CN207835898U - A kind of hollow out wiring board of no glue - Google Patents
A kind of hollow out wiring board of no glue Download PDFInfo
- Publication number
- CN207835898U CN207835898U CN201721614224.7U CN201721614224U CN207835898U CN 207835898 U CN207835898 U CN 207835898U CN 201721614224 U CN201721614224 U CN 201721614224U CN 207835898 U CN207835898 U CN 207835898U
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- CN
- China
- Prior art keywords
- cover film
- base material
- reverse side
- double
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a kind of hollow out wiring boards of no glue, it is related to printed circuit field, reverse side polyimides cover film glue-line is provided with below second double-sided polyimide base material copper foil layer, the lower surface bonds of reverse side polyimides cover film glue-line have reverse side polyimides cover film, reverse side vacancy section Gold plated Layer is offered on double-sided polyimide base material polyimide layer, the second double-sided polyimide base material copper foil layer, reverse side polyimides cover film glue-line and reverse side polyimides cover film, positive vacancy section Gold plated Layer and reverse side vacancy section Gold plated Layer are oppositely arranged.It is different from general double-faced flexible wiring board, there was only a sandwich circuit in void region, this part circuit can contact on two sides, it can be welded from two sides, and using no glue connection between positive hollow out circuit, polyimide base material and reverse side copper foil circuit, the hollow out wiring board can be applied to the two-sided product for needing pressure welding, and the characteristics of due to no glue, temperature tolerance and reliability are higher than general wiring board.
Description
Technical field：
The utility model is related to a kind of hollow out wiring boards of no glue, belong to printed circuit technique field.
Background technology：
Flexible PCB is that have height reliability, excellent using polyimides or polyester film to be a kind of made of base material
Flexible printed circuit board, abbreviation soft board or FPC, have the characteristics that Distribution density is high, light-weight, thickness is thin, main to use
In many products such as mobile phone, laptop, digital camera.General double-faced flexible wiring board is all two in the prior art
Insulating layer is provided between sandwich circuit, by via hole by two layers of connection, when product of two sides pressure welding is all to use single side
The flexible circuit board of hollow out, then the pressing of reverse side circuit is got up by epoxy glue glue-line, two-sided hollowed-out board is made.But it is existing
The flexible circuit board of this hollow out in technology can not use no glue material to make, client need product heatproof and can
When by property higher, it is necessary to which the base material without glue, how to provide a kind of double-faced flexible wiring board of the hollow out of no glue becomes people
Urgent demand.
Utility model content：
In view of the above-mentioned problems, the technical problem to be solved by the present invention is to provide a kind of hollow out wiring board of no glue, this
Kind wiring board is single layer circuit in void region, this part circuit can contact on two sides, can be welded from two sides, two layers
Without glue between circuit, heatproof is suitble to require higher application.
A kind of hollow out wiring board of no glue of the utility model, it includes front polyimides cover film, front polyamides Asia
It is amine cover film glue-line, the first double-sided polyimide base material copper foil layer, double-sided polyimide base material polyimide layer, second two-sided poly-
Acid imide base material copper foil layer, reverse side polyimides cover film glue-line and reverse side polyimides cover film composition, the first two-sided polyamides
Imines base material copper foil layer, double-sided polyimide base material polyimide layer and the second double-sided polyimide base material copper foil layer are mutually viscous
It connects, wherein the upper surface of the first double-sided polyimide base material copper foil layer is provided with front polyimides cover film glue-line, front is poly-
The upper surface of acid imide cover film glue-line is bonded with front polyimides cover film, front polyimides cover film and front polyamides
Positive vacancy section Gold plated Layer is offered on imines cover film glue-line, is provided with below the second double-sided polyimide base material copper foil layer
The lower surface bonds of reverse side polyimides cover film glue-line, reverse side polyimides cover film glue-line have the covering of reverse side polyimides
Film, double-sided polyimide base material polyimide layer, the second double-sided polyimide base material copper foil layer, reverse side polyimides cover film glue
Reverse side vacancy section Gold plated Layer, positive vacancy section Gold plated Layer and the plating of reverse side vacancy section are offered on layer and reverse side polyimides cover film
Layer gold is oppositely arranged.
Preferably, the positive vacancy section Gold plated Layer and reverse side vacancy section Gold plated Layer be electroplated respectively it is two-sided poly- first
The positive and negative surface layer of acid imide base material copper foil layer, double-sided polyimide base material polyimide layer, the first double-sided polyimide base material
Using no glue connection between copper foil layer and the second double-sided polyimide base material copper foil layer.
Preferably, using directly gold-plated at the copper foil of the double-side hollowed-out.
The beneficial effects of the utility model：It is different from general double-faced flexible wiring board, there was only one layer in void region
Circuit, this part circuit can be contacted on two sides, can be welded from two sides, and positive hollow out circuit, polyimide-based
The two-sided product for needing pressure welding can be applied to using no glue connection, the hollow out wiring board between material and reverse side copper foil circuit, by
In no glue the characteristics of, temperature tolerance and reliability are higher than general wiring board.
Description of the drawings：
The utility model is described in detail by following specific implementations and attached drawing for ease of explanation,.
Fig. 1 is the structural schematic diagram of the utility model.
The fronts 1- polyimides cover film；The fronts 2- polyimides cover film glue-line；3- the first double-sided polyimide base materials
Copper foil layer；4- double-sided polyimide base material polyimide layers；5- the second double-sided polyimide base material copper foil layers；6- reverse side polyamides is sub-
Amine cover film glue-line；7- reverse side polyimides cover films；The fronts 8- vacancy section Gold plated Layer；9- reverse side vacancy section Gold plated Layer.
Specific implementation mode：
As shown in Figure 1, present embodiment uses following technical scheme：It includes front polyimides cover film 1, just
Face polyimides cover film glue-line 2, the first double-sided polyimide base material copper foil layer 3, double-sided polyimide base material polyimide layer
4,7 groups of the second double-sided polyimide base material copper foil layer 5, reverse side polyimides cover film glue-line 6 and reverse side polyimides cover film
At the first double-sided polyimide base material copper foil layer 3, double-sided polyimide base material polyimide layer 4 and the second double-sided polyimide
Base material copper foil layer 5 is mutually bonded, wherein the upper surface of the first double-sided polyimide base material copper foil layer 3 is provided with front polyimides
The upper surface of cover film glue-line 2, front polyimides cover film glue-line 2 is bonded with front polyimides cover film 1, front polyamides
Positive vacancy section Gold plated Layer 8, the second two-sided polyimide are offered on imines cover film 1 and front polyimides cover film glue-line 2
The lower section of amido material copper foil layer 5 is provided with reverse side polyimides cover film glue-line 6, under reverse side polyimides cover film glue-line 6
Surface is bonded with reverse side polyimides cover film 7, double-sided polyimide base material polyimide layer 4, the second two-sided polyimide amido
It is gold-plated that reverse side vacancy section is offered on material copper foil layer 5, reverse side polyimides cover film glue-line 6 and reverse side polyimides cover film 7
Layer 9, positive vacancy section Gold plated Layer 8 and reverse side vacancy section Gold plated Layer 9 are oppositely arranged.
Wherein, the positive vacancy section Gold plated Layer 8 and reverse side vacancy section Gold plated Layer 9 are electroplated respectively in the first two-sided polyamides
The positive and negative surface layer of imines base material copper foil layer 3, double-sided polyimide base material polyimide layer 4, the first double-sided polyimide base material
Using no glue connection between copper foil layer 3 and the second double-sided polyimide base material copper foil layer 5；At the copper foil of the double-side hollowed-out
Using directly gold-plated.
Present embodiment is different from general dual platen in terms of production technology, using two-sided no gum base materials, first will
The etching removal of reverse side hollow part reverse side copper foil, polyimide base material is removed, make front copper two with the method for laser processing
Face, which has, exposes, and in order to ensure that the copper foil of hollow part does not break in etching, needs to open a window hollow part before the etch
Position protected with dry film, avoid etching solution from entering, cause to break, be pressed together on positive and negative cover film after the completion of etching
Positive and negative copper-clad surface needs to open a window cover film, to expose copper foil void region, then in the copper foil of void region before pressing
Locate plated with gold, facilitates client's thermal compression welding.
Present embodiment is different from general double-faced flexible wiring board, there was only a sandwich circuit in void region, this portion
Separated time road can contact on two sides, can be welded from two sides, and positive hollow out circuit, polyimide base material and reverse side
Using no glue connection between copper foil circuit, which can be applied to the two-sided product for needing pressure welding, due to the spy of no glue
Point, temperature tolerance and reliability are higher than general wiring board.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (2)
1. a kind of hollow out wiring board of no glue, it is characterised in that：It includes front polyimides cover film (1), front polyamides Asia
Amine cover film glue-line (2), the first double-sided polyimide base material copper foil layer (3), double-sided polyimide base material polyimide layer (4),
Second double-sided polyimide base material copper foil layer (5), reverse side polyimides cover film glue-line (6) and reverse side polyimides cover film
(7) it forms, the first double-sided polyimide base material copper foil layer (3), double-sided polyimide base material polyimide layer (4) and second are two-sided
Polyimide base material copper foil layer (5) is mutually bonded, wherein the upper surface of the first double-sided polyimide base material copper foil layer (3) is provided with
The upper surface of front polyimides cover film glue-line (2), front polyimides cover film glue-line (2) is bonded with front polyimides
Positive vacancy section is offered on cover film (1), front polyimides cover film (1) and front polyimides cover film glue-line (2)
Gold plated Layer (8) is provided with reverse side polyimides cover film glue-line (6) below the second double-sided polyimide base material copper foil layer (5),
The lower surface bonds of reverse side polyimides cover film glue-line (6) have reverse side polyimides cover film (7), double-sided polyimide base material
Polyimide layer (4), the second double-sided polyimide base material copper foil layer (5), reverse side polyimides cover film glue-line (6) and reverse side are poly-
Reverse side vacancy section Gold plated Layer (9), positive vacancy section Gold plated Layer (8) and the plating of reverse side vacancy section are offered on acid imide cover film (7)
Layer gold (9) is oppositely arranged.
2. a kind of hollow out wiring board of no glue according to claim 1, it is characterised in that：The positive vacancy section is gold-plated
The positive and negative table in the first double-sided polyimide base material copper foil layer (3) is electroplated in layer (8) and reverse side vacancy section Gold plated Layer (9) respectively
Layer, double-sided polyimide base material polyimide layer (4), the first double-sided polyimide base material copper foil layer (3) and second are two-sided poly-
Using no glue connection between acid imide base material copper foil layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614224.7U CN207835898U (en) | 2017-11-28 | 2017-11-28 | A kind of hollow out wiring board of no glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614224.7U CN207835898U (en) | 2017-11-28 | 2017-11-28 | A kind of hollow out wiring board of no glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207835898U true CN207835898U (en) | 2018-09-07 |
Family
ID=63386728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721614224.7U Expired - Fee Related CN207835898U (en) | 2017-11-28 | 2017-11-28 | A kind of hollow out wiring board of no glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207835898U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN113270383A (en) * | 2021-05-13 | 2021-08-17 | 深圳市汇顶科技股份有限公司 | Chip assembly and manufacturing method thereof |
| CN114615827A (en) * | 2022-03-28 | 2022-06-10 | 大连吉星电子股份有限公司 | Seamless welding flexible circuit board assembling method |
-
2017
- 2017-11-28 CN CN201721614224.7U patent/CN207835898U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN113270383A (en) * | 2021-05-13 | 2021-08-17 | 深圳市汇顶科技股份有限公司 | Chip assembly and manufacturing method thereof |
| CN114615827A (en) * | 2022-03-28 | 2022-06-10 | 大连吉星电子股份有限公司 | Seamless welding flexible circuit board assembling method |
| CN114615827B (en) * | 2022-03-28 | 2024-03-12 | 大连吉星电子股份有限公司 | Flexible circuit board assembling method for seamless welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 Termination date: 20201128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |