CN207927022U - Rigid Flex structure - Google Patents
Rigid Flex structure Download PDFInfo
- Publication number
- CN207927022U CN207927022U CN201820384924.XU CN201820384924U CN207927022U CN 207927022 U CN207927022 U CN 207927022U CN 201820384924 U CN201820384924 U CN 201820384924U CN 207927022 U CN207927022 U CN 207927022U
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- fpc
- layer
- rigid flex
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model is related to a kind of Rigid Flex structures, including protective layer, the first adhesive layer, substrate, the second adhesive layer and the FPC stacked gradually from top to bottom, and first adhesive layer, substrate and the second adhesive layer offer window in same position correspondence respectively.Protective layer is bonded on FPC, excessively heavy copper facing when, the upper exposed polyimides of FPC will not be contacted with the highly basic in copper plating bath, prevented FPC to be corroded when sinking copper facing excessively and caused to scrap；It can be fallen on PCB surface due to avoiding copper scale of red adhesive tape during removing on its surface, lead to cleaning difficulty greatly and be easy to cause the problem of PCB short circuits, therefore reduce cost of labor, improve production efficiency.
Description
Technical field
The utility model is related to Rigid Flex technical field more particularly to a kind of Rigid Flex structures.
Background technology
Rigid-flex (Rigid-Flex Printed Board or F/R PWB, soft or hard plywood) is by FPC
(FlexiblePrinted Circuits, flexible PCB) and PCB (PCB Printed CircuitsBoard, printing electricity
Road plate) it is combined into the electronic component of identical product, it is chiefly used in the fields such as military affairs, medical treatment, industrial instrumentation in early days.Now with electricity
Increasingly towards miniaturization, rigid-flex starts to be used for mobile communication and consumer electrical product (such as digital camera product
DSC, digital camera DV) etc. end products.
Currently, in mobile phone or intelligence wearing product design, since the inner space of mobile phone or intelligence wearing product is smaller,
It is frequently necessary to Rigid Flex making small size stereochemical structure, to save space.Since polyimides has high intensity, height
The properties such as toughness, abrasion performance, high dielectric and high temperature resistant, so generally select polyimides as strengthening course in FPC, but
It is in heavy copper facing excessively, the upper exposed polyimides of FPC is easy to be dissolved by the highly basic in copper plating bath, and FPC is caused to scrap.Row at present
Usual way in industry is that exposed polyimides is covered by red adhesive tape, is protected it from by the highly basic dissolving in copper plating bath.FPC
It needs to remove red adhesive tape after crossing heavy copper facing, since red adhesive tape is after excessively heavy copper facing, one layer of copper can be adhered on surface, during removing
Copper scale on red tape surface can be fallen on PCB surface, can lead to two problems：1, since FPC sizes are small, cause cleaning difficult
Degree is big, causes high labor cost, low production efficiency；2, even part copper scale is sticked on and can not be eliminated on PCB surface, is easy to lead
Cause PCB that short circuit occurs.
Utility model content
The purpose of this utility model is to provide a kind of Rigid Flex structures at low cost, production efficiency is high.
In order to solve the above-mentioned technical problem, technical solution provided by the utility model is：
A kind of Rigid Flex structure, including stack gradually from top to bottom protective layer, the first adhesive layer, substrate, second
Adhesive layer and FPC, first adhesive layer, substrate and the second adhesive layer offer window in same position correspondence respectively.
Wherein, the FPC is single layer FPC, including strengthening course, third adhesive layer and the copper foil stacked gradually from top to bottom
Layer.
Wherein, the copper foil layer of the FPC is equipped with pad, and array offers multiple heat emission holes on the pad.
Wherein, the strengthening course is aluminium foil strengthening course, polyethylene terephthalate strengthening course, polyimides strengthening course
Any one of with makrolon strengthening course.
Wherein, the protective layer, the first adhesive layer, substrate, the second adhesive layer and FPC are opened up in same position correspondence respectively
There are multiple location holes, pin to sequentially pass through the location hole and consolidate protective layer, the first adhesive layer, substrate, the second adhesive layer and FPC
It is fixed.
Wherein, the protective layer is copper foil layer.
Wherein, the substrate is FR4 substrates.
The beneficial effects of the utility model are：A kind of Rigid Flex structure, including the protection that stacks gradually from top to bottom
Layer, the first adhesive layer, substrate, the second adhesive layer and FPC, first adhesive layer, substrate and the second adhesive layer are respectively same
Position corresponds to and offers window.Protective layer is bonded on FPC, excessively heavy copper facing when, the upper exposed polyimides of FPC will not and plate
Highly basic contact in copper liquid, prevents FPC to be corroded in heavy copper facing excessively and causes to scrap；It was being removed due to avoiding red adhesive tape
Copper scale in journey on its surface can be fallen on PCB surface, caused cleaning difficulty greatly and be easy to cause the problem of PCB short circuits, because
This reduces cost of labor, improves production efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of Rigid Flex structure described in the utility model；
Fig. 2 is the enlarged diagram of pad described in the utility model；
1, protective layer；2, the first adhesive layer；3, substrate；4, the second adhesive layer；5、FPC；51, pad；511, heat emission hole；6、
Window；7, pin.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As the embodiment of Rigid Flex structure described in the utility model, as shown in Figure 1, including layer successively from top to bottom
Folded protective layer 1, the first adhesive layer 2, substrate 3, the second adhesive layer 4 and FPC5, first adhesive layer 2, substrate 3 and second are viscous
It closes layer 4 and offers window 6 in same position correspondence respectively.
Protective layer 1 is bonded on FPC5, excessively heavy copper facing when, the upper exposed polyimides of FPC5 will not with it is strong in copper plating bath
Alkali contacts, and prevents FPC5 to be corroded in heavy copper facing excessively and causes to scrap；Due to avoiding red adhesive tape its table during removing
Copper scale on face can be fallen on PCB surface, led to cleaning difficulty greatly and be easy to cause the problem of PCB short circuits, therefore reduce
Cost of labor improves production efficiency.
In the present embodiment, the FPC5 be single layer FPC, including stack gradually from top to bottom strengthening course, third bonding
Layer and copper foil layer.
Higher and higher with the integrated level of FPC, the performance of electronic product is more and more stronger, causes to integrate on the pad of FPC
More components will reduce the service life of FPC if can not radiate in time.In the present embodiment, Fig. 2 is please referred to, it is described
The copper foil layer of FPC5（Figure does not identify）It is equipped with pad 51, array offers multiple heat emission holes 511 on the pad 51.Pad 51
The heat of generation is discharged rapidly by multiple heat emission holes 511, be ensure that the temperature of pad 51 is unlikely to excessively high, is improved FPC5's
Service life；Since multiple heat emission holes 511 are opened up in array, heat dissipation is uniform.
In the present embodiment, the strengthening course is polyimides strengthening course.
In the present embodiment, the protective layer 1, the first adhesive layer 2, basic 3, second adhesive layer 4 and FPC5 are respectively same
One position corresponds to and offers multiple location holes, and pin 7 sequentially passes through the location hole by protective layer 1, the first adhesive layer 2, substrate
3, the second adhesive layer 4 and FPC5 are fixed, and prevent Rigid Flex from misplacing between each layer in bonding processes, are improved soft or hard
The accuracy of board pressing.
In the present embodiment, the protective layer 1 is copper foil layer.
In the present embodiment, the substrate 3 be FR4 substrates, FR4 have excellent mechanicalness, stability, impact resistance and
Moisture-proof.
In the other embodiment of the utility model, the strengthening course is aluminium foil strengthening course, polyethylene terephthalate
Any one of ester strengthening course and makrolon strengthening course.
The part production process of Rigid Flex structure：
The purpose of windowing：Due in Rigid Flex soft board and hardboard be not necessarily all to fit together, in order to allow not
The soft board region of fitting generates hard edge along hardboard region, and ensures that the soft board region not being bonded can be bent on product.
FPC：It is made according to the technological process of FPC, finally by formed in mould mode, is punched into the shape of needs, so
Location hole is made on soft board afterwards.
Substrate：It is made according to the technological process of PCB, leads to overetched mode and moor substrate etch to two-sided or single side copper,
Again by way of gong plate, window is opened up on substrate, location hole is then made on substrate.
Adhesive layer：Adhesive layer is PP prepregs or the pure glued membrane of acrylic acid thermosetting, and in the present embodiment, the adhesive layer is
PP prepregs open up window on adhesive layer, location hole are then made on adhesive layer by mold.
Protective layer：In the present embodiment, the protective layer is copper foil layer, location hole is first made on copper foil layer, then directly
It connects and is fitted in copper foil layer on substrate by adhesive layer.
It is solid to sequentially pass through protective layer, the first adhesive layer, substrate, the second adhesive layer, the location hole of FPC by pin for pressing
It is fixed, then press.
By after above-mentioned 5 steps when heavy copper facing, since polyimides exposed on FPC has copper foil layer protection, no
FPC can be prevented to be corroded in heavy copper facing excessively and cause to scrap with the highly basic contact in copper plating bath；Due to the copper on the surfaces FPC
Layers of foil can automatically strip after postorder etching, problem caused by falling off there is no copper scale.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement etc., should be included in the utility model made by within the spirit and principle of utility model
Protection domain within.
Claims (7)
1. a kind of Rigid Flex structure, which is characterized in that including stack gradually from top to bottom protective layer, the first adhesive layer,
Substrate, the second adhesive layer and FPC, first adhesive layer, substrate and the second adhesive layer are offered in same position correspondence respectively
Window.
2. Rigid Flex structure according to claim 1, which is characterized in that the FPC is single layer FPC, including from upper
Strengthening course, third adhesive layer and the copper foil layer stacked gradually under.
3. Rigid Flex structure according to claim 2, which is characterized in that the copper foil layer of the FPC is equipped with pad,
Array offers multiple heat emission holes on the pad.
4. Rigid Flex structure according to claim 2 or 3, which is characterized in that the strengthening course be aluminium foil strengthening course,
Any one of polyethylene terephthalate strengthening course, polyimides strengthening course and makrolon strengthening course.
5. Rigid Flex structure according to claim 1, which is characterized in that the protective layer, the first adhesive layer, base
Plate, the second adhesive layer and FPC offer multiple location holes in same position correspondence respectively, and pin sequentially passes through the location hole will
Protective layer, the first adhesive layer, substrate, the second adhesive layer and FPC are fixed.
6. Rigid Flex structure according to claim 1, which is characterized in that the protective layer is copper foil layer.
7. Rigid Flex structure according to claim 1, which is characterized in that the substrate is FR4 substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820384924.XU CN207927022U (en) | 2018-03-20 | 2018-03-20 | Rigid Flex structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820384924.XU CN207927022U (en) | 2018-03-20 | 2018-03-20 | Rigid Flex structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207927022U true CN207927022U (en) | 2018-09-28 |
Family
ID=63595925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820384924.XU Active CN207927022U (en) | 2018-03-20 | 2018-03-20 | Rigid Flex structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207927022U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
-
2018
- 2018-03-20 CN CN201820384924.XU patent/CN207927022U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
| CN114828389B (en) * | 2022-05-07 | 2023-07-28 | 深圳市易迅达电子科技有限责任公司 | OIS motor soft and hard combination board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20150053466A1 (en) | Printed circuit board and method for manufacturing same | |
| CN102340933B (en) | Manufacturing method of circuit board | |
| CN206481556U (en) | Have the high shielding EMI screened films of black polyamide thin film | |
| CN207927022U (en) | Rigid Flex structure | |
| KR100861123B1 (en) | Flexible printed circuits board for back light unit and back light unit | |
| JP2014063287A (en) | Method for manufacturing circuit configuration | |
| US7992290B2 (en) | Method of making a flexible printed circuit board | |
| CN207354709U (en) | A kind of LCD circuit board installation frames | |
| KR100852406B1 (en) | a PCB manufacturing method | |
| KR101317597B1 (en) | Method for forming via hole and outer circuit layer of printed circuit board | |
| CN105282996B (en) | The manufacturing method of multilayer board | |
| CN211019442U (en) | Soft-hard combined circuit board cover opening structure | |
| KR101368043B1 (en) | Structure of double-sided flexible printed circuit board | |
| CN208016103U (en) | A kind of goldfinger bevel circuit board | |
| CN208353708U (en) | A kind of flexibility drop resistant circuit board | |
| JP4945829B2 (en) | Flexible printed wiring board and manufacturing method thereof | |
| CN217957400U (en) | Pure copper foil circuit board | |
| CN219068461U (en) | Flexible circuit board for reducing tearing force | |
| JP2000151061A (en) | Electronic circuit, board therefor and manufacture thereof | |
| US9674955B2 (en) | Tape carrier package, method of manufacturing the same and chip package | |
| CN211860653U (en) | Flexible printed circuit board | |
| CN208462129U (en) | A kind of antistatic flexible circuit board | |
| CN219612117U (en) | Anti-fracture combined FPC circuit board | |
| CN215835603U (en) | Multi-state adjustable circuit board | |
| CN213991138U (en) | Short-circuit-proof FPC circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |