CN207758281U - A kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board - Google Patents
A kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board Download PDFInfo
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- CN207758281U CN207758281U CN201721648229.1U CN201721648229U CN207758281U CN 207758281 U CN207758281 U CN 207758281U CN 201721648229 U CN201721648229 U CN 201721648229U CN 207758281 U CN207758281 U CN 207758281U
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Abstract
High CTI, 4 structure for covering copper plate of alkali resistance FR that the utility model is related to a kind of on pcb board, including interior layer of cloth (1), cloth layer (2) and copper foil (3), the interior layer of cloth (1) is made by being toasted after E-glass cloth dipping glue, core plate as copper-clad plate, it is characterised in that：The cloth layer (2) is made of the resin of glass-fiber-fabric and high CTI, alkali resistance as skeleton, both sides positioned at interior layer of cloth (1), the copper foil (3) is located at the outside of cloth layer (2), the surface that the copper foil (3) contacts with cloth layer (2) forms microcosmic honeycomb by oxidation processes, another side is smooth planar surface, and the separation layer (4) of resin material is provided between the cloth layer (2) and interior layer of cloth (1).The CTI of the utility model is bad without white point in 10% sodium hydroxide solution, 90 DEG C of immersion 60min simultaneously up to 600V.
Description
Technical field
The utility model is related to copper-clad plate manufacturing technology field, especially a kind of high CTI being used on pcb board, alkali resistance
FR-4 structure for covering copper plate.
Background technology
The hinge of carrier and circuit signal transmission as various components, PCB have become electronics and IT products most
For important and crucial part, quality and the reliability level of quality determine the quality and reliability of whole set equipment.And
The electronic apparatus used in high temperature, filth, wet environment is general that institute is required to have using wiring board to prevent leaky
There are higher CTI values (relative discharge tracking index), traditional circuit plate base material copper-clad plate to glue in production process, relies primarily on drop
The bromine content and a large amount of aluminium hydroxides of addition of low glue formula meet the requirement of CTI performances as filler.But use this side
Plank heat resistance, the alkali resistance that method is made are very poor, during PCB is manufactured, it is often necessary to strong with concentration 8-12%
Alkali liquid medicine carry out it is anti-welding move back to wash do over again, this requires plank meet CTI require while have excellent alkali resistance again.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of height on pcb board for above-mentioned production status
CTI, alkali resistance FR-4 structure for covering copper plate, CTI impregnate 60min without white in 10% sodium hydroxide solution, 90 DEG C simultaneously up to 600V
Point is bad.
The technical scheme in the invention for solving the above technical problem is：It is a kind of high CTI on pcb board, alkaline-resisting
Property FR-4 structure for covering copper plate, including interior layer of cloth, cloth layer and copper foil, after the interior layer of cloth impregnates glue by E-glass cloth
Baking is made, as the core plate of copper-clad plate, the cloth layer by glass-fiber-fabric and high CTI, alkali resistance as skeleton resin group
At positioned at the both sides of interior layer of cloth, the copper foil is located at the outside of cloth layer, and the surface that the copper foil is contacted with cloth layer passes through oxygen
Change processing forms microcosmic honeycomb, and another side is smooth planar surface, and tree is provided between the cloth layer and interior layer of cloth
The separation layer of fat material.
Preferably, modified barium sulfate and high heat-resisting hydroxide are included in the high CTI of the cloth layer, the resin of alkali resistance
Aluminium filler material.
Preferably, the separation layer be include the prepreg of matrix resin, curing agent and accelerating agent or including asphalt mixtures modified by epoxy resin
Fat, curing agent and the pure adhesive film of accelerating agent, thickness are 30 μm~230 μm.
Compared with prior art, the utility model has the advantage of：
The utility model improves the CTI and alkali resistance of copper-clad plate by increasing by a level layer of cloth, which passes through electricity
Modified sulfuric acid is added with 1.33: 1 mass ratio in bisphenol A epoxide resin of the sub- grade glass cloth dipping bromine content 14~16%
Barium and high heat-resisting aluminium hydroxide (addition filler total mass ratio is 35%) are used as filler material, and dicyandiamide is curing agent, adds silane
Coupling agent, DMF solvent etc., high-speed stirred is uniformly mixed and high CTI is made, the glue of alkali resistance is made, while as core plate
Increase separation layer between interior layer of cloth and cloth layer, high CTI prepregs cloth layer and the barrier of interior layer of cloth are opened, avoids in its destruction
Layer of cloth is made copper, prepreg react and generates cuprammonium complex ion, adopted and be made of resin due to separation layer, can improve interior cloth
Binding performance between layer and cloth layer, so that it is guaranteed that the stability of copper-clad plate.
Description of the drawings
Fig. 1 is the structure sectional view of the utility model.
Wherein：
Interior layer of cloth 1
Cloth layer 2
Copper foil 3
Separation layer 4.
Specific implementation mode
The utility model is described in further detail below in conjunction with attached drawing embodiment.
As shown in Figure 1, a kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board in the present embodiment, packet
Interior layer of cloth 1, cloth layer 2 and copper foil 3 are included, the interior layer of cloth 1 impregnates common bromine content 18~20% by E-glass cloth
Bisphenol A epoxide resin, dicyandiamide cure system glue are made, and the cloth layer 2 passes through E-glass cloth dipping bromine content
In 14~16% bisphenol A epoxide resin, modified barium sulphate and high heat-resisting aluminium hydroxide (addition are added with 1.33: 1 mass ratio
Filler total mass ratio is 35%) to be used as filler material, and dicyandiamide is curing agent, addition silane coupling agent, DMF solvent etc., high-speed stirring
Mix be uniformly mixed high CTI is made, the glue of alkali resistance is made, cloth layer 2 is located at the upper and lower surface of interior layer of cloth 1, the copper foil 3
In the outer surface of upper and lower cloth layer 2, microcosmic honeycomb is formed by oxidation processes on the surface that the copper foil 3 is contacted with cloth layer 2
Structure, to increase copper face asperity (specific surface area increase), to increase the contact area of copper face and resin；It sets simultaneously
Fat diverging flow penetrates into the honeycomb of copper face, and realization is connect with the engagement of copper face, and the combination for enhancing cloth layer and copper face is strong
Degree；And another side is flat smooth structure.
In order to avoid being in direct contact for cloth layer 2 and interior layer of cloth 1, avoid its destroy in layer of cloth, so that copper, prepreg is occurred
Reaction generates cuprammonium complex ion, while the combination of interior layer of cloth and high CTI prepregs cloth layer is poor, is easy in heat-shock
Generate layering, and then do not interfere with the reliability of high CTI production boards, and caused by heat-shock when easy to produce asking for layering
Topic, is provided with separation layer 4 between the cloth layer 2 and interior layer of cloth 1, separation layer 4 be include matrix resin, curing agent and promotion
The prepreg of agent or including epoxy resin, curing agent and the pure adhesive film of accelerating agent, separation layer is by high CTI prepregs cloth layer
It is opened with the barrier of interior layer of cloth, the thickness of the separation layer 4 is 30 μm~230 μm.
Above structure unit stack in sequence after in 220 DEG C of temperature, face pressure 30kgf/cm2Under the conditions of press 135min,
Obtain high CTI, alkali resistance FR-4 copper-clad plates.
In addition to the implementation, the utility model further includes having other embodiment, all to use equivalents or equivalent
The technical solution that alternative is formed, should all fall within the protection domain of the utility model claims.
Claims (2)
1. a kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board, including interior layer of cloth (1), cloth layer (2) and copper
Foil (3), the interior layer of cloth (1) is made by being toasted after E-glass cloth dipping glue, as the core plate of copper-clad plate, feature
It is：The cloth layer (2) is made of the resin of glass-fiber-fabric and high CTI, alkali resistance as skeleton, is located at interior layer of cloth (1)
Both sides, the copper foil (3) are located at the outside of cloth layer (2), and the surface that the copper foil (3) contacts with cloth layer (2) passes through oxidation
Processing forms microcosmic honeycomb, and another side is smooth planar surface, is arranged between the cloth layer (2) and interior layer of cloth (1)
There is the separation layer (4) of resin material.
2. a kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board according to claim 1, feature exist
It is prepreg or pure adhesive film in the separation layer (4), thickness is 30 μm~230 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721648229.1U CN207758281U (en) | 2017-11-30 | 2017-11-30 | A kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721648229.1U CN207758281U (en) | 2017-11-30 | 2017-11-30 | A kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207758281U true CN207758281U (en) | 2018-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721648229.1U Active CN207758281U (en) | 2017-11-30 | 2017-11-30 | A kind of high CTI, alkali resistance FR-4 structure for covering copper plate on pcb board |
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| CN (1) | CN207758281U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050469A (en) * | 2019-12-30 | 2020-04-21 | 江苏联鑫电子工业有限公司 | High-heat-resistance high-CTI lead-free copper-clad plate and preparation method thereof |
| CN113263798A (en) * | 2021-05-06 | 2021-08-17 | 建滔电子材料（江阴）有限公司 | High-temperature-resistant copper-clad plate and preparation process thereof |
-
2017
- 2017-11-30 CN CN201721648229.1U patent/CN207758281U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050469A (en) * | 2019-12-30 | 2020-04-21 | 江苏联鑫电子工业有限公司 | High-heat-resistance high-CTI lead-free copper-clad plate and preparation method thereof |
| CN113263798A (en) * | 2021-05-06 | 2021-08-17 | 建滔电子材料（江阴）有限公司 | High-temperature-resistant copper-clad plate and preparation process thereof |
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