CN208014690U - A kind of improved 220FW-2L lead frames easy to process - Google Patents
A kind of improved 220FW-2L lead frames easy to process Download PDFInfo
- Publication number
- CN208014690U CN208014690U CN201721658740.XU CN201721658740U CN208014690U CN 208014690 U CN208014690 U CN 208014690U CN 201721658740 U CN201721658740 U CN 201721658740U CN 208014690 U CN208014690 U CN 208014690U
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- Prior art keywords
- pin
- area
- muscle
- chip region
- improved
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Abstract
The utility model discloses a kind of improved 220FW-2L lead frames easy to process, including several frame units disposed in parallel, several are done frame unit disposed in parallel and are concatenated by middle muscle and lower muscle, each frame unit includes heat sink area, chip region and pin area, heat sink area is located at the top of chip region, pin area is located at the lower section of chip region, heat sink area and chip region are wrapped up by plastic-sealed body, pin area is equipped with left pin, right pin and be located at left pin, false pin between right pin, left pin, the middle part of right pin and false pin is connect with middle muscle, bottom is connect with lower muscle, pin is divided into lead area and outer lead area by middle muscle；It is connect with chip region by connection sheet at the top of left pin, welding section is equipped at the top of right pin, and welding section and the top of false pin keep certain distance with plastic-sealed body edge.This structure improve welding, packaging operation process accuracy, it is easy to process, and facilitate processing while reduce equipment investment.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, and in particular to a kind of improved 220FW-2L easy to process
Lead frame.
Background technology
Chip carrier of the lead frame as integrated circuit is that one kind realizing that chip internal circuits draw by means of bonding material
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
Effect is required in most semiconductor integrated blocks using lead frame, is basic material important in electronics and information industry
Material.Lead frame is typically provided loading area and lead district, for the product of 220FW-2L series, generally requires and is set in lead district
Set double pins, however double pin configurations of 220FW-2L series of products at present, without any fixed structure between two pins,
Between being easy to cause double pins in the process relative displacement occurs for welding, encapsulation process, causes product unqualified, therefore process
In it should be noted that avoid problems, this just increases its difficulty of processing, causes working efficiency relatively low.
Invention content
Goal of the invention：The utility model aim is in view of the deficiencies of the prior art, to provide a kind of improved easy to process
220FW-2L series lead frame.
Technical solution：A kind of improved 220FW-2L lead frames easy to process described in the utility model, if including
Dry frame unit disposed in parallel, several described do frame unit disposed in parallel by middle muscle and lower muscle concatenation, each
The frame unit includes heat sink area, chip region and pin area, and the heat sink area is located at the top of chip region, pin area
Lower section positioned at chip region, heat sink area and chip region are wrapped up by plastic-sealed body, and the pin area is equipped with left pin, right pin and position
The middle part of false pin between left pin, right pin, the left pin, right pin and false pin is connect with middle muscle, bottom
It is connect with lower muscle, pin is divided into lead area and outer lead area by the middle muscle；At the top of the left pin by connection sheet with
Chip region connects, and welding section is equipped at the top of the right pin, and welding section and the top of false pin are kept with plastic-sealed body edge
Certain distance.
Further, to avoid the problem that occurring matrix torticollis in plastic-sealed body injection moulding process, lead to defective insulation, it is described
Oval heat emission hole is equipped in heat sink area, the edge of the heat emission hole is equipped with radiating groove, and the radiating groove is extended by heat emission hole
To heat sink area edge.
Further, the heat emission hole is involute conical through-hole.
Further, the edge of the heat emission hole is equipped with 2N radiating groove, 1≤N≤3, and the setting of radiating groove emitting shape exists
Around heat emission hole.
Further, it for ease of encapsulation process, avoids losing lead frame in encapsulation process, at the top of the left pin
Connection sheet is inverted trapezoidal structure, and at 30 ~ 60 ° of angles between the connection sheet and chip region, and pin area is mutually flat with chip region
Row.
Further, for ease of welding processing, avoid in the welding process lead frame lost, the left pin, the right side are drawn
On foot and false pin, it is located at below welding section, the position above middle muscle is equipped with buffering notch.
Further, the buffering notch is a pair of V-arrangement bar groove being mutually parallel.
Further, the lower muscle is equipped with several mounting holes, and each mounting hole corresponds to a frame unit.
Further, to improve heat dissipation effect, the left pin and right pin are equipped with several auxiliary heat dissipation holes, described
Auxiliary heat dissipation hole is involute conical through-hole.
Advantageous effect：（1）Utility model device is improved existing 220FW-2L, and original double pins are changed
Add three pin configurations of false pinned, the setting of false pin that can fix left pin and right pin in process for double pins
Between position relationship, avoid the mutual displacement caused by external force in process, improve welding, packaging operation process standard
True property, it is easy to process, and also after welding encapsulation, false pin can fall off naturally later for muscle and lower muscle in excision, lead
Frame is still double-legged structure, ensures the normal use of 220FW-2L lead frames；（2）Lead frame after improvement provided by the utility model
Original packaging and testing equipment can be used to be packaged, equipment investment is reduced while facilitating processing.
Description of the drawings
Fig. 1 is the overall structure diagram of utility model device；
Fig. 2 is the side view of utility model device；
Fig. 3 is the partial enlarged view of pin area；
Wherein：1, frame unit, 2, middle muscle, 3, lower muscle, 4, heat sink area, 41, heat emission hole, 42, radiating groove, 5, chip
Area, 6, pin area, 61, left pin, 62 right pins, 63, false pin, 64, auxiliary heat dissipation hole, 65, lead area, 66, outer lead
Area, 7, mounting hole, 8, connection sheet, 9, welding section, 10, buffering notch.
Specific implementation mode
Technical solutions of the utility model are described in detail below by attached drawing, but the scope of protection of the utility model
It is not limited to the embodiment.
Embodiment：As shown in Figure 1 and 2, a kind of improved 220FW-2L lead frames easy to process, including 4 parallel set
The frame unit 1 set is done frame unit 1 disposed in parallel for described 4 and is concatenated by middle muscle 2 and lower muscle 3, each frame unit packet
Heat sink area 4, chip region 5 and pin area 6 are included, 4th area of the cooling fin is located at the top of chip region 5, and pin area 6 is located at chip region
5 lower section, heat sink area 4 is interior to be equipped with oval heat emission hole 41, and heat emission hole 41 is involute conical through-hole；The heat emission hole 41
Edge is equipped with 4 radiating grooves 42, and 42 emitting shape of radiating groove is arranged around heat emission hole 41, and extends to heat dissipation by heat emission hole 41
The edge of section 4；Heat sink area 4 and chip region 5 are wrapped up by plastic-sealed body, and the pin area 6 is equipped with left pin 61,62 and of right pin
False pin 63 between left pin 61, right pin 62, left pin 61 and right pin 62 are equipped with several auxiliary heat dissipation holes
64, the auxiliary heat dissipation hole 64 is involute conical through-hole；The middle part of the left pin 61, right pin 62 and false pin 63 with
Middle muscle 2 connects, and bottom is connect with lower muscle 3, and lower muscle 3 is equipped with 4 mounting holes 7, and each mounting hole 7 corresponds to a frame unit
1；The middle muscle 2 divides pin area 6 for lead area 65 and outer lead area 66；The top of the left pin 61 by connection sheet 8 with
Chip region 5 connects, and connection sheet 8 is inverted trapezoidal structure, and at 60 ° of angles, pin area 6 and chip between connection sheet 8 and chip region 5
Area 5 is mutually parallel；62 top of right pin is equipped with welding section 9, and welding section 9 and the top of false pin 63 are protected with plastic-sealed body edge
Hold certain distance；On left pin 61, right pin 62 and false pin 63, it is located at 9 lower section of welding section, as shown in figure 3, on middle muscle 2
The position of side is equipped with buffering notch 10, and buffering notch 10 is a pair of V-arrangement bar groove being mutually parallel.
In process, load, bonding, plastic packaging are welded first, rib cutting are carried out after cleaning, in the processes such as welding and plastic packaging
Middle vacation pin can play the role of fixed left pin and right pin mutual alignment, avoid occurring mutual displacement in process leading
Failed part is caused, false pin falls off naturally after rib cutting, and lead frame remains double pin configurations, which improves welding, packaging operation
The accuracy of process, it is easy to process, and can guarantee the normal use of lead frame.
As described above, although the utility model has been indicated and described with reference to specific preferred embodiment, it must not
It is construed to the limitation to the utility model itself.In the spirit and scope for not departing from the utility model that appended claims define
Under the premise of, it can various changes can be made in the form and details to it.
Claims (7)
1. a kind of improved 220FW-2L lead frames easy to process, including several frame units disposed in parallel, described
Several frame units disposed in parallel concatenated by middle muscle and lower muscle, each frame unit includes heat sink area, core
Section and pin area, the heat sink area are located at the top of chip region, and pin area is located at the lower section of chip region, heat sink area and core
It is wrapped up by plastic-sealed body section, it is characterised in that：The pin area be equipped with left pin, right pin and positioned at left pin, right pin it
Between false pin, the middle part of the left pin, right pin and false pin connect with middle muscle, and bottom is connect with lower muscle, in described
Pin is divided into lead area and outer lead area by muscle；It is connect with chip region by connection sheet at the top of the left pin, the right side
Welding section is equipped at the top of pin, and welding section and the top of false pin keep certain distance with plastic-sealed body edge；The heat dissipation
Oval heat emission hole is equipped in section, the edge of the heat emission hole is equipped with radiating groove, and the radiating groove is extended to scattered by heat emission hole
Backing area edge；The heat emission hole is involute conical through-hole.
2. improved 220FW-2L lead frames easy to process according to claim 1, it is characterised in that：The heat dissipation
The edge in hole is equipped with 2N radiating groove, 1≤N≤3, and radiating groove emitting shape is arranged around heat emission hole.
3. improved 220FW-2L lead frames easy to process according to claim 1, it is characterised in that：Draw on the left side
Connection sheet at the top of foot is inverted trapezoidal structure, and at 30 ~ 60 ° of angles, pin area and chip between the connection sheet and chip region
Area is mutually parallel.
4. improved 220FW-2L lead frames easy to process according to claim 1, it is characterised in that：Draw on the left side
On foot, right pin and false pin, it is located at below welding section, the position above middle muscle is equipped with buffering notch.
5. improved 220FW-2L lead frames easy to process according to claim 4, it is characterised in that：The buffering
Notch is a pair of V-arrangement bar groove being mutually parallel.
6. improved 220FW-2L lead frames easy to process according to claim 1, it is characterised in that：The lower muscle
Several mounting holes are equipped with, and each mounting hole corresponds to a frame unit.
7. improved 220FW-2L lead frames easy to process according to claim 1, it is characterised in that：Draw on the left side
Foot and right pin are equipped with several auxiliary heat dissipation holes, and the auxiliary heat dissipation hole is involute conical through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721658740.XU CN208014690U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 220FW-2L lead frames easy to process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721658740.XU CN208014690U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 220FW-2L lead frames easy to process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208014690U true CN208014690U (en) | 2018-10-26 |
Family
ID=63879847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721658740.XU Expired - Fee Related CN208014690U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 220FW-2L lead frames easy to process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208014690U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256368A (en) * | 2018-11-07 | 2019-01-22 | 佛山市蓝箭电子股份有限公司 | SOT23-X lead frame and its packaging method |
-
2017
- 2017-12-01 CN CN201721658740.XU patent/CN208014690U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256368A (en) * | 2018-11-07 | 2019-01-22 | 佛山市蓝箭电子股份有限公司 | SOT23-X lead frame and its packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20191201 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |