CN208111393U - Draw the filament gas ion source device of cationic beam - Google Patents

Draw the filament gas ion source device of cationic beam Download PDF

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Publication number
CN208111393U
CN208111393U CN201721873529.XU CN201721873529U CN208111393U CN 208111393 U CN208111393 U CN 208111393U CN 201721873529 U CN201721873529 U CN 201721873529U CN 208111393 U CN208111393 U CN 208111393U
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China
Prior art keywords
filament
ionization cylinder
ionization
cylinder
ion source
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CN201721873529.XU
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Chinese (zh)
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苏东艺
彭继华
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GUANGZHOU GRANDTECH CO Ltd
South China University of Technology SCUT
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GUANGZHOU GRANDTECH CO Ltd
South China University of Technology SCUT
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Abstract

The utility model relates to ion source apparatus technical fields, relate to a kind of filament gas ion source device for drawing cationic beam, including the first ionization cylinder, second ionization cylinder and power supply device, one end of first ionization cylinder is equipped with the first air inlet and the other end of the first ionization cylinder is equipped with the first escape orifice, first coil is wound on the lateral wall of first ionization cylinder, one end of second ionization cylinder is connected to the first escape orifice, the other end of second ionization cylinder is equipped with the second escape orifice, filament assembly is equipped in first ionization cylinder, the second coil is wound on the lateral wall of second ionization cylinder;The side wall of second ionization cylinder is electrically connected with the anode of power supply device, the first ionization cylinder and the insulation of the second ionization cylinder.The utility model can be improved gas ionization efficiency and foreign atom avoided to pollute workpiece to be machined, moreover it is possible to draw purer cationic beam.

Description

Draw the filament gas ion source device of cationic beam
Technical field
The utility model relates to ion source apparatus technical fields, more particularly to a kind of filament gas for drawing cationic beam Ion source device.
Background technique
Lower temperature plasma technology be widely deployed in material surface processing, semiconductor, microelectronics, optics, medicine, etc. Industrial circle, especially using very extensive in terms of thin-film material preparation and material surface modifying.Modification technology on the surface of the material Field hot filament ion source can provide heating workpiece, etching activating surface and assisted deposition function, can also for ion implanting, The suitable metallic element of the offers such as element doping, elemental gas ion source etc..But during filament thermal electron, itself Surface atom can also emit, and pollute if being adsorbed on workpiece surface and will constitute.In addition current heated filament technology utilizes thermolamp The electron collision gas of silk transmitting obtains ion, and gas ionization efficiency is lower, and also using the plasma of technology generation Including the electronics that a large amount of filaments emit, for only needing cation to participate in the technique of processing, which has also lacked filtering The function of electronics.
Utility model content
To solve the above-mentioned problems, the purpose of the utility model is to provide a kind of filament gas ions for drawing cationic beam Source device can be improved gas ionization efficiency and foreign atom avoided to pollute workpiece to be machined, moreover it is possible to draw purer cation Beam.
Based on this, the utility model provides a kind of filament gas ion source device for drawing cationic beam, including first One end of ionization cylinder, the second ionization cylinder and power supply device, the first ionization cylinder is equipped with the first air inlet and first ionization The other end of cylinder is equipped with the first escape orifice, is wound with first coil, second ionization on the lateral wall of the first ionization cylinder One end of cylinder is connected to first escape orifice, the other end of the second ionization cylinder equipped with the second escape orifice, described first from Change and be equipped with filament assembly in cylinder, is wound with the second coil on the lateral wall of the second ionization cylinder;The side of the second ionization cylinder Wall is electrically connected with the anode of the power supply device, the first ionization cylinder and the insulation of the second ionization cylinder.
Preferably, the filament assembly includes the filament being oppositely arranged and reflection pole plate, the reflection pole plate is located at Between the filament and the center line of the first escape orifice, it is connected in parallel between the filament and reflection pole plate.
Preferably, the reflection pole plate is parallel to the center line of first escape orifice.
Preferably, the quantity of the filament assembly is even number, and the filament assembly is symmetrical set.
Preferably, the material of the reflection pole plate is refractory metal.
Preferably, the second ionization cylinder is equipped with the second air inlet.
Preferably, further include focus coil, the focus coil is located at except the second ionization cylinder and corresponding described the The setting of two escape orifices, the axis of the focus coil is parallel with the axis of second escape orifice or is overlapped.
Preferably, second escape orifice is equipped with end casing, the second ionization cylinder and the end casing insulate, The anode of the filament and the end casing are grounded setting.
Preferably, the center line of the first ionization cylinder and the second ionization cylinder is overlapped.
The filament gas ion source device of the cationic beam of extraction of the utility model, the first ionization cylinder lateral wall are wound with the One coil, the magnetic field that first coil generates make the electronics escaped from filament make rotation drift fortune under the action of Lorentz force It is dynamic, the travel of electronics and the probability of electronics and inert gas collision are further increased, and then obtain high ionization level Plasma, and electrons are adsorbed in the second ionization cylinder of access power supply device anode, so that being escaped from the second escape orifice Be cation;In addition, the foreign atom emitted from filament is essentially neutral atom, not by electric and magnetic fields Effect, therefore be easy to capture precipitating by the inner wall of the first ionization cylinder, avoid foreign atom from polluting workpiece to be machined.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the filament gas ion source device of the cationic beam of extraction of the utility model embodiment.
Wherein, the 1, first ionization cylinder;11, the first air inlet;12, the first escape orifice;13, first coil;14, filament group Part;14a, filament;14b, reflection pole plate;2, the second ionization cylinder;21, the second escape orifice;22, the second coil;23, the second air inlet Mouthful;24, end casing;3, power supply device;4, dead ring;5, focus coil.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
As shown in connection with fig. 1, the filament gas ion source dress of the cationic beam of the extraction of the utility model is schematically showed It sets, including columnar first ionization cylinder 1, one end of the first ionization cylinder 1 is equipped with the first air inlet 11, can be passed through for protecting The other end of filament 14a and inert gas for ionization, the first ionization cylinder 1 is equipped with the first escape orifice 12.First ionization It is wound with first coil 13 on the lateral wall of cylinder 1, filament assembly 14 is equipped in the first ionization cylinder 1, filament assembly 14 includes opposite The filament 14a and reflection pole plate 14b of setting, reflection pole plate 14b are located between filament 14a and the center line of the first escape orifice 12, Since filament 14a and reflection pole plate 14b are connected in parallel, the current potential of the two is equal, towards reflection pole plate from filament 14a The electrons of the direction 14b evolution (are directed toward the from the center line of the first escape orifice 12 in the direction reflected by reflection pole plate 14b reflection The inner sidewall of one ionization cylinder 1), increase the travel of electronics with this, improves the probability of ionization by collision.Meanwhile first coil 13 magnetic fields generated force the electronics escaped from filament 14a to make rotation drift motion under the action of Lorentz force, further The travel of electronics and the collision probability of inert gas and electronics are increased, to obtain the plasma of high ionization level. In addition, being essentially neutral atom from the evaporated material that the surface filament 14a escapes, these neutral atoms are not by the work of electric and magnetic fields With, therefore they can collide the inner wall of the first ionization cylinder 1 during exercise and reflect pole plate 14b and captured precipitating.Wherein, above-mentioned Evaporated material is that the surface atom of satisfaction evolution work function on filament 14a can be made if evaporated material is adsorbed on the surface of workpiece It is reduced at surface coating quality, and the inner wall for reflecting pole plate 14b and the first ionization cylinder 1 can all capture these evaporated materials, It prevents it from escaping from the first escape orifice 12, avoids pollution workpiece to be machined.In order to further increase the density of plasma, that is, mention High gas ionization rate.The present apparatus further includes columnar second ionization cylinder 2, one end of the second ionization cylinder 2 and the first escape orifice 12 Connection, the other end of the second ionization cylinder 2 are equipped with the second escape orifice 21, and the lateral wall of the second ionization cylinder 2 winds the second coil 22, the On the one hand the magnetic field that two coil 22 generates forces charged particle (electronics and cation) to make rotation drift motion, increase and gas point The collision probability (generating ionization by collision) of son, to improve the positive ion density in plasma, another aspect pack plasma It is escaped from the second escape orifice 21 of the second ionization cylinder 2, provides plasma for workpiece to be machined.Wherein, the side of the second ionization cylinder 2 Wall is electrically connected at the anode of power supply device 3, is connected between the first ionization cylinder 1 and the second ionization cylinder 2 by dead ring 4, when the The side wall of two ionization cylinders 2 disconnects power supply and in when floating current potential, can get high-density plasma at the second escape orifice 21; When the side wall of the second ionization cylinder 2 powers on anode, the current potential of the side wall of the second ionization cylinder 2 is higher than the current potential of filament 14a, the The electronics moved in two ionization cylinders 2 is adsorbed and entered in the circuit loop of power supply device 3 by the side wall of the second ionization cylinder 2, due to Electronics is all adsorbed by the side wall of the second ionization cylinder 2, therefore can get the gas cations of high-purity at the second escape orifice 21.Pass through Power supply device 3 changes the current potential of 2 side wall of the second ionization cylinder, can obtain the cation of highdensity plasma and high-purity respectively Beam, to meet the needs of different occasions.
It is additionally provided with the second air inlet 23 on the second ionization cylinder 2, the working gas needed for workpieces processing can be introduced second In ionization cylinder 2 so that working gas is in the second ionization cylinder 2 and electron impact ionization, and working gas will not also adverse current into Enter in the first ionization cylinder 1 and reacts with filament 14a and reflection pole plate 14b.In the present embodiment, the second ionization cylinder 2 is equipped with the It is insulated on one end of two escape orifices 21 to be equipped with end casing 24, dead ring 4, lamp are equipped between end casing 24 and the second ionization cylinder 2 The anode of silk 14a and the setting of the equal electrical ground of end casing 24, cause the cathode of filament 14a and end casing 24 to form potential difference, from The electrons of filament 14a evolution are automatically moved toward the direction where end casing 24, so that electrons are orderlyly from the One ionization cylinder 1 moves to the second escape orifice 21, and the direction of motion of electronics is limited with this.
For the needs of processing, which further includes focus coil 5, and focus coil 5 is located at except the second ionization cylinder 2 and right The second escape orifice 21 is answered to be arranged, the axis of the axis of focus coil 5 and the second escape orifice 21 is parallel or is overlapped, and focus coil 5 is used The plasma escaped from the second escape orifice 21 or cationic beam are focused in generating magnetic field according to the demand of work pieces process, so as to In the processing for meeting workpiece to be machined.
In the present embodiment, in order to optimize the device, reflection pole plate 14b is parallel to the center line of the first escape orifice 12.Lamp Silk component 14 has even number, and filament assembly 14 is symmetrical set, and the reflection pole plate 14b of each filament assembly 14 can be right by its The electron reflection for the filament 14a evolution answered enables electronics to extend the road of its movement as far as possible to the inner sidewall of the first ionization cylinder 1 Journey increases the probability of ionization by collision, to improve gas ionization rate.The hair of electronics greatly improved in two filament assemblies 14 in parallel Penetrate quantity, moreover it is possible to balance its power consumption, the present apparatus is made to be unlikely to too to consume energy.The material for reflecting pole plate 14b is refractory metal, infusibility Metal refers generally to fusing point higher than 1650 DEG C and has the metal (tungsten, tantalum, molybdenum, niobium, hafnium, chromium, vanadium, zirconium and titanium) of certain reserves, also has The metal that fusing point is higher than zirconium fusing point (1852 DEG C) is known as refractory metal.Because the ionization energy of refractory metal atoms is higher, it is difficult to Become ion, it can reflect the electronics of filament 14a evolution, will not also escape metal cation, pollute workpiece to be machined.First The center line of ionization cylinder 1 and the second ionization cylinder 2 is overlapped, so that cation and electronics are generated by first coil 13 and the second coil 22 Magnetic field constraint, focus.
In conclusion the filament gas ion source device of the cationic beam of the extraction of the utility model, the first ionization cylinder outside Wall is wound with first coil, and the magnetic field that first coil generates makees the electronics escaped from filament under the action of Lorentz force Drift motion is rotated, further increases the travel of electronics and the probability of electronics and inert gas collision, and then obtain The plasma of high ionization level, and electrons are adsorbed in the second ionization cylinder of access power supply device anode, so that from second Escape orifice evolution is cation;In addition, the foreign atom emitted from filament is essentially neutral atom, not by electricity The effect of field and magnetic field, therefore be easy to capture precipitating by the inner wall of the first ionization cylinder, avoid foreign atom pollution workpiece to be machined.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change It also should be regarded as the protection scope of the utility model into replacement.

Claims (8)

1. a kind of filament gas ion source device for drawing cationic beam, which is characterized in that including the first ionization cylinder, the second ionization Cylinder and power supply device, the other end that one end of the first ionization cylinder is equipped with the first air inlet and the first ionization cylinder are equipped with the One escape orifice, is wound with first coil on the lateral wall of the first ionization cylinder, one end of the second ionization cylinder and described the The connection of one escape orifice, the other end of the second ionization cylinder are equipped with the second escape orifice, are equipped with filament group in the first ionization cylinder Part is wound with the second coil on the lateral wall of the second ionization cylinder;The side wall and the power supply device of the second ionization cylinder Anode electrical connection, the first ionization cylinder and the second ionization cylinder insulation, the center of the first ionization cylinder and the second ionization cylinder Line is overlapped.
2. the filament gas ion source device according to claim 1 for drawing cationic beam, which is characterized in that the filament Component includes the filament being oppositely arranged and reflection pole plate, and the reflection pole plate is located at the center line of the filament and the first escape orifice Between, it is connected in parallel between the filament and reflection pole plate.
3. the filament gas ion source device according to claim 2 for drawing cationic beam, which is characterized in that the reflection Pole plate is parallel to the center line of first escape orifice.
4. the filament gas ion source device according to claim 2 for drawing cationic beam, which is characterized in that the filament The quantity of component is even number, and the filament assembly is symmetrical set.
5. the filament gas ion source device according to claim 2 for drawing cationic beam, which is characterized in that the reflection The material of pole plate is refractory metal.
6. the filament gas ion source device according to claim 1 for drawing cationic beam, which is characterized in that described second Ionization cylinder is equipped with the second air inlet.
7. the filament gas ion source device according to claim 1 for drawing cationic beam, which is characterized in that further include gathering Focal line circle, the focus coil is located at except the second ionization cylinder and the corresponding second escape orifice setting, the focus coil Axis is parallel with the axis of second escape orifice or is overlapped.
8. the filament gas ion source device according to claim 1 for drawing cationic beam, which is characterized in that described second Escape orifice is equipped with end casing, and the second ionization cylinder and the end casing insulate, the anode of the filament and the end casing Ground connection setting.
CN201721873529.XU 2017-12-26 2017-12-26 Draw the filament gas ion source device of cationic beam Active CN208111393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721873529.XU CN208111393U (en) 2017-12-26 2017-12-26 Draw the filament gas ion source device of cationic beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721873529.XU CN208111393U (en) 2017-12-26 2017-12-26 Draw the filament gas ion source device of cationic beam

Publications (1)

Publication Number Publication Date
CN208111393U true CN208111393U (en) 2018-11-16

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Country Status (1)

Country Link
CN (1) CN208111393U (en)

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