CN207909041U - A kind of computer motherboard of good heat dispersion performance - Google Patents

A kind of computer motherboard of good heat dispersion performance Download PDF

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Publication number
CN207909041U
CN207909041U CN201820338748.6U CN201820338748U CN207909041U CN 207909041 U CN207909041 U CN 207909041U CN 201820338748 U CN201820338748 U CN 201820338748U CN 207909041 U CN207909041 U CN 207909041U
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CN
China
Prior art keywords
shell
motor
wall
computer motherboard
rotating shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820338748.6U
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Chinese (zh)
Inventor
肖娟
王嵩
张雯雰
郭美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiangnan University
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Xiangnan University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiangnan University filed Critical Xiangnan University
Priority to CN201820338748.6U priority Critical patent/CN207909041U/en
Application granted granted Critical
Publication of CN207909041U publication Critical patent/CN207909041U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of computer motherboards of good heat dispersion performance of field of computer technology,Including shell,The left and right sides outer wall of the shell installs motor by fixed frame,The top of the computer motherboard is installed by thermally conductive sheet,It is uniformly provided with groove at the top of the thermally conductive sheet,The front side outer wall of the shell installs motor,Side of the fixed rotating shaft far from motor extends to the rear side inner wall that shell is mounted in the inner cavity of shell and by bearing,The outer wall of the fixed rotating shaft is evenly arranged with the identical connecting rod of four groups of structures,Side installation heat dissipation tile of the connecting rod far from fixed rotating shaft,The motor that the device passes through setting,Mutual cooperation between shaft and fan,Be conducive to distribute the heat that computer motherboard generates,When heat is more,During heat dissipation tile is rotated with fixed rotating shaft,The arcuate surface of each heat dissipation tile,From the arc surface sweep of institute's groove,Heat on thermally conductive sheet is taken away,The further effect for improving heat dissipation.

Description

A kind of computer motherboard of good heat dispersion performance
Technical field
The utility model is related to field of computer technology, specially a kind of computer motherboard of good heat dispersion performance.
Background technology
Mainboard is called motherboard, it is mounted in cabinet, be computer it is most basic be also one of most important component. The generally rectangular cross-section circuit board of mainboard, the main circuit system of composition computer installed above generally have BIOS chips, I/O controls The DC power supply power supply that coremaking piece, key and panel control switch interface, indicator light plug connector, expansion slot, mainboard and plug-in card connects The elements such as plug-in unit.
Computer motherboard will produce a large amount of heat when computer is run, since the space inside computer cabinet is effective, Therefore the heat that computer motherboard gives out at work is difficult to exclusion quickly, and most of present computer uses built-in wind Fan radiates, but since the space of cabinet inside is smaller, fan thermal effect is unsatisfactory, therefore, it is proposed that a kind of heat dissipation The computer motherboard of better performances.
Utility model content
The purpose of this utility model is to provide a kind of computer motherboards of good heat dispersion performance, to solve above-mentioned background skill What is proposed in art fans the unsatisfactory problem of thermal effect.
To achieve the above object, the utility model provides the following technical solutions:A kind of calculating owner of good heat dispersion performance The left and right sides outer wall of plate, including shell, the shell installs motor by fixed frame, and the output shaft of the motor extends to The inner cavity of shell is simultaneously rotatably connected to shaft by shaft coupling, and link block, the company are installed in side of the shaft far from motor It connecing and is provided with fan on block, the intracavity bottom of the shell installs beam, and computer motherboard is installed at the top of the beam, Thermally conductive sheet is installed at the top of the computer motherboard, and groove, the front side of the shell are uniformly provided at the top of the thermally conductive sheet Outer wall installs motor, and the output end of motor installs fixed rotating shaft, and side of the fixed rotating shaft far from motor extends to shell Inner cavity in and be mounted on by bearing the rear side inner wall of shell, the outer wall of the fixed rotating shaft is evenly arranged with four groups of structure phases With connecting rod, side installation heat dissipation tile of the connecting rod far from fixed rotating shaft, and the outer wall and groove for the tile that radiates Inner wall is bonded, and through-hole is offered at the top of the shell.
Preferably, the beam is sponge beam, and honeycomb hole is uniformly provided on beam, and adjacent cell hole Between unicom.
Preferably, the radian of the heat dissipation tile is identical as the radian of groove, and is uniformly provided with heat dissipation on the tile that radiates Connecting seat is installed in the bottom in hole, the heat dissipation tile, and connecting seat is connect by bolt with connecting rod.
Preferably, the motor is servo motor, and the outer wall of motor and motor is equipped with noise reduction film.
Preferably, the computer motherboard is rectangle mainboard, and computer motherboard size a length of 6cm, width 4cm.
Preferably, the shell is aluminum alloy casing, and the outer wall of shell is equipped with waterproof membrane.
Compared with prior art, the utility model has the beneficial effects that:The apparatus structure is simple, easy to use, by setting Mutual cooperation between motor, shaft and the fan set is conducive to distribute the heat that computer motherboard generates, works as heat When more, during heat dissipation tile is rotated with fixed rotating shaft, the arcuate surface of each tile that radiates is plunderred from the arc surface of institute's groove It sweeps, the heat on thermally conductive sheet is taken away, rotating to outer side by through-hole distributes heat, the further effect for improving heat dissipation Fruit.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model;
Fig. 2 is the utility model heat dissipation tile structure schematic diagram.
In figure:1 shell, 2 motors, 3 fixed frames, 4 shafts, 5 link blocks, 6 fans, 7 computer motherboards, 8 beams, 9 are led Backing, 10 grooves, 11 through-holes, 12 fixed rotating shafts, 13 connecting rods, 14 heat dissipation tiles, 141 heat emission holes, 142 connecting seats.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution:A kind of computer motherboard of good heat dispersion performance, Including shell 1, the left and right sides outer wall of shell 1 installs motor 2 by fixed frame 3, facilitates installation and dismounting, motor 2 it is defeated Shaft extends to the inner cavity of shell 1 and is rotatably connected to shaft 4, side installation connection of the shaft 4 far from motor 2 by shaft coupling Block 5 is provided with fan 6 on link block 5, and the intracavity bottom of shell 1 installs beam 8, and the top installation of beam 8 calculates owner Plate 7 prevents computer motherboard 7 to be given a shock damage, and thermally conductive sheet 9 is installed at the top of computer motherboard 7, and the top of thermally conductive sheet 9 is equal Even to open up fluted 10, the front side outer wall of shell 1 installs motor, and the output end of motor installs fixed rotating shaft 12, fixed rotating shaft 12 sides far from motor extend to the rear side inner wall that shell 1 is mounted in the inner cavity of shell 1 and by bearing, fixed rotating shaft 12 Outer wall be evenly arranged with the identical connecting rod 13 of four groups of structures, side installation heat dissipation watt of the connecting rod 13 far from fixed rotating shaft 12 Piece 14, and the outer wall for the tile 14 that radiates is bonded with the inner wall of groove 10, the top of shell 1 offers through-hole 11, motor 2 and motor It is connect with external power supply by conducting wire.
Wherein, beam 8 is sponge beam, and honeycomb hole is uniformly provided on beam 8, and between adjacent cell hole Unicom is conducive to while shock-absorbing protecting computer motherboard 7, the wind in shell 1 can be made to flow between honeycomb hole, by heat It takes away, radiates;
The radian of heat dissipation tile 14 is identical as the radian of groove 10, and is uniformly provided with heat emission hole 141 on the tile 14 that radiates, During being conducive to radiate tile 14 with the rotation of fixed rotating shaft 12, the arcuate surface of each tile 14 that radiates, from the circular arc of groove 10 Face sweep takes away the heat on thermally conductive sheet 9, and rotating to 1 outside of shell by through-hole 11 distributes heat, heat dissipation tile 14 Connecting seat 142 is installed in bottom, and connecting seat 142 is connect by bolt with connecting rod 13, and installation is facilitated;
Motor 2 is servo motor, is conducive to the rotating speed for controlling motor 2, to control the rotating speed of fan 6, and motor 2 and horse The outer wall reached is equipped with noise reduction film, advantageously reduces the noise generated when motor 2 and motor operations, is convenient for people to use;
Computer motherboard 7 is rectangle mainboard, and 7 size of computer motherboard a length of 6cm, width 4cm occupy little space, Facilitate installation;
Shell 1 is aluminum alloy casing, preferably improves the effect of heat dissipation, and the outer wall of shell 1 is equipped with waterproof membrane, prevents water Into damage computer motherboard 7.
Operation principle:When computer motherboard 7, which works, generates heat, the controller control motor 2 in computer works, electricity Machine 2 drives fan 6 to rotate, and the heat via through holes 11 that computer motherboard 7 generates is made to shed, when the heat that computer motherboard 7 generates When more, the controller in computer makes motor operations simultaneously, and fixed rotating shaft 12 is driven to rotate, and heat dissipation tile 14 is with fixed rotating shaft During 12 rotations, the arcuate surface of each tile 14 that radiates, from the arc surface sweep of groove 10, by the heat band on thermally conductive sheet 9 It walks, rotating to 1 outside of shell by through-hole 11 distributes heat, the further effect for improving heat dissipation.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (6)

1. a kind of computer motherboard of good heat dispersion performance, including shell(1), it is characterised in that:The shell(1)Left and right two Side outer wall passes through fixed frame(3)Motor is installed(2), the motor(2)Output shaft extend to shell(1)Inner cavity and pass through Shaft coupling is rotatably connected to shaft(4), the shaft(4)Far from motor(2)Side install link block(5), the link block (5)On be provided with fan(6), the shell(1)Intracavity bottom install beam(8), the beam(8)Top installation Computer motherboard(7), the computer motherboard(7)Top install thermally conductive sheet(9), the thermally conductive sheet(9)Top uniformly open Equipped with groove(10), the shell(1)Front side outer wall motor is installed, and the output end of motor installs fixed rotating shaft(12), institute State fixed rotating shaft(12)Side far from motor extends to shell(1)Inner cavity in and by bearing be mounted on shell(1)After Side inner wall, the fixed rotating shaft(12)Outer wall be evenly arranged with the identical connecting rod of four groups of structures(13), the connecting rod (13)Far from fixed rotating shaft(12)Side installation heat dissipation tile(14), and the tile that radiates(14)Outer wall and groove(10)It is interior Wall is bonded, the shell(1)Top offer through-hole(11).
2. a kind of computer motherboard of good heat dispersion performance according to claim 1, it is characterised in that:The beam (8)For sponge beam, and beam(8)On be uniformly provided with honeycomb hole, and unicom between adjacent cell hole.
3. a kind of computer motherboard of good heat dispersion performance according to claim 1, it is characterised in that:The heat dissipation tile (14)Radian and groove(10)Radian it is identical, and radiate tile(14)On be uniformly provided with heat emission hole(141), the heat dissipation Tile(14)Bottom install connecting seat(142), and connecting seat(142)Pass through bolt and connecting rod(13)Connection.
4. a kind of computer motherboard of good heat dispersion performance according to claim 1, it is characterised in that:The motor(2) For servo motor, and motor(2)It is equipped with noise reduction film with the outer wall of motor.
5. a kind of computer motherboard of good heat dispersion performance according to claim 1, it is characterised in that:The calculating owner Plate(7)For rectangle mainboard, and computer motherboard(7)Size a length of 6cm, width 4cm.
6. a kind of computer motherboard of good heat dispersion performance according to claim 1, it is characterised in that:The shell(1) For aluminum alloy casing, and shell(1)Outer wall be equipped with waterproof membrane.
CN201820338748.6U 2018-03-13 2018-03-13 A kind of computer motherboard of good heat dispersion performance Expired - Fee Related CN207909041U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820338748.6U CN207909041U (en) 2018-03-13 2018-03-13 A kind of computer motherboard of good heat dispersion performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820338748.6U CN207909041U (en) 2018-03-13 2018-03-13 A kind of computer motherboard of good heat dispersion performance

Publications (1)

Publication Number Publication Date
CN207909041U true CN207909041U (en) 2018-09-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820338748.6U Expired - Fee Related CN207909041U (en) 2018-03-13 2018-03-13 A kind of computer motherboard of good heat dispersion performance

Country Status (1)

Country Link
CN (1) CN207909041U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111665915A (en) * 2020-05-28 2020-09-15 上海三达电子科技有限公司 Computer motherboard with from heat dissipation function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111665915A (en) * 2020-05-28 2020-09-15 上海三达电子科技有限公司 Computer motherboard with from heat dissipation function

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180925

Termination date: 20210313

CF01 Termination of patent right due to non-payment of annual fee