CN207749197U - Electroplating bath - Google Patents
Electroplating bath Download PDFInfo
- Publication number
- CN207749197U CN207749197U CN201721927689.8U CN201721927689U CN207749197U CN 207749197 U CN207749197 U CN 207749197U CN 201721927689 U CN201721927689 U CN 201721927689U CN 207749197 U CN207749197 U CN 207749197U
- Authority
- CN
- China
- Prior art keywords
- electroplating bath
- raised line
- insulation board
- frame
- madial wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a kind of electroplating bath, multiple raised lines are provided on the madial wall of the electroplating bath, hollow portion is provided in raised line, insulation board is provided in electroplating bath, insulation board includes frame and conductive trough, raised line is arranged between the madial wall and insulation board of electroplating bath, frame is arranged on raised line, raised line face conductive trough, using the above structure, for placing conductive material in hollow portion in raised line, insulation board is placed in electroplating bath, the frame of insulation board can correspond to the surrounding on electroplating bath madial wall and frame is arranged on raised line, conductive trough corresponds to the center of electroplating bath, so that the surrounding conductive material positioned at electroplating bath can not be conductive, current density in electroplating bath is concentrated in conductive trough, to which the electrical force profiles for the high-low-position being applied on electroplated product are more evenly distributed, improve galvanization coating purpose in homogeneous thickness to realize to reach.
Description
Technical field
The utility model is related to electroplating device fields, more particularly, to a kind of electroplating bath.
Background technology
In process is electroplated, stable product quality is obtained simultaneously to improve production capacity, gantry is gradually used in industry
Mode based on formula plating line is electroplated, and dimension of tank is increased, to which area increase will effectively be electroplated.Increase effectively plating
After area, due to occurring the case where surrounding high potential middle section low potential in electroplating bath so that winged bar of each plating is in height
Thickness of coating inhomogeneities in current potential, causes electroplated product quality unstable, while high potential product quality surplus, low electricity
Position product has underproof phenomenon, requires high product, product qualification rate relatively low for part fitted position.
Invention content
The main purpose of the utility model is to provide a kind of uniform electroplating bath of improvement thickness of coating.
To realize above-mentioned main purpose, multiple raised lines are provided on the madial wall of electroplating bath provided by the utility model,
It is provided with hollow portion in raised line, insulation board is provided in electroplating bath, insulation board includes frame and conductive trough, and raised line setting is being electroplated
Between the madial wall and insulation board of slot, frame is arranged on raised line, raised line face conductive trough.
It can be seen that raised line is distributed in electroplating bath, for placing conductive material in the hollow portion in raised line, put in electroplating bath
Insulation board is set, the frame of insulation board can correspond to the surrounding on electroplating bath madial wall and frame is arranged on raised line, conductive trough pair
Answer the center of electroplating bath so that the surrounding conductive material for being located at electroplating bath can not be conductive, by the current density collection in electroplating bath
In in conductive trough, to which the electrical force profiles for the high-low-position being applied on electroplated product are more evenly distributed, change to realize to reach
Kind galvanization coating purpose in homogeneous thickness.
Further embodiment is that electroplating bath is in cuboid, and raised line is evenly distributed on the long side madial wall of electroplating bath, convex
Item is in cuboid, and raised line is vertically arranged, and hollow portion vertically extends.
As it can be seen that raised line is evenly distributed on madial wall so that the current density in slot is also relatively uniform, and raised line is vertically arranged
Convenient for placing conductive material in hollow portion.
Further embodiment is that insulation board is rectangle respectively with conductive trough, the length and width and electroplating bath of insulation board
Long side madial wall length and width it is identical, frame include two the first sides being mutually parallel with two be mutually parallel second
Side, between two first when being arranged at two second.
As it can be seen that the geomery of insulation board is depending on the geomery of electroplating bath so that insulation board preferably shields electricity
The conductive region of coating bath surrounding makes the current density higher of non-shielding area by the current convergence in electroplating bath in conductive trough
Evenly.
Description of the drawings
Fig. 1 is the structure chart of the utility model electroplating bath embodiment.
Fig. 2 is the vertical view of the utility model electroplating bath embodiment.
Fig. 3 is the sectional view of the line A-A cutting along Fig. 2.
The utility model is described in further detail with reference to the accompanying drawings and embodiments.
Specific implementation mode
In the electroplating bath application electroplating technology of the utility model, by increasing insulation board in electroplating bath so that anode is led
Electric object is arranged between electroplating bath madial wall and insulation board, and the frame in insulation board shields the peripheral portion of electroplating bath,
So that the current density in electroplating bath concentrates in the conductive trough on insulation board, to be applied to the high-low-position on electroplated product
Electrical force profiles are more evenly distributed, and improve galvanization coating purpose in homogeneous thickness to realize to reach.
Referring to Fig. 1, Fig. 2, it is provided with multiple raised lines 2 on the madial wall of the electroplating bath 1 of the utility model, is arranged in raised line 2
There is hollow portion 3, insulation board 4 is provided in electroplating bath 1, insulation board 4 includes frame 5 and conductive trough 6, and raised line 2 is arranged in electroplating bath 1
Madial wall and insulation board 4 between, frame 5 be arranged on raised line 2,2 face conductive trough 6 of raised line.Raised line 2 is distributed in electroplating bath 1
It is interior, for placing conductive material in the hollow portion 3 in raised line 2, insulation board 4, the installation of the frame 5 of insulation board 4 are placed in electroplating bath 1
Position corresponds to the energization area of the surrounding on 1 madial wall of electroplating bath and frame 5 is arranged on raised line 2, and conductive trough 6 corresponds to plating
The energization area of the center of slot 1 so that the surrounding conductive material for being located at electroplating bath 1 can not be conductive, by the electric current in electroplating bath 1
Density concentrates in conductive trough 6, to which the electrical force profiles for the high-low-position being applied on electroplated product are more evenly distributed, to realize
Reaching improves galvanization coating purpose in homogeneous thickness.
In the present embodiment, electroplating bath 1 is in cuboid, and raised line 2 is evenly distributed on the long side madial wall of electroplating bath 1,
So that the current density in slot is also relatively uniform.Raised line 2 is in cuboid, and raised line 2 is vertically arranged, and hollow portion 3 is along vertical
Direction extends, and raised line 2, which is vertically arranged, to be placed on convenient for placing conductive material in hollow portion 3.
Referring to Fig. 3, insulation board 4 is rectangle respectively with conductive trough 6, the length of the length and width and electroplating bath 1 of insulation board 4
The length and width of side madial wall is identical, and frame 5 includes two the first sides 51 being mutually parallel and two second to be mutually parallel
Side 52, between two first when 51 are arranged at two second 52, the geomery of insulation board 4 is according to the shape ruler of electroplating bath 1
Depending on very little so that insulation board 4 preferably shields the conductive region of 1 surrounding of electroplating bath, by the current convergence in electroplating bath 1 in conduction
In slot 6, make the current density higher of non-shielding area evenly.In fitting insulating panels 4, the frame 5 of insulation board 4 can cover convex
The area of item 2, correspondingly, on 2 vertical direction of raised line in two the first sides 51,1 liang of outside of covering electroplating bath of frame 5
Area, two the second sides 52 of frame 5 cover the area teased in 2 horizontal directions of brother's raised line, specific area simultaneously
Can be depending on practical electro-plating situation, two the first sides 51 of frame 5 are located at the both sides of electroplating bath, and lid closes the raised line 2 in two outsides
With the gap between electroplating bath 1.
Finally it is emphasized that the above is only the preferred embodiment of the present invention, it is not limited to this reality
With novel, for those skilled in the art, the utility model can have various change and change, all in the utility model
Spirit and principle within, any modification, equivalent substitution, improvement and etc. done should be included in the protection model of the utility model
Within enclosing.
Claims (3)
1. electroplating bath, it is characterised in that：Multiple raised lines are provided on the madial wall of the electroplating bath, in being provided in the raised line
Empty portion is provided with insulation board in the electroplating bath, and the insulation board includes frame and conductive trough, and the raised line is arranged in the electricity
Between the madial wall of coating bath and the insulation board, the frame is arranged on the raised line, conductive trough described in the raised line face.
2. electroplating bath according to claim 1, it is characterised in that：
The electroplating bath is in cuboid, and the raised line is evenly distributed on the long side madial wall of the electroplating bath, the raised line
In cuboid, the raised line is vertically arranged, and the hollow portion vertically extends.
3. electroplating bath according to claim 2, it is characterised in that：
The insulation board is rectangle respectively with the conductive trough, the length of the length and width of the insulation board and the electroplating bath
The length and width of side madial wall is identical, and the frame includes two the first sides being mutually parallel and two second to be mutually parallel
Side, between two described first when being arranged at two described second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927689.8U CN207749197U (en) | 2017-12-29 | 2017-12-29 | Electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927689.8U CN207749197U (en) | 2017-12-29 | 2017-12-29 | Electroplating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207749197U true CN207749197U (en) | 2018-08-21 |
Family
ID=63152283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721927689.8U Active CN207749197U (en) | 2017-12-29 | 2017-12-29 | Electroplating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207749197U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109811381A (en) * | 2019-03-26 | 2019-05-28 | 阳江三威科技有限公司 | Pre-impregnation device is electroplated in plastic parts electro-plating method and plastic parts |
-
2017
- 2017-12-29 CN CN201721927689.8U patent/CN207749197U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109811381A (en) * | 2019-03-26 | 2019-05-28 | 阳江三威科技有限公司 | Pre-impregnation device is electroplated in plastic parts electro-plating method and plastic parts |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201753369U (en) | Electroplating device | |
| CN105088323B (en) | Board-like Electropolating hangers | |
| CN207749197U (en) | Electroplating bath | |
| CN203754843U (en) | Arc metal anode used for small electroplating equipment | |
| JP2016180148A (en) | Electrolytic plating apparatus | |
| CN102337578A (en) | Double-sided plating tank, sheet and plating method | |
| CN204162822U (en) | Electroplating cathode shield and plating tank | |
| CN202898583U (en) | Electroplating board feeding rack and equipment | |
| CN203307457U (en) | Coating copper control device of electroplating process | |
| JP2016156084A (en) | Electrolytic plating apparatus | |
| CN204661855U (en) | With the plating tank of shielding unit | |
| CN209368374U (en) | Insoluble anode electro-coppering equipment | |
| CN214422775U (en) | Electroplating auxiliary tool adopting anode shielding | |
| CN206947759U (en) | A kind of Combined type power power distribution cabinet | |
| CN200999265Y (en) | Baffle plate for electric plating | |
| CN107190306A (en) | Electroplating system | |
| CN107190307A (en) | Electroplating anode device | |
| KR101047336B1 (en) | Electrical connecting apparatus of anode plate of continuous plating system for semiconductor integrated circuit board | |
| CN209010620U (en) | Cupric electrolysis cathode collector bar | |
| CN205529104U (en) | Plating device | |
| CN209522940U (en) | A kind of electroplating tank structure | |
| CN203333803U (en) | Adjustable insoluble anode device | |
| CN203761754U (en) | CF (CompactFlash) card shielding cover | |
| KR101374793B1 (en) | Electorde auxiliary substrate for prevention burning deposition of plastic electroplating | |
| CN105274608B (en) | Electroplating connector and electroplating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |