CN207982031U - A kind of conduction board mold - Google Patents
A kind of conduction board mold Download PDFInfo
- Publication number
- CN207982031U CN207982031U CN201820102321.6U CN201820102321U CN207982031U CN 207982031 U CN207982031 U CN 207982031U CN 201820102321 U CN201820102321 U CN 201820102321U CN 207982031 U CN207982031 U CN 207982031U
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- plate
- die holder
- bolster
- template
- upper clamp
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Abstract
The utility model discloses a kind of conductive board molds, it includes upper die structure and lower die structure, the upper die structure is sequentially installed with upper die holder from top to bottom, upper clamp plate and cope plate, the lower die structure is sequentially installed with lower cushion block from top to bottom, lower die holder, lower bolster and lower template, it is attached between the upper die holder and lower die holder by sliding outer guiding post, stripper plate is installed inside the cope plate, the stripper plate is movably connected in by the first contour sleeve below upper clamp plate, the stripper plate is connected to by the first Rectangular Spring below upper clamp plate, it is provided with lower de- plate above the lower template, the lower de- plate is movably connected in by the second contour sleeve above lower bolster, the lower de- plate is connected to by the second Rectangular Spring above lower bolster, described four angles of lower de- plate are provided with inner guiding post；The utility model realizes quick de- material, and solving the problems, such as conductive plate de- material not in time causes the bending part above conductive plate to wrinkle and tear.
Description
Technical field
The utility model is related to a kind of conductive plate processing technique field more particularly to a kind of conductive board molds.
Background technology
A kind of conductive plate, shape is as shown in Fig. 4, in the prior art, when being processed molding to this kind of conductive plate,
There are de- materials not in time, and bending part corrugation and the tearing being easy to cause above conductive plate keep conductive plate processing quality poor.
Invention content
For problems of the prior art, the utility model provides a kind of conductive board mold, solves conductive plate
The problem of de- material causes the bending part above conductive plate to wrinkle and tear not in time.
Technical solution used by the utility model is：A kind of conduction board mold comprising upper die structure and lower die structure,
The upper die structure includes upper die holder, and the upper die holder lower part is equipped with upper clamp plate, and the upper clamp plate lower part is equipped with cope plate,
The lower die structure includes lower die holder, and lower cushion block is equipped with below the lower die holder, lower bolster is equipped with above the lower die holder,
Lower template is installed above the lower bolster, is attached between the upper die holder and lower die holder by sliding outer guiding post, it is described
Stripper plate is installed, the stripper plate is movably connected in by the first contour sleeve below upper clamp plate, described de- inside cope plate
Flitch is connected to by the first Rectangular Spring below upper clamp plate, and the stripper plate passes through the first contour sleeve and the first Rectangular Spring
It is moved up and down inside cope plate, lower de- plate is provided with above the lower template, the lower de- plate is lived by the second contour sleeve
Dynamic to be connected to above lower bolster, the lower de- plate is connected to by the second Rectangular Spring above lower bolster, and the lower de- plate passes through
Second contour sleeve and the second Rectangular Spring are moved up and down along lower template, and described four angles of lower de- plate are provided with inner guiding post.
Preferably, the area of the lower template is less than the area of lower de- plate, and the lower template is arranged in lower de- intralamellar part.
Preferably, it is fixed by positioning pin between the upper die holder, upper clamp plate and cope plate, the lower template is under
It is fixed also by positioning pin between backing plate, between lower bolster and lower die holder.
Preferably, the inner guiding post bottom is fixed with lower die holder, and lower bolster and lower de- is extended upward through at the top of the inner guiding post
Plate.
The advantageous effect that the utility model reaches is：The utility model provides a kind of conductive board mold, respectively in upper mold
Stripper plate is set in structure, takes off plate under being arranged on lower die structure, is moved down by stripper plate and lower de- plate moves up, it is real
Quick de- material is showed, solving the problems, such as conductive plate de- material not in time causes the bending part above conductive plate to wrinkle and tear, section
About production cost.
Description of the drawings
The utility model is further illustrated below in conjunction with the accompanying drawings,
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the utility model upper die structure overlooking structure diagram；
Fig. 3 is the utility model lower die structure overlooking structure diagram；
Fig. 4 is the product structure schematic diagram of conductive plate；
Wherein, 11, upper die holder, 12, upper clamp plate, 13, cope plate, 14, stripper plate, the 15, first contour sleeve, 16, first
Rectangular Spring, 21, lower die holder, 22, lower cushion block, 23, lower bolster, 24, lower template, 25, lower de- plate, the 26, second contour sleeve,
27, the second Rectangular Spring, 28, inner guiding post, 3, sliding outer guiding post, 4, positioning pin.
Specific implementation mode
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
Technical solution used by the utility model is：As shown in Figures 1 to 4, a kind of conductive board mold comprising upper mold
Structure and lower die structure, the upper die structure include upper die holder 11, and 11 lower part of the upper die holder is equipped with upper clamp plate 12, it is described on
12 lower part of clamping plate is equipped with cope plate 13, and the lower die structure includes lower die holder 21, and 21 lower section of the lower die holder is equipped with underlay
Block 22,21 top of the lower die holder are equipped with lower bolster 23, and 23 top of the lower bolster is equipped with lower template 24, the upper die holder
It is attached between 11 and lower die holder 21 by sliding outer guiding post 3, stripper plate 14 is installed inside the cope plate 13, it is described de-
Flitch 14 is movably connected in 12 lower section of upper clamp plate by the first contour sleeve 15, and the stripper plate 14 passes through the first Rectangular Spring 16
It is connected to 12 lower section of upper clamp plate, the stripper plate 14 is by the first contour sleeve 15 and the first Rectangular Spring 16 in cope plate 13
Portion moves up and down, and 24 top of the lower template is provided with lower de- plate 25, and the lower de- plate 25 passes through 26 activity of the second contour sleeve
It is connected to 23 top of lower bolster, the lower de- plate 25 is connected to 23 top of lower bolster by the second Rectangular Spring 27, described lower de-
Plate 25 is moved up and down by the second contour sleeve 26 and the second Rectangular Spring 27 along lower template 24, and described 25 4 angles of lower de- plate are set
It is equipped with inner guiding post 28.
In the utility model, the stroke that stripper plate 14 moves up and down is controlled by the first contour sleeve 15, passes through second
Contour sleeve 26 controls down the stroke that de- plate 25 moves up and down.
The sliding outer guiding post 3 ensure that upper die structure can be moved up and down along sliding outer guiding post 3, ensure that frame mould and opens
The process of mould is smooth, and the effect of the inner guiding post 28 is to be used for correcting upper and lower mould, is positioned between upper and lower mould
It provides a convenient.
Preferable scheme is that the area of the lower template 24 is less than the area of lower de- plate 25, the setting of the lower template 24 exists
Down inside de- plate 25, which ensure that conductive plate waste material after molding quickly can be ejected lower template 24 by lower de- plate 25, reach
The purpose of quick separating waste material is arrived.
Preferable scheme is that be fixed by positioning pin 4 between the upper die holder 11, upper clamp plate 12 and cope plate 13,
It is positioned using positioning pin, ensure that the accuracy of position between upper die holder 11, upper clamp plate 12 and cope plate 13, the lower die
It is fixed also by positioning pin 4 between plate 24 and lower bolster 23, between lower bolster 23 and lower die holder 21, ensure that lower template 24
The accuracy positioned between lower bolster 23, between lower bolster 23 and lower die holder 21.
Preferable scheme is that 28 bottom of the inner guiding post is fixed with lower die holder 21,28 top of the inner guiding post extends upward through
Lower bolster 23 and lower de- plate 25.
The operation principle of the utility model is that conductive plate to be processed is put into above lower de- plate, and upper die holder drives and presss from both sides
Plate, cope plate and stripper plate move downward, and are positioned to the position of cope plate by the inner guiding post on lower bolster, pass through upper mold
Plate and lower de- plate push down conductive plate to be processed, move downwardly together, and conductive plate to be processed is then headed into upper mold by lower template
In the cavity of plate, conductive plate after molding is obtained, after cope plate is detached with lower template, waste material is ejected lower template by lower de- plate,
Conductive plate after molding is ejected cope plate cavity by stripper plate, realizes the separation of material and waste material, solves conductive plate de- material
The problem of causing the bending part above conductive plate to wrinkle and tear not in time, production cost is saved.
It is the preferred embodiment of the utility model above, does not impose any limitation on the present invention,
Every foundation the technical essence of the utility model any simple modification, equivalent change and modification made to the above embodiment,
Belong in the range of utility model technical solution.
Claims (4)
1. a kind of conduction board mold comprising upper die structure and lower die structure, the upper die structure include upper die holder, the upper mold
Seat lower part is equipped with upper clamp plate, and the upper clamp plate lower part is equipped with cope plate, and the lower die structure includes lower die holder, the lower die
Seat lower section is equipped with lower cushion block, and lower bolster is equipped with above the lower die holder, lower template is equipped with above the lower bolster, described
It is attached between upper die holder and lower die holder by sliding outer guiding post, which is characterized in that de- material is installed inside the cope plate
Plate, the stripper plate are movably connected in by the first contour sleeve below upper clamp plate, and the stripper plate passes through the first Rectangular Spring
Be connected to below upper clamp plate, the stripper plate by the first contour sleeve and the first Rectangular Spring inside the cope plate on move down
It is dynamic, lower de- plate is provided with above the lower template, the lower de- plate is movably connected in by the second contour sleeve above lower bolster,
The lower de- plate is connected to by the second Rectangular Spring above lower bolster, and the lower de- plate passes through the second contour sleeve and the second square
Shape spring is moved up and down along lower template, and described four angles of lower de- plate are provided with inner guiding post.
2. a kind of conductive board mold according to claim 1, which is characterized in that the area of the lower template is less than lower de- plate
Area, the lower template is arranged in lower de- intralamellar part.
3. a kind of conductive board mold according to claim 1, which is characterized in that the inner guiding post bottom is solid with lower die holder
It is fixed, extend upward through lower bolster and lower de- plate at the top of the inner guiding post.
4. a kind of conductive board mold according to claim 1, which is characterized in that the upper die holder, upper clamp plate and cope plate
Between be fixed by positioning pin, between the lower template and lower bolster, between lower bolster and lower die holder also by positioning pin
It is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820102321.6U CN207982031U (en) | 2018-01-22 | 2018-01-22 | A kind of conduction board mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820102321.6U CN207982031U (en) | 2018-01-22 | 2018-01-22 | A kind of conduction board mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207982031U true CN207982031U (en) | 2018-10-19 |
Family
ID=63821766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820102321.6U Active CN207982031U (en) | 2018-01-22 | 2018-01-22 | A kind of conduction board mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207982031U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328280A (en) * | 2019-07-17 | 2019-10-15 | 亿和精密工业（苏州）有限公司 | A kind of composite die of Anti-blockage |
-
2018
- 2018-01-22 CN CN201820102321.6U patent/CN207982031U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328280A (en) * | 2019-07-17 | 2019-10-15 | 亿和精密工业（苏州）有限公司 | A kind of composite die of Anti-blockage |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190717 Address after: 214000 Jinma Road, Hongshan Street, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Aisaite Technology Co., Ltd. Address before: 214028 West Side Block of Shuofang Dongxincun and Dongan Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Aibo Metal Products Co., Ltd. |