CN207783262U

CN207783262U - A kind of plated circuit PCB laminated construction

Info

Publication number: CN207783262U
Application number: CN201721919409.9U
Authority: CN
Inventors: 李广辉; 马峰超
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2017-12-29
Filing date: 2017-12-29
Publication date: 2018-08-28
Anticipated expiration: 2027-12-29

Abstract

The utility model provides a kind of plated circuit PCB laminated construction, including copper foil layer, layer of prepreg and core layer, which is characterized in that one or more layers of the pcb board lamination is provided with copper articulamentum and light waveguide-layer.Solve in the prior art light waveguide-layer can only flood be embedded into PCB laminations, cause optical waveguide material waste, cost increase the problem of.

Description

A kind of plated circuit PCB laminated construction

Technical field

The utility model is related to field of communication technology more particularly to a kind of plated circuit PCB laminated construction.

Background technology

With the high speed development of integrated circuit technique, the data processing speed of chip interior is higher and higher, and traditional copper is mutual Even technology faces huge challenge.Especially in terms of high-speed signaling designs, 56G backboards and later development, problems of Signal Integrity Numerous uncertain factors is brought to design.And light network is high with bandwidth compared to electrical interconnection, loss is small, is substantially not present string Disturb, electromagnetic compatibility the advantages that, the photoelectricity mixed printing plate circuit of embedded optical waveguide material comes into being, plated circuit (PCB, Printed Circuit Board) factory has begun the processing and fabricating of photoelectricity mixed plate.But current method is also all by flood Light waveguide-layer is embedded into traditional PCB laminations, often in plate grade light network, is covered with optical channel without whole plate, if flood Insertion light waveguide-layer will reduce the wiring of copper-connection lamination while increasing cost it will cause the waste of optical waveguide material Space.

Utility model content

In order to solve the above technical problems, the utility model provides a kind of plated circuit PCB laminated construction, it is existing to solve There is in technology light waveguide-layer can only flood the problem of being embedded into PCB laminations, causing optical waveguide material waste, cost increase.

The technical solution that the utility model solves above-mentioned technical problem is to provide a kind of plated circuit PCB laminated construction, Including copper foil layer, layer of prepreg and core layer, which is characterized in that one or more layers of the pcb board lamination is provided with copper company Connect layer and light waveguide-layer.

Further, the copper articulamentum is the core layer.

Further, the copper articulamentum is the combination of the copper foil layer and the layer of prepreg.

Further, the copper articulamentum is the combination of the core layer, the copper foil layer and the layer of prepreg.

Further, the consistency of thickness of the copper articulamentum and the light waveguide-layer.

Further, in the case of there is copper foil layer and light waveguide-layer within the same layer, the copper foil layer and the light wave The distance between conducting shell is not less than 0.2mm.

Further, the second bronze medal articulamentum is provided in the light waveguide-layer, the second bronze medal articulamentum connects with the copper The structure for connecing layer is consistent.

Further, in stacked there are light waveguide-layer in the case of, photoelectricity mixed core is additionally provided in the lamination Piece, the photoelectricity hybrid chip are used for the photoelectric signal transformation of the copper articulamentum and the light waveguide-layer.

Further, in stacked there are light waveguide-layer in the case of, be additionally provided in the lamination optical waveguide connection Device.

Further, the layer of prepreg and the core layer include FR4 planks, high frequency plank or high speed plank.

The utility model has the advantages that：It can be simutaneously arranged copper articulamentum and light waveguide-layer within the same layer, Reduce cost.

Description of the drawings

Fig. 1 is the laminated construction of existing pcb board；

Fig. 2 is a kind of one schematic diagram of PCB laminated construction provided in this embodiment；

Fig. 3 is a kind of one vertical view of PCB laminated construction provided in this embodiment；

Fig. 4 is a kind of two schematic diagram of PCB laminated construction provided in this embodiment；

Fig. 5 is a kind of three schematic diagram of PCB laminated construction provided in this embodiment；

Fig. 6 is a kind of four vertical view of PCB laminated construction provided in this embodiment；

Fig. 7 is a kind of five vertical view of PCB laminated construction provided in this embodiment.

Specific implementation mode

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain The utility model is not used to limit the utility model.

Fig. 1 is the laminated construction of existing pcb board, as shown in Figure 1, the PCB laminations include copper foil (copper) layer, semi-solid preparation Piece (PP, Prepeg) layer, core plate (core) layer etc., wherein layer of prepreg and core layer be FR4 planks, high frequency plank and/or High speed plank, first layer are copper foil (copper) layer to the 8th layer, and copper foil layer is used for copper-connection, makes it have transmission telecommunications number Ability.

When carrying out PCB laminations to a certain business board, according to its number of network connections, veneer area, the optical channel of chip output Quantity, optical waveguide connector connection type determine the copper-connection number of plies needed for its lamination and the transmission line number of plies and light wave Lead the occupied area in region.

Light waveguide-layer is added thereto by the present embodiment on the basis of above-mentioned lamination, light waveguide-layer include optical waveguide material and Upper layer and lower layer wrapping layer replaces layer of prepreg or core layer therein or copper foil using Mixed Design technology with light waveguide-layer A part in layer, to the ability for making circuit board that there is transmission optical signal.

Fig. 2 is a kind of one schematic diagram of PCB laminated construction provided in this embodiment, as shown in Fig. 2, whole core plates (core) Layer, local location are substituted by light waveguide-layer.Wherein, the part conventional panels not being replaced still use copper foil layer and half admittedly The combination for changing lamella or core layer, still realizes copper-connection with one or more layers copper foil layer, as shown in left-hand component, Specifically several layers of copper foil layers depend on the thickness of used optical waveguide material and its wrapping layer.Wherein, the thickness of light waveguide-layer by Optical waveguide material and upper layer and lower layer wrapping layer determine that is, part B, thickness are indicated with N, are at the same time in same with light waveguide-layer The part A (core layer) of one horizontal direction, the overall thickness folded out are indicated with M, are then required M to be equal to N in this mixing PCB lamination and (are permitted Perhaps certain mismachining tolerance), to ensure that this photoelectricity mixed signal layer does not influence the processing of other layers, to make this photoelectricity printing plate Circuit (OEPCB, Optical-Electrical Printed Circuit Board) forms two regions, conventional panels The light network region of copper interconnection region and optical waveguide material.

Fig. 3 is a kind of one vertical view of PCB laminated construction provided in this embodiment, as shown in figure 3, only the one of right area The transmission line that part is constituted as optical waveguide material.

Wherein, in the case of there is conventional panels and optical waveguide material within the same layer, the peace between copper foil and optical waveguide Full distance will ensure the pressing between 0.2mm or more, conventional panels and optical waveguide material due to conventional panels prepreg Mobility, without the distance between control, to prevent there is pressing cavity.

In the juncture area of conventional panels and optical waveguide material, between connection usually there are two types of methods to realize, first, logical It crosses optical waveguide connector and optical signal is imported into light waveguide-layer, another kind is directly to export optical signal importing by photoelectricity hybrid chip To light waveguide-layer.

Fig. 4 is a kind of two schematic diagram of PCB laminated construction provided in this embodiment, as shown in figure 4, partial core plate (core) Layer, local location are substituted by light waveguide-layer.The case where existing simultaneously copper conductive layer and optical waveguiding region in the horizontal direction Under, copper conductive layer is made of core plate (core) layer.

Fig. 5 is a kind of three schematic diagram of PCB laminated construction provided in this embodiment, as shown in figure 5, partial prepreg (PP) layer and copper foil layer, local location are substituted by light waveguide-layer.Copper conductive layer and light wave are existed simultaneously in the horizontal direction In the case of leading region, copper conductive layer is made of prepreg (PP) layer and copper foil layer.

In other embodiments, in the case of existing simultaneously copper conductive layer and optical waveguiding region in the horizontal direction, copper is led Electric layer can also be collectively constituted by core plate (core) layer, prepreg (PP) layer and copper foil layer.

Fig. 6 is a kind of four vertical view of PCB laminated construction provided in this embodiment, as shown in fig. 6, simultaneously in the horizontal direction In the case of there are copper conductive layer and optical waveguiding region, exist again there are the second bronze medal conductive region simultaneously in optical waveguiding region The applicable cases of multinest.

Further, in the case of existing simultaneously copper conductive layer and optical waveguiding region in the horizontal direction, copper conductive layer and Photoelectricity hybrid chip is additionally provided between optical waveguiding region, photoelectricity hybrid chip is used for the optical telecommunications of copper conductive layer and light waveguide-layer Number conversion.

Further, optical waveguide connection is additionally provided in the case of there is optical waveguiding region in the horizontal direction, in lamination Device is used for the change of signal transmission direction.It is of course also possible to be substituted with other structures such as prisms to realize identical function.

Fig. 7 is a kind of five vertical view of PCB laminated construction provided in this embodiment, no longer needs to pass through volume in photoelectricity hybrid chip Outer optical waveguide connector, but optical signal is directly exported by the optical interface of integrated chip, in this case, photoelectricity mixed core The photo-signal channel of piece is less, it is only necessary to which some is extended to below photoelectricity hybrid chip for optical waveguiding region, is directly coupled to Light waveguide-layer.

The preferred implementation case that these are only the utility model, is not intended to limit the utility model, for this field For technical staff, various modifications and changes may be made to the present invention.Within the spirit and principle of the utility model, institute Any modification, equivalent substitution, improvement and etc. of work, should be included within the scope of protection of this utility model.

Claims

1. a kind of plated circuit PCB laminated construction, including copper foil layer, layer of prepreg and core layer, which is characterized in that described One or more layers of pcb board lamination is provided with copper articulamentum and light waveguide-layer.

2. PCB laminated construction as described in claim 1, which is characterized in that the copper articulamentum is the core layer.

3. PCB laminated construction as described in claim 1, which is characterized in that the copper articulamentum is the copper foil layer and described The combination of layer of prepreg.

4. PCB laminated construction as described in claim 1, which is characterized in that the copper articulamentum is the core layer, the copper The combination of layers of foil and the layer of prepreg.

5. such as claim 2-4 any one of them PCB laminated construction, which is characterized in that the copper articulamentum and the light wave The consistency of thickness of conducting shell.

6. PCB laminated construction according to any one of claims 1-4, which is characterized in that exist within the same layer copper foil layer and In the case of light waveguide-layer, the distance between the copper foil layer and the light waveguide-layer are not less than 0.2mm.

7. PCB laminated construction according to any one of claims 1-4, which is characterized in that be provided in the light waveguide-layer Two bronze medal articulamentums, the second bronze medal articulamentum are consistent with the structure of copper articulamentum.

8. PCB laminated construction according to any one of claims 1-4, which is characterized in that there are light waveguide-layers in stacked In the case of, photoelectricity hybrid chip is additionally provided in the lamination, the photoelectricity hybrid chip is used for the copper articulamentum and institute State the photoelectric signal transformation of light waveguide-layer.

9. PCB laminated construction according to any one of claims 1-4, which is characterized in that there are light waveguide-layers in stacked In the case of, it is additionally provided with optical waveguide connector in the lamination.

10. PCB laminated construction according to any one of claims 1-4, which is characterized in that the layer of prepreg and the core Plate layer includes FR4 planks, high frequency plank or high speed plank.