CN208014674U - A kind of mounting structure of integration module - Google Patents
A kind of mounting structure of integration module Download PDFInfo
- Publication number
- CN208014674U CN208014674U CN201820273393.7U CN201820273393U CN208014674U CN 208014674 U CN208014674 U CN 208014674U CN 201820273393 U CN201820273393 U CN 201820273393U CN 208014674 U CN208014674 U CN 208014674U
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- CN
- China
- Prior art keywords
- integration module
- mounting structure
- contact point
- copper portion
- dew copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model is related to electronic technology fields, disclose a kind of mounting structure of integration module.In the embodiment of the utility model, the mounting structure of integration module includes:Integration module and mainboard;Wherein, integration module includes:Bottom plate and the module body for being fixed on bottom plate;Bottom plate is equipped with N number of contact point;N is the natural number more than 0;Mainboard is equipped with resigning mouthful and N number of dew copper portion;Wherein, N number of dew copper portion is corresponded with N number of contact point;Module body is placed in resigning mouthful, and bottom plate is held in mainboard;Contact point is electrically connected with dew copper portion.Using the embodiment of the utility model, the thickness at integration module is reduced, and advantageously reduces the complete machine thickness of electronic equipment.
Description
Technical field
The utility model is related to electronic technology field, more particularly to a kind of mounting structure of integration module.
Background technology
With the continuous development of science and technology and the epoch are constantly progressive, mobile phone, computer, tablet computer, electronic reading
The electronic equipments such as device have become essential tool in people's daily life, bring great convenience to people's lives.
In recent years, it is constantly progressive with the fast development and electronic technology of society, the appearance of these electronic equipments grace and gently
It is thin it is tactile gradually experience liking for people, therefore, these electronic equipments are intended to ultrathin development mostly.
But the inventor of present patent application has found that at least there are the following problems in the prior art:
In the prior art, the integration module in electronic equipment is on patch to mainboard mostly, this allows for integrated mould
The thickness that thickness at block is superimposed for mainboard with integration module, as the sum of the thickness of the thickness of mainboard itself and integration module,
Thickness is larger, is unfavorable for the development that electronic equipment is intended to ultrathin.
Utility model content
The purpose of this utility model is to provide a kind of mounting structures of integration module so that the thickness at integration module obtains
Reduction has been arrived, the complete machine thickness of electronic equipment is advantageously reduced.
In order to solve the above technical problems, the embodiment of the utility model provides a kind of mounting structure of integration module,
Including:Integration module and mainboard;Wherein, integration module includes:Bottom plate and the module body for being fixed on bottom plate;Bottom plate is equipped with
N number of contact point;N is the natural number more than 0;
Mainboard is equipped with resigning mouthful and N number of dew copper portion;Wherein, N number of dew copper portion is corresponded with N number of contact point;
Module body is placed in resigning mouthful, and bottom plate is held in mainboard;
Contact point is electrically connected with dew copper portion.
The utility model embodiment in terms of existing technologies, in such a way that mainboard is broken plate, forms and integrates mould
The areas Kuai Chenban.In this way, when installing integration module, the thickness of mainboard can be saved in a thickness direction so that integration module
The thickness at place is reduced, and the complete machine thickness of electronic equipment is advantageously reduced.
Preferably, the first surface in bottom plate is arranged in N number of contact point.In this way, in the feelings for being not provided with other connection assists
Under condition, so that it may it is easy to assembly to realize the in electrical contact of integration module and mainboard, and cost is relatively low.
Preferably, the mounting structure of integration module further includes:N number of connector;Wherein, N number of connector and N number of contact point with
And N number of dew copper portion corresponds;Reveal copper portion and is equipped with jack;Connector includes:Interconnecting piece and extended outwardly by interconnecting piece one end
Plug division;The contact point of interconnecting piece and integration module connects;Plug division is inserted in the jack in dew copper portion.In this way, adding and connecing
The connector of contact portion, and by the plug division of connector be inserted in the jack in dew copper portion in the way of, realize connector and master
The electric connection of plate not only connects more reliably, but also operation is more convenient.
Preferably, N number of dew copper portion is enclosed set on resigning mouthful;Second surface or side wall in bottom plate is arranged in N number of contact point;It is integrated
The mounting structure of module further includes:N number of connector;Wherein, N number of connector and N number of contact point and N number of dew copper portion one are a pair of
It answers;Connector includes:Interconnecting piece and by the outwardly extending button bit shell foot in interconnecting piece one end;Contact of the interconnecting piece with integration module
Point connection;Button bit shell foot is held in dew copper portion.In this way, when installing integration module, it can be advance with integration module by connector
Device after assembling, is then pressed at resigning mouthful by assembling, enables button bit shell foot be held in dew copper portion and integration module can be realized
With the electric connection of mainboard, it is more convenient to operate.
Preferably, N number of connector and integration module are integral type, can be convenient for the installation in later stage, and can save connection
Assembly cost between part and integration module.
Preferably, integration module is integrated chip.
Preferably, the mounting structure of integration module is applied to mobile terminal.
Preferably, mobile terminal is mobile phone or tablet computer.
Description of the drawings
One or more embodiments are illustrated by the picture in corresponding attached drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element with same reference numbers label is expressed as similar element in attached drawing, removes
Non- to have special statement, composition does not limit the figure in attached drawing.
Fig. 1 is the structural schematic diagram according to the mounting structure of integration module in the utility model first embodiment;
Fig. 2 is a kind of structural schematic diagram according to the mounting structure of integration module in the utility model third embodiment;
Fig. 3 is another structural representation according to the mounting structure of integration module in the utility model third embodiment
Figure.
Specific implementation mode
It is new to this practicality below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Each embodiment of type is explained in detail.However, it will be understood by those skilled in the art that each in the utility model
In embodiment, in order to make the reader understand this application better, many technical details are proposed.But even if without these skills
Art details and various changes and modifications based on the following respective embodiments can also realize that each claim of the application is required and protect
The technical solution of shield.
The first embodiment of the utility model is related to a kind of mounting structure of integration module, as shown in Figure 1, including:Collection
At module 1 and mainboard 2.Wherein, integration module 1 includes:Bottom plate 12 and the module body 11 for being fixed on bottom plate 12.Bottom plate 12
Equipped with N number of contact point;N is the natural number more than 0.Mainboard 2 is equipped with resigning mouthful and N number of dew copper portion, N number of dew copper portion connect with N number of
Contact corresponds.
Specifically, integration module 1 can be applied for the mounting structure of integrated chip or integrated circuit, integration module
In mobile terminal, e.g., mobile phone, tablet computer etc..More specifically, when installing integration module 1, module body 11 is enabled to be placed in
Resigning mouthful, bottom plate 12 is held in mainboard 2, and contact point 121 is electrically connected with dew copper portion.
In present embodiment, the first surface in bottom plate 12 is arranged in N number of contact point 121.In this way, in installation integration module 1
When, integration module 1 is buckled in, the in electrical contact of integration module 1 and mainboard 2 can be realized on mainboard 2, is not related on mainboard 2
Reveal the variation of copper portion position, the application range of integration module 1 is wider.It such as, can be by 1 patch of integration module to mainboard 2, not only in fact
The reliable contacts of integration module 1 and mainboard 2 are showed, and easy to assembly, cost is relatively low.
Compared with prior art, in present embodiment, in such a way that mainboard 2 is broken plate, the heavy plate of integration module 1 is formed
Area.In this way, when installing integration module 1, the thickness of mainboard 2 can be saved in a thickness direction so that the thickness at integration module 1
Degree is reduced, and the complete machine thickness of electronic equipment is advantageously reduced.
The second embodiment of the utility model is related to a kind of mounting structure of integration module.Second embodiment is first
It is improved on the basis of embodiment, is mainly theed improvement is that:In the utility model second embodiment, integration module
Mounting structure further include N number of connector, can further ensure being reliably connected for integration module 1 and mainboard 2.
Specifically, N number of connector is corresponded with N number of contact point and N number of dew copper portion.Connector includes:Interconnecting piece
And by the outwardly extending plug division in interconnecting piece one end.The dew copper portion of mainboard 2 is equipped with jack, and interconnecting piece connects with integration module 1
Contact 121 connects, and plug division is inserted in the jack in dew copper portion.In this way, when installing integration module 1, it can be in advance by connector
The contact point 121 of interconnecting piece and integration module 1 weld, the assembly of connector and integration module 1 is obtained, then by assembly
The corresponding position being inserted on mainboard 2, assembling are more convenient.When actual production operates, N number of connector and integration module
Integral type is could be provided as, the installation in later stage can not only be convenient for, and the group between connector and integration module can be saved
Dress up this.
The utility model third embodiment is related to a kind of mounting structure of integration module, as shown in Figure 2.Third embodiment party
Formula is roughly the same with first embodiment, is in place of the main distinction:N number of contact point in the utility model third embodiment
Side wall in bottom plate 12 is set.
Specifically, the mounting structure of integration module further includes:N number of connector 3.Wherein, N number of connector 3 is contacted with N number of
Point 121 and N number of dew copper portion correspond.3 one end of connector is connect with the contact point 121 of integration module 1, the other end and mainboard
2 dew copper portion connection.
More specifically, by taking connector 3 shown in Fig. 2 as an example:Connector 3 includes:Interconnecting piece and by interconnecting piece one end
Outwardly extending button bit shell foot.Interconnecting piece is connect with the contact point 121 of integration module 1, and button bit shell foot is held in dew copper portion.This
Device after assembling can then be pressed connector 3 and 1 pre-assembly of integration module when installing integration module 1 by sample
To resigning mouthful, button bit shell foot is enabled to be held in the electric connection that integration module 1 and mainboard 2 can be realized in dew copper portion, operation is more
It is convenient.
However, the example above is only to illustrate, the not concrete form to connector 3 and N number of contact in present embodiment
Do any restriction in the installation position of point.Such as, in practical operation, the structure of connector 3 can also be as shown in Figure 3.Specifically,
The second surface in bottom plate 12 can also be arranged in N number of contact point.In this way, at the position in dew copper portion on designing mainboard 2, can incite somebody to action
N number of dew copper portion is gently towards lateral offset part, and when being mounted on mainboard 2 in order to integration module 1, N number of dew copper portion, which can enclose, to be set
In the surrounding of integration module 1, then, technical staff can pass through N number of contact of the integration module 1 correspondingly of N number of connector 3
N number of dew copper portion connection on point 121 and mainboard 2, to realize the connection of integration module 1 and mainboard 2.
It will be understood by those skilled in the art that the respective embodiments described above are to realize the specific implementation of the utility model
Example, and in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit of the utility model
And range.
Claims (8)
1. a kind of mounting structure of integration module, which is characterized in that including:Integration module and mainboard;Wherein, the integrated mould
Block includes:Bottom plate and the module body for being fixed on the bottom plate;The bottom plate is equipped with N number of contact point;N is the nature more than 0
Number;
The mainboard is equipped with resigning mouthful and N number of dew copper portion;Wherein, N number of dew copper portion and N number of contact point one are a pair of
It answers;
The module body is placed in the resigning mouthful, and the bottom plate is held in the mainboard;
The contact point is electrically connected with the dew copper portion.
2. the mounting structure of integration module according to claim 1, which is characterized in that N number of contact point is arranged in institute
State the first surface of bottom plate.
3. the mounting structure of integration module according to claim 2, which is characterized in that further include:N number of connector;Wherein,
N number of connector is corresponded with N number of contact point and N number of dew copper portion;
The dew copper portion is equipped with jack;
The connector includes:Interconnecting piece and by the outwardly extending plug division in interconnecting piece one end;
The interconnecting piece is connect with the contact point of the integration module;
The plug division is inserted in the jack in the dew copper portion.
4. the mounting structure of integration module according to claim 1, which is characterized in that N number of dew copper portion is enclosed set on institute
State resigning mouthful;
Second surface or side wall in the bottom plate is arranged in N number of contact point;
The mounting structure of the integration module further includes:N number of connector;Wherein, N number of connector and N number of contact point
And N number of dew copper portion corresponds;
The connector includes:Interconnecting piece and by the outwardly extending button bit shell foot in described interconnecting piece one end;
The interconnecting piece is connect with the contact point of the integration module;
The button bit shell foot is held in the dew copper portion.
5. the mounting structure of integration module according to claim 3, which is characterized in that N number of connector and the collection
It is integral type at module.
6. the mounting structure of integration module according to claim 1, which is characterized in that the integration module is integrated core
Piece.
7. the mounting structure of integration module according to claim 1, which is characterized in that the mounting structure of the integration module
Applied to mobile terminal.
8. the mounting structure of integration module according to claim 7, which is characterized in that the mobile terminal is mobile phone or puts down
Plate computer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820273393.7U CN208014674U (en) | 2018-02-27 | 2018-02-27 | A kind of mounting structure of integration module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820273393.7U CN208014674U (en) | 2018-02-27 | 2018-02-27 | A kind of mounting structure of integration module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208014674U true CN208014674U (en) | 2018-10-26 |
Family
ID=63886920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820273393.7U Expired - Fee Related CN208014674U (en) | 2018-02-27 | 2018-02-27 | A kind of mounting structure of integration module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208014674U (en) |
-
2018
- 2018-02-27 CN CN201820273393.7U patent/CN208014674U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20200227 |
|
CF01 | Termination of patent right due to non-payment of annual fee |