CN207799285U - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN207799285U CN207799285U CN201820013946.5U CN201820013946U CN207799285U CN 207799285 U CN207799285 U CN 207799285U CN 201820013946 U CN201820013946 U CN 201820013946U CN 207799285 U CN207799285 U CN 207799285U
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- backboard
- heat
- backlight module
- led light
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Abstract
A kind of backlight module of disclosure offer and display device, belong to technical field of heat dissipation.The backlight module includes:Backboard and lamp bar, lamp bar have a flexible parent metal and an at least LED lamp;The wherein described flexible parent metal includes:The supporting part of an at least LED light is set, and being fixed on one side on the backboard of the LED light is not arranged for the supporting part;The bending part that the LED light is not set and is bent along the edge of backboard;And extend to the extension on the outside of the backboard from the bending part.The backlight module is on the basis of carrying the flexible parent metal of LED light, increase the bending part for extending to back plate edges and extends to the extension on the outside of backboard, the area of the flexible parent metal of lamp bar is installed by increase, the heat dissipation area for increasing lamp bar solves the problems, such as that heat derives cause display abnormal not in time.
Description
Technical field
This disclosure relates to technical field of heat dissipation, in particular to a kind of backlight module and display device.
Background technology
Currently, liquid crystal display in automotive field using increasingly extensive, demand of the vehicle-mounted product to high brightness is also increasingly
Obviously, if just disclosure satisfy that vehicle-mounted liquid crystal as light source using LED (Light Emitting Diode, light emitting diode)
The demand of this high brightness of display screen.
But even for the LED of high brightness, during luminous, also only 30% or so energy can convert
At luminous energy, the energy of rest part is mainly come out in the form of thermal energy, therefore for LED display, if heat dissipation
Bad, the thermal energy that LED is generated exports not in time, then these heats will lead to the other structures of liquid crystal display (such as membrane material is led
Tabula rasa etc.) even fold is deformed upon, be exactly heat it is more than that (i.e. liquid crystal becomes transparent for the clearing point of liquid crystal if even more serious
When temperature), it will cause liquid crystal to fail, it is abnormal that display occurs so as to cause liquid crystal display.
Therefore, to the technical solution of heat dissipation, there is also the places that has much room for improvement in the prior art.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Utility model content
The disclosure is designed to provide a kind of backlight module and display device, so overcome at least to a certain extent by
One or more problem caused by the limitation and defect of the relevant technologies.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by this public affairs
The practice opened and acquistion.
According to one aspect of the disclosure, a kind of backlight module is provided, including:
Backboard;And
Lamp bar has a flexible parent metal and an at least LED lamp;
The wherein described flexible parent metal includes:
The supporting part of an at least LED light is set, and the supporting part LED light is not set be fixed on institute on one side
It states on backboard;
The bending part that the LED light is not set and is bent along the edge of backboard;And
The extension on the outside of the backboard is extended to from the bending part.
In a kind of exemplary embodiment of the disclosure, the length of the extension is not less than the supporting part in the back of the body
Length on the inside of plate.
In a kind of exemplary embodiment of the disclosure, heat conduction mould is additionally provided between the extension and the backboard
Block.
In a kind of exemplary embodiment of the disclosure, the area of the heat conducting module is not less than the face of the extension
Product.
In a kind of exemplary embodiment of the disclosure, the heat conducting module extends to the back of the body on the outside of the backboard
The bottom of plate.
In a kind of exemplary embodiment of the disclosure, the material of the heat conducting module is graphite.
In a kind of exemplary embodiment of the disclosure, the heat conducting module is heat pipe.
In a kind of exemplary embodiment of the disclosure, the edge of the backboard is additionally provided with groove, for accommodating described
Bending part.
In a kind of exemplary embodiment of the disclosure, what the supporting part was not arranged the LED light passes through heat conduction on one side
Glue is fixed on the backboard.
According to another aspect of the present disclosure, a kind of display device, including above-described backlight module are also provided.
The backlight module and display device that some embodiments of the disclosure provide, in the base of the flexible parent metal of carrying LED light
On plinth, increases the bending part for extending to back plate edges and extend to the extension on the outside of backboard, on the one hand, installed by increasing
The area of the flexible parent metal of lamp bar increases the heat dissipation area of lamp bar, solves the problems, such as that heat derives cause display abnormal not in time;
In another aspect, by the way that heat conducting module is arranged between backboard and extension on the outside of backboard, make flexible parent metal and heat conducting module and
Backboard constitutes an overall structure, originally only by the heat dissipation path of heat-conducting glue on the basis of increase through the heat dissipation road of heat conducting module
Heat quickly can be passed to backboard and distributed, increase the heat-sinking capability of product by diameter, can preferably solve lamp bar concentration
Position radiate bad problem.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows a kind of sectional view of the backlight module provided in the embodiment of the present disclosure.
Fig. 2 shows the schematic diagrames of the heat dissipation path of structure shown in Fig. 1 in the embodiment of the present disclosure.
Fig. 3 shows the sectional view of another backlight module provided in the embodiment of the present disclosure.
Fig. 4 shows the stereogram of structure shown in Fig. 3 in the embodiment of the present disclosure.
Fig. 5 shows the schematic diagram that groove is arranged on embodiment of the present disclosure dorsulum.
Specific implementation mode
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein;On the contrary, thesing embodiments are provided so that the disclosure will more
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Attached drawing is only the disclosure
Schematic illustrations, be not necessarily drawn to scale.Identical reference numeral indicates same or similar part in figure, thus
Repetition thereof will be omitted.
In addition, described feature, structure or characteristic can be incorporated in one or more implementations in any suitable manner
In mode.In the following description, many details are provided to fully understand embodiment of the present disclosure to provide.So
And it will be appreciated by persons skilled in the art that one in the specific detail can be omitted with technical solution of the disclosure
Or more, or other methods, constituent element, device, step may be used etc..In other cases, it is not shown in detail or describes
Known features, method, apparatus, realization, material or operation are to avoid a presumptuous guest usurps the role of the host and all aspects of this disclosure is made to become mould
Paste.
Herein, " inside ", " outside " directional terminology refer respectively to towards the side of liquid crystal layer and deviate from liquid crystal layer
Side, for example, referring to one layer towards liquid crystal layer of underlay substrate on the inside of underlay substrate.In addition, "upper", "lower", " left side " with
And the directional terminologies such as " right side " are to illustrate the orientation put to define relative to display device in attached drawing.It is to be understood that above-mentioned
Directional terminology is opposite concept, they be used for relative to description and clarification, can be placed according to display device
The variation in orientation and correspondingly change.
There are mainly three types of the heat transfer types of object:Heat transfer, convection current and radiation, therefore make these three heat transfer types wherein one
Kind obtains enhancing the heat-sinking capability that can achieve the purpose that enhance vehicle-mounted product.The disclosure is by the improvement in structure, to change
Radiate bad problem in kind existing structure.
Fig. 1 shows that a kind of sectional view of the backlight module provided in the embodiment of the present disclosure, the backlight module include:Backboard
And lamp bar, and lamp bar is arranged on backboard, wherein lamp bar has a flexible parent metal and an at least LED lamp.
As shown in Figure 1, in the lamp bar of the backlight module, it is provided with LED light 101 and flexible parent metal, wherein flexible parent metal
Further comprise:
The supporting part 102 of an at least LED light 101 is set, and supporting part 102 LED light is not set be fixed on backboard on one side
On 105;
The bending part 103 that LED light 101 is not set and is bent along the edge of backboard 105;And
The extension 104 in 105 outside of backboard is extended to from bending part 103.
Based on above-mentioned, on the basis of carrying the flexible parent metal of LED light, increase extends to the backlight module that the disclosure provides
The bending part of back plate edges and extension on the outside of backboard is extended to, improved radiator structure passes through increase and installs lamp bar
The area of flexible parent metal increases the heat dissipation area of lamp bar, solves the problems, such as that heat derives cause display abnormal not in time.
By taking backlight module shown in FIG. 1 as an example, flexible parent metal is FPC (Flexible Printed Circuit, flexible electrical
Road plate), it is that there is flexible and height reliability printed circuit to be a kind of made of base material using polyimides or polyester film
Plate has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.The one side of LED light 101 is not arranged for supporting part 102
It is fixed on backboard 105 by heat-conducting glue 106.I.e. LED light 101 passes through SMD (Surface Mounted Devices, surface patch
Dress device) it is fixed on the one side of supporting part 102, and the another side of supporting part 102 is fixed on by heat-conducting glue 106 on backboard 105.
Fig. 2 shows the schematic diagrames of the heat dissipation path of structure shown in Fig. 1 in the embodiment of the present disclosure, as shown in Fig. 2, heat dissipation path
R1 is:LED light → flexible base board (being specifically supporting part) → heat-conducting glue → backboard → air, i.e., the heat generated when LED light shines
Amount can be transmitted to by the heat-conducting glue 106 between supporting part 102 and backboard 105 on backboard 105, since backboard 102 is generally
Metal material can be transferred heat in air by backboard 105 and cross-ventilation, achieve the purpose that heat dissipation.
In a kind of exemplary embodiment of the disclosure, the length of extension 104 is not less than supporting part 102 in backboard 105
The length of inside.As shown in Figure 1, the length of extension 104 can be equal to the length of supporting part 102, in this way, the present embodiment provides
Backlight module heat dissipation area can be made to double on the basis of only being radiated originally by heat-conducting glue.In the disclosure
In other embodiment, extension can be with longer or more shorter, compared to only in such a way that thermally conductive pathways R1 is radiated
Can increasing heat radiation area, accelerate radiating rate, improve heat dissipation effect.
In a kind of exemplary embodiment of the disclosure, it is additionally provided with heat-conducting glue between extension 104 and backboard 105 or leads
Thermal modules 107.In the present embodiment, the material of heat conducting module 107 is graphite or heat conducting module 107 is heat pipe, heat conducting module 107
Thermal coefficient compared with the thermal coefficient higher of heat-conducting glue, heat dissipation performance is also more preferable so that the feelings of heat derives not in time is occurring
Under condition, quickly heat can be passed on the backboard 105 of metal material, reach better heat dissipation effect.
For example, the heat conducting module 107 in the present embodiment can be graphite flake.The thermal coefficient of graphite flake be 150~
1200W/m.k, it is not worse than the heat conduction of metal, it is a kind of completely new heat conduction and heat radiation material, uniform heat conduction, shielding are hot in both directions
Source and the performance that consumer electronics product is improved while component, graphite flake can smoothly be attached to the table of any plane and bending
Face, and any type of cutting can be made according to the demand of client.
In disclosure other embodiment, it is exactly to utilize evaporation system that heat conducting module 107, which can also use hot pipe technique, heat pipe,
It is cold so that heat pipe both ends temperature difference is very big, and heat is made quickly to conduct.General heat pipe is made of shell, liquid-sucking core and end cap, heat pipe
Inside is to be pumped into negative pressure state, is filled with liquid appropriate, and this boiling point of liquid is low, readily volatilized, and tube wall has liquid-sucking core, by
Capillary-porous material is constituted.Heat pipe one end is evaporation ends, and other end is condensation end, when heat pipe one end is heated, in capillary
Liquid evaporate rapidly, steam flows to other end under small pressure difference, and releases heat, and regelation is at liquid
Evaporation ends are flowed back in body, effect of the liquid again along porous material by capillary force, and so cycle is more than, and heat is reached separately by heat pipe one end
Outer one end.
In disclosure other embodiment, heat conducting module can also use thermal coefficient higher, the better material of heat conductivility
Matter, to reach more good heat dissipation effect, details are not described herein again.
In a kind of exemplary embodiment of the disclosure, the heat conduction mould between 102 outside of extension 104 and backboard is set
The area of block 107 is not less than the area of extension 104, and the thickness of heat conducting module 107 is not less than the thickness of extension 104.Such as Fig. 1
It is shown, by taking the length of extension 104 is equal to the length of supporting part 102 as an example, the length of heat conducting module 104 and extension 104
Equal, i.e., extension 104 is contacted by heat conducting module 107 with 102 outside of backboard and forms an overall structure.
As shown in Fig. 2, also one heat dissipation path R2 of increase is:LED light → flexible base board (being specifically extension) → heat conduction
The heat that module → backboard → air, i.e. LED light generate when shining can reach extension by supporting part 102, bending part 103
104, the heat conducting module 107 between extension 104 and backboard 105 is transmitted on backboard 105, since backboard 102 is generally metal
Material can be transferred heat in air by backboard 105 and cross-ventilation, achieve the purpose that heat dissipation.
Fig. 3 shows the sectional view for another backlight module that the embodiment of the present disclosure provides, i.e., in the architecture basics as described in 1
On, heat conducting module 107 extends to the bottom of backboard 105 along the outside of backboard 105, the terminal sheet extended for heat conducting module 107
It is not particularly limited in embodiment, the bigger the size of heat conducting module 107 the thicker, and heat dissipation effect is better.
Fig. 4 shows the stereogram of structure shown in Fig. 3 in the embodiment of the present disclosure, as shown in figure 4, supporting part 102 is positioned at the back of the body
A part for 105 inside of plate, is provided with multiple LED light 101, and bending part 103 is arranged along 105 edge of backboard, extension
104 are arranged in the outside of backboard 105, are provided with conducting resinl 106 between 105 inside of supporting part 102 and backboard, extension 104 with
Heat conducting module 107 is provided between the outside of backboard 105, heat conducting module 107 extends to backboard along the outside of backboard 105
105 bottom.
In a kind of exemplary embodiment of the disclosure, the edge of backboard 105 is additionally provided with groove, for accommodating bending
Portion.By the way that groove is being arranged at the edge of backboard so that flexible base board can be reached more easily on the outside of backboard, with convenient
Assembling.
Fig. 5 shows the schematic diagram that groove is arranged on embodiment of the present disclosure backboard, as shown in figure 5, groove W is arranged in backboard
105 edge, bending part 102 can reach the outside of backboard 105 across groove W.Even if due to flexibility bending part and backboard
There are certain gaps for meeting between edge, such as depth of groove can be 1mm, and the depth of groove could be provided as slightly larger than flexibility
The thickness of substrate, no more than the height that bending part position backboard is not arranged when ensureing that bending part bypasses the edge of backboard after assembling
Degree.
In addition, again as shown in figure 5, the length of groove can be slightly larger than the size of flexible base board, the i.e. bending of flexible base board
Portion and it is not arranged between the backboard of bending part position that there are a fixed gaps, with ease of assembly.
It should be noted that only showing the portion of entire backboard in the present embodiment in order to be clearly shown design details
Separation structure.
In a kind of exemplary embodiment of the disclosure, backboard can be bolted to connection or pass through buckle with lamp bar
It is fixedly connected.
The backlight module that some embodiments of the disclosure provide, on the basis of carrying the flexible parent metal of LED light, increase is prolonged
It reaches the bending part of back plate edges and extends to the extension on the outside of backboard, on the one hand, the flexibility of lamp bar is installed by increase
The area of base material increases the heat dissipation area of lamp bar, solves the problems, such as that heat derives cause display abnormal not in time;In another aspect,
By the way that heat conducting module is arranged between backboard and extension on the outside of backboard, flexible parent metal is made to constitute one with heat conducting module and backboard
Overall structure, originally only by the heat dissipation path of heat-conducting glue on the basis of increase through the heat dissipation path of heat conducting module, can be fast
Heat is passed to backboard and distributed by speed, increases the heat-sinking capability of product, and the position that can preferably solve lamp bar concentration dissipates
The bad problem of heat.
Based on above-mentioned, the disclosure also provides a kind of display device, which includes display panel and above-described embodiment
In backlight module.It should be noted that the display device can be:Display panel, Electronic Paper, mobile phone, tablet computer, TV
Any product or component with display function such as machine, display, laptop, Digital Frame, navigator.
In a kind of exemplary embodiment of the disclosure, which can be vehicle-mounted display screen, vehicle-carrying display screen
Main sinking path is that LED is transferred thermal energy to by heat transfer and radiation in other component or structure, then main heat
Amount concentrates on metal backing, and the principal element for being transmitted in air by way of convection current, and influencing convection current is exactly radiating surface
Product, product increasing heat radiation area provided in this embodiment can effectively enhance the heat-sinking capability of product, liquid crystal when avoiding showing
Failure, it is abnormal that there is a phenomenon where displays.
Based on above-mentioned, which can realize technique effect identical with above-mentioned backlight module, and details are not described herein again.
It will be clearly understood that the present disclosure describes how to form and use particular example, but the principle of the disclosure is not limited to
These exemplary any details.On the contrary, the introduction based on disclosure disclosure, these principles can be applied to many other
Embodiment.
It is particularly shown and described the illustrative embodiments of the disclosure above.It should be appreciated that the disclosure is unlimited
In detailed construction described herein, set-up mode or implementation method;On the contrary, disclosure intention covers included in appended claims
Spirit and scope in various modifications and equivalence setting.
Claims (10)
1. a kind of backlight module, which is characterized in that including:
Backboard;And
Lamp bar has a flexible parent metal and an at least LED lamp;
The wherein described flexible parent metal includes:
The supporting part of an at least LED light is set, and the supporting part LED light is not set be fixed on the back of the body on one side
On plate;
The bending part that the LED light is not set and is bent along the edge of backboard;And
The extension on the outside of the backboard is extended to from the bending part.
2. backlight module according to claim 1, which is characterized in that the length of the extension is not less than the supporting part
Length on the inside of the backboard.
3. backlight module according to claim 1, which is characterized in that be additionally provided between the extension and the backboard
Heat conducting module.
4. backlight module according to claim 3, which is characterized in that the area of the heat conducting module is not less than the extension
The area in portion.
5. backlight module according to claim 4, which is characterized in that the heat conducting module extends along the outside of the backboard
To the bottom of the backboard.
6. according to claim 3-5 any one of them backlight modules, which is characterized in that the material of the heat conducting module is stone
Ink.
7. according to claim 3-5 any one of them backlight modules, which is characterized in that the heat conducting module is heat pipe.
8. backlight module according to claim 1, which is characterized in that the edge of the backboard is additionally provided with groove, is used for
House the bending part.
9. backlight module according to claim 1, which is characterized in that the one side of the LED light is not arranged for the supporting part
It is fixed on the backboard by heat-conducting glue.
10. a kind of display device, which is characterized in that including the backlight module described in any one of claim 1-9.
Priority Applications (1)
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CN201820013946.5U CN207799285U (en) | 2018-01-02 | 2018-01-02 | Backlight module and display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820013946.5U CN207799285U (en) | 2018-01-02 | 2018-01-02 | Backlight module and display device |
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Publication Number | Publication Date |
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CN207799285U true CN207799285U (en) | 2018-08-31 |
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CN201820013946.5U Active CN207799285U (en) | 2018-01-02 | 2018-01-02 | Backlight module and display device |
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2018
- 2018-01-02 CN CN201820013946.5U patent/CN207799285U/en active Active
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