of the application, makes it possible to transmit
Data of higher capacity and undistorted.
The mixed printing circuit board of the application can be used for any high-performance system for requiring high working frequency (10GHz or more)
Irrespective of size encapsulates (SiP) or multi-chip module (MCM).The mixed printing circuit board of the application can be used in fibre optic transmission equipment
Transmitting module and receiving module, the modulator driver and laser diode drive that are used including transmitting terminal and receiving end
The integrated photodiode and trans-impedance amplifier used.The application mixed printing circuit board can also be in radar or wireless base station
On, it can be used for power amplifier module, local oscillating module, synthesizer and low-noise amplifier.
Compared with the existing technology, the technical effect of the application includes at least：
1, the number of plies of substrate can arbitrarily be increased, so that the functional complexity of circuit is improved.
2, since expensive high performance material is that can be reduced into on crucial radio frequency and microwave circuit
This.
3, by using the low frequency substrate of different-thickness, the Desired Height between low frequency substrate and high frequency substrate can be obtained
Difference so that between MMIC crystal grain 30 and first, second radiating element 200a, 200b the length of high-frequency lead 40 more, height it is lower,
The stray inductance of high-frequency lead 40 can be substantially reduced, to obtain better bandwidth of operation, improves the radio-frequency performance of system.
The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within mind and principle.
Claims (9)
1. a kind of mixed printing circuit board comprising low frequency substrate, high frequency substrate and monolithic integrated microwave circuit crystal grain, the list
Piece microwave integrated circuit crystal grain is installed on the low frequency substrate, wherein the low frequency substrate includes the first low frequency substrate and the
Two low frequency substrates, the high frequency substrate include the first high frequency substrate and the second high frequency substrate, first high frequency substrate and second
High frequency substrate is laminated to a surface of the second low frequency substrate, and sets between first high frequency substrate and the second high frequency substrate
It is equipped with interval, the first low frequency substrate is located in the interval and is laminated to the surface of the second low frequency substrate, institute
State the surface that monolithic integrated microwave circuit crystal grain is located in the interval and is installed on the first low frequency substrate, described first
High frequency substrate and the second high frequency substrate surface are respectively equipped with the first radiating element and the second radiating element, first radiating element
It is electrically connected respectively with the monolithic integrated microwave circuit crystal grain by high-frequency lead with the second radiating element；
Wherein, the surface on the surface of first, second radiating element and the monolithic integrated microwave circuit crystal grain
In same plane.
2. mixed printing circuit board according to claim 1, wherein the low frequency substrate includes N block lamination low frequency substrate,
The N block lamination low frequency substrate is sequentially laminated since the first low frequency substrate, the second low frequency substrate.
3. mixed printing circuit board according to claim 1, wherein the table of the monolithic integrated microwave circuit grained region
Area is less than the surface area of the first low frequency substrate.
4. mixed printing circuit board according to claim 3, wherein first high frequency substrate and the second high frequency substrate with
Gap is respectively arranged between monolithic integrated microwave circuit crystal grain and the first low frequency substrate.
5. mixed printing circuit board according to claim 1, wherein the monolithic integrated microwave circuit crystal grain and described
One, pad, the monolithic integrated microwave circuit crystal grain and first, second radiating element are respectively equipped on the second radiating element
Pad between pass through high-frequency lead realize electrical connection.
6. mixed printing circuit board according to claim 5, wherein the monolithic integrated microwave circuit crystal grain and described
One, a plurality of parallel high-frequency lead is set between the second radiating element.
7. mixed printing circuit board according to claim 5, wherein be connected electrically in monolithic integrated microwave circuit crystal grain and institute
The side profile of the high-frequency lead between the pad of the first, second radiating element is stated as wedge shape.
8. mixed printing circuit board according to claim 1, wherein the material of the high frequency substrate is selected from aluminium oxide, nitrogen
Change one of aluminium, beryllium oxide, quartz, ceramics and sapphire or a variety of.
9. mixed printing circuit board according to claim 2, wherein the monolithic integrated microwave circuit crystal grain is low with first
Electrical connection between frequency substrate is realized by low frequency connecting line, by opening between low frequency substrate between the N block lamination low frequency substrate
If through-hole and across through-hole inner conductor realize electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820219230.0U CN208111438U (en) | 2018-02-06 | 2018-02-06 | Mixed printing circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820219230.0U CN208111438U (en) | 2018-02-06 | 2018-02-06 | Mixed printing circuit board |
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| CN208111438U true CN208111438U (en) | 2018-11-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470729A (en) * | 2018-02-06 | 2018-08-31 | 深圳市傲科光电子有限公司 | Mixed printing circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470729A (en) * | 2018-02-06 | 2018-08-31 | 深圳市傲科光电子有限公司 | Mixed printing circuit board |
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