CN208058469U - A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell - Google Patents

A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell Download PDF

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Publication number
CN208058469U
CN208058469U CN201820692138.6U CN201820692138U CN208058469U CN 208058469 U CN208058469 U CN 208058469U CN 201820692138 U CN201820692138 U CN 201820692138U CN 208058469 U CN208058469 U CN 208058469U
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CN
China
Prior art keywords
boron
silicon glass
glass shell
shell
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820692138.6U
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Chinese (zh)
Inventor
周玉春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGHAI FEIYA ELECTRIC LIGHT SOURCE Co Ltd
Original Assignee
DONGHAI FEIYA ELECTRIC LIGHT SOURCE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGHAI FEIYA ELECTRIC LIGHT SOURCE Co Ltd filed Critical DONGHAI FEIYA ELECTRIC LIGHT SOURCE Co Ltd
Priority to CN201820692138.6U priority Critical patent/CN208058469U/en
Application granted granted Critical
Publication of CN208058469U publication Critical patent/CN208058469U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell,Including high-boron-silicon glass shell,The both sides outer wall of the high-boron-silicon glass shell is equipped with fixed seal ring,It is transversely provided with semiconductor wafer group between two fixed seal rings,The semiconductor wafer group is located at the inside of high-boron-silicon glass shell,The side outer wall of the fixed seal ring is equipped with glass stem,The glass stem runs through fixed seal ring close to one end of shell and extends to the inside of high-boron-silicon glass shell,Outer wall is welded with power supply guide wire on front side of the semiconductor wafer group,The utility model uses a diameter of 45-65mm high-boron-silicon glass shell,There is sufficient space,It is more advantageous to cross-ventilation heat dissipation,Reduce light decay,Radiating efficiency is higher,Improve lamps and lanterns service life,And position adjustment can also be carried out or carry out mobile light source,It simultaneously also can be according to the needs of greenhouse,Mobile placement is carried out at any time,Structure novel,With good practicability.

Description

A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell
Technical field
The utility model is related to 360 ° of a kind of light-emitting LED engineering device technique field more particularly to a kind of high-boron-silicon glass shells Light-emitting LED device.
Background technology
Common light-emitting LED device form is various, chipset have single group, double groups, it is multigroup, shape has outside circular glass Shell, ellipsoidal glass shell, square glass shell etc., but power is smaller, generally between 5-15 watts, seldom with a diameter of 45-65mm high-boron-silicon glass shells are as lamp housing.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of high-boron-silicon glass proposed 360 ° of light-emitting LED devices of shell.
To achieve the goals above, the utility model uses following technical solution:
A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell, including high-boron-silicon glass shell, outside the high-boron-silicon glass The both sides outer wall of shell is equipped with fixed seal ring, and semiconductor wafer group is transversely provided between two fixed seal rings, described Semiconductor wafer group is located at the inside of high-boron-silicon glass shell, and the side outer wall of the fixed seal ring is equipped with glass stem, institute Glass stem is stated to run through fixed seal ring close to one end of shell and extend to the inside of high-boron-silicon glass shell, the semiconductor Outer wall is welded with power supply guide wire on front side of chipset, and the one end of the glass stem far from fixed seal ring is equipped with screwed socket.
Preferably, the high-boron-silicon glass housing diameter is a diameter of 45-65mm.
Preferably, the number of the semiconductor wafer group is 6 or less than 6.
Preferably, it the described one end of power supply guide wire far from semiconductor wafer group and is electrically connected between glass stem.
Preferably, it is electrically connected between the screwed socket and glass stem.
Compared with prior art, the utility model has the beneficial effects that:
1, in the utility model, the high-boron-silicon glass shell by the way that a diameter of 45-65mm is arranged has sufficient space, more has It radiates conducive to cross-ventilation, reduces light decay, radiating efficiency is higher, improves lamps and lanterns service life;
2, in the utility model, by be arranged two fixed seal rings by semiconductor wafer group be fixed as 360 ° it is light-emitting LED Device, formation can carry out position adjustment or carry out mobile light source, while also can carry out mobile peace at any time according to the needs of greenhouse It puts;
To sum up, using a diameter of 45-65mm high-boron-silicon glass shell, there is sufficient space, be more advantageous to cross-ventilation and dissipate Heat reduces light decay, and radiating efficiency is higher, improves lamps and lanterns service life, and can also carry out position adjustment or carry out movement Light source, while also mobile placement can be carried out at any time according to the needs of greenhouse, structure novel has good practicability.
Description of the drawings
Fig. 1 be the utility model proposes a kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell structural schematic diagram;
Fig. 2 be the utility model proposes a kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell side view.
In figure:1 high-boron-silicon glass shell, 2 semiconductor wafer groups, 3 glass stems, 4 power supply guide wires, 5 fixed seal rings, 6 screwed sockets.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.
Referring to Fig.1-2, a kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell, including high-boron-silicon glass shell 1, high boron The both sides outer wall of silica glass shell 1 is equipped with fixed seal ring 5, and semiconductor wafer is transversely provided between two fixed seal rings 5 Group 2, semiconductor wafer group 2 are located at the inside of high-boron-silicon glass shell 1, and the side outer wall of fixed seal ring 5 is equipped with glass stem 3, glass stem 3 runs through fixed seal ring 5 close to one end of shell 1 and extends to the inside of high-boron-silicon glass shell 1, semiconductor 2 front side outer wall of chipset is welded with power supply guide wire 4, and the one end of glass stem 3 far from fixed seal ring 5 is equipped with screwed socket 6.
1 a diameter of 45-65mm of high-boron-silicon glass shell, the number of semiconductor wafer group 2 for 6 or less than 6, lead by power supply It is electrically connected between the one end of lead 4 far from semiconductor wafer group 2 and glass stem 3, between screwed socket 6 and glass stem 3 It is electrically connected, the outer wall of screwed socket 6 is equipped with screw thread mouth.
Operation principle:Screwed socket 6 is installed on the lamp holder in greenhouse, then opens the switch of lamp holder, can will shine LED matrix is electrified, and then fax can be passed glass stem 3 by screwed socket 6, and then glass stem 3 again passs fax Fax can be passed semiconductor wafer group 2 by power lead 4, power lead 4, since the property of semiconductor wafer group 2 can To maintain shining for LED matrix, and there is sufficient space by the way that the high-boron-silicon glass shell 1 of a diameter of 45-65mm is arranged, more Be conducive to cross-ventilation heat dissipation, reduce light decay, radiating efficiency is higher, improves lamps and lanterns service life, and two fixed seal rings 5 can be with Semiconductor chip group 2 is fixed as to 360 ° of light-emitting device, formation can carry out position adjustment or carry out mobile light source, while also may be used According to the needs of greenhouse, mobile placement is carried out at any time, and structure novel has good practicability.
The preferable specific implementation mode of the above, only the utility model, but the scope of protection of the utility model is not Be confined to this, any one skilled in the art within the technical scope disclosed by the utility model, according to this practicality Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model Within enclosing.

Claims (6)

1. a kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell, including high-boron-silicon glass shell (1), which is characterized in that described The both sides outer wall of high-boron-silicon glass shell (1) is equipped with fixed seal ring (5), between two fixed seal rings (5) laterally Equipped with semiconductor wafer group (2), the semiconductor wafer group (2) is located at the inside of high-boron-silicon glass shell (1), and the fixation is close The side outer wall of seal (5) is equipped with glass stem (3), and the glass stem (3) runs through fixing seal close to one end of shell (1) Circle (5) and the inside for extending to high-boron-silicon glass shell (1), semiconductor wafer group (2) front side outer wall are welded with power supply and lead Lead (4), the one end of the glass stem (3) far from fixed seal ring (5) are equipped with screwed socket (6).
2. 360 ° of light-emitting LED devices of a kind of high-boron-silicon glass shell according to claim 1, which is characterized in that the height Pyrex shell (1) a diameter of 45-65mm.
3. 360 ° of light-emitting LED devices of a kind of high-boron-silicon glass shell according to claim 1, which is characterized in that described half The number of conductor chipset (2) is 6 or less than 6.
4. 360 ° of light-emitting LED devices of a kind of high-boron-silicon glass shell according to claim 1, which is characterized in that the electricity Source guide wire (4) is electrically connected between one end and glass stem (3) far from semiconductor wafer group (2).
5. 360 ° of light-emitting LED devices of a kind of high-boron-silicon glass shell according to claim 1, which is characterized in that the spiral shell It is electrically connected between line lamp cap (6) and glass stem (3).
6. 360 ° of light-emitting LED devices of a kind of high-boron-silicon glass shell according to claim 1, which is characterized in that the spiral shell The outer wall of line lamp cap (6) is equipped with screw thread mouth.
CN201820692138.6U 2018-05-10 2018-05-10 A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell Expired - Fee Related CN208058469U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820692138.6U CN208058469U (en) 2018-05-10 2018-05-10 A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820692138.6U CN208058469U (en) 2018-05-10 2018-05-10 A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell

Publications (1)

Publication Number Publication Date
CN208058469U true CN208058469U (en) 2018-11-06

Family

ID=63982088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820692138.6U Expired - Fee Related CN208058469U (en) 2018-05-10 2018-05-10 A kind of 360 ° of light-emitting LED devices of high-boron-silicon glass shell

Country Status (1)

Country Link
CN (1) CN208058469U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181106

Termination date: 20190510