CN207783328U - The production system of multi-layer H ID wiring boards - Google Patents
The production system of multi-layer H ID wiring boards Download PDFInfo
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- CN207783328U CN207783328U CN201721775622.7U CN201721775622U CN207783328U CN 207783328 U CN207783328 U CN 207783328U CN 201721775622 U CN201721775622 U CN 201721775622U CN 207783328 U CN207783328 U CN 207783328U
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- wiring board
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- wiring boards
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Abstract
The utility model discloses the production systems of multi-layer H ID wiring boards, for the production to HID wiring boards, including cutter device, dust-extraction unit, feeding device, point glue equipment, drilling equipment and building mortion；The cutter device cuts to be defined size to the wiring board, and photoelectric sensor and limiting plate to be limited to the wiring board；The dust-extraction unit to on the wiring board droplet and dust be purged, the dust-extraction unit includes inflatable body and the air nozzle that is connected on the inflatable body；The feeding device carries out limit point glue to the wiring board be delivered on point glue equipment；For the building mortion compression is fixed to the wiring board, the building mortion includes cylinder and Guan Tong mechanisms, can effectively realize the production to multi-layer H ID wiring boards thus, while work efficiency is high, the quality of quality can also rise, practical function, be suitble to be widely popularized.
Description
Technical field
The utility model is related to wiring board technology fields, the more particularly to production system of multi-layer H ID wiring boards.
Background technology
At present when carrying out the production of multi-layer H ID wiring boards, the mode of production of separation procedure, the utilization of equipment are often used
Rate is relatively low, and integrated degree also relatively falls behind, and the product produced, and quality is more low, and qualification rate is relatively low, causes to produce
Cost improves, and working efficiency is relatively low, and especially when produce multi-layer H ID wiring boards, it is uneven to have a lamination, there are gap with
The case where pressure break, has certain limitation, needs the production technology for improving multi-layer H ID wiring boards thus.
Utility model content
The main purpose of the utility model is to provide the production systems of multi-layer H ID wiring boards, can effectively solve background
The problems in technology.
To achieve the above object, the technical solution that the utility model is taken is：
The production system of multi-layer H ID wiring boards, for production to HID wiring boards, including cutter device, dust-extraction unit,
Feeding device, point glue equipment, drilling equipment and building mortion；
For the cutter device to be defined size cutting to the wiring board, the cutter device further includes that laser is cut
Cutting mill, and photoelectric sensor and limiting plate to be limited to the wiring board；
The dust-extraction unit to on the wiring board droplet and dust be purged, the dust-extraction unit include blow
Mechanism of qi structure and the air nozzle being connected on the inflatable body；
The feeding device carries out limit point glue to the wiring board be delivered on point glue equipment；
To carry out drilling limit to the wiring board, the drilling equipment further includes and the circuit drilling equipment
The matched limiting slot of plate；
For the building mortion compression is fixed to the wiring board, the building mortion includes cylinder and filling copper machine
Structure.
Further, stock chest there are two being opened up on the feeding device, two stock chests are put respectively insulation
Plate and circuit board.
Further, AB glue glue is filled in the point glue equipment.
Further, it is installed with mechanical drilling machine and laser type drilling machine on the drilling equipment, to the point
The wiring board being superimposed on adhesive dispenser carries out drilling limit.
Further, the cylinder on the building mortion is connected with pressing plate by piston rod thread, and the pressing plate is rectangle
Structure, to be flattened to the wiring board.
Further, the limiting slot on the drilling equipment is slidably adjustment structure.
Compared with prior art, the utility model has the advantages that：This kind of utility model reasonable design, user
Just, it by being provided with cutter device, dust-extraction unit, feeding device, point glue equipment, drilling equipment and building mortion, may be implemented
The a full set of process of wiring board production, utilization rate of equipment and installations is higher, and finished product scrappage is relatively low, and enterprise is reduced in certain degree
The production cost of industry, and the product produced, size is consistent, and lamination is clear, it is seen that this kind of utility model, practical function,
It is suitble to be widely popularized.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
In figure：1, cutter device；2, dust-extraction unit；3, point glue equipment；4, hickey；5, drilling equipment；6, at shape dress
It sets.
Specific implementation mode
To make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, below
In conjunction with specific implementation mode, the utility model is expanded on further.
As shown in Figure 1, the production system of multi-layer H ID wiring boards, for the production to HID wiring boards, including cutter device
1, dust-extraction unit 2, feeding device 3, point glue equipment 4, drilling equipment 5 and building mortion 6；
For the cutter device 1 to be defined size cutting to the wiring board, the cutter device 1 further includes laser
Cutting machine, and photoelectric sensor and limiting plate to be limited to the wiring board；
The dust-extraction unit 2 to on the wiring board droplet and dust be purged, the dust-extraction unit 2 includes
Inflatable body and the air nozzle being connected on the inflatable body；
The feeding device 3 carries out limit point glue to the wiring board be delivered on point glue equipment 4；
To carry out drilling limit to the wiring board, the drilling equipment 5 further includes and the line drilling equipment 5
The matched limiting slot of road plate；
For the building mortion 6 compression is fixed to the wiring board, the building mortion 6 includes cylinder and filling copper
Mechanism.
Wherein, opened up on the feeding device 3 there are two stock chest, two stock chests puts respectively have insulation board with
Circuit board.
Wherein, AB glue glue is filled in the point glue equipment 4.
Wherein, it is installed with mechanical drilling machine and laser type drilling machine on the drilling equipment 5, to described mucilage binding
It sets the wiring board being superimposed on 4 and carries out drilling limit.
Wherein, the cylinder on the building mortion 6 is connected with pressing plate by piston rod thread, and the pressing plate is rectangle knot
Structure, to be flattened to the wiring board.
Wherein, the limiting slot on the drilling equipment 5 is slidably adjustment structure.
It should be noted that the utility model is the production system of multi-layer H ID wiring boards, when work, first wiring board and
Insulation board can be in cutter device 1, the cutting being sized, then can be in dust-extraction unit 2, by being sprayed on inflatable body
The effect of gas nozzle, progress water droplet and dust are dispelled, and then wiring board and insulation board can be carried out in the stock chest on feeding device 3
Classified placing, and in the limiting slot being sent on point glue equipment 4, fix, and layering gluing is carried out, it can then bore
In aperture apparatus 5 carry out laser drill limit, after by mechanical holes drilled through carry out wiring board limit, last wiring board is at shape dress
Pressing is formed in setting 6 and wiring board through-hole fills Copper treatment, equipment integrated degree is higher.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. the production system of multi-layer H ID wiring boards, for the production to HID wiring boards, it is characterised in that：Including cutter device
(1), dust-extraction unit (2), feeding device (3), point glue equipment (4), drilling equipment (5) and building mortion (6)；
For the cutter device (1) to be defined size cutting to the wiring board, the cutter device (1) further includes laser
Cutting machine, and photoelectric sensor and limiting plate to be limited to the wiring board；
The dust-extraction unit (2) to on the wiring board droplet and dust be purged, the dust-extraction unit (2) includes
Inflatable body and the air nozzle being connected on the inflatable body；
The feeding device (3) carries out limit point glue to the wiring board be delivered on point glue equipment (4)；
To carry out drilling limit to the wiring board, the drilling equipment (5) further includes and the line drilling equipment (5)
The matched limiting slot of road plate；
For the building mortion (6) compression is fixed to the wiring board, the building mortion (6) includes cylinder and filling copper
Mechanism.
2. the production system of multi-layer H ID wiring boards according to claim 1, it is characterised in that：On the feeding device (3)
Stock chest there are two opening up, two stock chests are put respectively insulation board and circuit board.
3. the production system of multi-layer H ID wiring boards according to claim 1, it is characterised in that：In the point glue equipment (4)
Filled with AB glue glue.
4. the production system of multi-layer H ID wiring boards according to claim 1, it is characterised in that：On the drilling equipment (5)
It is installed with mechanical drilling machine and laser type drilling machine, to be carried out to the wiring board being superimposed on the point glue equipment (4)
Drilling limit.
5. the production system of multi-layer H ID wiring boards according to claim 1, it is characterised in that：On the building mortion (6)
Cylinder pressing plate is connected with by piston rod thread, the pressing plate is rectangular configuration, to be flattened to the wiring board.
6. the production system of multi-layer H ID wiring boards according to claim 1, it is characterised in that：On the drilling equipment (5)
The limiting slot be slidably adjustment structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721775622.7U CN207783328U (en) | 2017-12-19 | 2017-12-19 | The production system of multi-layer H ID wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721775622.7U CN207783328U (en) | 2017-12-19 | 2017-12-19 | The production system of multi-layer H ID wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783328U true CN207783328U (en) | 2018-08-28 |
Family
ID=63226395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721775622.7U Active CN207783328U (en) | 2017-12-19 | 2017-12-19 | The production system of multi-layer H ID wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783328U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110980114A (en) * | 2019-11-27 | 2020-04-10 | 安徽天兵电子科技股份有限公司 | Processing and conveying device for FPC (Flexible printed Circuit) |
| CN111299867A (en) * | 2019-11-05 | 2020-06-19 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
| CN112261785A (en) * | 2020-10-19 | 2021-01-22 | 陈圆圆 | Integrated circuit board processing device |
-
2017
- 2017-12-19 CN CN201721775622.7U patent/CN207783328U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111299867A (en) * | 2019-11-05 | 2020-06-19 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
| CN111299867B (en) * | 2019-11-05 | 2021-08-27 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
| CN110980114A (en) * | 2019-11-27 | 2020-04-10 | 安徽天兵电子科技股份有限公司 | Processing and conveying device for FPC (Flexible printed Circuit) |
| CN110980114B (en) * | 2019-11-27 | 2021-07-13 | 安徽天兵电子科技股份有限公司 | Processing and conveying device for FPC (Flexible printed Circuit) |
| CN112261785A (en) * | 2020-10-19 | 2021-01-22 | 陈圆圆 | Integrated circuit board processing device |
| CN112261785B (en) * | 2020-10-19 | 2021-12-17 | 嘉兴桀华电子科技有限公司 | Integrated circuit board processing device |
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