CN208060766U - A kind of high density optical waveguide structure and printed circuit board - Google Patents
A kind of high density optical waveguide structure and printed circuit board Download PDFInfo
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- CN208060766U CN208060766U CN201820674396.1U CN201820674396U CN208060766U CN 208060766 U CN208060766 U CN 208060766U CN 201820674396 U CN201820674396 U CN 201820674396U CN 208060766 U CN208060766 U CN 208060766U
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Abstract
A kind of high density optical waveguide structure and printed circuit board, the high density optical waveguide structure include under-clad layer, sandwich layer, top covering successively；Wherein, several grooves are arranged in interval in the under-clad layer, fill optical waveguide material in groove, form sandwich layer.Optical waveguide can be integrated into PCB by the utility model, realize photoelectricity interconnection；Higher in parallel density can be better achieved, keep good signal integrity, reduce the size of device and equipment；Meanwhile small power consumption, heat dissipation are easy, can realize simpler physical structure and design, improve PCB routing space to the full extent, be conducive to the making of superfinishing filament wiring board；And it is possible to improve the wiring density of existing preparation method, reliability is improved.
Description
Technical field
The utility model is related to the manufacturing technologies of printed circuit board or semiconductor integrated circuit package substrate, more particularly to one
Kind high density optical waveguide structure and printed circuit board.
Background technology
With the development of the social economy, demand of the people to information sharply increases, information content is exponentially increased, only
Internet user needs the information bit rate transmitted to be increased by 8 times every year.In long range wire communication field, optical-fibre communications
Technology disclosure satisfy that this high performance requirement.However field is transmitted in short distance information, because of cost and technical problem, at present still
Based on electricity interconnection.But the shortcomings of there are intrinsic electromagnetic interference, high loss and low bandwidth is electrically interconnected, limits data transmission
The further promotion of energy.Optical waveguide has high bandwidth, electromagnetism interference, low damage as photo-signal channel, compared with telecommunication path
The advantages that consumption, low energy consumption, low crosstalk, small physical size, so that light network is become solve high-speed electrical signals interconnection bottleneck one has
Efficacious prescriptions method.Meanwhile the light printing backplane technology based on Light Wave Guide Theory is in developing stage, hot technology is the biography of optical waveguide
The art that is of coupled connections of defeated characteristic and optical waveguide-optical fiber.
In optical waveguide printed wiring board, the transmission characteristic of optical waveguide plays decisive action to the quality of the performance of system,
The factor for influencing optical waveguide transmission characteristic mainly has：The inherent loss of optical waveguide material, optical waveguide geometric dimension, optical waveguide material
Surface roughness, the processing mode of end face, these factors can all influence the transmission loss of optical waveguide, to influence the steady of system
It is qualitative.Currently, the preparation method of optical waveguide includes reactive ion etching, Ultraviolet lithography, maskless direct write etc., each preparation
Method all respectively has the scope of application, feature and advantage, for example, ion etching method technology maturation, and traditional IC process compatibles, but work
Skill is complicated, and lateral erosion is serious, and sidewall roughness is big；The shortcomings that Ultraviolet lithography is that the size of control optical waveguide core layer is more difficult；Nothing is covered
Mould direct-write process is simple, straight forming on material, but equipment is expensive, and working (finishing) area is small, and volume production is difficult.
It can be seen from the above, the processing method of optical waveguide is flexible and changeable, can be selected according to the characteristic of material.But it needs
Following several principles：(1) interface roughness of optical waveguide is small, and (2) waveguide solidification is uniform, the attachment of (3) waveguide and substrate
Power is good, no layering, and (4) technology stability is good, can guarantee batch production.
Currently, conventional optical waveguide structure is as shown in Figure 1, optical waveguide is made of upper 10, sandwich layer 20 and under-clad layer 30,40
For loading plate.Wherein, sandwich layer 20 is on the surface of under-clad layer 30.Its production method is：The under-clad layer of optical waveguide is first made, then
The mode of the spin coating of waveguide core layer material or pad pasting is placed on the surface of under-clad layer, is exposed, develops, makes outlet
Then road carries out the making of top covering again.
The defect of above-mentioned existing structure is：In the production process, due to sandwich layer be on under-clad layer surface, using exposure,
What the methods of development made, lightwave circuit one side is connected with under-clad layer, and binding force is poor, in developing process, by
The attack of liquid medicine, lightwave circuit are easy to fall off or are stripped, and form defect, for finer lightwave circuit, feelings
Condition will be more serious.
Therefore, it is necessary to a kind of new structures, and the binding force of lightwave circuit and under-clad layer is made to increase, and are suitble to make ratio
Finer lightwave circuit.
Invention content
The purpose of this utility model is to provide a kind of high density optical waveguide structure and printed circuit boards, can be by optical waveguide
It is integrated into PCB, realizes photoelectricity interconnection；Higher in parallel density can be better achieved, keep good signal integrity
Property, reduce the size of device and equipment；Meanwhile small power consumption, heat dissipation are easy, and can realize simpler physical structure and design,
PCB routing space is improved to the full extent, is conducive to the making of superfinishing filament wiring board；And it is possible to improve existing
There is the wiring density of preparation method, improves reliability.
In order to achieve the above objectives, the technical solution of the utility model is：
A kind of high density optical waveguide structure includes under-clad layer, sandwich layer, top covering successively；Wherein, interval in the under-clad layer
Several grooves are set, fills optical waveguide material in groove, forms sandwich layer.
Further, the trench wall in the under-clad layer is equipped with one layer of reflectance coating.
Preferably, the groove vertical sectional shape in the under-clad layer is circle, ellipse, triangle, trapezoidal or rectangle.
Preferably, the optical waveguide material is acrylate, polymethyl methacrylate and its derivative fluoride, epoxy
Resin, fluorinated poly arylene ether, fluorinated polyimide, polysiloxanes, the tree-shaped supermolecule of fluorination and fluorination branched polymers.
Preferably, the material of the reflectance coating is identical as optical waveguide material, or is metal.
The utility model includes the printed circuit board of the high density optical waveguide structure comprising optical waveguide structure and its
It is lower to set first line layer, dielectric layer, the second line layer, solder mask and surface-treated layer successively respectively；Wherein, it sets and fills out in dielectric layer
Fill the hole of conducting medium.
Preferably, the dielectric layer material is epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide
Or polytetrafluoroethylene (PTFE), glass, quartz or silica.
Preferably, the surface-treated layer be chemical nickel gold, chemistry silver, chemical NiPdAu, electronickelling gold, electrosilvering or
NiPdAu is electroplated.
The beneficial effects of the utility model：
1, increase binding force
Prior art makes sandwich layer when making optical waveguide, using the method for exposure imaging, still, in developing process,
Due to optical waveguide be on the surface of under-clad layer, be easy to developed liquid medicine wash out.And the utility model is making light wave
When leading, groove is first produced, then is injected into groove or sandwich layer is made using the method for spin coating, groove is already below lower packet at this time
Layer surface, therefore the solution in groove is not allowed to be easy to run off, after solidification, sandwich layer is completely fixed to the inside of under-clad layer, and three
Face is surrounded by under-clad layer, and binding force is much larger than prior art.
2, optical signal crosstalk is small, and loss is low
Due to doing the groove of optical waveguide using stamping technique and laser ablation technology, the uniform of circuit can be greatly improved
Property, circuit is very steep, and the crosstalk of optical signal is smaller, and loss is low, and reliability is high.
Description of the drawings
Fig. 1 is the structure sectional view for having high density optical waveguide structure；
Fig. 2 is the structure sectional view of the utility model embodiment 1；
Fig. 3 is the structure sectional view of the utility model embodiment 2；
Fig. 4 is the structure sectional view of the utility model embodiment 3；
Fig. 5 is the structure sectional view of the utility model embodiment 4；
Fig. 6 is the structure sectional view of the utility model embodiment 5；
Fig. 7 is the structure sectional view of the utility model embodiment 6；
Fig. 8 is the structure sectional view of the printed circuit board of the utility model optical waveguide structure containing high density.
Specific implementation mode
Referring to Fig. 2, the high density optical waveguide structure of the utility model comprising under-clad layer 1, sandwich layer 2, top covering 3；Its
In, several grooves 101 are arranged in interval in the under-clad layer 1, fill optical waveguide material in groove 101, form sandwich layer 2.
In the present embodiment, the groove 101 is rectangle.
Referring to Fig. 3,101 inner wall of groove in the under-clad layer 1 is equipped with one layer of reflectance coating 4, the thickness of the reflectance coating 4
Degree is at 0.1nm-50 μm；The material of reflectance coating 4 is polymer and metal.
Referring to Fig. 4~Fig. 7,101 vertical sectional shape of groove in the under-clad layer 1 is trapezoidal, round, oval, triangle
Shape.
Preferably, the optical waveguide material is acrylate, polymethyl methacrylate and its derivative fluoride, epoxy
Resin, fluorinated poly arylene ether, fluorinated polyimide, polysiloxanes, the tree-shaped supermolecule of fluorination and fluorination branched polymers.
The material of the reflectance coating is identical as optical waveguide material, or is metal.
Referring to Fig. 2, Fig. 8, the utility model includes the printed circuit board of the high density optical waveguide structure comprising light
Waveguiding structure and its lower set first line layer 5, dielectric layer 6, the second line layer 7, solder mask 8 and surface-treated layer 9 successively respectively；
Wherein, the hole 11 of filling conducting medium is set in dielectric layer 6.
Preferably, 6 material of the dielectric layer is epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide
Or polytetrafluoroethylene (PTFE), glass, quartz or silica.
Preferably, the surface-treated layer 9 is chemical nickel gold, chemistry silver, chemical NiPdAu, electronickelling gold, electrosilvering
Or plating NiPdAu.
Claims (9)
1. a kind of high density optical waveguide structure, which is characterized in that include under-clad layer, sandwich layer, top covering successively；Wherein, under described
Several grooves are arranged in interval in covering, fill optical waveguide material in groove, form sandwich layer.
2. high density optical waveguide structure as described in claim 1, which is characterized in that the trench wall in the under-clad layer is set
There is one layer of reflectance coating.
3. high density optical waveguide structure as claimed in claim 2, which is characterized in that the thickness of the reflectance coating is in 0.1nm
~50 μm.
4. high density optical waveguide structure as described in claim 1, which is characterized in that the groove longitudinal section shape in the under-clad layer
Shape is circle, ellipse, triangle, trapezoidal or rectangle.
5. high density optical waveguide structure as described in claim 1, which is characterized in that the optical waveguide material be acrylate,
Polymethyl methacrylate and its derivative fluoride, epoxy resin, fluorinated poly arylene ether, fluorinated polyimide, polysiloxanes, fluorine
Change tree-shaped supermolecule and fluorination branched polymers.
6. high density optical waveguide structure as claimed in claim 2 or claim 3, which is characterized in that the material and light of the reflectance coating
Waveguide material is identical, or is metal.
7. a kind of printed circuit board including high density optical waveguide structure as described in claim 1, which is characterized in that including light
Waveguiding structure and its lower set first line layer, dielectric layer, the second line layer, solder mask and surface-treated layer successively respectively；Wherein,
The hole of filling conducting medium is set in dielectric layer.
8. the printed circuit board of high density optical waveguide structure as claimed in claim 7, which is characterized in that the dielectric layer material
For epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide or polytetrafluoroethylene (PTFE), glass, quartz or oxidation
Silicon.
9. the printed circuit board of high density optical waveguide structure as claimed in claim 7, which is characterized in that described or electronickelling palladium
Gold.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820674396.1U CN208060766U (en) | 2018-05-08 | 2018-05-08 | A kind of high density optical waveguide structure and printed circuit board |
| PCT/US2019/040787 WO2019222769A2 (en) | 2018-05-08 | 2019-07-08 | High-density optical waveguide structure and printed circuit board and preparation method thereof |
| KR1020207031444A KR20220019217A (en) | 2018-05-08 | 2019-07-08 | High-density optical waveguide structure and printed circuit board and method for preparing same |
| JP2020563652A JP2021523414A (en) | 2018-05-08 | 2019-07-08 | High-density optical waveguide structure and printed circuit board and their manufacturing method |
| CA3098887A CA3098887A1 (en) | 2018-05-08 | 2019-07-08 | High-density optical waveguide structure and printed circuit board and preparation method thereof |
| US17/053,554 US11693181B2 (en) | 2018-05-08 | 2019-07-08 | High-density optical waveguide structure and printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820674396.1U CN208060766U (en) | 2018-05-08 | 2018-05-08 | A kind of high density optical waveguide structure and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208060766U true CN208060766U (en) | 2018-11-06 |
Family
ID=63981982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820674396.1U Active CN208060766U (en) | 2018-05-08 | 2018-05-08 | A kind of high density optical waveguide structure and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208060766U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108415124A (en) * | 2018-05-08 | 2018-08-17 | 上海美维科技有限公司 | A kind of high density optical waveguide structure and printed circuit board and preparation method thereof |
| CN114488397A (en) * | 2022-01-27 | 2022-05-13 | 苏州大学 | Planar optical waveguide structure based on printed circuit board and manufacturing method thereof |
-
2018
- 2018-05-08 CN CN201820674396.1U patent/CN208060766U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108415124A (en) * | 2018-05-08 | 2018-08-17 | 上海美维科技有限公司 | A kind of high density optical waveguide structure and printed circuit board and preparation method thereof |
| CN114488397A (en) * | 2022-01-27 | 2022-05-13 | 苏州大学 | Planar optical waveguide structure based on printed circuit board and manufacturing method thereof |
| CN114488397B (en) * | 2022-01-27 | 2023-09-19 | 苏州大学 | Planar optical waveguide structure based on printed circuit board and manufacturing method thereof |
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