CN207938650U - The emitting semiconductor for sending out a variety of coloured light is realized based on a chip - Google Patents
The emitting semiconductor for sending out a variety of coloured light is realized based on a chip Download PDFInfo
- Publication number
- CN207938650U CN207938650U CN201820419131.7U CN201820419131U CN207938650U CN 207938650 U CN207938650 U CN 207938650U CN 201820419131 U CN201820419131 U CN 201820419131U CN 207938650 U CN207938650 U CN 207938650U
- Authority
- CN
- China
- Prior art keywords
- fluorescent film
- chip
- regions
- variety
- emitting semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a kind of emitting semiconductor realized based on a chip and send out a variety of coloured light, include the luminous semiconductor chip of an areflexia cover board, a fluorescent film is covered on the luminous semiconductor chip, the fluorescent film squarely cover body structure, surface at the top of the fluorescent film, which divides, multiple regions, the fluorescent film in each region is correspondingly arranged on a kind of color, one first reflecting layer is provided at the top of the fluorescent film, four sides are both provided with one second reflecting layer around the fluorescent film, the multiple region is four regions, and four regions etc. are big is uniformly distributed.The utility model can launch the light of multiple color by a chip, reduce production cost.
Description
Technical field
The utility model is related to LED encapsulation technologies fields, are based particularly on chip realization and send out shining for a variety of coloured light
Semiconductor.
Background technology
Include luminous semiconductor chip in existing emitting semiconductor structure, and the manufacturing process of emitting semiconductor structure
It is:The form that fluorescent powder and silica gel are directly carried out to dispensing or spraying is set on luminous semiconductor chip;In this way dispensing or
The mode not only low production efficiency of person's spraying, but also made by a dispensing or spraying, fluorescent powder and silica gel global formation
It is bad, and existing emitting semiconductor needs multiple luminous semiconductor chips, such nothing to launch the light of multiple color
It doubts and increases manufacturing cost.
Invention content
In order to overcome the problems referred above, the purpose of this utility model is to provide sends out shining for a variety of coloured light based on chip realization
Semiconductor can launch the light of multiple color by a chip, reduce production cost.
The utility model is realized using following scheme:It is a kind of to realize that sending out the luminous of a variety of coloured light partly leads based on a chip
Body includes the luminous semiconductor chip of an areflexia cover board, a fluorescent film, the fluorescence is covered on the luminous semiconductor chip
Film squarely cover body structure, the surface at the top of the fluorescent film, which divides, multiple regions, and the fluorescent film correspondence in each region is set
It is equipped with a kind of color, one first reflecting layer is provided at the top of the fluorescent film, four sides are all provided with around the fluorescent film
It is equipped with one second reflecting layer, the multiple region is four regions, and four regions etc. are big is uniformly distributed.
Further, the fluorescent film is made of fluorescent powder and silica gel.
Further, the fluorescent film in four regions is correspondingly arranged there are four types of color, and four kinds of colors are respectively:In vain
Color, red, green and yellow.
Further, the region is homalographic region.
The beneficial effects of the utility model are:The fluorescent film global formation of the utility model is good, can allow shine and partly lead
Body uniform in light emission, and by the effect in the first reflecting layer and the second reflecting layer, the luminous energy that such luminous semiconductor chip is sent out to
Surrounding dissipates, and such illumination effect is good, and fluorescent film division is had multiple regions, the fluorescent film in each region by the utility model
It is correspondingly arranged on a kind of color, as long as a luminous semiconductor chip can send out the light of multiple color in this way.
Description of the drawings
Fig. 1 is the structural schematic diagram that the first reflecting layer and the second reflecting layer are not arranged for the utility model.
Fig. 2 is the sectional view of the utility model.
Specific implementation mode
The utility model is described further below in conjunction with the accompanying drawings.
It please refers to Fig.1 with shown in Fig. 2, the utility model provides a kind of hair realized based on a chip and send out a variety of coloured light
Photosemiconductor includes the luminous semiconductor chip 1 of an areflexia cover board, a fluorescent film is covered on the luminous semiconductor chip 1
2,2 squarely cover body structure of the fluorescent film, the surface at 2 top of the fluorescent film, which divides, multiple regions 3, each region 3
Fluorescent film 2 be correspondingly arranged on a kind of color, the top of the fluorescent film 2 is provided with one first reflecting layer 4(Reflecting layer can adopt
With transmitting cover board), four sides are both provided with one second reflecting layer 5, such luminous semiconductor chip around the fluorescent film 2
1 adjusts light emitting angle through the first reflecting layer 4 and four the second reflecting layer 5 of surrounding, reaches and dissipates around, sends out in this way
Light effect is good;The multiple region 3 is four regions, and four regions etc. are big is uniformly distributed.The fluorescent film 2 is by fluorescence
Powder and silica gel are made.
In the utility model, the fluorescent film 2 in four regions 3 is correspondingly arranged there are four types of color, and four kinds of colors are divided
It is not:White, red, green and yellow.There are multiple regions, the fluorescent film correspondence in each region to set fluorescent film division
It is equipped with a kind of color, as long as a luminous semiconductor chip can send out the light of multiple color in this way.Preferably, those regions can
To be homalographic region, those regions can be fan-shaped, heart-shaped or various regular patterns.
In short, the fluorescent film global formation of the utility model is good, emitting semiconductor uniform in light emission can be allowed, and pass through first
The effect in reflecting layer and the second reflecting layer, the luminous energy that such luminous semiconductor chip is sent out dissipate around, such illumination effect
It is good, and fluorescent film division is had multiple regions, the fluorescent film in each region to be correspondingly arranged on a kind of color by the utility model, this
As long as one luminous semiconductor chip of sample can send out the light of multiple color.
Although it is noted that the utility model integrally look over it is simple in structure, its structure no matter from make work
Skill, or it is all very prominent from using effect:
1. fluorescent film is by fluorescent powder and silica gel(Containing silicone resin)Composition forms fluorescent film by knifing machine knifing and heating;
2. after fluorescent film completes, may be produced that different shape or sized membrane by cutting, being attached to emitting semiconductor
(Or do not cut direct attaching);
3. attaching emitting semiconductor by fluorescent film, emitting semiconductor uniform in light emission can be allowed, consistency(Concentration degree)More
It is good;
4. fluorescent film is attached than traditional dot fluorescent powder(Glue)On emitting semiconductor and coating(Containing outer cover)It light extraction and can grasp
The property made is strong, and precision is more preferable;
5. fluorescent film is attached to emitting semiconductor, attached by heat and vacuum, does not increase glue or other substances are viscous
Patch, and fluorescent film is applied to emitting semiconductor and improves heat conductivity.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the claims it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (4)
1. a kind of realizing the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Including an areflexia cover board
Luminous semiconductor chip, be covered with a fluorescent film, the fluorescent film squarely cover body structure, institute on the luminous semiconductor chip
Stating the surface at the top of fluorescent film and dividing has multiple regions, and the fluorescent film in each region is correspondingly arranged on a kind of color, described glimmering
One first reflecting layer is provided at the top of light film, four sides are both provided with one second reflecting layer, institute around the fluorescent film
It is four regions to state multiple regions, and four regions etc. are big is uniformly distributed.
2. according to claim 1 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute
Fluorescent film is stated to be made of fluorescent powder and silica gel.
3. according to claim 1 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute
The fluorescent film for stating four regions is correspondingly arranged there are four types of color, and four kinds of colors are respectively:White, red, green, Yi Jihuang
Color.
4. according to claim 3 realize the emitting semiconductor for sending out a variety of coloured light based on a chip, it is characterised in that:Institute
It is homalographic region to state region.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820020768 | 2018-01-05 | ||
CN2018200207689 | 2018-01-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207938650U true CN207938650U (en) | 2018-10-02 |
Family
ID=63656017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820419131.7U Expired - Fee Related CN207938650U (en) | 2018-01-05 | 2018-03-27 | The emitting semiconductor for sending out a variety of coloured light is realized based on a chip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207938650U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116825929A (en) * | 2023-06-30 | 2023-09-29 | 淮安澳洋顺昌光电技术有限公司 | Chip-level light-emitting diode package with large light-emitting angle |
-
2018
- 2018-03-27 CN CN201820419131.7U patent/CN207938650U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116825929A (en) * | 2023-06-30 | 2023-09-29 | 淮安澳洋顺昌光电技术有限公司 | Chip-level light-emitting diode package with large light-emitting angle |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101436637B (en) | High-efficiency heat-dissipating luminous high-power LED packaging structure | |
CN101826590B (en) | LED lamp with lens injected with fluorescent glue and packaging method thereof | |
JP2012142540A (en) | Light emitting diode package structure and manufacturing method of the same | |
CN106972092B (en) | A kind of quantum spot white light LED of high-luminous-efficiency and preparation method thereof | |
CN103050615A (en) | High-color-rendering white light LED (light emitting diode) device | |
CN105810780A (en) | Method for manufacturing white LED (Light Emitting Diode) chip | |
TW200929513A (en) | Method for packaging a light emitting diode and its structure | |
CN207938650U (en) | The emitting semiconductor for sending out a variety of coloured light is realized based on a chip | |
CN203351659U (en) | Adjustable color temperature COB light source module | |
CN107785476B (en) | A kind of white light LEDs fluorescent glass film and preparation method thereof | |
CN201336318Y (en) | High-power LED encapsulating structure with high efficiency heat radiation and luminescence | |
CN105449083B (en) | A kind of method of LED fluorescent powder glue coating | |
CN202384331U (en) | Light mixing LED packaging structure | |
CN102644901A (en) | Light-emitting diode (LED) fluorescent diaphragm and LED illuminating lamp based on LED florescent diaphragm | |
CN108987556A (en) | A kind of white chip | |
CN204732409U (en) | A kind of encapsulating structure of LED silk | |
CN206282876U (en) | A kind of LED inverted structures | |
CN107123727B (en) | A kind of quantum spot white light LED of low operating temperature and preparation method thereof | |
CN204189795U (en) | Arc MCOB LED encapsulation structure | |
CN207938643U (en) | A kind of emitting semiconductor structure that can send out a variety of coloured light | |
CN203415624U (en) | White LED with high color rendering index | |
CN207884069U (en) | A kind of VCSEL devices | |
CN201666469U (en) | LED module packaging structure | |
CN206401357U (en) | Gao Se areas centrality white-light LED encapsulation | |
CN201167098Y (en) | Low light-decline small power white light LED |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181002 Termination date: 20210327 |
|
CF01 | Termination of patent right due to non-payment of annual fee |