CN207888079U - A kind of laser cutting jig - Google Patents
A kind of laser cutting jig Download PDFInfo
- Publication number
- CN207888079U CN207888079U CN201721881547.2U CN201721881547U CN207888079U CN 207888079 U CN207888079 U CN 207888079U CN 201721881547 U CN201721881547 U CN 201721881547U CN 207888079 U CN207888079 U CN 207888079U
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- laser cutting
- cutting jig
- microscope carrier
- hollow
- substrate
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Abstract
The utility model belongs to laser cutting technique field, and in particular to a kind of laser cutting jig.Laser cutting jig provided by the utility model includes:Substrate and microscope carrier set on substrate side, microscope carrier are equipped with for that will cut the vacuum air-channel structure that workpiece is fixed on microscope carrier;Microscope carrier is equipped with the first engraved structure, and substrate is equipped with second engraved structure opposite with the first engraved structure.Thus, the second engraved structure and the first engraved structure on laser cutting jig provided by the utility model can dexterously avoid laser cutting path, influence of the characteristic that light beam reflects to product cutting accuracy is avoided, the cut quality and production efficiency of product are improved.
Description
Technical field
The utility model belongs to laser cutting technique field, and in particular to a kind of laser cutting jig.
Background technology
It is aobvious to be widely used in tablet because it is with high temperature resistant, wear-resisting, corrosion resistant characteristic for LCD and OLED liquid crystal screen
Show, the consumer electronics industry such as smart mobile phone screen.The attention to comprehensive screen mobile phone and comprehensive screen mobile phone with all big enterprises
It is widely available, the production technology shielded comprehensively is deeply concerned.The advantage being cut by laser at this stage in comprehensive screen production is particularly prominent
Go out, and it is most important on the Quality of Laser Cutting influence shielded comprehensively to cut jig.
However, existing laser cutting jig is reflected due to not accounting for light beam to cutting workpiece Product Precision in design
Influence, there are cut quality it is poor, yield is low the problems such as;Meanwhile most laser cutting jig also without sliver waste material with
The separating treatment structure of finished product, low production efficiency.
Utility model content
In order to solve the above-mentioned technical problem, the purpose of this utility model is to provide a kind of laser cutting jigs, specific
Technical solution is as follows:
A kind of laser cutting jig, including:Substrate and microscope carrier set on the substrate side, the microscope carrier are equipped with and are used for
Cutting workpiece is fixed on the vacuum air-channel structure on the microscope carrier;
The microscope carrier is equipped with the first engraved structure, and the substrate is engraved equipped with opposite with first engraved structure second
Hollow structure.
Preferably, the vacuum air-channel structure includes vacuum suction mouth and vacuumizes interface;
The vacuum suction mouth is opened on the loading end of the microscope carrier, and is connected with the cutting workpiece;It is described to take out very
Null interface is connected with pumped vacuum systems by pipeline.
It is furthermore preferred that the interface that vacuumizes is opened on the side of the microscope carrier;
It is described to vacuumize interface and the position of second engraved structure is adjacent.
Preferably, first engraved structure includes:First hollow-out parts, the second hollow-out parts and third hollow-out parts, described
One hollow-out parts and third hollow-out parts are symmetrical set in the both sides of second hollow-out parts.
Preferably, second engraved structure includes the left side hollow-out parts and right side hollow-out parts that left and right is set up in parallel.
Preferably, the laser cutting jig further includes:Deviate from the waste material box of the microscope carrier side on the substrate,
For collecting sliver waste material.
It is furthermore preferred that the both sides of the substrate are equipped with the slideway being slidably connected with the waste material box.
It is furthermore preferred that the slideway is equipped with sliding groove, the waste material box is equipped with the sliding part being connect with the sliding groove.
It is furthermore preferred that the substrate is equipped with limited block, the substrate and the waste material box are connected to form a pumping
Drawer structure.
It is furthermore preferred that the limited block is equipped with magnet, the side to connect with the limited block in the waste material box is magnetic
Property material product.
Thus, the second engraved structure and the first engraved structure on laser cutting jig provided by the utility model are by a happy coincidence
Laser cutting path is avoided wonderfully, is avoided influence of the characteristic that light beam reflects to product cutting accuracy, is improved cutting for product
Cut quality and production efficiency.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is the agent structure schematic diagram of the laser cutting jig of the preferred embodiment in the utility model;
Fig. 2 is the vertical view of this laser cutting jig.
Reference numeral:Substrate 1, the first engraved structure 21, the second engraved structure 11, vacuum suction mouth 22, is taken out very microscope carrier 2
Null interface 23, waste material box 3, slideway 12, limited block 13.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please refers to Fig.1 to Fig. 2, the laser cutting jig that the preferred embodiment in the utility model is provided, including:1 He of substrate
Microscope carrier 2 set on 1 side of substrate, microscope carrier 2 are equipped with for that will cut the vacuum air-channel structure that workpiece is fixed on microscope carrier 2;
Microscope carrier 2 is equipped with the first engraved structure 21, and substrate 1 is equipped with second engraved structure opposite with the first engraved structure 21
11。
Further, the vacuum air-channel structure of the present embodiment includes vacuum suction mouth 22 and vacuumizes interface 23, and vacuum is inhaled
Attached mouth 22 is opened on the loading end of microscope carrier 2, and is connected with cutting workpiece;It vacuumizes interface 23 and pumped vacuum systems passes through pipeline
Connection, is opened on the side of microscope carrier 2, the position for vacuumizing interface 23 and the second engraved structure 11 is adjacent.
Further, first engraved structure 21 of the present embodiment includes:First hollow-out parts, the second hollow-out parts and third hollow out
Portion, the first hollow-out parts and third hollow-out parts are symmetrical set in the both sides of the second hollow-out parts.Second engraved structure 11 includes a left side
The left side hollow-out parts and right side hollow-out parts that the right side is set up in parallel.
When in use, liquid crystal Mobile phone screen to be cut is placed on carrier, the site to be cut of the both sides up and down of Mobile phone screen
Alignment is respectively aligned to the second engraved structure 11 and the first engraved structure 21;Then, it connects and opens and be arranged in external vacuum system
System, it is motionless can to ensure that Mobile phone screen is stablized in whole process in this way;Later, it is cut by laser, the second engraved structure 11
Laser cutting path is dexterously avoided with the first engraved structure 21, avoids the characteristic of light beam reflection to product cutting accuracy
It influences.
Further, laser cutting jig further includes:The waste material box 3 for deviating from 2 side of microscope carrier on substrate 1, for receiving
Collect sliver waste material.Meanwhile second engraved structure 11 and the first engraved structure 21 ensure that sliver waste material can directly fall into waste material box
3, realize that sliver waste material is quickly cleaned with finished product.
Further, the both sides of substrate 1 are equipped with the slideway 12 being slidably connected with waste material box 3.
Further, slideway 12 is equipped with sliding groove, and waste material box 3 is equipped with the sliding part being connect with sliding groove.
Further, substrate 1 is equipped with limited block 13, and substrate 1 and waste material box 3, which are connected, forms a drawer knot
Structure.
Further, limited block 13 is equipped with magnet, and the side to connect with limited block 13 in waste material box 3 is magnetic material
Product.
Above example is only to illustrate the technical solution of the utility model, rather than its limitations;Although with reference to aforementioned reality
Example is applied the utility model is described in detail, it will be understood by those of ordinary skill in the art that:It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features;And these
Modification or replacement, the spirit and model of various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
It encloses.
Claims (10)
1. a kind of laser cutting jig, which is characterized in that including:Substrate and microscope carrier set on the substrate side, the microscope carrier
It is equipped with for the vacuum air-channel structure that workpiece is fixed on the microscope carrier will to be cut;
The microscope carrier is equipped with the first engraved structure, and the substrate is equipped with the second hollow out knot opposite with first engraved structure
Structure.
2. laser cutting jig according to claim 1, which is characterized in that the vacuum air-channel structure includes vacuum suction
Mouthful and vacuumize interface;
The vacuum suction mouth is opened on the loading end of the microscope carrier, and is connected with the cutting workpiece;Described vacuumize connects
Mouth is connected with pumped vacuum systems by pipeline.
3. laser cutting jig according to claim 2, which is characterized in that the interface that vacuumizes is opened in the microscope carrier
Side on;
It is described to vacuumize interface and the position of second engraved structure is adjacent.
4. laser cutting jig according to claim 1, which is characterized in that first engraved structure includes:First engraves
Empty portion, the second hollow-out parts and third hollow-out parts, first hollow-out parts and third hollow-out parts are symmetrical set described second
The both sides of hollow-out parts.
5. laser cutting jig according to claim 1, which is characterized in that second engraved structure includes that left and right is arranged side by side
The left side hollow-out parts and right side hollow-out parts of setting.
6. laser cutting jig according to claim 1, which is characterized in that further include:Deviate from institute on the substrate
The waste material box for stating microscope carrier side, for collecting sliver waste material.
7. laser cutting jig according to claim 6, which is characterized in that the both sides of the substrate are equipped with and the waste material
The slideway that box is slidably connected.
8. laser cutting jig according to claim 7, which is characterized in that the slideway is equipped with sliding groove, described useless
Magazine is equipped with the sliding part being connect with the sliding groove.
9. laser cutting jig according to claim 6, which is characterized in that the substrate is equipped with limited block, the base
Plate and the waste material box are connected to form a drawer structure.
10. laser cutting jig according to claim 9, which is characterized in that the limited block is equipped with magnet, described useless
The side to connect with the limited block on magazine is magnetic material product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721881547.2U CN207888079U (en) | 2017-12-28 | 2017-12-28 | A kind of laser cutting jig |
Applications Claiming Priority (1)
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CN201721881547.2U CN207888079U (en) | 2017-12-28 | 2017-12-28 | A kind of laser cutting jig |
Publications (1)
Publication Number | Publication Date |
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CN207888079U true CN207888079U (en) | 2018-09-21 |
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ID=63550573
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CN201721881547.2U Active CN207888079U (en) | 2017-12-28 | 2017-12-28 | A kind of laser cutting jig |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113369701A (en) * | 2020-03-09 | 2021-09-10 | 大族激光科技产业集团股份有限公司 | Method and device for processing anti-counterfeiting pattern on transparent plastic product |
-
2017
- 2017-12-28 CN CN201721881547.2U patent/CN207888079U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113369701A (en) * | 2020-03-09 | 2021-09-10 | 大族激光科技产业集团股份有限公司 | Method and device for processing anti-counterfeiting pattern on transparent plastic product |
CN113369701B (en) * | 2020-03-09 | 2024-02-06 | 大族激光科技产业集团股份有限公司 | Method and device for processing anti-fake pattern on transparent plastic product |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 523770 Second Floor, 3 Kusai Science Park, No. 8 Fumin South Road, Foxin Community, Dalang Town, Dongguan City, Guangdong Province Patentee after: Dongguan Shengxiong Laser Advanced Equipment Co., Ltd. Address before: 523000 First Floor, Building A, 53 Fofu Road, Foziwa Village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Strong Laser Co., Ltd. |
|
CP03 | Change of name, title or address |