CN207938650U - The emitting semiconductor for sending out a variety of coloured light is realized based on a chip - Google Patents

The emitting semiconductor for sending out a variety of coloured light is realized based on a chip Download PDF

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Publication number
CN207938650U
CN207938650U CN201820419131.7U CN201820419131U CN207938650U CN 207938650 U CN207938650 U CN 207938650U CN 201820419131 U CN201820419131 U CN 201820419131U CN 207938650 U CN207938650 U CN 207938650U
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CN
China
Prior art keywords
fluorescent film
chip
regions
variety
emitting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820419131.7U
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Chinese (zh)
Inventor
李玉元
万喜红
雷玉厚
陈三奇
王于璐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN LIGHTNING OPTOELECTRONIC Co Ltd
Original Assignee
FUJIAN LIGHTNING OPTOELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of CN207938650U publication Critical patent/CN207938650U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of emitting semiconductor realized based on a chip and send out a variety of coloured light, include the luminous semiconductor chip of an areflexia cover board, a fluorescent film is covered on the luminous semiconductor chip, the fluorescent film squarely cover body structure, surface at the top of the fluorescent film, which divides, multiple regions, the fluorescent film in each region is correspondingly arranged on a kind of color, one first reflecting layer is provided at the top of the fluorescent film, four sides are both provided with one second reflecting layer around the fluorescent film, the multiple region is four regions, and four regions etc. are big is uniformly distributed.The utility model can launch the light of multiple color by a chip, reduce production cost.

Description

The emitting semiconductor for sending out a variety of coloured light is realized based on a chip
Technical field
The utility model is related to LED encapsulation technologies fields, are based particularly on chip realization and send out shining for a variety of coloured light Semiconductor.
Background technology
Include luminous semiconductor chip in existing emitting semiconductor structure, and the manufacturing process of emitting semiconductor structure It is:The form that fluorescent powder and silica gel are directly carried out to dispensing or spraying is set on luminous semiconductor chip;In this way dispensing or The mode not only low production efficiency of person's spraying, but also made by a dispensing or spraying, fluorescent powder and silica gel global formation It is bad, and existing emitting semiconductor needs multiple luminous semiconductor chips, such nothing to launch the light of multiple color It doubts and increases manufacturing cost.
Invention content
In order to overcome the problems referred above, the purpose of this utility model is to provide sends out shining for a variety of coloured light based on chip realization Semiconductor can launch the light of multiple color by a chip, reduce production cost.
The utility model is realized using following scheme:It is a kind of to realize that sending out the luminous of a variety of coloured light partly leads based on a chip Body includes the luminous semiconductor chip of an areflexia cover board, a fluorescent film, the fluorescence is covered on the luminous semiconductor chip Film squarely cover body structure, the surface at the top of the fluorescent film, which divides, multiple regions, and the fluorescent film correspondence in each region is set It is equipped with a kind of color, one first reflecting layer is provided at the top of the fluorescent film, four sides are all provided with around the fluorescent film It is equipped with one second reflecting layer, the multiple region is four regions, and four regions etc. are big is uniformly distributed.
Further, the fluorescent film is made of fluorescent powder and silica gel.
Further, the fluorescent film in four regions is correspondingly arranged there are four types of color, and four kinds of colors are respectively:In vain Color, red, green and yellow.
Further, the region is homalographic region.
The beneficial effects of the utility model are:The fluorescent film global formation of the utility model is good, can allow shine and partly lead Body uniform in light emission, and by the effect in the first reflecting layer and the second reflecting layer, the luminous energy that such luminous semiconductor chip is sent out to Surrounding dissipates, and such illumination effect is good, and fluorescent film division is had multiple regions, the fluorescent film in each region by the utility model It is correspondingly arranged on a kind of color, as long as a luminous semiconductor chip can send out the light of multiple color in this way.
Description of the drawings
Fig. 1 is the structural schematic diagram that the first reflecting layer and the second reflecting layer are not arranged for the utility model.
Fig. 2 is the sectional view of the utility model.
Specific implementation mode
The utility model is described further below in conjunction with the accompanying drawings.
It please refers to Fig.1 with shown in Fig. 2, the utility model provides a kind of hair realized based on a chip and send out a variety of coloured light Photosemiconductor includes the luminous semiconductor chip 1 of an areflexia cover board, a fluorescent film is covered on the luminous semiconductor chip 1 2,2 squarely cover body structure of the fluorescent film, the surface at 2 top of the fluorescent film, which divides, multiple regions 3, each region 3 Fluorescent film 2 be correspondingly arranged on a kind of color, the top of the fluorescent film 2 is provided with one first reflecting layer 4(Reflecting layer can adopt With transmitting cover board), four sides are both provided with one second reflecting layer 5, such luminous semiconductor chip around the fluorescent film 2 1 adjusts light emitting angle through the first reflecting layer 4 and four the second reflecting layer 5 of surrounding, reaches and dissipates around, sends out in this way Light effect is good;The multiple region 3 is four regions, and four regions etc. are big is uniformly distributed.The fluorescent film 2 is by fluorescence Powder and silica gel are made.
In the utility model, the fluorescent film 2 in four regions 3 is correspondingly arranged there are four types of color, and four kinds of colors are divided It is not:White, red, green and yellow.There are multiple regions, the fluorescent film correspondence in each region to set fluorescent film division It is equipped with a kind of color, as long as a luminous semiconductor chip can send out the light of multiple color in this way.Preferably, those regions can To be homalographic region, those regions can be fan-shaped, heart-shaped or various regular patterns.
In short, the fluorescent film global formation of the utility model is good, emitting semiconductor uniform in light emission can be allowed, and pass through first The effect in reflecting layer and the second reflecting layer, the luminous energy that such luminous semiconductor chip is sent out dissipate around, such illumination effect It is good, and fluorescent film division is had multiple regions, the fluorescent film in each region to be correspondingly arranged on a kind of color by the utility model, this As long as one luminous semiconductor chip of sample can send out the light of multiple color.
Although it is noted that the utility model integrally look over it is simple in structure, its structure no matter from make work Skill, or it is all very prominent from using effect:
1. fluorescent film is by fluorescent powder and silica gel(Containing silicone resin)Composition forms fluorescent film by knifing machine knifing and heating;
2. after fluorescent film completes, may be produced that different shape or sized membrane by cutting, being attached to emitting semiconductor (Or do not cut direct attaching);
3. attaching emitting semiconductor by fluorescent film, emitting semiconductor uniform in light emission can be allowed, consistency(Concentration degree)More It is good;
4. fluorescent film is attached than traditional dot fluorescent powder(Glue)On emitting semiconductor and coating(Containing outer cover)It light extraction and can grasp The property made is strong, and precision is more preferable;
5. fluorescent film is attached to emitting semiconductor, attached by heat and vacuum, does not increase glue or other substances are viscous Patch, and fluorescent film is applied to emitting semiconductor and improves heat conductivity.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the claims it is equal Deng variation and modification, it should all belong to the covering scope of the utility model.

Claims (4)

1. a kind of realizing the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Including an areflexia cover board Luminous semiconductor chip, be covered with a fluorescent film, the fluorescent film squarely cover body structure, institute on the luminous semiconductor chip Stating the surface at the top of fluorescent film and dividing has multiple regions, and the fluorescent film in each region is correspondingly arranged on a kind of color, described glimmering One first reflecting layer is provided at the top of light film, four sides are both provided with one second reflecting layer, institute around the fluorescent film It is four regions to state multiple regions, and four regions etc. are big is uniformly distributed.
2. according to claim 1 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute Fluorescent film is stated to be made of fluorescent powder and silica gel.
3. according to claim 1 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute The fluorescent film for stating four regions is correspondingly arranged there are four types of color, and four kinds of colors are respectively:White, red, green, Yi Jihuang Color.
4. according to claim 3 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute It is homalographic region to state region.
CN201820419131.7U 2018-01-05 2018-03-27 The emitting semiconductor for sending out a variety of coloured light is realized based on a chip Expired - Fee Related CN207938650U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201820020768 2018-01-05
CN2018200207689 2018-01-05

Publications (1)

Publication Number Publication Date
CN207938650U true CN207938650U (en) 2018-10-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820419131.7U Expired - Fee Related CN207938650U (en) 2018-01-05 2018-03-27 The emitting semiconductor for sending out a variety of coloured light is realized based on a chip

Country Status (1)

Country Link
CN (1) CN207938650U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116825929A (en) * 2023-06-30 2023-09-29 淮安澳洋顺昌光电技术有限公司 Chip-level light-emitting diode package with large light-emitting angle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116825929A (en) * 2023-06-30 2023-09-29 淮安澳洋顺昌光电技术有限公司 Chip-level light-emitting diode package with large light-emitting angle

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181002

Termination date: 20210327

CF01 Termination of patent right due to non-payment of annual fee