CN207957756U - MEMS sensor linear array, palaption probe - Google Patents
MEMS sensor linear array, palaption probe Download PDFInfo
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- CN207957756U CN207957756U CN201820212458.7U CN201820212458U CN207957756U CN 207957756 U CN207957756 U CN 207957756U CN 201820212458 U CN201820212458 U CN 201820212458U CN 207957756 U CN207957756 U CN 207957756U
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Abstract
A kind of MEMS sensor linear array of the utility model offer, palaption probe, MEMS sensor linear array includes interconnecting piece and several MEMS sensor units, and interconnecting piece and each MEMS sensor unit are arranged in order；Several MEMS sensor units share a top electrode；The upper surface of interconnecting piece is provided with the conductive material being electrically connected with top electrode, top electrode pad is provided on the lower surface of interconnecting piece, there is interconnecting piece the first through hole of the upper and lower surface through interconnecting piece, conductive material and top electrode pad to be electrically connected by the first connectivity layer being set on the hole wall of first through hole.Using MEMS sensor linear array provided by the utility model, palaption probe, the connectionless line of palaption probe encapsulation process, it can avoid reliability decrease of popping one's head in caused by connection thread breakage, and connecting line bring sensor linear array surface irregularity the phenomenon that occur, the palaption probe encapsulating structure is compact, it is simple for process, and improve the reliability of palaption probe.
Description
Technical field
The utility model is related to the field of medical instrument technology, more particularly to a kind of MEMS sensor linear array, palaption probe.
Background technology
In recent years, Chinese breast cancer has high incidence speedup, death rate height, treatment difficulty height, the trend of age of onset morning,
But other tumours are compared, it is preferable that the early diagnosis of breast cancer early controls effect, as carcinoma in situ nearly 100% can cure.The main reviewing party of breast cancer
Method has physical palpation, mammography, ultrasound, nuclear-magnetism, fiberoptic ductoscopy etc., they have some limitations.Mammary gland palpation is imaged skill
Art is suggested the nineties in last century, and corresponding medical device product emerged in 2003, this product have completely it is noninvasive,
The advantages that high sensitivity, easy to operate, result interpretation are easy, has very high market prospects and social value.
The performance quality of palaption probe is the key that the imaging of mammary gland palpation.Palaption probe is arranged several by vertical and horizontal
Pressure sensor forms linear array, and after breast surface, the pressure sensor in linear array can correspond to the bullet of tissue because of it for probe pressure testing
Property modulus it is different and export different pressure signals, after calculating these pressure signals, can obtain lump hardness,
The information such as size, shape, are diagnosed with adjuvant clinical.
Traditional pressure sensor linear array structure is mainly made of upper bottom crown and elastic silica gel therein, the silica gel
For the insulation dielectric of capacitance, makes sensor make the corresponding of pole span variation to external force using the elastic property of silica gel, cause
Capacitance changes.Using due to manufacture craft, the consistency of different sensors is poor in linear array when the program, measures knot
Fruit be affected by temperature it is larger, cannot spring back or spring back for a long time deficiency using rear silica gel.
Currently, the silicon based on MEMS (Micro-Electro-Mechanical System, abbreviation MEMS) technique
Base capacitance sensor starts to apply in palaption probe, which is encapsulated into the packaging effect when palaption probe of curved surface
Influence whether the signal acquisition effect of palaption probe, thus, how to optimize envelope when MEMS sensor linear array makes curved surface probe
The technical issues of dress is current urgent need to resolve.
Utility model content
The purpose of this utility model is that a kind of MEMS sensor linear array, palaption probe are proposed, so that palaption probe has
It is compact-sized, simple for process, high reliability.
For this purpose, the utility model uses following technical scheme：
A kind of MEMS sensor linear array, the MEMS sensor linear array include interconnecting piece and several MEMS sensor units,
The interconnecting piece and each MEMS sensor unit are arranged in order；Several MEMS sensor units share one and power on
Pole；The upper surface of the interconnecting piece is provided with the conductive material being electrically connected with the top electrode, on the lower surface of the interconnecting piece
It is provided with top electrode pad, the interconnecting piece has the first through hole of the upper and lower surface through the interconnecting piece, described
Conductive material and the top electrode pad are electrically connected by the first connectivity layer being set on the hole wall of the first through hole.
In said program, the MEMS sensor unit includes the top electrode for stacking gradually setting, insulating layer, elastic membrane
Layer, lower electrode and basal layer, wherein：The lower electrode is located at the upper surface of the basal layer, on the lower surface of the basal layer
It is provided with lower electrode pad, is provided through the second through-hole of the basal layer on the basal layer, the lower electrode and described
Lower electrode pad is electrically connected by the second connectivity layer being set on the hole wall of second through-hole.
In said program, cavity is provided between the layers of elastomeric film and the basal layer, the cavity includes mutually being connected
Logical multiple circular cavities；
The lower electrode includes electrodes piece under multiple circles being electrically connected to each other, each circular cavity and one
Lower electrodes piece is corresponding, the center of circle of projection of the circular cavity with corresponding lower electrodes piece on the basal layer
It overlaps；
Alternatively, the top electrode includes multiple circular upper electrode electrode slices being electrically connected to each other, each circular cavity
It is corresponding with a top electrode electrode slice, projection of the circular cavity with corresponding top electrode electrode slice on the basal layer
The center of circle overlap.
In said program, the height of the cavity is 1 μm；And/or a diameter of 50 μm -100 μm of the circular cavity；
And/or the lower electrodes piece is circle, the diameter of the circular cavity and the diameter ratio of the lower electrodes piece are big
In 110%；And/or the height of the lower electrode is 0.5 μm；And/or the height of the top electrode is 0.5 μm.
In said program, second through-hole is circular platform type through-hole, is located at the through-hole port of the upper surface of the basal layer
A diameter of 150 μm, be located at a diameter of 400 μm of through-hole port of the lower surface of the basal layer.
In said program, the material of the basal layer is glass；And/or the material of the layers of elastomeric film is silicon.
A kind of palaption probe, the palaption probe include probe base, circuit board, the cable with the circuit board electrical connection
And the MEMS sensor linear array in several above-mentioned technical proposals, wherein：The circuit board is arranged on the probe base；Institute
State and be provided with the first solder joint group corresponding with the lower electrode pad of MEMS sensor linear array on circuit board, and with it is described
The corresponding second solder joint group of top electrode pad of MEMS sensor linear array；The top electrode pad is corresponding with the lower electrode pad
It is connected in the first solder joint group and the second solder joint group.
In said program, the top electrode pad plants ball with the circuit board with the lower electrode pad by the pad
Or conductive glue connection.
The MEMS sensor linear array of MEMS sensor linear array provided by the utility model, palaption probe, use includes connection
Portion and several MEMS sensor units, the top electrode pad of the lower surface of interconnecting piece and the top electrode of MEMS sensor unit are electrically connected
It connects, in this way, when being connect with circuit board positioned at the top electrode pad of connection lower surface, is not necessarily to connecting line, it is disconnected to can avoid connecting line
The phenomenon that sensor linear array surface irregularity that probe reliability decrease and connecting line are brought caused by splitting, occurs, this is touched
It is compact to examine probe encapsulating structure, it is simple for process, improve the reliability of palaption probe.
Description of the drawings
Fig. 1 is the schematic diagram of MEMS sensor linear array in the utility model embodiment one；
Fig. 2 is the sectional view of MEMS sensor linear array in the utility model embodiment one；
Fig. 3 is the sectional view of MEMS sensor unit in the utility model embodiment one；
Fig. 4 is the schematic diagram of the MEMS sensor unit of the utility model embodiment one；
Fig. 5 is the exploded view of the palaption probe in the utility model embodiment two；
Fig. 6 is the method flow diagram of the manufacturing method of the MEMS sensor linear array in the utility model embodiment three；
Fig. 7 is the method flow diagram of the manufacturing method of the palaption probe in the utility model embodiment four.
Specific implementation mode
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is only used for explaining the utility model, rather than the restriction to the utility model.It further needs exist for illustrating
, illustrate only for ease of description, in attached drawing and the relevant part of the utility model rather than entire infrastructure.
Embodiment one
As depicted in figs. 1 and 2, the MEMS sensor linear array that the utility model embodiment provides includes interconnecting piece 110 and five
A MEMS sensor unit 200, interconnecting piece 110 and each MEMS sensor unit 200 are arranged in order；This five MEMS sensors
Unit 200 shares a top electrode 130；The upper surface of interconnecting piece 110 is provided with the conductive material being electrically connected with top electrode 130,
Top electrode pad 111 is provided on the lower surface of interconnecting piece, interconnecting piece has the upper and lower surface through interconnecting piece 110
First through hole 112, conductive material and top electrode pad 111 pass through the first connectivity layer for being set on the hole wall of first through hole 112
Electrical connection.
In the utility model embodiment, a MEMS sensor linear array includes five MEMS sensor units, but
In practical application, it is not limited to this.Here, MEMS sensor is pressure sensor.
As depicted in figs. 1 and 2, the lower surface of interconnecting piece 200 and the lower surface of MEMS sensor linear array are coplanar, at this point,
The top electrode 130 of MEMS sensor linear array guides the lower surface of MEMS sensor linear array, Ke Yiyu by top electrode pad 111
The lower electrode welding of MEMS sensor linear array is not necessarily to connecting line on same plane circuit board, can avoid connection thread breakage and causes
Probe reliability decrease and connecting line bring sensor linear array surface irregularity the phenomenon that occur, the palaption probe
Encapsulating structure is compact, simple for process, improves the reliability of palaption probe.
As shown in Figure 3 and Figure 4, MEMS sensor unit includes the top electrode 210 for stacking gradually setting, insulating layer 220, bullet
Property film layer 230, lower electrode 240 and basal layer 250, wherein：Lower electrode 240 is located at the upper surface of basal layer 250, basal layer 250
Lower surface on be provided with lower electrode pad 260, the second through-hole 270 of basal layer 250 is provided through on basal layer 250, under
Electrode 240 and lower electrode pad 260 are electrically connected by the second connectivity layer being set on the hole wall of the second through-hole 270.
In the utility model embodiment, the material of basal layer 250 is glass, and the material of layers of elastomeric film 230 is silicon.Its
In, the height of lower electrode 240 is 0.5 μm, and the height of top electrode 210 is 0.5 μm.In addition, the second through-hole 270 is logical for circular platform type
Hole is located at a diameter of 150 μm of the through-hole port of the upper surface of basal layer 250, is located at the through hole end of the lower surface of basal layer 250
A diameter of 400 μm of mouth.
As shown in figure 4, being provided with cavity 280 between layers of elastomeric film 230 and basal layer 250；Lower electrode 240 includes multiple phases
Electrodes piece under the circle being mutually electrically connected, cavity include the multiple circular cavities 281 interconnected, each circular cavity 281
It is corresponding with a lower electrodes piece, the circle of projection of the circular cavity 281 with corresponding lower electrodes piece on the base layer
The heart overlaps.As shown in figure 4, the quantity of circular cavity 281 is nine, at this point, the lower electrode that each MEMS sensor unit includes
The quantity of electrode slice is also nine.
In addition, top electrode 130 include multiple circular upper electrode electrode slices being electrically connected to each other, each circular cavity 281 with
One top electrode electrode slice is corresponding, the center of circle of projection of the circular cavity 281 with corresponding top electrode electrode slice on the base layer
It overlaps.
Wherein, the height of cavity 280 is 1 μm, a diameter of 50 μm -100 μm of circular cavity 281.Circular cavity 281 it is straight
The diameter ratio of diameter and lower electrodes piece is more than 110%, the diameter ratio of the diameter and top electrode electrode slice of circular cavity 281
More than 110%.
MEMS sensor linear array provided by the utility model includes interconnecting piece and several MEMS sensor units, interconnecting piece
The top electrode pad of lower surface is electrically connected with the top electrode of MEMS sensor unit, in this way, powering on positioned at connection lower surface
When pole pad is connect with circuit board, it is not necessarily to connecting line, can avoid reliability decrease of popping one's head in caused by connection thread breakage, and connection
The phenomenon that sensor linear array surface irregularity that tape comes, occurs, and the palaption probe encapsulating structure is compact, simple for process, improves
The reliability of palaption probe.
Embodiment two
As shown in figure 5, the palaption probe that the utility model embodiment provides includes that probe base (is not shown in figure, circuit
MEMS sensor linear array in plate 500, the cable being electrically connected with circuit board 500 and several embodiments one, wherein：Circuit board
500 are arranged on probe base；The first weldering corresponding with the lower electrode pad of MEMS sensor linear array is provided on circuit board 500
Point group 510, and the second solder joint group 520 corresponding with the top electrode pad of MEMS sensor linear array；Top electrode pad 111 is under
Electrode pad 260 is correspondingly connected in the first solder joint group 510 and the second solder joint group 520.
MEMS sensor linear array in embodiment one is formed after scribing after integral type making on wafer, and multiple MEMS are passed
Sensor linear array is arranged in parallel on circuit board 500, and circuit board 500 is flexible PCB.First solder joint group 510 of circuit board 500
It is connect with top electrode lead-out wire 512, the second solder joint group 520 is connect with lower electrode outlet line 522.
Specifically, top electrode pad 111 can plant ball by pad with circuit board with lower electrode pad 260 or conducting resinl connects
It connects.
The MEMS sensor linear array that palaption probe provided by the utility model uses includes interconnecting piece and several MEMS sensings
Device unit, the top electrode pad of the lower surface of interconnecting piece is electrically connected with the top electrode 130 of MEMS sensor unit, in this way, being located at
When the top electrode pad of connection lower surface is connect with circuit board, it is not necessarily to connecting line, can avoid probe caused by connection thread breakage
The phenomenon that sensor linear array surface irregularity that reliability decrease and connecting line are brought, occurs, palaption probe encapsulation knot
Structure is compact, simple for process, improves the reliability of palaption probe.
Embodiment three
In the utility model embodiment, MEMS sensor linear array includes interconnecting piece and several MEMS sensor units
MEMS sensor linear array, several MEMS sensor units share a top electrode.As shown in fig. 6, the utility model embodiment carries
The manufacturing method of the MEMS sensor linear array of confession includes：
Step 610, first through hole is made in the upper surface of interconnecting piece and between being provided with the lower surface of top electrode pad.
Step 620, insulating materials and conductive material, conduction material are sequentially depositing on the upper surface of interconnecting piece and first through hole
Material and top electrode pad are electrically connected by the first connectivity layer being formed on the hole wall of first through hole.
Specifically, when manufacturing MEMS sensor linear array, following steps 701-711 is executed：
Step 701, the second through-hole for being provided through basal layer is formed on glass substrate layers.Second through-hole be it is upper it is thin under
Thick circular platform type via hole is located at a diameter of 150 μm of the through-hole port of the upper surface of basal layer, is located at the lower surface of basal layer
A diameter of 400 μm of through-hole port.Laser drilling can be used or sandblasting micro-processing technology makes the via hole.
Step 702, the lower electrode of MEMS sensor is formed in the upper surface of basal layer, lower electrode includes multiple being mutually electrically connected
The lower electrodes piece connect；The top electrode pad of MEMS sensor and lower electrode pad, lower electricity are formed in the lower surface of basal layer
Pole and lower electrode pad are electrically connected by the second connectivity layer being set on the hole wall of the second through-hole.
It is rectangular at the internal layers of elastomeric film with cavity on the base layer in following steps 703 to step 705, specifically
Ground：
The top layer silicon of silicon chip (Silicon-On-Insulator, abbreviation SOI) silicon chip step 703, on an insulating substrate
Upper formation cavity.For example, it is 300 μm to select thickness, 6 cun of twin polishing silicon wafer to manufacture layers of elastomeric film, wherein top layer silicon thickness is
10 μm, cavity is formed by gluing, photoetching, development and silicon etching process in top layer silicon graphical cavity structure prepared above,
1.5 μm of corrosion depth.The cavity includes the multiple circular cavities interconnected, a diameter of 50-100 μm of circular cavity.
Step 704, the above soi wafer is bonded with basal layer will.There is cavity, each circle of cavity inside the silicon chip
Cavity is corresponding with a lower electrodes piece, the circle of projection of the circular cavity with corresponding lower electrodes piece on the base layer
The heart overlaps.
Step 705, the bottom silicon layer and oxygen buried layer of the soi wafer after removal is bonded with basal layer.Specifically, Ke Yili
With the bottom silicon layer of the soi wafer after tetramethyl ammonium hydroxide solution removal bonding, SOI silicon is removed using buffered oxide etch liquid
The oxygen buried layer of piece.
Step 706, it using laser boring technique, is made in layers of elastomeric film and basal layer and runs through layers of elastomeric film and basal layer
First through hole.
Step 707, it is sequentially depositing insulating materials on the hole wall of the upper surface of layers of elastomeric film and first through hole, it is therefore an objective to keep away
Exempt from top electrode and the lower possible electrical contact of electrode.The step forms insulating layer.
Step 708, side deposits conductive material on the insulating layer, forms top electrode, conductive material and top electrode pad pass through
The the first connectivity layer electrical connection being formed on the hole wall of first through hole.
Step 709, top electrode is graphical, in the upper surface deposited metal aluminium of insulating layer, 0.5 μm of thickness, then by gluing,
Photoetching, development and etching technics form graphical top electrode, while top electrode sidewalls form top electrode connectivity layer.On
Electrode is formed by top electrode conductting layer and top electrode pad and is electrically connected.
Step 710, using low-pressure chemical vapour deposition technique low temperature depositing silica as insulating layer, thickness is 1 μm.
The step can be in direct contact to avoid top electrode and the external world.
Step 711, wafer is cut into linear array, such as the sensor linear array of 5*1, i.e. five sensor units and a company
Socket part constitutes a linear array.
Example IV
Palaption probe in the utility model embodiment includes probe base, circuit board, the cable with circuit board electrical connection
And the MEMS sensor linear array of the manufacture in several technical solutions according in embodiment three, as shown in fig. 7, the utility model
The manufacturing method of palaption probe that embodiment provides includes：
Step 810, circuit board is made, corresponding with the lower electrode pad of MEMS sensor linear array the is provided on circuit board
One solder joint group, and second solder joint group corresponding with the top electrode pad of MEMS sensor linear array
Step 820, the first solder joint group and second are bonded in by top electrode pad is corresponding with lower electrode pad by conducting resinl
In solder joint group.
Wherein, step 820 can also be replaced with following steps：By Reflow Soldering by top electrode pad and lower electricity after planting ball
Pole pad correspondence is welded in the first solder joint group and the second solder joint group.
Later, the flexible PCB for being welded with MEMS sensor linear array is Nian Jie with curved surface backing, at the same by top electrode and
Lower electrode is established with cable and is electrically connected.
Finally, palaption probe is connect with capture card system, host, forms palpation imaging system.
The MEMS sensings of MEMS sensor linear array, the use of the manufacturing method of palaption probe that the utility model embodiment provides
Device linear array includes interconnecting piece and several MEMS sensor units, top electrode pad and the MEMS sensor list of the lower surface of interconnecting piece
The top electrode electrical connection of member is not necessarily to connecting line in this way, when being connect with circuit board positioned at the top electrode pad of connection lower surface,
It can avoid the sensor linear array surface irregularity that probe reliability decrease and connecting line are brought caused by connection thread breakage
Phenomenon occurs, and the palaption probe encapsulating structure is compact, simple for process, improves the reliability of palaption probe.
The above, the only preferred embodiment of the utility model, are not intended to limit the protection of the utility model
Range.
Claims (8)
1. a kind of MEMS sensor linear array, which is characterized in that the MEMS sensor linear array includes that interconnecting piece and several MEMS are passed
Sensor cell, the interconnecting piece and each MEMS sensor unit are arranged in order；
Several MEMS sensor units share a top electrode；
The upper surface of the interconnecting piece is provided with the conductive material being electrically connected with the top electrode, on the lower surface of the interconnecting piece
It is provided with top electrode pad, the interconnecting piece has the first through hole of the upper and lower surface through the interconnecting piece, described
Conductive material and the top electrode pad are electrically connected by the first connectivity layer being set on the hole wall of the first through hole.
2. MEMS sensor linear array according to claim 1, which is characterized in that the MEMS sensor unit includes successively
Top electrode, insulating layer, layers of elastomeric film, lower electrode and the basal layer of setting are stacked, wherein：
The lower electrode is located at the upper surface of the basal layer, and lower electrode pad, institute are provided on the lower surface of the basal layer
The second through-hole that the basal layer is provided through on basal layer is stated, the lower electrode and the lower electrode pad are by being set to
The second connectivity layer electrical connection on the hole wall of second through-hole.
3. MEMS sensor linear array according to claim 2, which is characterized in that the layers of elastomeric film and the basal layer it
Between be provided with cavity, the cavity includes the multiple circular cavities interconnected；
The lower electrode includes electrodes piece under multiple circles being electrically connected to each other, each circular cavity with it is electric under one
Pole electrode slice is corresponding, the center of circle weight of projection of the circular cavity with corresponding lower electrodes piece on the basal layer
It closes；
Alternatively, the top electrode includes multiple circular upper electrode electrode slices being electrically connected to each other, each circular cavity and one
A top electrode electrode slice is corresponding, the circle of projection of the circular cavity with corresponding top electrode electrode slice on the basal layer
The heart overlaps.
4. MEMS sensor linear array according to claim 3, which is characterized in that the height of the cavity is 1 μm；And/or
A diameter of 50 μm -100 μm of the circular cavity；And/or state the diameter of the diameter and the lower electrodes piece of circular cavity
The ratio between be more than 110%；And/or the height of the lower electrode is 0.5 μm；And/or the height of the top electrode is 0.5 μm.
5. according to claim 2 to 4 any one of them MEMS sensor linear array, which is characterized in that second through-hole is circle
Bench-type through-hole is located at a diameter of 150 μm of the through-hole port of the upper surface of the basal layer, is located at the lower surface of the basal layer
A diameter of 400 μm of through-hole port.
6. according to claim 2 to 4 any one of them MEMS sensor linear array, which is characterized in that the material of the basal layer
For glass；And/or the material of the layers of elastomeric film is silicon.
7. a kind of palaption probe, which is characterized in that the palaption probe includes probe base, circuit board and circuit board electricity
The cable of connection and several such as claim 1 to 6 any one of them MEMS sensor linear arrays, wherein：
The circuit board is arranged on the probe base；
The first solder joint group corresponding with the lower electrode pad of MEMS sensor linear array, Yi Jiyu are provided on the circuit board
The corresponding second solder joint group of top electrode pad of the MEMS sensor linear array；
The top electrode pad is correspondingly connected with the lower electrode pad in the first solder joint group and the second solder joint group.
8. palaption probe according to claim 7, which is characterized in that the top electrode pad and the lower electrode pad with
The circuit board plants ball or conductive glue connection by the pad.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820212458.7U CN207957756U (en) | 2018-02-07 | 2018-02-07 | MEMS sensor linear array, palaption probe |
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| CN201820212458.7U CN207957756U (en) | 2018-02-07 | 2018-02-07 | MEMS sensor linear array, palaption probe |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108190828A (en) * | 2018-02-07 | 2018-06-22 | 北京先通康桥医药科技有限公司 | MEMS sensor linear array, palaption probe and its manufacturing method |
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2018
- 2018-02-07 CN CN201820212458.7U patent/CN207957756U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108190828A (en) * | 2018-02-07 | 2018-06-22 | 北京先通康桥医药科技有限公司 | MEMS sensor linear array, palaption probe and its manufacturing method |
| WO2019153162A1 (en) * | 2018-02-07 | 2019-08-15 | 北京先通康桥医药科技有限公司 | Linear mems sensor array, palpation probe, and manufacturing method thereof |
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Denomination of utility model: MEMS sensor line array, palpation probe Effective date of registration: 20190318 Granted publication date: 20181012 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: BEIJING XIANTONG KANGQIAO MEDICINE SCIENCE & TECHNOLOGY CO., LTD. Registration number: 2019990000231 |
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Date of cancellation: 20200417 Granted publication date: 20181012 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: BEIJING XIANTONG KANGQIAO MEDICINE SCIENCE & TECHNOLOGY Co.,Ltd. Registration number: 2019990000231 |
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