CN207820306U - A kind of radiator structure of Novel PCB board - Google Patents
A kind of radiator structure of Novel PCB board Download PDFInfo
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- CN207820306U CN207820306U CN201721863440.5U CN201721863440U CN207820306U CN 207820306 U CN207820306 U CN 207820306U CN 201721863440 U CN201721863440 U CN 201721863440U CN 207820306 U CN207820306 U CN 207820306U
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- pcb board
- rivet
- hollow cavity
- heat dissipation
- radiator structure
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Abstract
The utility model is related to technical field of PCB board, in particular a kind of radiator structure of Novel PCB board, including pcb board, the side of pcb board are provided with rivet hole, and rivet hole is internally provided with heat dissipation rivet.The heat that pyrotoxin distributes is adsorbed and is conducted by heat dissipation rivet, heat is conducted and radiate using heat dissipation rivet, accelerate the process to radiate on pcb board, simultaneously radiate rivet can automated production installation, it is compared to traditional heat-dissipating sheet form, production rapidly and efficiently is realized, the production efficiency of product is improved；Hot gas is entered by the bottom of riveted pipe in the second hollow cavity inside rivet bar, and extraneous cold air at the top of manufactured head by entering in the first hollow cavity inside manufactured head, one side hot gas transmits in the first hollow cavity and the second hollow cavity, improve the area of heat dissipation, another aspect hot gas and cold air form cold-hot air convection inside the first hollow cavity and the second hollow cavity, greatly improve the efficiency of heat dissipation.
Description
Technical field
The utility model is related to technical field of PCB board, specially a kind of radiator structure of Novel PCB board.
Background technology
PCB, Chinese are printed circuit board, also known as printed wiring board, are important electronic unit, are electronic components
Supporter, be electronic component electrical connection carrier.Since it is made of electron printing, therefore it is referred to as " print
Brush " circuit board.After electronic equipment uses printed board, due to the consistency of similar printed board, so as to avoid the difference of artificial wiring
Mistake, and can realize electronic component inserting or attachment, automatic tin soldering, automatic detection automatically, it ensure that the quality of electronic equipment, carry
High labor productivity reduces cost, and easy to repair.PCB work will produce a large amount of thermal energy, need to carry out pcb board
Heat dissipation.
Traditional heat dissipation is nothing more than the conduction, convection current, radiation theory using heat, although traditional heat-dissipating sheet form diversification,
Generally use metal material, by medium lock fever electronic item on or around, by metal fin to heat transfer, spoke
The modes such as penetrating makes the temperature of fever electronic item reduce, but by medium to lock fever electronics material technique more numerous for metal fin
It is trivial and need manual operation, lead to low production efficiency, production cost has been significantly greatly increased.In consideration of it, it is proposed that a kind of novel
The radiator structure of pcb board.
Invention content
The purpose of this utility model is to provide a kind of radiator structures of Novel PCB board, to solve in above-mentioned background technology
It is cumbersome and need manual operation that the metal fin of proposition by medium locks fever electronics material technique, leads to production efficiency
It is low, the problem of production cost has been significantly greatly increased.
To achieve the above object, the utility model provides the following technical solutions：
The side of a kind of radiator structure of Novel PCB board, including pcb board, the pcb board is provided with several electronics member
The side of part, the pcb board is provided with rivet hole, and the rivet hole is internally provided with heat dissipation rivet, the both ends of the pcb board
It is respectively arranged with installation card base, the other side of the pcb board is provided with pyrotoxin, and the side of the pyrotoxin is provided with riveted
Pipe, the pcb board center is provided with bar-shaped trough.
Preferably, several described electronic components and the pcb board seamless welding.
Preferably, the rivet hole and the riveted pipe are located on same horizontal linear.
Preferably, the heat dissipation rivet includes manufactured head, and the bottom of the manufactured head is provided with rivet bar, the manufactured head
Be internally provided with the first hollow cavity, the rivet bar is internally provided with the second hollow cavity.
Preferably, the manufactured head and the rivet bar are an integral molding structure, and first hollow cavity and described
Two hollow cavities are connected to.
Preferably, the manufactured head and the rivet hole are engaged by clamping.
Preferably, the rivet bar runs through the rivet hole, the rivet bar and riveted pipe riveting.
Compared with prior art, the beneficial effects of the utility model：
1, the radiator structure of the Novel PCB board, the heat that pyrotoxin distributes are adsorbed and are conducted by heat dissipation rivet, are utilized
Heat dissipation rivet by heat conduct and radiate, accelerate the process to radiate on pcb board, at the same the rivet that radiates can automatic metaplasia
Production installation, is compared to traditional heat-dissipating sheet form, realizes production rapidly and efficiently, improve the production efficiency of product.
2, the radiator structure of the Novel PCB board, hot gas are entered by the bottom of riveted pipe in second inside rivet bar
In cavity, and extraneous cold air is entered by manufactured head top in the first hollow cavity inside manufactured head, and one side hot gas exists
It is transmitted in first hollow cavity and the second hollow cavity, improves the area of heat dissipation, another aspect hot gas and cold air are in the first hollow cavity
With formation cold-hot air convection inside the second hollow cavity, the efficiency of heat dissipation is greatly improved.
Description of the drawings
Fig. 1 is the utility model entirety positive structure schematic；
Fig. 2 is the utility model entirety structure schematic diagram；
Fig. 3 is the utility model heat dissipation rivet arrangement schematic diagram.
In figure：1, pcb board；2, electronic component；3, rivet hole；4, radiate rivet；41, manufactured head；42, rivet bar；43,
One hollow cavity；44, the second hollow cavity；5, card base is installed；6, pyrotoxin；7, riveted pipe；8, bar-shaped trough.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：
A kind of radiator structure of Novel PCB board, as depicted in figs. 1 and 2, including pcb board 1, the side of pcb board 1 are provided with
The side of several electronic components 2, pcb board 1 is provided with rivet hole 3, and rivet hole 3 is internally provided with heat dissipation rivet 4, pcb board 1
Both ends be respectively arranged with installation card base 5, be conducive to be combined installation to pcb board 1, the other side of pcb board 1 is provided with fever
The side in source 6, pyrotoxin 6 is provided with riveted pipe 7, and 1 center of pcb board is provided with bar-shaped trough 8, and it is whole to be conducive to enhancing pcb board 1
The toughness of body, 1 seamless welding of several electronic components 2 and pcb board, rivet hole 3 and riveted pipe 7 are located at same horizontal linear
On, manufactured head 41 and rivet hole 3 are engaged by clamping, and rivet bar 42 runs through rivet hole 3, and rivet bar 42 and riveted pipe 7 rivet, installation
When, in the place that needs radiate, will be radiated in the implantation pcb board 1 of rivet 4 by AI machines, rivet bar 42 runs through rivet hole 3 at this time
And riveted with riveted pipe 7, manufactured head 41 is stuck in the surface of rivet hole 3, and riveted pipe 7 is adopted close to 6 side of pyrotoxin, heat dissipation rivet 4
It being made of metal copper material, thermal coefficient of the metallic copper at 100 ° is up to 377W/mK, has extremely strong heat absorption capacity,
The heat that pyrotoxin 6 distributes is adsorbed and is conducted by heat dissipation rivet 4, and heat is conducted and radiate using heat dissipation rivet 4,
Accelerate the process to radiate on pcb board 1, at the same the rivet 4 that radiates can automated production installation, be compared to traditional heat-dissipating piece shape
Formula realizes production rapidly and efficiently, improves the production efficiency of product.
As shown in figure 3, heat dissipation rivet 4 includes manufactured head 41, the bottom of manufactured head 41 is provided with rivet bar 42, manufactured head 41
Be internally provided with the first hollow cavity 43, rivet bar 42 is internally provided with the second hollow cavity 44, manufactured head 41 and rivet bar 42
It is an integral molding structure, and the first hollow cavity 43 is connected to the second hollow cavity 44, heat distributes from pyrotoxin 6 and enters riveted
Inside pipe 7, a part of hot gas is transmitted to 41 surface of manufactured head along rivet bar 42 and radiates, due to air heats inside air
Spacing becomes larger between molecule, and density becomes smaller, and forms ascending air, and the spacing between the interior molecules of extraneous cold air is smaller,
Density is more than the density of hot gas, forms down current, and another part hot gas enters rivet bar by the bottom of riveted pipe 7 at this time
In the second hollow cavity 44 inside 42, and extraneous cold air is entered by 41 top of manufactured head in first inside manufactured head 41
In cavity 43, one side hot gas transmits in the first hollow cavity 43 and the second hollow cavity 44, improves the area of heat dissipation, another party
Face hot gas and cold air form cold-hot air convection inside the first hollow cavity 43 and the second hollow cavity 44, greatly improve heat dissipation
Efficiency.
Basic principles, main features, and advantages of the present invention has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Be only the utility model preference, be not intended to limit the utility model, do not departing from the spirit and scope of the utility model
Under the premise of, the utility model also has various changes and improvements, these changes and improvements both fall within this claimed practicality
In novel range.The protection scope of the present invention is defined by the appended claims and their equivalents.
Claims (7)
1. a kind of radiator structure of Novel PCB board, including pcb board（1）, it is characterised in that：The pcb board（1）Side setting
There are several electronic components（2）, the pcb board（1）Side be provided with rivet hole（3）, the rivet hole（3）Inside setting
There is heat dissipation rivet（4）, the pcb board（1）Both ends be respectively arranged with installation card base（5）, the pcb board（1）The other side set
It is equipped with pyrotoxin（6）, the pyrotoxin（6）Side be provided with riveted pipe（7）, the pcb board（1）Center is provided with item
Shape slot（8）.
2. the radiator structure of Novel PCB board according to claim 1, it is characterised in that：Several described electronic components（2）
With the pcb board（1）Seamless welding.
3. the radiator structure of Novel PCB board according to claim 1, it is characterised in that：The rivet hole（3）With the riveting
Close pipe（7）On same horizontal linear.
4. the radiator structure of Novel PCB board according to claim 1, it is characterised in that：The heat dissipation rivet（4）Including riveting
Ailhead（41）, the manufactured head（41）Bottom be provided with rivet bar（42）, the manufactured head（41）Be internally provided with first
Hollow cavity（43）, the rivet bar（42）Be internally provided with the second hollow cavity（44）.
5. the radiator structure of Novel PCB board according to claim 4, it is characterised in that：The manufactured head（41）With it is described
Rivet bar（42）It is an integral molding structure, and first hollow cavity（43）With second hollow cavity（44）Connection.
6. the radiator structure of Novel PCB board according to claim 4, it is characterised in that：The manufactured head（41）With it is described
Rivet hole（3）It is engaged by clamping.
7. the radiator structure of Novel PCB board according to claim 4, it is characterised in that：The rivet bar（42）Through institute
State rivet hole（3）, the rivet bar（42）With the riveted pipe（7）Riveting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721863440.5U CN207820306U (en) | 2017-12-27 | 2017-12-27 | A kind of radiator structure of Novel PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721863440.5U CN207820306U (en) | 2017-12-27 | 2017-12-27 | A kind of radiator structure of Novel PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207820306U true CN207820306U (en) | 2018-09-04 |
Family
ID=63331035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721863440.5U Active CN207820306U (en) | 2017-12-27 | 2017-12-27 | A kind of radiator structure of Novel PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207820306U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114650670A (en) * | 2020-12-18 | 2022-06-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
-
2017
- 2017-12-27 CN CN201721863440.5U patent/CN207820306U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114650670A (en) * | 2020-12-18 | 2022-06-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
| CN114650670B (en) * | 2020-12-18 | 2024-03-12 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
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